JPH0756850B2 - Ceramic multilayer capacitor and manufacturing method thereof - Google Patents
Ceramic multilayer capacitor and manufacturing method thereofInfo
- Publication number
- JPH0756850B2 JPH0756850B2 JP25226989A JP25226989A JPH0756850B2 JP H0756850 B2 JPH0756850 B2 JP H0756850B2 JP 25226989 A JP25226989 A JP 25226989A JP 25226989 A JP25226989 A JP 25226989A JP H0756850 B2 JPH0756850 B2 JP H0756850B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- multilayer capacitor
- capacitor
- ceramic multilayer
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003990 capacitor Substances 0.000 title claims description 41
- 239000000919 ceramic Substances 0.000 title claims description 29
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000002003 electrode paste Substances 0.000 claims description 16
- 229910000323 aluminium silicate Inorganic materials 0.000 claims description 10
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims description 10
- 238000010304 firing Methods 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 28
- 239000011521 glass Substances 0.000 description 12
- 239000000843 powder Substances 0.000 description 10
- 230000032798 delamination Effects 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000010953 base metal Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229920006222 acrylic ester polymer Polymers 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- -1 conventionally Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000012856 weighed raw material Substances 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、セラミック積層コンデンサおよびその製法に
関し、更に詳細には、Ni電極を内部電極として用いたセ
ラミック積層コンデンサおよびその製法に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic multilayer capacitor and a manufacturing method thereof, and more particularly to a ceramic multilayer capacitor using a Ni electrode as an internal electrode and a manufacturing method thereof.
（従来の技術） セラミック積層コンデンサは、内部電極としての電極材
料を印刷したセラミックグリーンシートを、順次積層し
て焼成してなるものであり、上記電極材料としては、従
来、Pt、Ag−Pd等の貴金属が用いられていた。しかしな
がら、これら従来の積層磁気コンデンサでは、内部電極
の層数が増えるにつれて、コンデンサの体積に対して内
部電極の占める割合が増加し、コンデンサのコストにも
大きく影響するようになってきた。このような理由か
ら、最近では、内部電極として安価な卑金属を用いたセ
ラミック積層コンデンサが種々検討されており、その一
つとして、内部電極をNiで形成したものが提案されてい
る。(Prior Art) A ceramic multilayer capacitor is one in which ceramic green sheets printed with an electrode material as an internal electrode are sequentially laminated and fired. As the above electrode material, conventionally, Pt, Ag-Pd, etc. are used. Noble metal of was used. However, in these conventional multilayer magnetic capacitors, as the number of layers of the internal electrodes increases, the ratio of the internal electrodes to the volume of the capacitor increases, and the cost of the capacitor has also been greatly affected. For these reasons, various ceramic multilayer capacitors using an inexpensive base metal as the internal electrodes have been recently studied, and one of them has been proposed in which the internal electrodes are made of Ni.
また、従来、Ni電極を内部電極として用いたセラミック
積層コンデンサは、Ni金属粉末に、ガラス成分を添加し
た電極ペーストを、 （Ba１−ｘCaｘ（Ti１−ｙZrｙ）O3粉末を主成分とした
グリーンシート上に印刷し、そして、このシートを通常
の手法により積層し、還元雰囲気中で焼成することによ
って製造されていた。即ち、従来は、内部電極と素体と
は、ガラス成分によって接合されていた。また、ガラス
成分を用いない電極ペーストとして、本出願人は先に、
特開昭64−80007号（特願昭62−236029号）でニッケル
を主成分とする卑金属粉末に、炭化物粉末を添加した電
極ペーストを提案し、また、特開昭64−80010号（特願
昭62−236032号）でニッケルを主成分とする卑金属粉末
に、窒化物粉末を添加した電極ペーストを提案した。Further, conventionally, a ceramic multilayer capacitor using a Ni electrode as an internal electrode has an electrode paste in which a glass component is added to Ni metal powder, and (Ba 1-x Ca x (Ti 1-y Zr y ) O 3 powder is used. It was manufactured by printing on a green sheet as a main component, laminating this sheet by a usual method, and baking it in a reducing atmosphere. It was bonded by the components.Also, as an electrode paste that does not use a glass component, the applicant has previously
In JP-A-64-80007 (Japanese Patent Application No. 62-236029), an electrode paste in which a carbide powder is added to a base metal powder containing nickel as a main component is proposed. (Sho 62-236032) proposed an electrode paste in which a nitride powder was added to a base metal powder containing nickel as a main component.
（発明が解決しようとする課題） しかしながら、従来のNi電極を内部電極として用いたセ
ラミック積層コンデンサにおいて、ガラス成分を添加し
た電極ペーストの場合は、上記したように、素体とNi内
部電極がガラス成分により接合されているため、ガラス
相と素体、あるいはガラス相とNi内部電極との熱膨張差
から、焼成過程において、デラミネーションが発生し易
い。このため、得られたセラミック積層コンデンサの耐
湿特性が劣化し、信頼性に問題を残している。また、特
開昭64−80007号で提案の炭化物粉末を用いた電極ペー
ストの場合は、ガラス成分を用いた電極ペーストの問題
点である積層コンデンサの耐湿特性の劣化を防止できる
が、電極ペーストを未焼成の磁器シート、即ちグリーン
シートに積層し、その後還元雰囲気中で焼成処理を施し
てコンデンサ磁器体を得る際、作用の欄に記載のよう
に、炭化物の一部は次のように反応し、これにより金属
粒子の炭化物（MzCw）が析出する。(Problems to be solved by the invention) However, in a ceramic multilayer capacitor using a conventional Ni electrode as an internal electrode, in the case of an electrode paste containing a glass component, as described above, the element body and the Ni internal electrode are made of glass. Since the components are bonded together, delamination is likely to occur in the firing process due to the difference in thermal expansion between the glass phase and the element body, or the glass phase and the Ni internal electrode. For this reason, the moisture resistance of the obtained ceramic multilayer capacitor is deteriorated, leaving a problem in reliability. Further, in the case of the electrode paste using the carbide powder proposed in JP-A-64-80007, it is possible to prevent the deterioration of the moisture resistance characteristics of the multilayer capacitor, which is a problem of the electrode paste using a glass component. When laminated on an unfired porcelain sheet, that is, a green sheet, and then subjected to a firing treatment in a reducing atmosphere to obtain a capacitor porcelain body, as described in the column of action, a part of the carbide reacts as follows. As a result, carbide (MzCw) of metal particles is deposited.
wM′xCy＋（yxz）Ｍ→（xxw）Ｍ′＋yMzCw 式中、Ｍ′はTi等の金属元素、Ｍは卑金属粉末に含まれ
る金属元素である。wM′xCy + (yxz) M → (xxw) M ′ + yMzCw In the formula, M ′ is a metal element such as Ti, and M is a metal element contained in the base metal powder.
このように、焼成処理によりその一部とは言え、ニッケ
ル等の卑金属粒子の炭化物が析出されることにより、そ
の析出した炭化ニッケルは電極として作用しないため、
得られたコンデンサの比抵抗の増大、或いは容量の低下
の原因となることが生じやすいという問題がある。Thus, although a part of it by the firing treatment, because the carbide of the base metal particles such as nickel is deposited, the deposited nickel carbide does not act as an electrode,
There is a problem that it tends to cause an increase in the specific resistance of the obtained capacitor or a decrease in the capacitance.
この問題点は特開昭64−80010号で提案の窒化物粉末を
用いた電極ペーストの場合にも同様に生ずる。This problem also occurs in the case of the electrode paste using the nitride powder proposed in Japanese Patent Laid-Open No. 64-80010.
そこで、本発明は、上記従来のコンデンサの問題点を解
決して、焼成工程においてデラミネーションが発生せ
ず、その結果、種々の特性を良好に維持することのでき
るセラミック積層コンデンサ、およびその製法を提供す
ることを目的とするものである。Therefore, the present invention solves the problems of the conventional capacitors described above, delamination does not occur in the firing process, as a result, a ceramic multilayer capacitor capable of maintaining various characteristics satisfactorily, and its manufacturing method. It is intended to be provided.
（課題を解決するための手段） 本願の第１の発明は、Ni内部電極と素体とを接合層を介
して接合してなるセラミック積層コンデンサにおいて、
上記接合層がアルミノシリケートで形成されていること
を特徴とするものである。(Means for Solving the Problems) A first invention of the present application is a ceramic multilayer capacitor formed by joining a Ni internal electrode and an element body through a joining layer,
The above-mentioned bonding layer is formed of aluminosilicate.
本願の第２の発明は、電極ペーストを、セラミック素体
用グリーンシート上に印刷し、この後、該グリーンシー
トを複数枚積層したものを焼成することからなるセラミ
ック積層コンデンサの製法において、前記電極ペースト
はNi成分100重量部に対してSiおよびAlをそれらの酸化
物の形で0.1〜10重量部添加したペーストであることを
特徴とする。A second invention of the present application is a method for manufacturing a ceramic multilayer capacitor, which comprises printing an electrode paste on a green sheet for a ceramic body, and then firing a laminate of a plurality of the green sheets. The paste is characterized in that 0.1 to 10 parts by weight of Si and Al in the form of their oxides are added to 100 parts by weight of Ni component.
（作用） 本発明によれば、上記したように、Niペースト中へSiお
よびAlをそれらの酸化物として添加することにより、焼
成後、素体・内部電極間に板状のアルミノシリケート相
が析出する。(Function) According to the present invention, as described above, by adding Si and Al to the Ni paste as oxides thereof, a plate-shaped aluminosilicate phase is precipitated between the element body and the internal electrode after firing. To do.
これは、焼成過程高温において、Ni電極中に固溶あるい
は偏在していたSiおよびAlの酸化物が、焼成過程冷却中
にNi電極から析出し、アルミノシリケート相としてエピ
タキシャル成長を起こしていると考えられる。また、こ
のアルミノシリケート相は、SiおよびAlの酸化物を主成
分とし、Niが混合したものである。It is considered that the Si and Al oxides that were solid-dissolved or unevenly distributed in the Ni electrode at the high temperature during the firing process were precipitated from the Ni electrode during the cooling during the firing process and caused epitaxial growth as an aluminosilicate phase. . Further, the aluminosilicate phase is a mixture of Si and Al oxides as main components and Ni mixed.
以上により、本発明によれば、従来のように、内部電極
ペースト中にガラス成分を添加しなくとも、素体−電極
間を強固に結合することが可能であり、デラミネーショ
ンも抑えられ、セラミック積層コンデンサの信頼性の向
上が図れる。As described above, according to the present invention, it is possible to strongly bond between the element body and the electrode without adding a glass component to the internal electrode paste as in the conventional case, the delamination is suppressed, and the ceramic The reliability of the multilayer capacitor can be improved.
なお、Si、Al成分を素体成分中へ添加すると、コンデン
サの誘電率等の電気的特性が大きく変動し、その電気特
性を把握しずらくなるので、本発明ではSiおよびAlの添
加を電極ペーストで行うこととした。また、この電極ペ
ースト中への添加はSiおよびAlを酸化物の形で、その総
添加量の範囲をNi成分100重量部に対して0.1〜10重量部
としたのは、添加量が0.1重量部より少ないと、アルミ
ノシリケート相の析出量が少なく、素体−電極間の接合
が十分でなく、コンデンサの静電容量が低下するととも
に、誘電損失が悪化する等の特性上の問題が生ずる一
方、添加量が10重量部を超えると、電極自体の焼結が阻
害され、多孔質の電極となり、耐湿特性の低下を招くか
らである。Note that when Si and Al components are added to the element body component, the electrical characteristics such as the dielectric constant of the capacitor fluctuate significantly and it becomes difficult to grasp the electrical characteristics. I decided to use paste. Further, the addition to the electrode paste is Si and Al in the form of oxides, and the range of the total addition amount is 0.1 to 10 parts by weight with respect to 100 parts by weight of Ni component, the addition amount is If the amount is less than the part, the amount of aluminosilicate phase deposited is small, the element-electrode joint is not sufficient, the capacitance of the capacitor decreases, and the dielectric loss deteriorates. If the added amount exceeds 10 parts by weight, the sintering of the electrode itself is hindered and a porous electrode is formed, resulting in deterioration of moisture resistance.
（実施例） 以下、添付図面を参照しつつ本発明の好ましい実施例に
よるセラミック積層コンデンサ、およびその製造方法に
ついて説明する。(Example) Hereinafter, a ceramic multilayer capacitor according to a preferred embodiment of the present invention and a method for manufacturing the same will be described with reference to the accompanying drawings.
セラミック積層コンデンサの構造 図面は、本発明の実施例によるセラミック積層コンデン
サの２層を示す断面図である。Structure of Ceramic Monolithic Capacitor The drawings are cross-sectional views showing two layers of a ceramic monolithic capacitor according to an embodiment of the present invention.
セラミック積層コンデンサは、第１図に示されているよ
うな、Niで内部電極１が形成された誘電体すなわち素体
２を複数枚積層して形成されている。また、上記内部電
極１と素体２の間には、アルミノシリケート相である接
合層３が形成され、該内部電極１と素体２とは、該接合
層３によって強固に接合されている。The ceramic multilayer capacitor is formed by laminating a plurality of dielectrics, that is, an element body 2 in which an internal electrode 1 is formed of Ni, as shown in FIG. Further, a bonding layer 3 which is an aluminosilicate phase is formed between the internal electrode 1 and the element body 2, and the internal electrode 1 and the element body 2 are firmly bonded by the bonding layer 3.
具体的実施例 まず、上記素体２を形成するため、次の作業を行った。Specific Examples First, the following work was performed to form the element body 2.
すなわち、まず、純度99.9％以上のBaCO3、CaCO3、Ti
O2,ZrO2を出発原料として、基本成分 〔（Ba0.91Ca0.09）Ｏ〕1.02（Ti0.83Zr0.17）O2 となるように秤量した。That is, first, BaCO 3 , CaCO 3 , and Ti with a purity of 99.9% or more are used.
O 2 and ZrO 2 were used as starting materials, and weighed so that the basic component [(Ba 0.91 Ca 0.09 ) O] 1.02 (Ti 0.83 Zr 0.17 ) O 2 was obtained.
次に、上記秤量した原料を15時間、湿式混合し、粉砕し
た後、乾燥し、次いで、大気中において、約1200℃で、
２時間仮焼を行った。Next, the weighed raw materials are wet mixed for 15 hours, pulverized and then dried, and then in the atmosphere at about 1200 ° C.,
It was calcined for 2 hours.
上記基本成分100重量部に対し、２重量部のLi2O−CaO−
SiO2ガラス粉末を添加し、これと同時に、アクリル酸エ
ステルポリマ、グリセリン、縮合燐酸塩の水溶液からな
る有機バインダを15重量部加え、更に50重量部の純水を
加え、ボールミルで混合し、セラミック原料のスラリを
作製した。この原料スラリから、ドクターブレード法に
よりセラミックグリーンシートを作製した。2 parts by weight of Li 2 O-CaO- based on 100 parts by weight of the above basic components
SiO 2 glass powder was added, and at the same time, 15 parts by weight of an organic binder consisting of an aqueous solution of acrylic ester polymer, glycerin, and condensed phosphate was added, and further 50 parts by weight of pure water was added and mixed in a ball mill to make a ceramic. A raw material slurry was prepared. A ceramic green sheet was produced from this raw material slurry by the doctor blade method.
一方、Niを95重量％、Al2O3とSiO2とを総量で５重量％
に、有機ビヒクルを添加して、導電性の電極ペーストを
作製し、この電極ペーストを、上記セラミックグリーン
シートの一方の主面上に、内部電極の電極パターンで印
刷した。この後、上記のように電極パターンが印刷され
たセラミックグリーンシートを所定の枚数積層し、熱圧
着し一体化させた。On the other hand, Ni is 95% by weight and Al 2 O 3 and SiO 2 are 5% by weight in total.
Then, an organic vehicle was added to prepare a conductive electrode paste, and this electrode paste was printed on one main surface of the ceramic green sheet with an electrode pattern of internal electrodes. After that, a predetermined number of ceramic green sheets on which the electrode patterns were printed as described above were laminated and thermocompression bonded to be integrated.
次に、上記一体化させたグリーンシートの積層体をカッ
トし、チップ化したものを、加熱炉中に配置し、空気中
で、室温から600℃まで昇温させて加熱し、有機バイン
ダを燃焼させた。更に、加熱炉の雰囲気を非酸性雰囲気
（例えば、H21.5％−N298.5％）に変え、焼成温度1200
℃で３時間保持し、上記チップ化したものの焼成を行っ
た。Next, the laminated body of the integrated green sheets is cut and made into chips, which are placed in a heating furnace, heated in the air from room temperature to 600 ° C., and heated to burn the organic binder. Let Furthermore, the atmosphere of the heating furnace is changed to a non-acidic atmosphere (for example, H 2 1.5% -N 2 98.5%), and the firing temperature is set to 1200.
The chips were held at 3 ° C. for 3 hours and fired.
以上により得られたコンデンサチップの電極−素体界面
の構造は、上記図の様であった。The structure of the electrode-element interface of the capacitor chip thus obtained was as shown in the above figure.
このように作製されたコンデンサチップ100個の絶縁抵
抗を測定したところ、いずれも103MΩ以上であり、ガラ
ス成分で内部電極と素体を結合したものと変わらなかっ
た。このことから、本実施例によるものも、上記アルミ
ノシリケート相からなる接合層３によって、内部電極１
−素体２間が強固に結合されていることが分かる。When the insulation resistance of 100 capacitor chips manufactured in this way was measured, they were all 10 3 MΩ or more, which were the same as those in which the internal electrode and the element body were bonded with a glass component. From this, in the case of the present embodiment as well, the internal electrode 1 is formed by the bonding layer 3 made of the aluminosilicate phase.
-It can be seen that the element bodies 2 are firmly connected.
比較例 電極ペーストを、Niを95重量％、PbO−BaO−SiO2ガラス
を５重量％に、有機ビヒクルを添加して形成したものに
変えた他は上記実施例と同様の方法で、比較例のコンデ
ンサチップを作製した。Comparative Example A comparative example was carried out in the same manner as in the above-described example except that the electrode paste was changed to one formed by adding 95% by weight of Ni, 5% by weight of PbO—BaO—SiO 2 glass, and an organic vehicle. A capacitor chip was manufactured.
以上のように作製した実施例のコンデンサチップと比較
例のコンデンサチップを用いて、デラミネーション検査
と、コンデンサの信頼性で問題となる耐湿負荷試験を行
った。Using the capacitor chip of the example and the capacitor chip of the comparative example manufactured as described above, a delamination test and a moisture resistance load test, which is a problem in the reliability of the capacitor, were performed.
デラミネーション検査は、上記実施例と比較例のコンデ
ンサチップをそれぞれ100個づつ各々樹脂中に埋め込
み、チップの内部電極が形成されている面を紙やすりを
用いて水平方向に研磨しながら、時々拡大鏡（×30）で
研磨面を観察さる方法で行った。The delamination inspection was performed by embedding 100 capacitor chips of each of the above-mentioned Example and Comparative Example in a resin, respectively, and enlarging the surface of the chip on which the internal electrodes were formed in the horizontal direction using sandpaper while occasionally expanding. It was performed by observing the polished surface with a mirror (× 30).
その結果、本実施例のコンデンサチップでは、デラミネ
ーションの発生個数は零、即ち、発生率0/100であった
のに対して、比較例でのデラミネーション発生個数は３
個、即ち発生率3/100であった。As a result, in the capacitor chip of this example, the number of delaminations generated was zero, that is, the generation rate was 0/100, whereas the number of delaminations generated in the comparative example was three.
In other words, the incidence was 3/100.
次に、耐湿負荷試験は、上記実施例と比較例のコンデン
サチップをそれぞれ100個づつ、予め所定形状パターン
ニングされているプリント基板に、リフロー炉を用いて
ハンダ付けした後、定格電圧（50V）を印加した状態
で、恒温（60℃）恒湿（95％）槽中に1000時間放置し、
この放置の前後の絶縁抵抗を比較することにより行っ
た。Next, the humidity resistance load test is performed by soldering the capacitor chips of the above-mentioned Example and Comparative Example, 100 each, to a printed circuit board that has been patterned in a predetermined shape using a reflow oven, and then rated the voltage (50V). With the applied voltage, leave it in a constant temperature (60 ° C), constant humidity (95%) bath for 1000 hours,
The comparison was performed by comparing the insulation resistance before and after the standing.
その結果、本実施例のコンデンサチップでは、そのいず
れもが絶縁抵抗の変化が無かったのに対して、比較例の
ものでは、５個のチップにおいて絶縁抵抗抵抗の低下が
見られ、即ち、耐湿特性劣化率が5/100であった。As a result, in each of the capacitor chips of this example, there was no change in the insulation resistance, whereas in the comparative example, the decrease of the insulation resistance resistance was observed in the five chips, that is, the moisture resistance. The characteristic deterioration rate was 5/100.
（発明の効果） 以上の説明から分かるように、本発明のセラミック積層
コンデンサによれば、Ni内部電極と素体との間にアルミ
ノシリケートから成る接合層を有しているので、内部電
極−素体間が強固に結合され、かつデラミネーションの
発生も抑えられるとともに、耐湿特性が向上する等の効
果がある。(Effects of the Invention) As can be seen from the above description, according to the ceramic multilayer capacitor of the present invention, since the bonding layer made of aluminosilicate is provided between the Ni internal electrode and the element body, the internal electrode-element There are effects such that the body is firmly bound, delamination is suppressed, and the moisture resistance is improved.
また、本発明の製法によれば、NiにSiおよびAlの酸化物
を添加したペーストを用いるようにしたので、ガラス成
分を用いなくとも、内部電極−素体間に強固に結合さ
れ、かつデラミネーションの発生がなく、耐湿特性が向
上したNi内部電極と素体との間にアルミノシリケートか
ら成る接合層を有するセラミック積層コンデンサを容易
に製造することが出来る。Further, according to the production method of the present invention, since the paste obtained by adding the oxides of Si and Al to Ni is used, the internal electrode is firmly bonded between the internal electrode and the element body without using the glass component, and It is possible to easily manufacture a ceramic multilayer capacitor having a bonding layer made of aluminosilicate between a Ni internal electrode having improved moisture resistance and an element body without causing lamination.
図は、本発明の実施例によるセラミック積層コンデンサ
の２層の断面図である。 １……内部電極 ２……素体 ３……接合層The figure is a cross-sectional view of two layers of a ceramic multilayer capacitor according to an embodiment of the present invention. 1 ... Internal electrode 2 ... Element body 3 ... Joining layer
Claims (2)
してなるセラミック積層コンデンサにおいて、前記接合
層がアルミノシリケートで形成されていることを特徴と
するセラミック積層コンデンサ。1. A ceramic multilayer capacitor in which a Ni internal electrode and an element body are bonded via a bonding layer, wherein the bonding layer is formed of aluminosilicate.
ンシート上に印刷し、この後、該グリーンシートを複数
枚積層したものを焼成することからなるセラミック積層
コンデンサの製法において、前記電極ペーストはNi成分
100重量部に対してSiおよびAlをそれらの酸化物の形で
0.1〜10重量部添加したペーストであることを特徴とす
るセラミック積層コンデンサの製法。2. A method for producing a ceramic multilayer capacitor, which comprises printing an electrode paste on a green sheet for a ceramic body and then firing a laminate of a plurality of the green sheets, wherein the electrode paste is Ni. component
100 parts by weight of Si and Al in the form of their oxides
A method for producing a ceramic multilayer capacitor, which is a paste containing 0.1 to 10 parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25226989A JPH0756850B2 (en) | 1989-09-29 | 1989-09-29 | Ceramic multilayer capacitor and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25226989A JPH0756850B2 (en) | 1989-09-29 | 1989-09-29 | Ceramic multilayer capacitor and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03116810A JPH03116810A (en) | 1991-05-17 |
| JPH0756850B2 true JPH0756850B2 (en) | 1995-06-14 |
Family
ID=17234890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25226989A Expired - Lifetime JPH0756850B2 (en) | 1989-09-29 | 1989-09-29 | Ceramic multilayer capacitor and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0756850B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002270458A (en) * | 2001-03-08 | 2002-09-20 | Murata Mfg Co Ltd | Ceramic layered capacitor |
| JP2007194592A (en) * | 2005-12-20 | 2007-08-02 | Tdk Corp | Dielectric element and manufacturing method thereof |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3596743B2 (en) | 1999-08-19 | 2004-12-02 | 株式会社村田製作所 | Manufacturing method of multilayer ceramic electronic component and multilayer ceramic electronic component |
| TWI223291B (en) * | 2001-10-25 | 2004-11-01 | Matsushita Electric Industrial Co Ltd | Laminated ceramic electronic component and method of manufacturing the same |
-
1989
- 1989-09-29 JP JP25226989A patent/JPH0756850B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002270458A (en) * | 2001-03-08 | 2002-09-20 | Murata Mfg Co Ltd | Ceramic layered capacitor |
| JP2007194592A (en) * | 2005-12-20 | 2007-08-02 | Tdk Corp | Dielectric element and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03116810A (en) | 1991-05-17 |
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