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JPH0765885B2 - Thin film thickness measurement method - Google Patents
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JPH0765885B2 - Thin film thickness measurement method - Google Patents

Thin film thickness measurement method

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Publication number
JPH0765885B2
JPH0765885B2 JP1272623A JP27262389A JPH0765885B2 JP H0765885 B2 JPH0765885 B2 JP H0765885B2 JP 1272623 A JP1272623 A JP 1272623A JP 27262389 A JP27262389 A JP 27262389A JP H0765885 B2 JPH0765885 B2 JP H0765885B2
Authority
JP
Japan
Prior art keywords
thin film
thickness
measuring
film thickness
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1272623A
Other languages
Japanese (ja)
Other versions
JPH03131703A (en
Inventor
孝夫 安江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1272623A priority Critical patent/JPH0765885B2/en
Publication of JPH03131703A publication Critical patent/JPH03131703A/en
Publication of JPH0765885B2 publication Critical patent/JPH0765885B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、導電性物質表面の絶縁性薄膜の厚さを測定す
る方法に関するものである。
The present invention relates to a method for measuring the thickness of an insulating thin film on the surface of a conductive substance.

〔従来の技術〕[Conventional technology]

第4図は従来方法の一例である電気容量法の説明図であ
る。同図において、1は導電性薄膜、2は被測定物であ
る絶縁膜、3は電極層、4は静電容量を測定するための
電気系である。
FIG. 4 is an explanatory diagram of an electric capacitance method which is an example of a conventional method. In the figure, 1 is a conductive thin film, 2 is an insulating film which is an object to be measured, 3 is an electrode layer, and 4 is an electric system for measuring capacitance.

また、第5図は、電気系4による測定結果を示すグラフ
である。
Further, FIG. 5 is a graph showing the measurement results by the electric system 4.

ここであげる従来方法はあくまで一例で、他の従来方法
として種々のものがあるが、詳細は、例えば文献(金原
粲著、「薄膜の基本技術」、物理工学実験5、東京大学
出版会、74頁〜77頁)を参照されたい。
The conventional method mentioned here is merely an example, and there are various other conventional methods. For details, refer to, for example, the literature (Kanehara, A., “Basic Technology of Thin Films”, Physical Engineering Experiment 5, The University of Tokyo Press, 74 Pp.-77).

次に、電気容量法について説明する。導電性物質1上に
形成された絶縁膜2の膜厚を測定するために、絶縁膜2
上に形成された電極層3のいわゆるサンドイッチ構造に
おいて、上下の導電層1,3を電極層とした電気系4によ
って両電極間の静電容量を測定し、既知の誘電率から絶
縁膜2の膜厚を計算することができる。これが電気容量
法と呼ばれる方法である。
Next, the capacitance method will be described. In order to measure the film thickness of the insulating film 2 formed on the conductive material 1, the insulating film 2
In the so-called sandwich structure of the electrode layer 3 formed above, the capacitance between both electrodes is measured by the electric system 4 using the upper and lower conductive layers 1 and 3 as electrode layers, and the insulating film 2 of the known dielectric constant is measured. The film thickness can be calculated. This is a method called the capacitance method.

このような測定方法において、絶縁膜2の膜厚が100Å
(オングストローム)以下であるような場合には、両電
極間にトンネル電流が流れることが一般に知られてい
る。第5図は、酸化アルミニウム皮膜を流れるトンネル
電流を表わしており、電極間を流れるトンネル電流と絶
縁膜2の厚さには比例関係が成立している。すなわち、
100Å以下の非常に薄い極薄膜の膜厚は、このトンネル
電流をモニタリングすることによって可能である。な
お、第5図は文献(堺 孝夫著,「電子物性」,標準電
気工学講座,コロナ社)の80頁に記載されたグラフであ
る。
In this measurement method, the thickness of the insulating film 2 is 100Å
It is generally known that a tunnel current flows between both electrodes in the case of (Angstrom) or less. FIG. 5 shows the tunnel current flowing through the aluminum oxide film, and the tunnel current flowing between the electrodes and the thickness of the insulating film 2 have a proportional relationship. That is,
Very thin ultrathin films below 100Å are possible by monitoring this tunnel current. Note that FIG. 5 is a graph described on page 80 of the document (Takei Sakai, “Electronic Properties”, Standard Electrical Engineering Course, Corona Publishing Co.).

〔発明が解決しようとする課題〕[Problems to be Solved by the Invention]

従来の薄膜の膜厚測定方法は以上のようになされるが、
被測定物に何らかの処理(例えば非破壊測定)を施すこ
とや、被測定物の局所的,微視的な領域における薄膜測
定ができなく、また、100Å以下の極薄膜の測定誤差が
大きいなどの問題があった。
The conventional thin film thickness measuring method is as described above,
It is impossible to perform some processing (for example, non-destructive measurement) on the DUT, or it is not possible to measure the thin film in the local or microscopic area of the DUT. There was a problem.

本発明はこのような点に鑑みてなされたものであり、そ
の目的とするところは、非破壊測定や局所領域測定が可
能で、特に100Å以下の極薄膜の測定に精度が高い薄膜
の膜厚測定方法を得ることにある。
The present invention has been made in view of such a point, and its purpose is to enable non-destructive measurement and local area measurement, and particularly high-precision thin film thickness of 100 Å or less. To obtain a measuring method.

〔課題を解決するための手段〕[Means for Solving the Problems]

このような課題を解決するために本発明は、先端の鋭利
な導電性チップを絶縁性薄膜の表面に非接触で近づけた
ときに流れる電流を測定することにより絶縁性薄膜の厚
さを測定するようにしたものである。
In order to solve such a problem, the present invention measures the thickness of the insulating thin film by measuring the current flowing when the sharp conductive tip has been brought close to the surface of the insulating thin film in a non-contact manner. It was done like this.

〔作用〕[Action]

本発明による薄膜の膜厚測定方法は、非接触、非破壊
で、極めて局所領域の極薄膜の測定を可能にする。
The thin film thickness measuring method according to the present invention enables non-contact, non-destructive measurement of an extremely thin film in an extremely local region.

〔実施例〕〔Example〕

以下、本発明の実施例を図を用いて説明する。 Embodiments of the present invention will be described below with reference to the drawings.

第1図は、本発明による薄膜の膜厚測定方法の一実施例
の説明図である。同図において、1は導電性薄膜として
の導電性物質、2は被測定物である絶縁膜、5は先端の
鋭利な導電性チップである。
FIG. 1 is an explanatory diagram of an embodiment of a method for measuring the thickness of a thin film according to the present invention. In the figure, 1 is a conductive substance as a conductive thin film, 2 is an insulating film as an object to be measured, and 5 is a conductive tip having a sharp tip.

導電性物質1上の被測定物である絶縁膜2の膜厚を測定
する場合、先端の鋭利な導電性チップ5をピエゾ素子等
を用いて絶縁膜2の表面に近づける。導電性チップ5の
先端と絶縁膜2の表面との距離が10Å程度まで近づく
と、導電性チップ5と導電性物質1との間でトンネル電
流が流れる。
When measuring the film thickness of the insulating film 2 that is the object to be measured on the conductive substance 1, the conductive tip 5 having a sharp tip is brought close to the surface of the insulating film 2 using a piezo element or the like. When the distance between the tip of the conductive chip 5 and the surface of the insulating film 2 approaches about 10Å, a tunnel current flows between the conductive chip 5 and the conductive substance 1.

このトンネル電流の大きさは、先に第5図に述べたよう
に、絶縁膜2の厚さによって変化するため、この電流値
をモニタしておけば、絶縁膜2の厚さ測定が可能とな
る。
Since the magnitude of this tunnel current varies depending on the thickness of the insulating film 2 as described above with reference to FIG. 5, it is possible to measure the thickness of the insulating film 2 by monitoring this current value. Become.

なお、上記実施例では、導電性チップ5の結晶性を特に
規定しなかったが、多結晶でも可であり、単結晶チップ
を用いれば、より先端の細いチップの作製が可能であ
る。
In addition, although the crystallinity of the conductive tip 5 is not particularly specified in the above-mentioned embodiment, a polycrystal may be used, and if a single crystal tip is used, a tip having a finer tip can be manufactured.

また、第2図に示すように、他のチップ6を用いて同じ
測定を行なうことにより、より確度の高い測定が行なえ
る。
Further, as shown in FIG. 2, by performing the same measurement using another chip 6, more accurate measurement can be performed.

さらに、第2図に示す2本のチップとして、異なる結晶
軸をもつ単結晶チップを用いれば、それぞれの単結晶チ
ップからの放出電流は、第3図に示すように、その結晶
軸に固有のため、より確度の高い測定ができる。第3図
は文献(堺 孝夫著,「電子物性」,標準電気工学講
座,コロナ社)の79頁に記載されたグラフであり、(11
1),(211),(011)は結晶軸を示す。
Furthermore, if single crystal chips having different crystal axes are used as the two chips shown in FIG. 2, the emission current from each single crystal chip is unique to the crystal axis as shown in FIG. Therefore, more accurate measurement can be performed. Fig. 3 is a graph described on page 79 of the literature (Takao Sakai, "Electronic Properties", Standard Electrical Engineering Course, Corona Publishing Co., Ltd.) (11
1), (211) and (011) indicate crystal axes.

さらに、本実施例では、チップ5と絶縁膜2との間の環
境は規定していないが、真空中でも大気中でも可能であ
る。ただし、真空中の方が、ノイズ,コンタミネーショ
ン(汚染)は軽減される。
Furthermore, in this embodiment, the environment between the chip 5 and the insulating film 2 is not specified, but it is possible in vacuum or in the atmosphere. However, noise and contamination are reduced in a vacuum.

〔発明の効果〕〔The invention's effect〕

以上説明したように本発明は、薄膜の膜厚測定に先端の
鋭利な導電性チップからのトンネル電流を利用すること
により、非接触,非破壊で、局所的な領域の膜厚測定を
行なうことができ、また導電性チップを複数用いること
により100Å以下の極薄膜の膜厚測定を精度高く行なう
ことができる効果がある。
As described above, according to the present invention, non-contact, non-destructive, local film thickness measurement is performed by utilizing a tunnel current from a sharp conductive tip for thin film thickness measurement. By using a plurality of conductive chips, it is possible to accurately measure the film thickness of an extremely thin film of 100 Å or less.

【図面の簡単な説明】[Brief description of drawings]

第1図および第2図は本発明による薄膜の膜厚測定方法
の第1および第2の実施例の説明図、第3図はタングス
テン結晶と面電界放出電流の関係を示すグラフ、第4図
は従来の薄膜の膜厚測定方法の説明図、第5図はトンネ
ル電流対絶縁膜の厚さの関係を示すグラフである。
1 and 2 are explanatory views of first and second embodiments of the method for measuring the thickness of a thin film according to the present invention, FIG. 3 is a graph showing the relationship between a tungsten crystal and a surface field emission current, and FIG. Is an explanatory view of a conventional method for measuring the film thickness of a thin film, and FIG. 5 is a graph showing the relationship between tunnel current and the thickness of an insulating film.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】導電性物質表面の絶縁性薄膜の厚さを測定
する膜厚測定方法において、先端の鋭利な導電性チップ
を前記絶縁性薄膜の表面に非接触で近づけたときに流れ
る電流を測定することにより前記絶縁性薄膜の厚さを測
定することを特徴とする薄膜の膜厚測定方法。
1. A film thickness measuring method for measuring a thickness of an insulating thin film on a surface of a conductive substance, wherein a current flowing when a conductive tip having a sharp tip is brought into contact with the surface of the insulating thin film in a non-contact manner. A method for measuring the thickness of a thin film, which comprises measuring the thickness of the insulating thin film by measuring.
JP1272623A 1989-10-18 1989-10-18 Thin film thickness measurement method Expired - Lifetime JPH0765885B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1272623A JPH0765885B2 (en) 1989-10-18 1989-10-18 Thin film thickness measurement method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1272623A JPH0765885B2 (en) 1989-10-18 1989-10-18 Thin film thickness measurement method

Publications (2)

Publication Number Publication Date
JPH03131703A JPH03131703A (en) 1991-06-05
JPH0765885B2 true JPH0765885B2 (en) 1995-07-19

Family

ID=17516510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1272623A Expired - Lifetime JPH0765885B2 (en) 1989-10-18 1989-10-18 Thin film thickness measurement method

Country Status (1)

Country Link
JP (1) JPH0765885B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6079497B2 (en) * 2013-08-01 2017-02-15 信越半導体株式会社 Semiconductor substrate evaluation method and semiconductor substrate evaluation apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6433007U (en) * 1987-08-21 1989-03-01

Also Published As

Publication number Publication date
JPH03131703A (en) 1991-06-05

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