JPH0766028B2 - Cooling structure of test head for IC tester - Google Patents

Description

The present invention relates to a cooling structure of a test head for an IC tester.

[Prior Art] Next, a conventional cooling structure for a test head for an IC tester will be described with reference to FIG.

In FIG. 3, 11 is a hollow tube provided in the central part of the test head, 13 is a printed board radially arranged around the tube 11,
Reference numeral 14 is a blower provided at the four corners of the test head, 1 is a ventilation hole provided at the four corners of the test head, and 16 is a case.

An IC is mounted on the printed board 13.

Usually, the IC to be measured is placed in the center of the test head.

Each pin of the IC to be measured and the IC mounted on each printed board 13
In order to make the distance between and as short as possible and make them equidistant, the printed board 13 is arranged radially around the tube 11.

Next, a sectional view of the main part of FIG. 3 will be described with reference to FIG.

Reference numeral 17 in FIG. 4 is a ventilation hole provided in the pipe 11, and the blower 14
Rotates to blow air out of the case 16, so
The air sucked from the upper side or the lower side of the tube 11 goes out of the case 16 through the ventilation holes 17 of the tube 11 between the printed boards 13.

By passing air between the printed boards 13, the ICs mounted on the printed boards 13 are cooled.

[Problems to be Solved by the Invention] In FIG. 3, air cooling by a blower 14 is adopted, but recently, the number of printed boards 13 mounted increases, and further, the printed boards 13 are mounted.
Is becoming densely packed.

For this reason, in the cooling structure as shown in FIG. 3, the circulation of air is deteriorated, and the cooling efficiency cannot be improved.

In addition, problems such as noise, vibration, and dust caused by the blower 14 may be limited depending on the use environment, and a cooling method that does not use the blower 14 is required.

According to the present invention, the first heat conduction plate is inserted into the inner layer of the printed board 13 arranged around the tube 11 and the second heat conduction plate which is electrically connected to the first heat conduction plate is connected to the printed board. Attach to the end of the surface opposite to the tube 11, fix the heat sink to the second heat conduction plate, attach the heat pipe to the heat sink,
The cooling plate is configured to be in contact with each heat sink, a flow path is formed inside the cooling plate, and a fluid having a large specific heat, such as water, is flowed in the flow path of the cooling plate to be mounted on the printed board 13. The present invention aims to provide a cooling structure for a test head for an IC tester having a high cooling efficiency by cooling the IC.

[Means for Solving the Problem] In order to achieve this object, in the present invention, a tube 11 arranged in the central portion, and radially arranged around the tube 11, IC12A is attached to the front surface, For a test head of an IC tester composed of a plurality of printed boards 13 to which chip parts 12B are attached, a first heat conduction plate 1 inserted into an inner layer of the printed board 13 and a printed board opposite to the tube 11. A second heat conducting plate 2 attached to the surface of the printed board 13 at the end of 13 and electrically conducting to the first heat conducting plate 1, and a heat sink 3 fixed to the second heat conducting plate 2. , A heat pipe 4 connected to the heat sink 3 and in contact with the IC 12A, and a cooling plate 5 configured to contact each heat sink 3 and having a flow passage 6 formed therein. Cool the IC 12A and chip parts 12B by flowing a fluid with a large specific heat To.

Next, the cooling structure of the IC tester test head according to the present invention will be described with reference to FIG.

In FIG. 1, 3 is a heat sink, 4 is a heat pipe, 5 is a cooling plate, 12A is an IC mounted on the surface of the printed board 13 to be cooled, 6 is a flow path formed inside the cooling plate 5, and 7 is A cooling fluid inlet, 8 is a cooling fluid outlet.

The relationship between the tube 11 and the printed board 13 is the same as in FIG.

The cooling plate 5 is formed in a donut shape, and a flow path 6 through which a cooling fluid flows is formed inside.

The cooling plate 5 presses the printed board 13 mounted in a radial shape from the upper surface and is connected to the heat sink 3.

[Operation] Next, a cross-sectional view of the main parts related to the printed board 13 of FIG. 1 will be described with reference to FIG.

A plurality of ICs 12A are attached to the front surface of the printed board 13, and a plurality of chip components 12B are attached to the back surface of the printed board 13.

Reference numeral 1 in FIG. 2 denotes a heat conduction plate, which is inserted into the inner layer of the printed board 13.

Reference numeral 2 denotes a heat conductive plate, which is attached to the surface of the printed board 13 at the side opposite to the tube 11 and at the end of the printed board 13 so as to be electrically conducted to the heat conductive plate 1.

The heat sink 3 is fixed to the heat conducting plate 2, and the heat pipe 4 is connected to the heat sink 3.

The heat pipe 4 is formed in a tubular shape, the inner wall of the tube has a capillary structure, the inside is evacuated, and a small amount of a working fluid such as freon is sealed therein, and has good thermal conductivity.

That is, when a part of the heat pipe 4 is heated, the liquid in the heated part evaporates and the vapor moves to the unheated part.

In the low temperature part, the liquid condenses and the condensate flows back to the heated part by the capillary phenomenon.

By repeating this operation, heat is transferred from the heated portion to the unheated portion.

The capacity of IC12A is 2W to 6W, and the capacity of chip part 12B is 0.
It is about 1W.

When the IC 12A and the chip portion 12B generate heat, the heat of the IC 12A is transferred from the heat pipe 4 to the heat sink 3 and the chip component 12
The heat of B is transmitted from the heat conducting plate 1 in the inner layer of the printed board 13 to the heat conducting plate 2 and the heat sink 3 in sequence.

The heat conductive plates 1 and 2 and the heat sink 3 are made of a material having a high heat conductivity, such as copper.

Also, in order to reduce contact thermal resistance, heat pipe 4 and IC12
Apply silicone grease with high thermal conductivity between A. Further, when the heat generation amount of the IC 12A is small, a copper plate or the like may be used instead of the heat pipe 4.

On the other hand, a cooling fluid such as water having a high specific heat passes from the inlet 7 in FIG. 1 through the flow path 6 of the cooling plate 5, and cools the heat sink 3 in the flow path 6.

The cooling fluid that has passed over the heat sink 3 exits at the outlet 8.

[Effects of the Invention] According to the present invention, the first heat conduction plate is inserted into the inner layer of the printed board arranged centering on the tube, and the second heat conduction that conducts heat with the first heat conduction plate is provided. Attach the board to the end of the printed board on the side opposite to the tube, fix the heat sink to the second heat conduction plate, attach the heat pipe to the heat sink,
The cooling plate is configured so that it contacts each heat sink, a flow path is formed inside the cooling plate, and a fluid with a large specific heat flows in the flow path of the cooling plate, so the IC mounted on the surface of the printed board
And, it is possible to cool the chip components attached to the back surface of the printed board, and it is possible to provide a cooling structure for the test head for the IC tester, which has a higher cooling efficiency than the air cooling type.

[Brief description of drawings]

FIG. 1 is a cooling structure diagram of an IC tester test head according to the present invention, FIG. 2 is a sectional view of an essential part related to a printed board 13 of FIG. 1, and FIG. 3 is a conventional IC tester test head cooling. FIG. 4 is a sectional view of the main part of FIG. 1 ... Heat conduction plate, 2 ... Heat conduction plate, 3 ... Heat sink, 4 ... Heat pipe, 5 ... Cooling plate, 6 ... Flow path,
7 ... Inlet, 8 ... Exit, 11 ... Pipe, 12A ... IC, 12B ...
… Chip parts, 13… Printed boards.

Claims (1)

[Claims] 1. A pipe (11) arranged in a central portion, and a pipe (11)
Printed on the test head of the IC tester, which is composed of multiple printed boards (13) that are radially arranged around the IC, the IC (12A) is attached to the front surface, and the chip parts (12B) are attached to the back surface. The first heat conducting plate (1) inserted into the inner layer of the plate (13) and the end of the printed plate (13) opposite to the tube (11) are attached to the surface of the printed plate (13), 1 heat conduction plate (1)
A second heat conducting plate (2) which is in thermal communication with the heat sink (3) fixed to the second heat conducting plate (2)
A heat pipe (4) connected to the heat sink (3) and contacting the IC (12A), and a cooling plate configured to contact each heat sink (3) and having a channel (6) formed therein (5) and a test head for an IC tester, characterized in that the IC (12A) and the chip component (12B) are cooled by flowing a fluid having a large specific heat through the flow path (6) of the cooling plate (5). Cooling structure.