JPH0756776B2 - Impregnated type cathode - Google Patents
Impregnated type cathodeInfo
- Publication number
- JPH0756776B2 JPH0756776B2 JP12100586A JP12100586A JPH0756776B2 JP H0756776 B2 JPH0756776 B2 JP H0756776B2 JP 12100586 A JP12100586 A JP 12100586A JP 12100586 A JP12100586 A JP 12100586A JP H0756776 B2 JPH0756776 B2 JP H0756776B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- cathode
- impregnated
- oxide
- tungsten
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- Solid Thermionic Cathode (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は高精細用の表示管,受像管及び撮像管の高電流
密度カソードとして注目されている含浸形カソードに関
する。TECHNICAL FIELD The present invention relates to an impregnated cathode which has been attracting attention as a high current density cathode for high definition display tubes, picture tubes and image pickup tubes.
従来のカソードは特願昭59−133149記載のように、耐熱
性多孔質基体の電子放出面に高融点金属とSc又はScの酸
化物もしくはその両者とからなる薄膜を設けていた。In the conventional cathode, as described in Japanese Patent Application No. 59-133149, a thin film made of a refractory metal and Sc or an oxide of Sc or both is provided on the electron emission surface of a heat resistant porous substrate.
上記従来のカソードでは、薄膜構成元素特にWの酸化状
態は考慮されておらず、薄膜形成時の真空雰囲気等に対
応してWの酸化の程度が変化していた。In the above-mentioned conventional cathode, the element constituting the thin film, particularly the oxidation state of W, is not taken into consideration, and the degree of oxidation of W changes depending on the vacuum atmosphere and the like when forming the thin film.
本発明の目的は、このWの酸化状態を人為的に制御する
ことにある。An object of the present invention is to artificially control the oxidation state of W.
上記目的は、前記従来のカソードの製作する際薄膜付着
時によく制御された酸素ガス,水蒸気等酸化性のガスま
たは蒸気を導入することにより達成される。また上記目
的は予め酸化したW粉または板をスパツタ蒸着時のター
ゲツトとして用いることによつても実現される。The above-mentioned object is achieved by introducing a well-controlled oxidizing gas or vapor such as oxygen gas or water vapor during the deposition of the thin film in the production of the conventional cathode. The above object can also be realized by using W powder or a plate that has been previously oxidized as a target during vapor deposition of the sputter.
含浸形カソードの電子放出特性は、カソード表面の仕事
関数によつて支配される。仕事関数はカソード最表面の
原子群の配置によつて決定される。The electron emission characteristics of the impregnated cathode are governed by the work function of the cathode surface. The work function is determined by the arrangement of atomic groups on the outermost surface of the cathode.
WとSc2O3の混合薄膜を被覆したカソードの最表面は理
想的にはBa,Sc及びOからなる単分子層が存在する。こ
の単分子層の構成元素であるSc及びOは被覆混合薄膜よ
り、またBaは下地の通常の含浸形カソードより補給さ
れ、カソード動作時はこれらの元素の供給と蒸発が平衡
して定常状態になる。The outermost surface of the cathode coated with the mixed thin film of W and Sc 2 O 3 ideally has a monolayer composed of Ba, Sc and O. The constituent elements of this monolayer, Sc and O, are replenished from the mixed coating thin film, and Ba is supplied from the normal impregnated cathode of the base, and during the operation of the cathode, the supply and evaporation of these elements are in equilibrium and a steady state is achieved. Become.
このうちOは薄膜中のWの酸化物(WO3)やSc2O3の分解
によつて補給される。特に初期の単分子層形成時には多
量のOが要求される為、W酸化物の存在が不可欠とな
る。Of these, O is replenished by the decomposition of W oxide (WO 3 ) and Sc 2 O 3 in the thin film. In particular, the presence of W oxide is indispensable because a large amount of O is required at the initial formation of the monolayer.
薄膜形成後、カソードを一旦大気にさらすことによりW
酸化物は容易に表面に形成されるが、この酸化物層の厚
さは極めて薄く、十分なOの補給源となり得ない。本発
明は、このW酸化物を制御して人為的に形成せしめるも
のである。After forming the thin film, W
Oxide is easily formed on the surface, but the thickness of this oxide layer is extremely thin and cannot be a sufficient source of O 2 supply. The present invention controls and artificially forms the W oxide.
以下、本発明の一実施例を第1図により説明する。第1
図は本発明による含浸形カソードを模式図的に示した断
面図である。図において、1はカソード材料のペレツト
(1.4φ)であり、空孔率20〜25%の多孔質のW基体2
と空孔3とから形成されている。なお多孔質基体とし
て、Mo,Ir,Pt,Re等及びこれらの合金を用いても良い。
空孔3中には電子放出材料としてBaCO3,CaCO3,Al2O3
をモル比で4:1:1の割合に配合したものを含浸した。な
お異なつたモル比の材料や、異る材料を添加した電子放
出材料を用いても良い。このペレツト1をTaカツプ4に
装着し、その後Taカツプ4はTaスリーブ5にレーザ溶接
される、レーザ溶接の代りにロー材を用いても良い。カ
ソードの加熱には、W芯線6をアルミナ被覆したヒータ
7を用いて行う。以上がBa補給源となる。Baの補給量
は、加熱温度に依存するが、電子放出材料のモル比を変
えたり、また基体材料中にZr,Hf,Ti,Cr,Mn,Si,Al等の活
性剤を含有せしめる事によつても調整できる。Sc2O3補
給源として厚さ10nm〜1μmのWとSc2O3からなる薄膜
8を真空スパツタ蒸着法により付着せしめた。Wの代り
にMo,Re,Pt,Ir,Ta等の金属あるいはこれらの合金を用い
てもよい。An embodiment of the present invention will be described below with reference to FIG. First
The drawing is a cross-sectional view schematically showing an impregnated cathode according to the present invention. In the figure, reference numeral 1 is a cathode material pellet (1.4φ), which is a porous W substrate 2 having a porosity of 20 to 25%.
And holes 3 are formed. As the porous substrate, Mo, Ir, Pt, Re or the like and alloys thereof may be used.
BaCO 3 , CaCO 3 , and Al 2 O 3 are used as electron emission materials in the holes 3.
Was mixed in a molar ratio of 4: 1: 1 to impregnate. Note that materials having different molar ratios or electron emission materials to which different materials are added may be used. The pellet 1 may be attached to the Ta cup 4, and then the Ta cup 4 may be laser-welded to the Ta sleeve 5. Instead of laser welding, a brazing material may be used. The heating of the cathode is performed using a heater 7 in which the W core wire 6 is coated with alumina. The above is the source of Ba supply. The amount of replenishment of Ba depends on the heating temperature, but it is necessary to change the molar ratio of the electron emitting material or to add an activator such as Zr, Hf, Ti, Cr, Mn, Si and Al in the base material. It can also be adjusted. As a Sc 2 O 3 supply source, a thin film 8 made of W and Sc 2 O 3 having a thickness of 10 nm to 1 μm was deposited by a vacuum sputtering deposition method. Instead of W, a metal such as Mo, Re, Pt, Ir, Ta, or an alloy thereof may be used.
なお、真空中スパツタ蒸着に先立ち、スパツタ蒸着容器
内の酸素分圧を1×10-5〜1×10-4Torrになるように、
ガス導入器を通して高純度(99.9%)の酸素を導入し、
容器内に装着した小型の質量分析計にてその分圧を測定
した。Prior to the sputter deposition in vacuum, the oxygen partial pressure in the sputter deposition container was adjusted to 1 × 10 −5 to 1 × 10 −4 Torr.
High purity (99.9%) oxygen is introduced through the gas introduction device,
The partial pressure was measured with a small mass spectrometer mounted in the container.
この操作により、薄膜8中のWを酸化させることが可能
になる。またスパツタ蒸着の途中から予め測定した分圧
の酸素を導入し、薄膜8の一部分のみを酸化することも
可能である。導入ガスは酸素以外にも酸化性ガスであれ
ば用いることが出来る。By this operation, W in the thin film 8 can be oxidized. It is also possible to introduce a partial pressure of oxygen measured in advance from the middle of the sputtering deposition to oxidize only a part of the thin film 8. As the introduced gas, an oxidizing gas other than oxygen can be used.
このようなカソードを用い、カソード・アノード2極管
方式でアノードに幅5μS、くり返し100Hzの高圧パル
スを印加して飽和電流密度を測定した。その結果を第2
図に示す。Using such a cathode, a saturation current density was measured by applying a high-voltage pulse having a width of 5 μS and a repetition rate of 100 Hz to the anode in a cathode / anode bipolar system. The result is the second
Shown in the figure.
図中9が本発明によるWとSc2O3からなる薄膜の被覆を
行つたカソードの特性である。In the figure, 9 is the characteristic of the cathode coated with a thin film of W and Sc 2 O 3 according to the present invention.
図中10は、薄膜の酸化処理の無いカソードの特性であ
る。なお図中11は、薄膜被覆を施してないカソードの特
性を示す。In the figure, 10 is the characteristic of the cathode without the oxidation treatment of the thin film. Note that 11 in the figure shows the characteristics of the cathode not coated with a thin film.
本発明によれば、カソード最表面にBa,Sc及びOからな
る単分子層が安定に供給できるために、電子放出特性の
良いカソードを再現性良く得られる。According to the present invention, a monomolecular layer composed of Ba, Sc and O can be stably supplied to the outermost surface of the cathode, so that a cathode having excellent electron emission characteristics can be obtained with good reproducibility.
第1図は本発明の含浸形カソードの一実施例を模式図的
に示した断面図、第2図は本発明のカソードと従来の含
浸形カソードの電子放出特性を比較した図である。 1…カソードペレツト、2…W基体、3…空孔、4…Ta
カツプ、5…Taスリーブ、6…W芯線、7…アルミナ被
覆、8…薄膜、9…本発明による含浸形カソードの電子
放出特性、10…薄膜に酸化処理を行つていない従来型の
含浸形カソードの電子放出特性、11…薄膜被覆の無い含
浸形カソードの電子放出特性。FIG. 1 is a cross-sectional view schematically showing an embodiment of the impregnated cathode of the present invention, and FIG. 2 is a diagram comparing electron emission characteristics of the cathode of the present invention and a conventional impregnated cathode. 1 ... Cathode pellet, 2 ... W substrate, 3 ... Hole, 4 ... Ta
Cup, 5 ... Ta sleeve, 6 ... W core wire, 7 ... Alumina coating, 8 ... Thin film, 9 ... Electron emission characteristics of impregnated cathode according to the present invention, 10 ... Conventional impregnated type in which thin film is not oxidized. Electron emission characteristics of cathode, 11 ... Electron emission characteristics of impregnated cathode without thin film coating.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 佐々木 進 東京都国分寺市東恋ヶ窪1丁目280番地 株式会社日立製作所中央研究所内 (56)参考文献 特開 昭61−91822(JP,A) 特開 昭61−13526(JP,A) 特開 昭59−203343(JP,A) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Susumu Sasaki 1-280 Higashi Koigakubo, Kokubunji, Tokyo Inside Central Research Laboratory, Hitachi, Ltd. (56) References JP 61-91822 (JP, A) JP 61 -13526 (JP, A) JP-A-59-203343 (JP, A)
Claims (3)
孔部に含浸されたバリウムを含む電子放出物質と、上記
基体の表面に形成されたスカンジウムおよびスカンジウ
ムの酸化物からなる群から選ばれた少なくとも1種とタ
ングステンを含む薄膜を有し、該薄膜はタングステンの
酸化物を含んでいることを特徴とする含浸形カソード。1. A group consisting of a substrate made of a heat-resistant porous body, an electron-emitting substance containing barium impregnated in the pores of the substrate, and scandium and a scandium oxide formed on the surface of the substrate. An impregnated cathode comprising a thin film containing at least one selected and tungsten, the thin film containing an oxide of tungsten.
成時の酸化性のガスの導入により、上記薄膜中のタング
ステンが酸化処理されて得られたものである特許請求の
範囲第1項記載の含浸形カソード。2. The oxide of tungsten is obtained by oxidizing tungsten in the thin film by introducing an oxidizing gas at the time of forming the thin film. Impregnated cathode.
請求の範囲第1項又は第2項に記載の含浸形カソード。3. The impregnated cathode according to claim 1, wherein the thin film has a thickness of 10 nm to 1 μm.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12100586A JPH0756776B2 (en) | 1986-05-28 | 1986-05-28 | Impregnated type cathode |
| KR1019870005242A KR900009071B1 (en) | 1986-05-28 | 1987-05-27 | Impregnated Cathode |
| US07/055,035 US4783613A (en) | 1986-05-28 | 1987-05-28 | Impregnated cathode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12100586A JPH0756776B2 (en) | 1986-05-28 | 1986-05-28 | Impregnated type cathode |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8170882A Division JP2713290B2 (en) | 1996-07-01 | 1996-07-01 | Picture tube |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62278718A JPS62278718A (en) | 1987-12-03 |
| JPH0756776B2 true JPH0756776B2 (en) | 1995-06-14 |
Family
ID=14800427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12100586A Expired - Lifetime JPH0756776B2 (en) | 1986-05-28 | 1986-05-28 | Impregnated type cathode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0756776B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5979934A (en) * | 1982-10-29 | 1984-05-09 | Hitachi Ltd | Impregnated cathode |
| JPS6113536A (en) * | 1984-06-27 | 1986-01-21 | Matsushita Electronics Corp | Cathode-ray tube |
-
1986
- 1986-05-28 JP JP12100586A patent/JPH0756776B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62278718A (en) | 1987-12-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |