JPH0760774B2 - Manufacturing method of small common mode coil - Google Patents
Manufacturing method of small common mode coilInfo
- Publication number
- JPH0760774B2 JPH0760774B2 JP2987587A JP2987587A JPH0760774B2 JP H0760774 B2 JPH0760774 B2 JP H0760774B2 JP 2987587 A JP2987587 A JP 2987587A JP 2987587 A JP2987587 A JP 2987587A JP H0760774 B2 JPH0760774 B2 JP H0760774B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- common mode
- piece
- terminal
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Insulating Of Coils (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は樹脂により外装を施したリード端子付小型コモ
ンモードコイルの製造方法に関する。The present invention relates to a method for manufacturing a small-sized common mode coil with a lead terminal, which is sheathed with a resin.
従来,小型のインダクタ素子としてトロイダル磁気コア
に被覆電線を巻回することによって形成されたものがあ
る。このインダクタンス素子は外装ケースに収納され,
外部回路と接続されるリード端子に巻線端末を巻き付け
半田付したのち,ケース内を樹脂,絶縁ワニス等を充填
してコモンモードコイルとして用いられている。したが
って,この種のコモンモードコイルは,第4図に示す例
のように下面に4本の端子8が突設され,またインダク
タンス素子1は外装ケース9に収納されており特に耐振
動性を要求されるときは外装ケース9内に絶縁ワニスな
どを充填して内部素子を固定し,保護している。Conventionally, there is a small inductor element formed by winding a coated electric wire around a toroidal magnetic core. This inductance element is housed in an outer case,
It is used as a common mode coil by winding a winding terminal around a lead terminal connected to an external circuit and soldering it, and then filling the inside of the case with resin, insulating varnish or the like. Therefore, in this type of common mode coil, four terminals 8 are projectingly provided on the lower surface as in the example shown in FIG. 4, and the inductance element 1 is housed in the outer case 9 so that vibration resistance is particularly required. In this case, the outer case 9 is filled with an insulating varnish or the like to fix and protect the internal elements.
しかし,このような従来のコモンモードコイルは巻線端
末を外装ケースのリード端子に接続するとき,巻線端末
が曲りやすく電子機器,回路基板への装着が面倒となる
欠点がある。また,コモンモードコイルは第4図のよう
に4端子8は一列に並んで配列されていないので,自動
挿入機を使用して自動的に組み立てることができないと
いう欠点がある。However, such a conventional common mode coil has a drawback that when the winding terminal is connected to the lead terminal of the outer case, the winding terminal is easily bent and mounting on the electronic device or the circuit board is troublesome. Further, in the common mode coil, as shown in FIG. 4, the four terminals 8 are not arranged side by side in a line, so that there is a drawback that the common mode coil cannot be automatically assembled using an automatic insertion machine.
本発明による小型コモンモードコイルの製造方法は,先
端に金属材よりなる挾持細片と圧着片とを対向させて設
けたスタンドオフ部と,該スタンドオフ部の他端側に延
設された細いリード端子片とからなるリード端子部を一
定間隔で複数本垂設させた帯状のリードフレームを備
え,前記挾持細片と前記圧着片との間に,絶縁材よりな
り中央に貫通孔を有する回路基板の縁辺に前記複数のリ
ード端子部と同じ間隔で設けられた複数個の端子用回路
パタンを挾持させ,かつ高磁性材よりなるトロイダル磁
気コア上に被覆された巻線材を巻回したインダクタ素子
を前記貫通孔にはめ込み,前記巻線材の端末を抵抗溶接
により前記圧着片に溶接したのち,前記回路基板の外囲
を樹脂で覆い,前記リード端子片を前記帯状のリードフ
レームから切断することを特徴とする。A method of manufacturing a small-sized common mode coil according to the present invention includes a stand-off portion provided with a holding strip and a crimping piece made of a metal material facing each other at a tip thereof, and a thin extension extending to the other end side of the stand-off portion. A circuit having a strip-shaped lead frame in which a plurality of lead terminal portions, each of which is composed of a lead terminal piece, are vertically erected at regular intervals, and which is made of an insulating material and has a through hole in the center between the holding strip and the crimping piece. An inductor element in which a plurality of terminal circuit patterns provided at the same intervals as the lead terminal portions are sandwiched on the edge of the substrate, and a winding material coated on a toroidal magnetic core made of a high magnetic material is wound. Is fitted into the through hole, the end of the winding material is welded to the crimping piece by resistance welding, the outer circumference of the circuit board is covered with resin, and the lead terminal piece is cut from the strip-shaped lead frame. And wherein the door.
樹脂で外装されたコモンモードコイルが複数個連続して
リード端子フレームに固定されるので,必要の都度スタ
ンドオフ部で切り取って使用される。しかも、コモンモ
ードコイルがリード端子フレームに整然と配列されてい
るので、自動機によってコイルを装置,または基板に取
り付けることができる。Since a plurality of common mode coils covered with resin are continuously fixed to the lead terminal frame, they are used by cutting them off at the standoff section whenever necessary. Moreover, since the common mode coils are arranged in order on the lead terminal frame, the coils can be attached to the device or the board by an automatic machine.
本発明による小型コモンモードコイルの製造方法につい
て,実施例を挙げて説明する。第1図に示すように,イ
ンダクタ素子1はトロイダル形フエライト磁気コア2に
被覆巻線材3を2本バイフィラー巻きに巻き回して形成
される。また,第2図に示すように,このインダクタ素
子1が取り付けられる薄板状の回路基板4には,その縁
辺に銅張積層プリント配線板をホトエッチング加工によ
り形成した一定間隔を有する端子用の複数個の回路パタ
ーン41と,中央にインダクタ素子1が収納される貫通孔
42とが貫設されている。A method for manufacturing a small common mode coil according to the present invention will be described with reference to examples. As shown in FIG. 1, the inductor element 1 is formed by winding two coated winding materials 3 around a toroidal ferrite magnetic core 2 around a bifilar winding. Further, as shown in FIG. 2, the thin circuit board 4 to which the inductor element 1 is attached has a plurality of terminals for terminals which are formed by photo-etching a copper clad laminated printed wiring board on the edge thereof. A circuit pattern 41 and a through hole for accommodating the inductor element 1 in the center
42 and are pierced.
ここで,第3図(a)はリード端子フレームの構造を回
路基板との結合前の状態で示したものである。ここで,
黄銅,ベリリウム銅,ステンレンス,鉄,またはそれら
の合金などの弾性に富み,良電導性の帯状金属板を主フ
レーム51とし,その一方の縁辺に上記回路パタン41の間
隔と同じ間隔で細いリード端子片52と,その先にそれよ
り多少幅の広いスタンドオフ部55とが主フレーム51と直
角方向に打抜加工,またはエッチング加工により形成さ
れている。このスタンドオフ部55の先端には回路基板4
を挾持するための挾持細片53とリード圧着片54とが互に
対向するように設けられている。Here, FIG. 3 (a) shows the structure of the lead terminal frame in a state before being joined to the circuit board. here,
The main frame 51 is a band-shaped metal plate having high elasticity and good conductivity such as brass, beryllium copper, stainless steel, iron, or alloys thereof, and the thin lead terminals are arranged on one edge of the main frame 51 at the same intervals as the circuit pattern 41. A piece 52 and a standoff portion 55, which is slightly wider than the piece 52, are formed by punching or etching in the direction perpendicular to the main frame 51. The circuit board 4 is attached to the tip of the standoff portion 55.
A holding strip 53 for holding the lead and a lead crimping piece 54 are provided so as to face each other.
第3図(b)は回路基板の挾持段階を示したもので,ふ
たまたに分かれた挾持細片53と圧着片54との間に回路基
板4の回路パターン41を挿入し,位置を合わせて挾持さ
れる。FIG. 3 (b) shows the step of holding the circuit board. The circuit pattern 41 of the circuit board 4 is inserted between the holding strips 53 and the crimping pieces 54, which are divided into two lids, and the positions are aligned. Be held.
次に,第3図(c)はインダクタ素子の組込み段階を示
したもので,回路基板4の貫通孔42にインダクタ素子1
を収納し,巻線材3のリード線31の端末を圧着片54に配
接し,電気抵抗溶接機の溶接電極にて圧着片54ごと圧着
しながら,まずリード線31の被覆を熱剥離するに充分な
電流を流してリード線の被覆をはがし,次にリード線と
圧着片54とを溶接するに充分な電流を流して接合部に適
正な溶接塊を生成させてリード線とリード端子片52とを
接続する。その後,余分なリード線31を切断除去し,回
路パタン41と挾持細片53とを高融点半田で半田付する。
ついで,インダクタ素子1の表面に低残留応力歪を呈す
るシリコン樹脂,あるいはエポキシ樹脂などを塗布して
保護膜6を生成する。Next, FIG. 3 (c) shows a step of assembling the inductor element, in which the inductor element 1 is inserted into the through hole 42 of the circuit board 4.
The lead wire 31 end of the winding material 3 is housed in the crimping piece 54, and the welding wire of the electric resistance welding machine is used to crimp the crimping piece 54 together. Current is applied to peel off the coating of the lead wire, and then a current sufficient to weld the lead wire and the crimping piece 54 is applied to generate an appropriate welded mass at the joint portion, and the lead wire and the lead terminal piece 52 are Connect. After that, the excess lead wire 31 is cut and removed, and the circuit pattern 41 and the holding strip 53 are soldered with a high melting point solder.
Then, the surface of the inductor element 1 is coated with a silicone resin exhibiting a low residual stress strain, an epoxy resin, or the like to form the protective film 6.
その後,第3図(d)に見られる段階で,スタンドオフ
部55を残して回路基板4の外囲部をエポキシ樹脂,また
はレジン液などの電気的絶縁樹脂に浸して外装7を施
し,最終的にリード端子片52の所要長を残して主フレー
ム51より切断し,小形コモンモードコイルが部品として
完成する。Then, at the stage shown in FIG. 3 (d), the outer portion of the circuit board 4 is immersed in an epoxy resin or an electrically insulating resin such as a resin liquid, leaving the standoff portion 55, and the outer casing 7 is applied. Then, the lead terminal piece 52 is cut from the main frame 51 leaving the required length, and a small common mode coil is completed as a component.
以上に述べたよに,本発明によれば,小型インダクタ素
子1の位置決めや,リード線31を外部端子に容易かつ竪
固に接続できる。したがって,コイルのリード線31の接
続作業において端子に不必要な外力が加わらず,曲がり
破損などの不良品の発生を無くし,信頼性の高いコイル
が得られる。また,端子は同一平面内に並んでいるの
で,紙台紙に一定間隔で貼りつけられたテーピング部品
の特長を活かし,位置決め孔56を基準として自動装着機
によるインダクタ素子1の装着が容易となり,自動化に
よる生産性が高く,経済性の向上が得られる点,その効
果は大きい。As described above, according to the present invention, the positioning of the small inductor element 1 and the lead wire 31 can be easily and firmly connected to the external terminal. Therefore, an unnecessary external force is not applied to the terminal in the work of connecting the lead wire 31 of the coil, a defective product such as bending damage is not generated, and a highly reliable coil can be obtained. Also, since the terminals are lined up in the same plane, it is easy to mount the inductor element 1 by the automatic mounting machine based on the positioning holes 56 by taking advantage of the features of the taping parts that are attached to the paper backing at regular intervals. The productivity is high and the economic efficiency is improved, and the effect is great.
第1図は本発明による小型コモンモードコイルに使用さ
れるインダクタ素子の外観斜視図,第2図は本発明に使
用される回路基板の外観斜視図,第3図は本発明の小型
コモンモードコイルの端子組立工程を段階的に説明する
ための平面図,第4図は従来の小型コモンモードコイル
の例を示す外観斜視図である。 なお,1:インダクタ素子,2:磁気コア,3:巻線材,4:回路基
板,5:リード端子フレーム,6:保護膜,7:外装,8:端子,9:
外装ケース,31:リード線,41:回路パターン,42:貫通孔,5
1:主フレーム,52:リード端子片,53:挾持細片,54:圧着
片,55:スタンドオフ部,56:位置決め孔。1 is an external perspective view of an inductor element used in a small common mode coil according to the present invention, FIG. 2 is an external perspective view of a circuit board used in the present invention, and FIG. 3 is a small common mode coil of the present invention. FIG. 4 is a plan view for explaining the step of assembling the terminal in steps, and FIG. 4 is an external perspective view showing an example of a conventional small common mode coil. In addition, 1: inductor element, 2: magnetic core, 3: winding material, 4: circuit board, 5: lead terminal frame, 6: protective film, 7: exterior, 8: terminal, 9:
Outer case, 31: Lead wire, 41: Circuit pattern, 42: Through hole, 5
1: Main frame, 52: Lead terminal piece, 53: Holding strip, 54: Crimping piece, 55: Standoff part, 56: Positioning hole.
Claims (1)
を対向させて設けたスタンドオフ部と,該スタンドオフ
部の他端側に延設された細いリード端子片とからなるリ
ード端子部を一定間隔で複数本垂設させた帯状のリード
フレームを備え,前記挾持細片と前記圧着片との間に,
絶縁材よりなり中央に貫通孔を有する回路基板の縁辺に
前記複数のリード端子部と同じ間隔で設けられた複数個
の端子用回路パタンを挾持させ,かつ高磁性材よりなる
トロイダル磁気コア上に被覆された巻線材を巻回したイ
ンダクタ素子を前記貫通孔にはめ込み,前記巻線材の端
末を抵抗溶接により前記圧着片に溶接したのち,前記回
路基板の外囲を樹脂で覆い,前記リード端子片を前記帯
状のリードフレームから切断することを特徴とする小型
コモンモードコイルの製造方法。1. A lead comprising a stand-off portion having a holding strip and a crimping piece made of a metal material, which are opposed to each other at a tip thereof, and a thin lead terminal piece extending to the other end of the stand-off portion. A strip-shaped lead frame in which a plurality of terminal portions are vertically erected at a constant interval is provided, and between the holding strip and the crimping piece,
On a toroidal magnetic core made of a high magnetic material, which holds a plurality of terminal circuit patterns provided at the same intervals as the lead terminal portions on the edge of a circuit board made of an insulating material and having a through hole in the center, The inductor element wound with the covered winding material is fitted into the through hole, the end of the winding material is welded to the crimping piece by resistance welding, and then the outer circumference of the circuit board is covered with resin, and the lead terminal piece is provided. Is cut from the strip-shaped lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2987587A JPH0760774B2 (en) | 1987-02-13 | 1987-02-13 | Manufacturing method of small common mode coil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2987587A JPH0760774B2 (en) | 1987-02-13 | 1987-02-13 | Manufacturing method of small common mode coil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63198312A JPS63198312A (en) | 1988-08-17 |
| JPH0760774B2 true JPH0760774B2 (en) | 1995-06-28 |
Family
ID=12288151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2987587A Expired - Fee Related JPH0760774B2 (en) | 1987-02-13 | 1987-02-13 | Manufacturing method of small common mode coil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0760774B2 (en) |
-
1987
- 1987-02-13 JP JP2987587A patent/JPH0760774B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63198312A (en) | 1988-08-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |