JPH0762129B2 - Tile bonding method - Google Patents
Tile bonding methodInfo
- Publication number
- JPH0762129B2 JPH0762129B2 JP62294487A JP29448787A JPH0762129B2 JP H0762129 B2 JPH0762129 B2 JP H0762129B2 JP 62294487 A JP62294487 A JP 62294487A JP 29448787 A JP29448787 A JP 29448787A JP H0762129 B2 JPH0762129 B2 JP H0762129B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- tile
- nco
- prepolymer
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 13
- 239000000853 adhesive Substances 0.000 claims description 27
- 230000001070 adhesive effect Effects 0.000 claims description 27
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 19
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 17
- 229920000570 polyether Polymers 0.000 claims description 17
- 239000005056 polyisocyanate Substances 0.000 claims description 12
- 229920001228 polyisocyanate Polymers 0.000 claims description 12
- 230000009974 thixotropic effect Effects 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 9
- 229920005862 polyol Polymers 0.000 claims description 9
- 150000003077 polyols Chemical class 0.000 claims description 9
- 239000004568 cement Substances 0.000 claims description 7
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 7
- 239000011324 bead Substances 0.000 claims description 5
- 238000013008 moisture curing Methods 0.000 claims description 5
- 229920005906 polyester polyol Polymers 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- -1 etc. Substances 0.000 description 7
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 6
- 238000001723 curing Methods 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 150000002009 diols Chemical class 0.000 description 4
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical class CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 4
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- NXQMCAOPTPLPRL-UHFFFAOYSA-N 2-(2-benzoyloxyethoxy)ethyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCCOCCOC(=O)C1=CC=CC=C1 NXQMCAOPTPLPRL-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- 206010040880 Skin irritation Diseases 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 238000007665 sagging Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 230000036556 skin irritation Effects 0.000 description 2
- 231100000475 skin irritation Toxicity 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- 150000004072 triols Chemical class 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- ZBBLRPRYYSJUCZ-GRHBHMESSA-L (z)-but-2-enedioate;dibutyltin(2+) Chemical compound [O-]C(=O)\C=C/C([O-])=O.CCCC[Sn+2]CCCC ZBBLRPRYYSJUCZ-GRHBHMESSA-L 0.000 description 1
- ZWVMLYRJXORSEP-UHFFFAOYSA-N 1,2,6-Hexanetriol Chemical compound OCCCCC(O)CO ZWVMLYRJXORSEP-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- NMBQBIACXMPEQB-UHFFFAOYSA-N 2-butoxyethyl benzoate Chemical compound CCCCOCCOC(=O)C1=CC=CC=C1 NMBQBIACXMPEQB-UHFFFAOYSA-N 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 208000010201 Exanthema Diseases 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 150000001558 benzoic acid derivatives Chemical class 0.000 description 1
- HIFVAOIJYDXIJG-UHFFFAOYSA-N benzylbenzene;isocyanic acid Chemical class N=C=O.N=C=O.C=1C=CC=CC=1CC1=CC=CC=C1 HIFVAOIJYDXIJG-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- DROMNWUQASBTFM-UHFFFAOYSA-N dinonyl benzene-1,2-dicarboxylate Chemical compound CCCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCCC DROMNWUQASBTFM-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 201000005884 exanthem Diseases 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 150000002483 hydrogen compounds Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000007794 irritation Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 239000011499 joint compound Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000002808 molecular sieve Substances 0.000 description 1
- 125000005609 naphthenate group Chemical group 0.000 description 1
- 125000005498 phthalate group Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 206010037844 rash Diseases 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 231100000046 skin rash Toxicity 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 239000011882 ultra-fine particle Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Finishing Walls (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明はタイル接着方法、更に詳しくは、主にユニツト
バスの、セメント系ボードにタイルを接着してなるタイ
ル壁パネルの製造において、初期定着性良好にかつ作業
上安全にタイルの接着を実施できる方法に関する。Description: TECHNICAL FIELD The present invention relates to a method for adhering tiles, and more specifically, in the production of a tile wall panel mainly composed of a unit bath in which a tile is adhered to a cement board, good initial fixing property is obtained. In addition, the present invention relates to a method for safely adhering tiles.
従来技術と発明の解決すべき問題点 ユニツトバスのタイル壁パネルは、一般にケイ酸カルシ
ウムボードやフレキシブルボードなどのセメント系ボー
ドに陶器質もしくは磁気質タイルを接着することにより
製造されている。この接着には、従来より、二液型エポ
キシ樹脂接着剤が用いられ、該接着剤をセメント系ボー
ドにヘラ、クシゴテ、ロールコーター、ハンドガンなど
で塗布し、これにタイルを貼り合せる方法が行われてい
る。しかしながら、この接着方法では、使用接着剤は二
液の混合作業を考慮して一般に低粘度であるため、タイ
ルの初期定着性がよくない。また、硬化剤または触媒と
して有機アミン等が用いられるため、その刺激性による
皮膚の炎症、カブレなどを誘起し、安全面で排気設備な
ど環境改善が必要であり、また形成する接着剤被膜の硬
さに起因してタイルの割れや剥離が起るといつた問題が
ある。Prior Art and Problems to be Solved Unit bath tile wall panels are generally manufactured by adhering ceramic or magnetic tiles to cementitious boards such as calcium silicate boards and flexible boards. Conventionally, a two-component epoxy resin adhesive has been used for this adhesion, and a method of applying the adhesive to a cement-based board with a spatula, a cusgote, a roll coater, a hand gun, etc., and attaching a tile to this is performed. ing. However, in this bonding method, since the adhesive used generally has a low viscosity in consideration of the mixing operation of the two liquids, the initial fixing property of the tile is not good. In addition, since organic amines are used as curing agents or catalysts, they cause skin irritation and rash due to their irritation, and it is necessary to improve the environment such as exhaust equipment in terms of safety. If there is cracking or peeling of the tiles due to this, there is a problem.
一方、低粘度の湿気硬化性一液型ウレタン系接着剤を用
い、これをロールコーターで塗布する方法に市場実績が
あるが、依然、低粘度のためタイルの初期定着性が劣
り、硬化までの間は連続した圧縮が必要であり、作業効
率が悪い。On the other hand, there is a market record in the method of using a low-viscosity, moisture-curing one-component urethane adhesive and applying this with a roll coater, but the tile's initial fixability is poor due to its low viscosity, and Continuous compression is required during this period, resulting in poor work efficiency.
本発明者らは、かかるタイル接着方法の問題を解決すべ
く鋭意検討を進めたところ、互いに相溶しない2種の活
性イソシアネート基含有ウレタンプレポリマーを含有す
る、揺変性の湿気硬化性一夜型ウレタン系接着剤を使用
すれば、タイルの初期定着性が極めて向上し、圧縮時間
もわずか数秒で済み、さらに安全面でも皮膚炎症などの
心配が大巾に解消されることを見出し、本発明を完成さ
せるに至つた。The inventors of the present invention have made extensive studies to solve the problem of the tile bonding method, and as a result, thixotropic moisture-curable overnight type urethane containing two types of urethane prepolymers containing active isocyanate groups which are incompatible with each other. We have completed the present invention by finding that the use of a system adhesive significantly improves the initial fixing property of tiles, the compression time is only a few seconds, and the safety concerns such as skin irritation are largely eliminated. I was allowed to do it.
発明の構成と効果 すなわち、本発明は、セメント系ボードにタイルを接着
するに際し、揺変性湿気硬化性一液型ウレタン系接着剤
を用い、該接着剤は、以下に詳述する、互いに相溶しな
い2種の活性イソシアネート基含有ウレタンプレポリマ
ーを特定重量比で分散せしめた、特定粘度の揺変性湿気
硬化性一液型ウレタン系接着剤であることを特徴とする
タイル接着方法を提供するものである。Structure and effect of the invention That is, the present invention, when bonding the tile to the cement-based board, using thixotropic moisture-curable one-component urethane-based adhesive, the adhesive is compatible with each other, which will be described in detail below. A tile adhering method characterized in that it is a thixotropic moisture-curable one-component type urethane adhesive having a specific viscosity in which two types of urethane prepolymers containing active isocyanate groups are dispersed in a specific weight ratio. is there.
本発明で用いる接着剤は、ポリエーテルポリオールと過
剰のポリイソシアネート化合物を反応させて得られる活
性イソシアネート基含有ウレタンプレポリマー(以下、
NCO含有ポリエーテルプレポリマーという)に対し、該N
CO含有ポリエーテルプレポリマーと相溶しない、ポリエ
ステルポリオールと過剰のポリイソシアネート化合物を
反応させて得られる活性イソシアネート基含有ウレタン
プレポリマー(以下、NCO含有ポリエステルプレポリマ
ーという)を分散せしめた系に、通常の揺変剤(無水シ
リカ粉、ベントナイトなど)をブレンドして揺変性を付
与し、更に必要に応じて各種の添加剤、たとえば充填剤
(炭酸カルシウム、タルク、クレー、カーボン、無水け
い酸、金属粉など)、可塑剤(ジオクチルフタレート、
ブチルベンジルフタレート、ジノニルフタレートなどの
フタル酸エステル類、ジエチレングリコールジベンゾエ
ート、エチレングリコールモノブチルエーテルベンゾエ
ートなどの安息香酸エステル類、部分水素添加ターフエ
ニル、アルキル多環芳香族炭化水素類、塩素化パラフイ
ン類など)、溶剤(トルエン、キシレンなどの芳香族炭
化水素類、エステル類、ケトン類、エーテル類など)、
硬化促進用触媒(N−アルキルベンジルアミン、N−ア
ルキルモルホリン、N−アルキル脂肪族ポリアミン、N
−アルキルピペラジン、トリエチレンジアミン、錫、
鉛、コバルト、マンガンおよび鉄などの重金属のナフテ
ン酸塩またはオクテン酸塩、ジブチル錫ジラウレート、
ジブチル錫マレエートなど)、酸化防止剤、紫外線吸収
剤、染料、顔料、吸水吸湿剤(酸化カルシウム、モレキ
ユラーシーブスなど)等を適当配合した一液型の系で構
成され、5万〜150万cps/20℃の高粘度を有し、空気中
などの水分と反応して硬化被膜を形成する。The adhesive used in the present invention is an active isocyanate group-containing urethane prepolymer obtained by reacting a polyether polyol and an excess polyisocyanate compound (hereinafter,
NCO-containing polyether prepolymer))
Normally, a system in which a urethane prepolymer containing an active isocyanate group (hereinafter referred to as an NCO-containing polyester prepolymer), which is incompatible with a CO-containing polyether prepolymer and is obtained by reacting a polyester polyol with an excess polyisocyanate compound, is dispersed, is usually used. Thixotropic agents (anhydrous silica powder, bentonite, etc.) are blended to impart thixotropy, and if necessary, various additives such as fillers (calcium carbonate, talc, clay, carbon, silicic acid anhydride, metal). Powder, etc., plasticizer (dioctyl phthalate,
Butylbenzyl phthalate, dinonyl phthalate and other phthalates, diethylene glycol dibenzoate, ethylene glycol monobutyl ether benzoate and other benzoates, partially hydrogenated terphenyl, alkyl polycyclic aromatic hydrocarbons, chlorinated paraffins, etc.) , Solvent (aromatic hydrocarbons such as toluene and xylene, esters, ketones, ethers, etc.),
Catalyst for curing acceleration (N-alkylbenzylamine, N-alkylmorpholine, N-alkylaliphatic polyamine, N
-Alkylpiperazine, triethylenediamine, tin,
Naphthenates or octenoates of heavy metals such as lead, cobalt, manganese and iron, dibutyltin dilaurate,
Dibutyltin maleate, etc.), antioxidant, UV absorber, dye, pigment, water-absorption agent (calcium oxide, molecular sieves, etc.) It has a high viscosity of cps / 20 ℃ and reacts with moisture in the air to form a cured film.
上記NCO含有ポリエーテルプレポリマーにおけるポリエ
ーテルポリオールとしては、たとえば活性水素2個以上
を有する低分子量活性水素化合物(たとえばエチレング
リコール、プロピレングリコール、ブチレングリコー
ル、1,6−ヘキサンジオールなどのジオール類、グリセ
リン、トリメチロールプロパン、1,2,6−ヘキサントリ
オールなどのトリオール類、アンモニア、メチルアミ
ン、エチルアミン、プロピルアミン、ブチルアミンなど
のアミン類)の1種または2種以上の存在下にプロピレ
ンオキサイドおよびエチレンオキサイドを開環重合させ
て得られるランダムまたはブロツク共重合体のポリオキ
シエチレン−プロピレンポリオール(特にエチレンオキ
サイドが30モル%以下のポリオールが望ましい)、また
はテトラヒドロフランの開環重合によつて得られるポリ
オキシテトラメチレングリコールが挙げられ、通常分子
量300〜7000、1分子中のOH含有2〜4個のものが使用
されてよい。また、かかるポリエーテルポリオールと反
応させるポリイソシアネート化合物としては、たとえば
ヘキサメチレンジイソシアネート、リジンメチルエステ
ルジイソシアネートなどの脂肪族ポリイソシアネート
類、水添ジフエニルメタンジイソシアネート、イソホロ
ンジイソシアネート、水添トリレンジイソシアネートな
どの脂環式ポリイソシアネート類、トリレンジイソシア
ネート(TDI)、ジフエニルメタンジイソシアネート(M
DI)、ナフチレンジイソシアネート、キシリレンジイソ
シアネートなどの芳香族イソシアネート類、およびこれ
らの混合物が挙げられる。とくに好ましいポリイソシア
ネート化合物は芳香族ポリイソシアネート類であつて、
例えばTDI,MDIなどが好適に用いられる。ポリエーテル
ポリオールと過剰のポリイソシアネート化合物を、すな
わちポリエーテルポリオールのヒドロキシル基(OH)に
対しポリイソシアネート化合物の活性イソシアネート基
(NCO)が1より大となるように、たとえば1.3≦NCO/OH
≦10の割合にて、70〜100℃で数時間反応させることに
より、通常NCO含有量1〜15%(重量%、以下同様)のN
CO含有ポリエーテルプレポリマーが得られる。この反応
に際して、通常の触媒、可塑剤あるいは溶剤を用いても
よい。Examples of the polyether polyol in the NCO-containing polyether prepolymer include low molecular weight active hydrogen compounds having two or more active hydrogens (for example, diols such as ethylene glycol, propylene glycol, butylene glycol, 1,6-hexanediol, and glycerin). , Trimethylolpropane, triols such as 1,2,6-hexanetriol, ammonia, amines such as methylamine, ethylamine, propylamine and butylamine) and propylene oxide and ethylene oxide in the presence of one or more of them. Random or block copolymer polyoxyethylene-propylene polyol (particularly a polyol with ethylene oxide of 30 mol% or less is desirable) obtained by ring-opening polymerization of Examples of the polyoxytetramethylene glycol obtained by the combination include those having a molecular weight of 300 to 7,000 and 2 to 4 OH-containing one molecule. Examples of the polyisocyanate compound to be reacted with the polyether polyol include hexamethylene diisocyanate, aliphatic polyisocyanates such as lysine methyl ester diisocyanate, hydrogenated diphenylmethane diisocyanate, isophorone diisocyanate, and hydrogenated tolylene diisocyanate. Cyclic polyisocyanates, tolylene diisocyanate (TDI), diphenylmethane diisocyanate (M
DI), aromatic isocyanates such as naphthylene diisocyanate, xylylene diisocyanate, and mixtures thereof. Particularly preferred polyisocyanate compounds are aromatic polyisocyanates,
For example, TDI and MDI are preferably used. Polyether polyol and excess polyisocyanate compound, that is, 1.3 ≦ NCO / OH so that the active isocyanate group (NCO) of the polyisocyanate compound is greater than 1 with respect to the hydroxyl group (OH) of the polyether polyol.
By reacting at 70 to 100 ° C for several hours at a ratio of ≤10, NCO with a normal NCO content of 1 to 15% (wt%, the same applies hereinafter)
A CO-containing polyether prepolymer is obtained. In this reaction, a usual catalyst, plasticizer or solvent may be used.
上記NCO含有ポリエステルプレポリマーは、NCO含有ポリ
エーテルプレポリマーと相溶しないことが重要であり
(そうでないと、当該接着剤の揺変性の安定性が損な
い、たとえば時間経過時に垂れが生じる)、かかる観点
から、たとえばポリオール成分として芳香族多塩基酸
(フタル酸、テレフタル酸、イソフタル酸、またはこれ
らのジアルキルエステルなど)と多価アルコール類(前
記と同じジオール類やトリオール類以外に、ジエチレン
グリコール、トリエチレングリコール、ジプロピレング
リコール、トリプロピレングリコールなども含まれる)
を反応させて得られるポリエステルポリオール(通常、
分子量300〜3000、1分子中のOH含有2〜4個)を用
い、上記NCO含有ポリエーテルプレポリマーの場合と同
様な条件で、これにポリイソシアネート化合物を反応さ
せることにより製造され、これも通常NCO含有量1〜15
%に調整されている。It is important that the NCO-containing polyester prepolymer is not compatible with the NCO-containing polyether prepolymer (otherwise the thixotropic stability of the adhesive is impaired, for example sagging over time). From the viewpoint, for example, aromatic polybasic acids (phthalic acid, terephthalic acid, isophthalic acid, or dialkyl esters thereof) as the polyol component and polyhydric alcohols (the same diols and triols as described above, diethylene glycol, triethylene, etc. (Includes glycol, dipropylene glycol, tripropylene glycol, etc.)
A polyester polyol obtained by reacting
It is produced by reacting a polyisocyanate compound with a molecular weight of 300 to 3000, 2 to 4 containing OH in one molecule) under the same conditions as in the case of the NCO containing polyether prepolymer, which is also usually NCO content 1-15
% Has been adjusted.
上記NCO含有ポリエーテルプロポリマーとNCO含有ポリエ
ステルプレポリマーの重量比は、通常95/5〜50/50、好
ましくは90/10〜70/30の範囲内で選定する。NCO含有ポ
リエステルプレポリマーの比率が5%未満であると、安
定な揺変性が得られず、また50%を越えると、プレポリ
マー/プレポリマーの海島構造の逆転現象が見られ、当
初の物性、すなわち接着性、伸び、耐久性等を低下させ
る傾向にある。The weight ratio of the NCO-containing polyether propolymer to the NCO-containing polyester prepolymer is usually selected within the range of 95/5 to 50/50, preferably 90/10 to 70/30. If the ratio of the NCO-containing polyester prepolymer is less than 5%, stable thixotropy cannot be obtained, and if it exceeds 50%, a reversal phenomenon of the prepolymer / prepolymer sea-island structure is observed, and the initial physical properties are That is, the adhesiveness, elongation and durability tend to be reduced.
本発明に係るタイル接着方法は、以下の手順で実施する
ことができる。The tile adhering method according to the present invention can be carried out in the following procedure.
被着体のセメント系ボードに、上記揺変性高粘度の湿気
硬化性一液型ウレタン系接着剤を、クシゴテあるいは専
用の自動ビード塗布機を用いて2〜3mmφ、5〜20本/10
cm(塗布量300〜1000g/m2)のビード状に塗布するか、
またはマルチスプレツダーを用いて多点塗布した後、こ
れにタイルを貼り合せ、通常0.02〜2.0Kg/cm2、好まし
くは0.1〜0.2Kg/cm2程度の圧力で数秒間圧着する。この
状態でそのまま養生してもよく、あるいは直ちに目地セ
メントを入れてもよい。To the cement-based board of the adherend, the above thixotropic high-viscosity moisture-curable one-component urethane adhesive is used with a cusigote or a dedicated automatic bead applicator, 2-3 mmφ, 5-20 pieces / 10
Apply in the form of a bead of cm (application amount 300 to 1000 g / m 2 ), or
Alternatively, after multi-point coating using a multi-spreader, tiles are stuck to this and pressure-bonded for several seconds at a pressure of usually 0.02 to 2.0 Kg / cm 2 , preferably 0.1 to 0.2 Kg / cm 2 . In this state, curing may be performed as it is, or joint cement may be added immediately.
このように本発明方法によれば、接着剤を二液混合する
必要がなく、また高粘度ノンサグタイプの接着剤を用い
ることからタイルの初期定着性は非常に良好であり、タ
イル貼り合せ後の圧締も緩和な条件で完了させることが
できる。As described above, according to the method of the present invention, it is not necessary to mix the two liquids of the adhesive, and since the high-viscosity non-sag type adhesive is used, the initial fixing property of the tile is very good, and the pressure after the tiles are adhered to each other. The tightening can be completed under mild conditions.
次に実施例および比較例を挙げて、本発明をより具体的
に説明する。Next, the present invention will be described more specifically with reference to Examples and Comparative Examples.
実施例1 (1)NCO含有ポリエーテルプレポリマー ポリオキシプロピレンジオール(武田薬品工業社製、タ
ケラツクP−21、分子量2000)100gに可塑剤としてDOP
(ジオクチルフタレート)100gとMDI100gを加え、80℃
にて5時間反応せしめ、NCO含有量9.8%、粘度2000cps/
20℃のNCO含有ポリエーテルプレポリマーを得る。Example 1 (1) NCO-containing polyether prepolymer Polyoxypropylene diol (Takeraku P-21, molecular weight 2000, manufactured by Takeda Pharmaceutical Co., Ltd.) 100 g, DOP as a plasticizer
(Dioctyl phthalate) 100g and MDI 100g, 80 ℃
After reacting for 5 hours, NCO content 9.8%, viscosity 2000cps /
An NCO containing polyether prepolymer at 20 ° C. is obtained.
(2)NCO含有ポリエステルプレポリマー テレフタル酸系ポリエステルジオール(旭電化工業社
製、アデカニユーエースYG−214、分子量2000)100gにD
OP100gとMDI100gを加え、80℃にて5時間反応せしめ、N
CO含有量9.8%、粘度10000cps/20℃のNCO含有ポリエス
テルプレポリマーを得る。(2) NCO-containing polyester prepolymer terephthalic acid-based polyester diol (Adekanyuace YG-214, manufactured by Asahi Denka Co., Ltd., molecular weight 2000) D to 100 g
Add OP100g and MDI100g, react at 80 ℃ for 5 hours, N
An NCO-containing polyester prepolymer having a CO content of 9.8% and a viscosity of 10,000 cps / 20 ° C. is obtained.
(3)揺変性湿気硬化性一液型ウレタン系接着剤 上記(1)のNCO含有ポリエーテルプレポリマー90gに上
記(2)のNCO含有ポリエステルプレポリマー10gを加
え、よく攪拌して分散体を得る。次に予め乾燥した炭酸
カルシウム100gと超微粒子無水シリカ(日本アエロジル
工業社製、アエロジール200)8gを加え、さらに硬化触
媒、密着剤、粘稠剤等を加え、よく攪拌した後、脱泡し
て揺変性湿気硬化性一液型ウレタン系接着剤(粘度10万
cps/20℃)を調製する。(3) Thixotropic moisture-curing one-pack type urethane adhesive To 90 g of NCO-containing polyether prepolymer of (1) above, 10 g of NCO-containing polyester prepolymer of (2) above was added and well stirred to obtain a dispersion. . Next, 100 g of pre-dried calcium carbonate and 8 g of ultrafine particle anhydrous silica (Nippon Aerosil Co., Ltd., Aerozil 200) were added, and a curing catalyst, an adhesive, a thickener, etc. were further added, and the mixture was thoroughly stirred and then defoamed. Thixotropic moisture-curable one-component urethane adhesive (viscosity 100,000
cps / 20 ° C).
(4)タイル接着 上記(3)の接着剤を用いて、セメント系ボードと陶器
質タイル(98mm角、ダントー社製)の接着を行つた。す
なわち、フレキシブルボードにくし目ごてを用い、2.5m
mφのビード状に当該接着剤を塗布し、陶器質タイルを
貼り合せる。貼り合せた後、ただちに貼り合せパネルを
0.1Kg/cm2の圧力で10秒間圧締し、解圧後垂直にして40
℃雰囲気下、3時間養生したところ、タイルのズレはな
かつた。(4) Tile Adhesion Using the adhesive of (3) above, cement-based boards and ceramic tiles (98 mm square, manufactured by DANTO) were bonded. That is, using a comb iron on a flexible board, 2.5m
Apply the adhesive in mφ bead shape and attach ceramic tiles. Immediately after bonding, the bonded panel
Tighten at a pressure of 0.1 Kg / cm 2 for 10 seconds, and after decompressing, make vertical 40
When it was cured for 3 hours in an atmosphere of ° C, the tiles were not displaced.
実施例2 実施例1の(4)と同様にしてフレキシブルボードにタ
イルを貼り合せ、圧着後ただちに、予め調製した目地用
セメントをタイル目地に充てたところ、その時にタイル
のズレ等の動きは見られなかつた。その後、40℃にて3
時間養生してタイルパネルを得た。Example 2 Tiles were attached to a flexible board in the same manner as in (4) of Example 1, and the cement for joints prepared in advance was applied to the tile joints immediately after crimping, and movements such as displacement of the tiles were observed at that time. I couldn't do it. After that, 3 at 40 ℃
After curing for a while, a tile panel was obtained.
実施例3 実施例1の(3)に準じて、粘度100万cps/20℃の揺変
性湿気硬化性一液型ウレタン系接着剤を調製し、専用自
動塗布装置を用いてタイルパネルを作製を行つた。すな
わち、本接着剤を59:1のポンプ(パイレス社製)を用い
て、専用の多孔ノズルより3mmφ、10mmピツチにて3尺
×6尺(90×180cm)大のボードの長手方向に81本/巾
のビード状塗布し、陶器質タイルを貼り合せた。貼り合
せた後、ただちに貼り合せパネルを0.1Kg/cm2の圧力で1
0秒間圧締し、解圧後垂直にして40℃雰囲気下で3時間
養生した。Example 3 According to (3) of Example 1, a thixotropic moisture-curable one-component urethane adhesive having a viscosity of 1,000,000 cps / 20 ° C. was prepared and a tile panel was prepared using a dedicated automatic coating device. I went. That is, using a 59: 1 pump (manufactured by Pires Co., Ltd.), 81 adhesives in the longitudinal direction of a board of 3 x 6 (90 x 180 cm) size with a 3 mmφ and 10 mm pitch from a dedicated porous nozzle. / A bead of width was applied and ceramic tiles were laminated. Immediately after bonding, the bonded panel is pressed with a pressure of 0.1 Kg / cm 2
It was clamped for 0 seconds, decompressed, and then verticalized, and cured in an atmosphere of 40 ° C. for 3 hours.
比較例1 実施例1の(1)のNCO含有ポリエーテルプレポリマー1
00gに、予め乾燥した炭酸カルシウム100gを加え、さら
に硬化触媒、密着剤を加え、よく攪拌した後脱泡して、
揺変性のない粘度10万cps/20℃の湿気硬化性一液型ウレ
タン系接着剤を得る。Comparative Example 1 NCO-containing polyether prepolymer 1 of (1) of Example 1
To 00g, add 100g of pre-dried calcium carbonate, further add curing catalyst and adhesive, stir well and defoam,
A moisture-curing one-component urethane adhesive with a viscosity of 100,000 cps / 20 ° C without thixotropy is obtained.
フレキシブルボードにくし目ごてを用いて上記揺変性の
ない接着性を塗布し、陶器質タイルを貼り合せて、ただ
ちに0.1Kg/cm2の圧力で10秒間圧締したが、次工程への
移動中にタイルにズレ及び浮きが発生した。The above-mentioned thixotropic adhesiveness was applied to a flexible board using a comb iron, ceramic tiles were pasted together, and immediately pressed with a pressure of 0.1 Kg / cm 2 for 10 seconds, but transfer to the next step. Misalignment and floating occurred on the tiles.
なお、下記表1に示す重量部数の成分から成る接着剤N
o.1〜4について、揺変性の安定化試験[50℃で7日経
日後のミル試験を行い、垂れの長さ(mm)を測定]に付
し、結果を表1に併記する。用いたウレタンプレポリマ
ーはそれぞれ、実施例1の(1),(2)で製造したも
のである。Adhesive N composed of the parts by weight shown in Table 1 below
o.1 to 4 are attached to a thixotropic stabilization test [a mill test after 7 days at 50 ° C. is performed to measure the length of sagging (mm)], and the results are also shown in Table 1. The urethane prepolymers used are those produced in (1) and (2) of Example 1, respectively.
Claims (2)
し、揺変性湿気硬化性一液型ウレタン系接着剤を用い、
該接着剤は、ポリエーテルポリオールと過剰のポリイソ
シアネート化合物を反応させて得られる活性イソシアネ
ート基含有ウレタンプレポリマーに対し、該ウレタンプ
レポリマーと相溶しない、ポリエステルポリオールと過
剰のポリイソシアネート化合物を反応させて得られる活
性イソシアネート基含有ウレタンプレポリマーを重量比
95/5〜50/50となるように分散せしめた、粘度5万〜150
万cps/20℃の揺変性湿気硬化性一液型ウレタン系接着剤
であることを特徴とするタイル接着方法。1. A thixotropic moisture-curing one-component urethane adhesive is used for adhering a tile to a cement board,
The adhesive is obtained by reacting a polyether polyol and an excess polyisocyanate compound with an active isocyanate group-containing urethane prepolymer obtained by reacting a polyester polyol and an excess polyisocyanate compound which are incompatible with the urethane prepolymer. The active isocyanate group-containing urethane prepolymer obtained by
Viscosity 50,000-150 dispersed to 95 / 5-50 / 50
A tile adhering method characterized by being a thixotropic moisture-curing one-pack type urethane adhesive at 10,000 cps / 20 ° C.
記第1項記載の方法。2. The method according to claim 1, wherein the adhesive is bead-coated or multi-point coated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62294487A JPH0762129B2 (en) | 1987-11-18 | 1987-11-18 | Tile bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62294487A JPH0762129B2 (en) | 1987-11-18 | 1987-11-18 | Tile bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01132675A JPH01132675A (en) | 1989-05-25 |
| JPH0762129B2 true JPH0762129B2 (en) | 1995-07-05 |
Family
ID=17808399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62294487A Expired - Fee Related JPH0762129B2 (en) | 1987-11-18 | 1987-11-18 | Tile bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0762129B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4738004B2 (en) * | 2005-01-31 | 2011-08-03 | サンスター技研株式会社 | One-component urethane moisture-curable composition |
| JP5993583B2 (en) * | 2011-03-03 | 2016-09-14 | 宝菱産業株式会社 | Curved wall covering tile panel |
| JP6024099B2 (en) * | 2011-11-22 | 2016-11-09 | セメダイン株式会社 | Tile joint structure and moisture-curing tile adhesive composition |
| GB2509821B (en) * | 2012-11-21 | 2020-09-02 | Safeguard Europe Ltd | Method of applying a substantially planar member to a substrate |
| MX2021008019A (en) * | 2019-04-05 | 2021-08-05 | Sika Tech Ag | Moisture-curing composition with good adhesive properties. |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59113076A (en) * | 1982-12-17 | 1984-06-29 | Sunstar Giken Kk | Moisture-curing adhesive composition |
| JPS60120045A (en) * | 1983-11-30 | 1985-06-27 | サンスター技研株式会社 | Bonding processing method of honeycomb sandwich structure panel |
| JPS60208380A (en) * | 1984-03-09 | 1985-10-19 | アメリカン・サイアナミド・カンパニー | Storage-stable, single-liquid type and thermosettable polyurethane adhesive composition |
-
1987
- 1987-11-18 JP JP62294487A patent/JPH0762129B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01132675A (en) | 1989-05-25 |
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