JPH0756825B2 - Socket for connection - Google Patents

Description

TECHNICAL FIELD The present invention relates to a connection socket used for connecting various electronic components such as an IC package to a connection circuit.

[Problems to be Solved by Prior Art and Invention]

6 and 7 are for a conventional flat type IC package.
Although an example of an IC socket is shown, in the figure, a plurality of contact pins 22 are arranged in the socket body 21, and each contact pin 22 is prevented from contacting each other by a partition wall 23, positioning is performed, etc. There is. In such an IC socket, when the IC package P in the socket body 21 is housed, each lead terminal L and the contact pin
22 and the IC socket is mounted on a printed wiring board (not shown) or the like, so that the IC package P is electrically connected to the external connection circuit. By the way, the partition wall 23 is provided for positioning the contact pins 22, preventing bending, mutual contact prevention, etc., but a large number of such partition walls 23 are formed and the contact pins 22 are provided between the partition walls 23 as described above. Since there are many contact pins
The 22 can be aligned correctly, so that the electrical connection between the IC package P and the external connection circuit can be properly performed.

On the other hand, in recent years, with the miniaturization of IC packages, the density of lead terminals has been increasing, and the number of lead terminals tends to increase. Therefore, as an IC socket that can be adapted to such IC packages, It requires a high density array of numerous contact pins. Therefore, in order to realize an IC socket having such a high-density array of contact pins, for example, the pitch interval between the contact pins is set to be small.
It is conceivable to reduce the thickness of the contact pin to about 0.3 mm and thin the thickness of the contact pin, but in that case, the contact pin's strength becomes weak and bending bending is likely to occur, and the contact pressure for electrical connection is insufficient. In addition, there is a problem that the durability is significantly reduced. Also, regarding the partition wall, if the thickness of the partition wall is reduced, it is difficult to process the portion corresponding to the partition wall in manufacturing the molding die, and the durability of the partition wall itself is reduced.

In order to solve such a problem, for example, as shown in FIG. 8, the insulating thin film 7 formed on the side surface of the contact pin 1,
There is a structure in which the contact pins 1 are arranged directly in contact with each other in an insulated state via 7 ', and the contact pins 1 are arranged in high density without using a partition wall. The structure will be described. The contact pin 1 shown in FIG. 8 is formed of a conductive plate 8 as shown in FIG. 9, and has a connection terminal portion 3 extending from one end of the base portion 2 and a connection terminal portion 3 extending from the other end of the base portion 2. Via the spring portion 5 extending to the opposite side to the base portion 2
An arm 4 which is connected to the arm 4, and a connecting piece 6 formed at the tip of the arm 4, and at least one of the side surfaces of the entire base 2 and part of the arm 4 has an insulating thin film 7 And an insulating thin film 7 '. Then, the contact pins 1 covered with the insulating thin film 7 and the insulating thin film 7'are made to be in an insulated state from each other via the insulating thin film 7 and the insulating thin film 7'into a socket body (not shown) without a partition wall. Have multiple rows.

In this case, the contact pin is positioned and attached to the socket main body by inserting the connection terminal portion 3 of the contact pin 1 into the insertion hole provided in the socket main body. , The contact pin may be slightly tilted or misaligned. In this way, the insulating thin film 7 is provided without providing a partition wall on the socket body.
When the contact pins 1 covered with the insulating thin film 7'are provided in a plurality of rows on the socket body, since the adjacent contact pins 1 are in contact with each other or extremely close to each other, one contact pin 1 is inclined or positioned. When the displacement occurs, the adjacent contact pins 1 are also tilted or distorted, and a slight displacement occurs.

Therefore, of the contact pins 1 arranged in multiple rows,
If the endmost contact pin 1 is installed at an angle, or if it is installed in a misaligned position,
All the remaining contact pins 1 arranged in a row are tilted or distorted, and the degree of the tilt or the distortion is gradually accumulated, and the contact pin 1 at the final end is positioned.
The position of the connecting piece 6 may be significantly displaced.

In view of such an actual situation, an object of the present invention is to provide a connection socket in which the contact pins 1 arranged in a row are regulated by the regulation portion of the socket body, and the contact pins 1 can be correctly positioned.

[Means and Actions for Solving the Problems]

The connection socket according to the present invention is formed of a plate-shaped conductive material, and has an arm portion connected to the base portion via a connection terminal portion extending from the base portion and a spring portion extending from the base portion to the side opposite to the connection terminal portion. A contact pin having a connecting piece formed at the tip of the arm, and at least one side surface of the entire base and a part of the arm covered with an insulating thin film are connected to each other via an insulating thin film. In a socket for connection in which a plurality of rows are arranged in the socket body so as to be in an insulated state, and the electronic components etc. mounted through the contact pins are electrically connected to the connection circuit, a fixed number of contact pins It is characterized in that each contact pin is positioned by forming a regulated portion on each contact pin and by regulating the above regulating portion by the regulating portion provided on the socket body. It is set to.

〔Example〕

An embodiment of the connection socket of the present invention will be described below with reference to FIGS. 1 to 5. In FIG. 1, overhanging portions 2a, 2b as regulated portions are provided at both ends of the base portion 2 of the contact pin 1 '.
Is formed, and the insulating thin film 7 is also formed on these overhang portions 2a and 2b. FIG. 2 is a partial plan view showing an example of the connection socket of the present invention in which such contact pin 1'is preferably used, and the contact pin 1'is four contact pins 1 without overhang portions 2a and 2b. It is arranged every four pieces following. The projecting portion 2a has a columnar shape, and both side surfaces (where the regulating portion 11 side is sandwiching the insulating thin film 7) are held by the first regulating portions 11 and 11 'which are erected on the socket body 10 and projecting. The portion 2b is fitted with the second regulating portion 12 formed in a groove shape on the wall of the peripheral portion of the socket body 10. In this way, the contact pin 1 ′ has the first and second restricting portions
The engagement with 1, 11 ′ and 12 regulates itself so that it is correctly positioned on the socket body 10. This makes the positioning with respect to the contact pin 1 more reliable and the contact pin 1 It is possible to secure sufficient position accuracy as a whole. When an electronic component such as an IC package is mounted on the socket body 10 during actual use, the contact piece 6 of the contact pin 1 (1 ') is
It is pushed down by the lead terminals of the package, but in that case, the contact pieces 6 are pushed down all at once, so that the arm portions 4 on which the insulating thin film 7'is formed are not displaced so that they are greatly displaced from each other. Not only is there no risk of wear due to such displacement, but there is also no electrical short circuit between the contact pins 1 (1 '). Therefore, the insulating thin film 7 '(7) only needs to have at least insulating properties and heat resistance, which is extremely advantageous in terms of selection of the material. In this way contact pins 1,1 '
In the connection socket using
In addition to remarkably improving the positional accuracy of 1 ', since no partition wall is used, it is possible to arrange the contact pins 1, 1'in higher density. Incidentally, the contact pins 1'may be arranged at intervals other than the above case. Further, in this embodiment, the first restricting portions 11, 11 '
2 is provided with a projecting body integral with the socket body as shown by the one-dot chain line in FIG. 2, and a groove similar to the groove-shaped restricting portion 12 is formed in the projecting body portion and fitted into the groove portion. You may make it regulate.

FIG. 3 shows a modification of the contact pin 1 '. In this example, the protruding portion 6a is formed at the base of the contact piece portion 6 and the first restricting portions 11 and 11 'are erected up to the height position of the protruding portion 6a. Since the first restricting portions 11 and 11 'restrict both the projecting portion 2a and the projecting portion 6a, the positional accuracy with respect to the contact pin 1'can be further improved. In this case as well, the restricting portions 11 and 11 'can use the groove structure of the projecting body as described above instead of the columnar body.

FIG. 4 shows another modification of the contact pin 1 '. In this example, the protruding portion 4a is formed on the side of the arm portion 4 and the groove of the second restricting portion 12 is adapted to fit both the protruding portion 2b and the protruding portion 4a. Regulatory Department
Since the 11, 11 'and the second restricting portion 12 restrict the protruding portion 2a, the protruding portion 6a and the protruding portion 2b, the protruding portion 4a, respectively, the positional accuracy of the contact pins 1, 1'is maintained more reliably. In this case, it is possible to form the grooves on the columns 11 and 11 'side in the same manner. FIG. 5 shows a plate material 8 for manufacturing the contact pin 1 '.
Although the insulating coatings 9 and 9 ′ are shown, the insulating coating 9 ′ is the arm 4
Also, the description is omitted because it is the same as that shown in FIG. 2 except that it is formed in the portions corresponding to the protrusions 4a and 6a.

The contact pins 1'in each of the above-described embodiments may be individually punched in advance, or may be punched in the plate member 8 with only a part cut off, and then the insulating thin films 7, 7'may be formed. The insulating thin films 7 and 7'may be formed by coating a non-conductive, highly heat-resistant plastic material, or by applying a non-conductive heat-resistant paint by an ion plating method.
It can be formed by pasting an insulating tape, but in any of the above cases, the contact pin formed on both surfaces and the contact pin on which the insulating thin film 7 or 7'are not formed at all are alternately arranged. The same effect as the example can be obtained. If the number of contact pins 1 is small and the pitch when arranged in a row is relatively rough, the thickness of the insulating thin film 7,7 'should be 1
It does not matter if it is more than mm.

〔The invention's effect〕

As described above, according to the present invention, since the contact pins can be arranged in a row at a fine pitch, it is possible to effectively deal with high density and miniaturization of the lead terminals of the IC package, and the positional accuracy of the arranged contact pins can be improved. Since it can be easily secured, a reliable electrical connection can be made as this type of connection socket. Since the contact pin can be manufactured by a simple process such as forming an insulating film at a predetermined position on the plate material in advance and punching the product, mass production can be easily realized.
Since the insulating film having a uniform film thickness can be easily formed on the contact pin, the positional accuracy of the contact pin arranged in the connection socket can be further improved. A connecting socket using such contact pins can be completely free of a partition wall, and as a result, the structure of the molding die is remarkably simple and very advantageous in terms of manufacturing cost. In the above description, the case of a socket for an IC package has been described as an example, but the connection socket according to the present invention is, for example, connected with a connection terminal of a liquid crystal display device or other connection terminals on an electric circuit board. It is needless to say that the above-mentioned operational effects can be exerted by applying the above.

[Brief description of drawings]

FIG. 1 is a front view of a contact pin according to an embodiment of a connection socket of the present invention, FIG. 2 is a partial plan view of an embodiment of a connection socket of the present invention, and FIGS. 3 and 4 are Each is a front view showing a modified example of the contact pin in the socket for connection of the present invention, FIG. 5 is a view for explaining the manufacturing process of the contact pin shown in FIG. 4, and FIGS.
FIG. 8 is a perspective view and a vertical sectional view of a connection socket for an IC package. FIG. 8 is a front view of a conventional contact pin coated with an insulating thin film, and FIG. 9 is a process for manufacturing the contact pin shown in FIG. It is a figure. 1 ... Contact pin, 2 ... Base part, 3 ... Connection terminal part, 4 ... Arm part, 5 ... Spring part, 6 ... Contact piece part, 7,
7 '... Insulating thin film, 8 ... Plate material, 9 ... Insulating film, 10 ...
… Socket body, 11,11 ′, 12 …… Regulator.

Claims (1)

[Claims] 1. An arm portion which is made of a plate-shaped conductive material and which is connected to the base portion via a connection terminal portion extending from the base portion and a spring portion extending from the base portion to the side opposite to the connection terminal portion. And a connection piece portion formed at the tip of the arm portion,
A plurality of contact pins, in which at least one side surface of the entire base portion and a part of the arm portion are covered with an insulating thin film, are provided in a plurality of rows on the socket body so as to be in a mutually insulated state via the insulating thin film, In a connection socket adapted to electrically connect an electronic component or the like mounted through a pin to a connection circuit, a regulated portion is formed on the contact pin at every fixed number of the contact pins, and A socket for connection, characterized in that each of the contact pins is positioned by regulating the regulating portion by the regulating portion provided on the socket body.