JPH0760739B2 - Modulated mixed dielectric film and electroluminescent device and optical disk - Google Patents
Modulated mixed dielectric film and electroluminescent device and optical diskInfo
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- JPH0760739B2 JPH0760739B2 JP63047140A JP4714088A JPH0760739B2 JP H0760739 B2 JPH0760739 B2 JP H0760739B2 JP 63047140 A JP63047140 A JP 63047140A JP 4714088 A JP4714088 A JP 4714088A JP H0760739 B2 JPH0760739 B2 JP H0760739B2
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Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、変調混合誘電膜に係り、特に、エレクトロル
ミネセンス装置等の電位デバイス及び光ディスクに用い
るのに好適な誘電膜の膜構造に関するものである。Description: TECHNICAL FIELD The present invention relates to a modulated mixed dielectric film, and more particularly to a film structure of a dielectric film suitable for use in a potential device such as an electroluminescence device and an optical disc. Is.
誘電膜は、誘電率が高く破壊電界強度の高いことが応用
上重要であるが、一般にこの両者は背反関係にある。そ
こで、第1図(b)のSiO2,Ta2O5などの単体膜の改良
として、第1図(c)の積層構造膜(特開昭52−129296
号)があり、さらにその改良として、第1図(d)の混
合構造膜(特開昭59−224098号)がある。It is important for application that the dielectric film has a high dielectric constant and a high breakdown electric field strength, but in general, these two are in a trade-off relationship. Therefore, as an improvement of the single film of SiO 2 , Ta 2 O 5, etc. in FIG. 1 (b), the laminated structure film of FIG. 1 (c) (Japanese Patent Laid-Open No. 52-129296) is used.
No.), and a further improvement thereof is the mixed structure film of FIG. 1 (d) (JP-A-59-224098).
しかし、従来の混合膜構造でも、用いる単体材料の破壊
特性(強いて分ければ、自己修復型破壊と伝搬型破壊に
分けられるが、相対的な性格である。)の違いを活用す
る配慮がなく、破壊電界強度の向上が不十分であった。However, even in the conventional mixed film structure, there is no consideration for utilizing the difference in the fracture characteristics of the single material used (which can be divided into self-repair type fracture and propagation type fracture if they are classified by force, but they are relative characteristics). Improvement of the breakdown electric field strength was insufficient.
本発明の目的は、混合膜構造の改良によって破壊電界強
度及び熱的破壊特性を向上させた変調混合誘電膜並びに
この膜を応用したエレクトロルミネセンス装置及び光デ
ィスクを提供することである。It is an object of the present invention to provide a modulated mixed dielectric film in which the breakdown electric field strength and the thermal breakdown characteristics are improved by improving the mixed film structure, and an electroluminescence device and an optical disk to which this film is applied.
本発明は、上記目的を達成するために、少なくとも2種
類の材料により製造される誘電膜において、前記膜材料
の混合比が、膜厚方向に5〜300Å周期で変化すること
を特徴とする変調混合誘電膜を提案するものである。In order to achieve the above-mentioned object, the present invention is a dielectric film produced from at least two kinds of materials, wherein the mixing ratio of the film materials changes in the film thickness direction at a period of 5 to 300Å. A mixed dielectric film is proposed.
前記膜材料は、伝搬型絶縁破壊的性格の強い材料と自己
修復型絶縁破壊的性格の強い材料との組み合せとする。The film material is a combination of a material having a strong propagation type dielectric breakdown characteristic and a material having a self-repairing type dielectric breakdown characteristic.
具体的には、SiO2,Y2O3,Si3N4,Sm2O3,Ta2O5,Ti
O2,HfO2,Al2O3,ZrO2,X-TaO3,X-NbO3,X-TiO3(た
だしXは金属)のうち少なくとも2つの組み合せからな
る。Specifically, SiO 2 , Y 2 O 3 , Si 3 N 4 , Sm 2 O 3 , Ta 2 O 5 , Ti
It is composed of at least two combinations of O 2 , HfO 2 , Al 2 O 3 , ZrO 2 , X-TaO 3 , X-NbO 3 , and X-TiO 3 (where X is a metal).
本発明はまた、上記構造及び成分の変調混合誘電膜を絶
縁層の少なくとも一部として用いたエレクトロルミネセ
ンス装置を提案するものである。The present invention also proposes an electroluminescence device using the modulated mixed dielectric film having the above structure and components as at least a part of the insulating layer.
本発明はさらに、上記構造及び成分の変調混合誘電膜を
保護層の少なくとも一部として用いた光ディスクを提案
するものである。The present invention further proposes an optical disc using the modulated mixed dielectric film having the above structure and components as at least a part of the protective layer.
本発明による変調混合誘電膜の構造の概念を示す第1図
(a)において、材料Aを高誘電率で伝搬型破壊の低破
壊電圧性の材料とし、材料Bを低誘電率で自己修復型破
壊の高破壊電圧性の材料とする。すると、材料Aが多く
配合された領域(層)は伝搬型破壊の特質を持ってはい
るが、この領域を充分薄く設定し、自己修復型破壊の特
質を持つ材料Bを多く含む領域で挟むことにより、膜全
体の破壊モードを自己修復型にできる。これは膜の破壊
をもたらす熱に対する安定性を向上させた結果である。In FIG. 1 (a) showing the concept of the structure of the modulation mixed dielectric film according to the present invention, the material A is a material having a high dielectric constant and a low breakdown voltage of propagation type breakdown, and the material B is a low dielectric constant and self-repairing type. Use a material with high breakdown voltage. Then, although the region (layer) containing a large amount of the material A has the characteristic of propagation type destruction, this region is set sufficiently thin and sandwiched by the region containing a large amount of the material B having the characteristic of self-repairing type destruction. As a result, the breakdown mode of the entire film can be made self-repairing. This is a result of improved stability to heat that causes the membrane to break.
ここまでは、伝搬型破壊と自己修復型破壊との両極端に
分けて説明したが、実際の破壊では、低電圧側で自己修
復し高電圧側で伝搬型となる材料が多い。破壊電界強度
はどの電圧から伝搬型破壊が生じるかで決定されるた
め、材料を2種類に分類することは必ずしも正確ではな
く、2つの材料を比較したとき、いずれかをより自己修
復的性格の強い材料とみなせるのである。これら2つ以
上の材料に対して変調混合の手法を用いると、先に述べ
た伝搬型破壊の材料と自己修復型破壊の材料を変調混合
した場合と同じ概念の効果が得られ、熱的安定性及び破
壊電界強度が上がる。Up to this point, the description has been divided into the extremes of propagation type breakdown and self-repair type breakdown, but in actual breakdown, many materials are self-repairing on the low voltage side and propagation type on the high voltage side. Since the breakdown electric field strength is determined by which voltage causes the propagation type breakdown, it is not always accurate to classify the materials into two types, and when comparing the two materials, one of the two materials with a more self-healing character is compared. It can be regarded as a strong material. When the method of modulation mixing is used for these two or more materials, the effect of the same concept as the case of modulating the materials of the propagation-type breakdown and the self-repair type destruction described above is obtained, and the thermal stability is obtained. Property and breakdown electric field strength are increased.
さて、変調混合誘電膜を作成するには、2つ以上の粒子
発生源のある成膜装置を用いれば良く、スパッタリン
グ,蒸着,MBE,CVD等の方法による。Now, in order to form the modulated mixed dielectric film, a film forming apparatus having two or more particle generation sources may be used, and a method such as sputtering, vapor deposition, MBE or CVD is used.
端的な例としては、A材料成膜→AB材料同時成膜→B材
料成膜→AB材料同時成膜→A材料成膜……の手順を採
る。As a straightforward example, the steps of A material film formation → AB material film formation → B material film formation → AB material film formation → A material film formation ...
また、イオンプレーティングなどにより、上部膜材料を
下部膜材料に打ち込めば、上記手順のAB材料同時成膜と
同様の混合膜を作成できる。If the upper film material is implanted into the lower film material by ion plating or the like, a mixed film similar to the AB film simultaneous film formation in the above procedure can be formed.
これらの変調構造は、断面TEM(透過型電子顕微鏡)で
直接観察して確認可能である。また、各層の厚さが50Å
以上の場合は、SIMS(2次イオン質量分析)により確認
できる。These modulation structures can be confirmed by direct observation with a cross-sectional TEM (transmission electron microscope). Also, the thickness of each layer is 50Å
The above cases can be confirmed by SIMS (secondary ion mass spectrometry).
また、変調周期は膜中で一定である必要はなく、用途と
材料の種類や膜成長の特性等によっては、膜周期を変化
させた方がより良い特性を実現できる。Further, the modulation period does not have to be constant in the film, and better properties can be realized by changing the film period depending on the application, the type of material, the film growth property, and the like.
次に、本発明による変調混合誘電膜の一実施例を第2図
により説明する。Next, an embodiment of the modulated mixed dielectric film according to the present invention will be described with reference to FIG.
第2図は、自己修復型破壊的性格の強いSiO2と伝搬型破
壊的性格の強いTiO2とで作成した膜の比誘電率と破壊電
界強度を示す図である。この膜は、SiO2ターットとTiO2
ターゲットとを交互にスパッタして作成した。SiO2とTi
O2との1度に作成される膜厚を、それぞれ、計算上9Å
と3Å,30Åと10Å,60Åと20Å,150Åと50Å,300Åと10
0Å,1800Åと600Åずつにして、総膜厚が5000Åになる
までくり返して積層した。この場合、スパッタされる粒
子の膜中への打ち込みの効果のために、SiO2とTiO2の境
界ではSiO2−TiO2の混合層が形成されており、その層は
光吸収端の測定などから、10〜20Å程度と推定される。
第2図に示すように、比誘電率はほぼ一定であるが、破
壊電界強度はTiO2層の計算上の厚さが100Å以下の領域
で向上している。この値は、TiO2−75%SiO2混合ターゲ
ットを用いて作成した均一混合膜の破壊電界強度(第2
図縦軸左の矢印位置)よりも大きい。すなわち、300Å
以下の周期の膜において変調混合効果による特性向上が
認められる。なお、変調周期厚をあまりに薄くすると従
来の混合膜に近くなるので、ここでは下限を5Åとして
ある。FIG. 2 is a diagram showing the relative dielectric constant and the breakdown electric field strength of a film made of SiO 2 having a strong self-repairing destructive character and TiO 2 having a strong propagating type destructive character. This film is composed of SiO 2 tarts and TiO 2
The target and the target were alternately sputtered. SiO 2 and Ti
The calculated film thickness with O 2 is 9Å for each calculation.
And 3Å, 30Å and 10Å, 60Å and 20Å, 150Å and 50Å, 300Å and 10
Layers were repeatedly laminated until the total film thickness reached 5000Å, with 0Å, 1800Å and 600Å each. In this case, due to the effect of implanting sputtered particles into the film, a mixed layer of SiO 2 -TiO 2 is formed at the boundary between SiO 2 and TiO 2 , and that layer is used for measuring the light absorption edge. Therefore, it is estimated to be about 10 to 20Å.
As shown in FIG. 2, the dielectric constant is almost constant, but the breakdown electric field strength is improved in the region where the calculated thickness of the TiO 2 layer is 100 Å or less. This value is the breakdown electric field strength of the homogeneous mixed film prepared by using the TiO 2 -75% SiO 2 mixed target (second
It is larger than the arrow position on the left side of the vertical axis in the figure). That is, 300Å
In the films having the following periods, the characteristic improvement due to the modulation mixing effect is recognized. If the modulation period thickness is made too thin, the thickness becomes close to that of the conventional mixed film, so the lower limit is set to 5Å here.
この変調混合誘電膜を応用した薄膜EL(エレクトロルミ
ネセンス)素子の一実施例の断面構造を第3図に示す。
1はガラス基板、2は透明伝導膜(200nm厚)、3は第
1絶縁層(500nm厚)、4は発光層(ZnS:0.5wt%Mn,500
nm厚)、5は第2絶縁層(500nm厚)、6は背面電極(2
00nm厚)である。この薄膜EL素子の第1及び第2絶縁膜
に第2図で特性を示したTiO2/SiO2変調混合膜を適用し
たEL素子の1kHz正弦波による発光開始電圧と素子破壊電
圧とを第4図に示す。白丸が発光開始電圧、黒丸が素子
破壊電圧であり、この2つの差が駆動電圧マージンであ
る。安定駆動するには、この駆動電圧マージンを大きく
する必要があるが、第4図に示したように、300Å周期
以下の領域で駆動電圧マージンが増大している。FIG. 3 shows a cross-sectional structure of an embodiment of a thin film EL (electroluminescence) element to which this modulated mixed dielectric film is applied.
1 is a glass substrate, 2 is a transparent conductive film (200 nm thick), 3 is a first insulating layer (500 nm thick), 4 is a light emitting layer (ZnS: 0.5 wt% Mn, 500)
nm thickness), 5 is the second insulating layer (500 nm thickness), 6 is the back electrode (2
(00 nm thickness). The emission start voltage and the element breakdown voltage by the 1 kHz sine wave of the EL element in which the TiO 2 / SiO 2 modulation mixed film whose characteristics are shown in FIG. 2 are applied to the first and second insulating films of this thin film EL element are Shown in the figure. The white circles are the light emission start voltage, the black circles are the element breakdown voltage, and the difference between the two is the drive voltage margin. For stable driving, it is necessary to increase the driving voltage margin, but as shown in FIG. 4, the driving voltage margin increases in the region of 300 Å cycle or less.
光磁気ディスクの保護層に本発明変調混合膜を用いた実
施例を第5図に示す。FIG. 5 shows an embodiment in which the modulation mixed film of the present invention is used as the protective layer of the magneto-optical disk.
光磁気ディスクの記録層を一方または両面からはさむ保
護層には、高屈折率,機械的強度,熱的安定性,低熱伝
導性等が要求される。混合絶縁膜は、単体膜の長所を組
み合せる意味でこの保護層として有効であるが、本発明
の変調混合誘電膜を用いると熱的安定性をさらに良くで
きる。第5図に示したのは、書換型光ディスクの断面構
造である。10はポリカーボネート基板、12はGdTbFe記録
層(50nm厚)、11は本発明による変調混合膜を適用した
保護層(10nm厚)である。スパッタリングによりTiO210
Å(計算上)とSiO210Å(計算上)とを交互に積層し、
スパッタされた粒子の膜中への打ち込みの効果によって
変調混合膜を作成してある。この結果、TiO2の高屈折率
とSiO2の優れた機械的強度に加えて、更に、熱的安定性
の向上が見られた。The protective layer sandwiching the recording layer of the magneto-optical disk from one side or both sides is required to have a high refractive index, mechanical strength, thermal stability, low thermal conductivity and the like. The mixed insulating film is effective as this protective layer in the sense that the advantages of the single film are combined, but the thermal stability can be further improved by using the modulated mixed dielectric film of the present invention. FIG. 5 shows the cross-sectional structure of a rewritable optical disc. Reference numeral 10 is a polycarbonate substrate, 12 is a GdTbFe recording layer (50 nm thick), and 11 is a protective layer (10 nm thick) to which the modulation mixed film according to the present invention is applied. TiO 2 10 by sputtering
Å (calculation) and SiO 2 10 Å (calculation) are laminated alternately,
A modulated mixed film is created by the effect of implanting sputtered particles into the film. As a result, in addition to the high refractive index of TiO 2 and the excellent mechanical strength of SiO 2 , the thermal stability was further improved.
本発明によれば、混合誘電膜の破壊電界強度を向上でき
る。従って、破壊電界強度が低すぎるため用いにくい高
誘電率材料を破壊電界強度が高い材料と混合した新材料
として利用可能である。特に、EL表示素子など、誘電率
と破壊電界強度の高さを合わせ持つ絶縁膜を必要とする
デバイスに有効である。According to the present invention, the breakdown electric field strength of the mixed dielectric film can be improved. Therefore, it is possible to use a new material in which a material having a high dielectric constant, which is difficult to use because the breakdown electric field strength is too low, is mixed with a material having a high breakdown electric field strength. In particular, it is effective for devices such as EL display devices that require an insulating film having both a dielectric constant and a high breakdown electric field strength.
具体的効果を示すため、スパッタリングにより作成した
変調混合膜(計算上、TiO210Å−SiO230Åの破壊電界強
度と総膜厚との関係7および混合膜(TiO2:SiO2=1:
3)の破壊電界強度と膜厚との関係8を第6図に揚げ
る。2周期以上について、本発明の効果が顕著である。In order to show a concrete effect, the modulation mixed film prepared by sputtering (calculated, the relation between the breakdown electric field strength of TiO 2 10Å−SiO 2 30Å and the total film thickness 7 and the mixed film (TiO 2 : SiO 2 =
Figure 8 shows the relationship 8 between the breakdown electric field strength and the film thickness in 3). The effect of the present invention is remarkable for two or more cycles.
第1図(a)は本発明による変調混合誘電膜の構造の概
念,(b)は従来の単体膜,(c)は従来の積層膜,
(d)は従来の混合膜をそれぞれ示す図、第2図はTi
O2:SiO2=1:3のスパッタリングにより多積層混合した
膜の変調混合周期に対する比誘電率及び破壊電界強度を
示す図、第3図は薄膜EL素子の断面構造を示す図、第4
図は第3図のEL素子の絶縁層に第2図の変調混合誘電膜
を採用したときの発光開始電圧と素子破壊電圧とを示す
図、第5図は保護層に変調混合誘電膜を採用した光ディ
スクを示す図、第6図は変調混合誘電膜と従来の混合膜
の破壊電界強度を比較して示す図である。 1……ガラス基板、2……透明伝導膜、3……第1絶縁
層、4……発光層、5……第2絶縁層、6……背面電
極、7……変調混合誘電膜の破壊電界強度、8……従来
の混合膜の破壊電界強度、10……ポリカーボネート基
板、11……保護層、12……GdTbFe記録層。FIG. 1 (a) is a conceptual diagram of the structure of a modulated mixed dielectric film according to the present invention, (b) is a conventional single film, (c) is a conventional laminated film,
(D) shows a conventional mixed film, and Fig. 2 shows Ti.
FIG. 4 is a diagram showing the relative permittivity and the breakdown electric field intensity with respect to the modulation mixing period of a film in which multiple layers are mixed by sputtering O 2 : SiO 2 = 1: 3. FIG.
The figure shows the emission start voltage and the element breakdown voltage when the modulation mixed dielectric film of FIG. 2 is adopted as the insulating layer of the EL element of FIG. 3, and FIG. 5 adopts the modulation mixed dielectric film as the protective layer. FIG. 6 is a diagram showing the prepared optical disc, and FIG. 6 is a diagram showing the breakdown electric field strengths of the modulated mixed dielectric film and the conventional mixed film in comparison. 1 ... Glass substrate, 2 ... Transparent conductive film, 3 ... First insulating layer, 4 ... Light emitting layer, 5 ... Second insulating layer, 6 ... Back electrode, 7 ... Modulation mixed dielectric film destruction Electric field strength, 8 ... Breakdown electric field strength of conventional mixed film, 10 ... Polycarbonate substrate, 11 ... Protective layer, 12 ... GdTbFe recording layer.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 田口 和夫 茨城県日立市久慈町4026番地 株式会社日 立製作所日立研究所内 (72)発明者 佐藤 明 茨城県日立市久慈町4026番地 株式会社日 立製作所日立研究所内 (72)発明者 橋本 健一 茨城県日立市久慈町4026番地 株式会社日 立製作所日立研究所内 (72)発明者 阿部 良夫 茨城県日立市久慈町4026番地 株式会社日 立製作所日立研究所内 (72)発明者 華園 雅信 茨城県日立市久慈町4026番地 株式会社日 立製作所日立研究所内 (56)参考文献 特開 昭52−129296(JP,A) 特開 昭59−224098(JP,A) 特開 昭53−43700(JP,A) 特開 昭58−194206(JP,A) 特開 昭60−121605(JP,A) 特開 昭62−133605(JP,A) 特開 昭62−188038(JP,A) 特開 昭63−26995(JP,A) 特開 昭63−289793(JP,A) 特開 昭58−212119(JP,A) 特公 昭49−33756(JP,B1) ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Kazuo Taguchi 4026 Kuji Town, Hitachi City, Ibaraki Prefecture Hitate Works, Ltd., Hitachi Research Institute (72) Akira Sato 4026 Kuji Town, Hitachi City, Ibaraki Prefecture Hitate Works Co., Ltd. Within Hitachi Research Laboratory (72) Kenichi Hashimoto 4026 Kuji Town, Hitachi City, Hitachi, Ibaraki Prefecture Hitachi Research Institute, Ltd. (72) Inventor Yoshio Abe 4026 Kuji Town, Hitachi City, Ibaraki Hitachi Research Institute, Ltd. ( 72) Inventor Masanobu Hanazono 4026 Kuji Town, Hitachi City, Ibaraki Prefecture Hitachi Research Laboratory, Hitachi Co., Ltd. (56) References JP-A-52-129296 (JP, A) JP-A-59-224098 (JP, A) Special Kai 53-43700 (JP, A) JP 58-194206 (JP, A) JP 60-121605 (JP, A) JP 62-133605 (JP, A) Kai 62-188038 (JP, A) JP 63-26995 (JP, A) JP 63-289793 (JP, A) JP 58-212119 (JP, A) JP 49-33756 ( JP, B1)
Claims (5)
誘電膜において、 前記膜材料の混合比が、膜厚方向に5〜300Å周期で変
化することを特徴とする変調混合誘電膜。1. A modulated mixed dielectric film, comprising: a dielectric film made of at least two kinds of materials, wherein a mixing ratio of the film materials changes in a film thickness direction at a period of 5 to 300Å.
修復型絶縁破壊的性格の強い材料との組み合せからなる
ことを特徴とする変調混合誘電膜。2. The modulated mixed dielectric film according to claim 1, wherein the film material is a combination of a material having a strong propagation type dielectric breakdown characteristic and a material having a self-repairing type dielectric breakdown characteristic. Modulated mixed dielectric film.
おいて、 前記膜材料が、SiO2,Y2O3,Si3N4,Sm2O3,Ta2O5,TiO
2,HfO2,Al2O3,ZrO2,X-TaO3,X-NbO3,X-TiO3(ただ
しXは金属)のうち少なくとも2つの組み合せからなる
ことを特徴とする変調混合誘電膜。3. The modulated mixed dielectric film according to claim 1, wherein the film material is SiO 2 , Y 2 O 3 , Si 3 N 4 , Sm 2 O 3 , Ta 2 O 5 , TiO 2.
2, HfO 2, Al 2 O 3, ZrO 2, X-TaO 3, X-NbO 3, modulating mixed dielectric film X-TiO 3 (where X is a metal), characterized in that it consists of at least two combinations of .
を絶縁層の少なくとも一部として用いることを特徴とす
るエレクトロルミネセンス装置。4. An electroluminescent device, wherein the modulated mixed dielectric film according to claim 1, 2 or 3 is used as at least a part of an insulating layer.
を保護層の少なくとも一部として用いることを特徴とす
る光ディスク。5. An optical disc comprising the modulated mixed dielectric film according to claim 1, 2 or 3 as at least a part of a protective layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63047140A JPH0760739B2 (en) | 1988-02-29 | 1988-02-29 | Modulated mixed dielectric film and electroluminescent device and optical disk |
| US07/454,961 US5200277A (en) | 1988-02-29 | 1989-12-22 | Electroluminescent device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63047140A JPH0760739B2 (en) | 1988-02-29 | 1988-02-29 | Modulated mixed dielectric film and electroluminescent device and optical disk |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01221806A JPH01221806A (en) | 1989-09-05 |
| JPH0760739B2 true JPH0760739B2 (en) | 1995-06-28 |
Family
ID=12766803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63047140A Expired - Lifetime JPH0760739B2 (en) | 1988-02-29 | 1988-02-29 | Modulated mixed dielectric film and electroluminescent device and optical disk |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0760739B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3047256B2 (en) * | 1991-06-13 | 2000-05-29 | 株式会社豊田中央研究所 | Dielectric thin film |
| JP4450252B2 (en) | 2005-04-13 | 2010-04-14 | パイオニア株式会社 | Recording medium, recording apparatus and recording method, and reproducing apparatus and reproducing method |
| CN107586499B (en) * | 2017-10-26 | 2020-04-14 | 弋阳县中泰君诺新材料有限公司 | Building exterior wall heat insulation coating and preparation method thereof |
-
1988
- 1988-02-29 JP JP63047140A patent/JPH0760739B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01221806A (en) | 1989-09-05 |
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