JPH0766698B2 - Thermosetting self-bonding enamel copper wire - Google Patents

Description

The present invention relates to a self-bonding enameled copper wire. More specifically, the present invention relates to a thermosetting self-bonding enameled copper wire suitable for winding of a coil used in a small motor.

[Conventional technology]

Self-fusing enamel copper wire coated and baked with an adhesive coating via an insulating film on the conductor, the adhesive film is fused or melted and swelled by heating or solvent treatment after winding the coil Since they can be adhered and solidified to each other, it is possible to relatively easily make a self-supporting coil, which is often used in the manufacture of stator and rotor coils of small motors for the purpose of omitting and simplifying the varnish impregnation process. There is.

The method for adhering a coil formed by winding a self-bonding enameled copper wire is roughly classified into a hot air adhesive type and a solvent adhesive type. Generally, in the hot air adhesive type that melts and adheres the adhesive film by heating, there is a limit to the hot air temperature to be blown to the wire due to the structure of the winding machine, and the low melting point thermoplastic resin with a thermal softening temperature of about 120 to 150 ° C. Since, for example, the block copolymer polyamide resin (nylon-12 copolymer elastomer, etc.), phenoxy resin, etc. are the main components, the heat resistance is low. On the other hand, the adhesive film of self-bonding enamel copper wire was
The solvent-adhesive type which is dissolved and swelled with an organic solvent such as ethanol and then adhered can use a high melting point thermoplastic resin such as an alcohol-soluble polyamide resin, and has improved heat resistance characteristics as compared with the hot-air adhesive type. However, the integrated coil in which the wire between the coils is fixed with an adhesive coating made of these thermoplastic resins has a difficulty in reliability in terms of heat-resistant adhesive strength, and when used in a moving part such as a motor, naturally there is a limit. It was For this reason, it has been mainly used limited to a stationary portion such as a deflection yoke coil and a low torque driving motor.

[Problems to be Solved by the Invention]

Motor stators, rotor coils, etc. are subject to loads generated during operation, such as magnetostriction and centrifugal force, which tend to cause the coils to come loose. Therefore, the coils are impregnated with varnish to firmly secure the wires and put them into practical use. I had to offer.

When an integrated coil with self-bonding enamel copper wire whose adhesive film is made of thermoplastic resin is used in a small motor,
At room temperature, the adhesive force between the wires is strong, so it can withstand the load generated during normal operation of the motor, such as magnetostriction and centrifugal force, but the motor overloads and the coil temperature forms an adhesive film. When the temperature rises to near the softening temperature of the thermoplastic resin, there is a problem in that the adhesive force between the wires decreases and the load cannot be withstood.

The present invention has been made in order to solve these problems of the prior art, and an object of the present invention is to use a thermosetting self-curing type self-standing type that can endure coil heat generation when overloaded when used in a coil of a small motor. It is to provide a fusible enameled copper wire.

[Means for Solving the Problems]

In order to achieve the above-mentioned object, the present invention is to add a polyfunctional epoxy resin to a polyamide resin having a molecular weight of 30,000 or more and having a film-forming property, and dissolve the adhesive coating (A) in an organic solvent to form a film with a molecular weight of 30,000 or more. A cross-linking agent of the above polyfunctional epoxy resin is added to an alcohol-soluble copolyamide resin having properties, and two kinds of adhesive paints (B) prepared by dissolving this in an organic solvent are directly applied to the conductor or other insulating materials. Alternating each layer individually through the film,
An adhesive film (A) which is dried and in which the polyfunctional epoxy resin remains in an unreacted state inside the adhesive film, and an adhesive film (B) in which the cross-linking agent remains in an unreacted state inside the adhesive film, It is a thermosetting self-bonding enamel copper wire provided with at least two layers of adhesive coatings (A) and (B).

As the polyamide resin having a molecular weight of 30,000 or more and having film-forming properties (hereinafter abbreviated as polyamide resin) of the present invention,
For example, block copolymer 12-nylon resin, alcohol-soluble copolymer polyamide resin, etc. may be mentioned. Block-copolymerized 12-nylon resin is an elastomer having a 12-nylon hard segment and a polyether component soft segment in the molecule, and is amorphous with a melting temperature of 120 to 160 ° C and an average molecular weight of 30,000 to 100,000. It is a block copolymerized polyamide resin having a molecular structure. Specific examples include Daiamide N1901, T451 (trade name of Daicel), Platabond M1276 and M1411 (trade name of Rilsan Japan).

Further, an alcohol-soluble copolymerized polyamide resin having a molecular weight of 30,000 or more and having a film-forming property (hereinafter abbreviated as an alcohol-copolymerized copolymerized polyamide resin) is a nylon 6-6,6-1.
1 is a copolyamide resin having a melting point of 180 ° C. or higher, for example, Ultramid 1C (German BAS
Company F product name), Amilan CM4000, CM4001 (Toray company product name) and the like.

Examples of the polyfunctional epoxy resin include novolac type polyfunctional epoxy resin ECN1299 (trade name of Dow Chemical Co.). Examples of the crosslinking agent for the polyfunctional epoxy resin include diamines such as methanediphenyldiamine. The reason why the molecular weight of the polyamide resin and the alcohol-soluble copolyamide resin is limited to 30,000 or more is that when the molecular weight is less than 30,000, the film forming property is poor and a good adhesive film cannot be obtained.

[Work]

In the production of the thermosetting self-bonding enamel copper wire of the present invention, two kinds of adhesive coatings (A) and (B) are applied alternately on the conductor directly or via an insulating film, layer by layer, In the drying process, first, the adhesive coating (A) is applied and dried to form the adhesive coating (A), and then the adhesive coating (B) is applied to the outer periphery and dried to form the adhesive coating (B). When formed (the order of forming the adhesive film may be from (B)), the polyfunctional epoxy resin dispersed on the surface of the adhesive film (A) at the boundary surface between the adhesive film (A) and the adhesive film (B). A part of the cross-linking agent (methanediphenyldiamine) dispersed on the surface of the adhesive coating (B) reacts with each other to form a thermosetting thin film, but inside the adhesive coating (A) and (B). Then, the polyfunctional epoxy resin and the crosslinking agent remain unreacted.

A thermosetting self-fusing enamel copper wire provided with such adhesive coatings (A) and (B) is wound around a coil, and this coil is subjected to the thermosetting temperature of the adhesive coatings (A) and (B). When the above heat treatment is performed, physical mixing occurs between the adhesive coatings (A) and (B) due to the tension of the coil held in the coil,
The reaction between the polyfunctional epoxy resin and the cross-linking agent starts and further progresses, the cross-linking of the polyfunctional epoxy resin dispersed and dissolved in the matrix of the polyamide resin progresses, and the adhesive film forms an interpenetrating network structure. A thermosetting film is formed. The adhesive film (A) and the adhesive film (B)
At least two layers of adhesive film (A) + (B) or (B) + (A) are necessary since the reaction starts and proceeds with the combination of, and preferably four layers of adhesive film (A) + (B) + (A)
+ (B). Also, the number of adhesive films is odd, for example, three layers of adhesive film (A) + (B) + (A) or (B) + (A) +
The case of (B) is also possible, but in this case, it is necessary to adjust the thickness of the adhesive films (A) and (B) so that the reaction between the polyfunctional epoxy resin and the crosslinking agent can be sufficiently performed. Further, the number of layers of the adhesive film may be increased, but care must be taken because the boundary surface between the adhesive film (A) and the adhesive film (B) increases and the above reaction is likely to occur.

〔Example〕

The contents of the present invention will be described below with reference to examples and comparative examples.

Preparation of Adhesive Paint Table 1 is a resin composition table of the adhesive paints of Examples 1 and 2.

Block copolymerized 12-nylon resin Daiamide N1901 (trade name of Daicel) is used as polyamide resin, and multifunctional epoxy resin ECN1299 (trade name of Dow Chemical)
Was added in the composition shown in Table 1, dissolved in a mixed solvent of cresol and xylene, and adhesive paints (A) -1, (A) with a concentration of 35% were added.
-2 was prepared.

Further, Ultramid 1C (trade name of BASF, Germany) was used as the alcohol-soluble copolyamide resin, and methanediphenyldiamine was added as a cross-linking agent of the ECN1299 in the composition shown in Table 1 to prepare a mixed solvent of cresol and xylene. Adhesive paint (B) -1, (B)-
2 was prepared.

As a comparative example, Amilan CM4000 (trade name of Toray) 10
To 0 g, 30 g of Epicoat 1007 (trade name of Yuka Shell Epoxy Co., Ltd.) was added as an anti-tacking agent and dissolved in a mixed solvent of cresol and xylene to prepare an adhesive coating having a concentration of 15%.

Manufacture of thermosetting self-bonding enamelled copper wire The manufacture of the thermosetting self-bonding enamelled copper wire of the example and the self-bonding enamelled copper wire of the comparative example will be described with reference to FIGS. 1 and 2. To do.

Example 1. As a conductor 1, a polyester imide-based insulating paint TSF-500 (trade name of Tokushu Paint Co., Ltd.) with a concentration of 35% that can be soldered onto an annealed copper wire with a conductor diameter of 0.270 mm is applied and baked (horizontal type with a furnace length of 3 m Baking furnace, furnace temperature 480 ° C, wire speed 54 m / min) Solderable polyester imide insulated wire with insulation film 2 equivalent to two kinds of film thickness was manufactured and used as a wire.

Next, another horizontal baking furnace (furnace length 3 m, furnace temperature 300 ° C, linear velocity 54 m / min)
By applying adhesive coating (A) -1 on the outer circumference of the wire,
The adhesive coating (A) 3a is baked to apply the adhesive coating (B) -1 to the outer periphery, and the adhesive coating (B) 3b is applied to the outer periphery to form the adhesive coating (A) -1. Is applied and baked to form an adhesive film (A) 3c, and the adhesive coating (B) -2 is further applied and baked on the outer periphery thereof to form an adhesive film (B) 3d. These four-layered adhesive films 3a, 3b, A thermosetting self-bonding enameled copper wire provided with an adhesive coating 3 composed of 3c and 3d was manufactured. The thickness ratio of the four layers of adhesive coatings 3a, 3b, 3c, 3d is
The target outer diameter was 1: 1: 1: 1, and the final outer diameter was one target.

Example 2 As an adhesive coating used in Example 2, instead of the adhesive coating (A) -1 used in Example 1, an adhesive coating (A) -2 and an adhesive coating (B) -1 were used instead of the adhesive coating ( B) -2 was used, and otherwise the same as in Example 1, and the thermosetting self-bonding enamel copper wire 4 was used.
Was manufactured.

Comparative Example A wire and a baking furnace were the same as those in the example, and the self-fusing enamel copper wire 5 having the adhesive coating 3 provided by coating and baking the adhesive coating of the comparative example on the outer circumference of the wire was manufactured. The finishing outer diameter was manufactured with the target of one kind of film thickness.

These self-fusing enamel copper wires were tested based on JIS C 3003 "Test method for enamel copper wires and enamel aluminum wires", and the results are shown in Table 2. In addition, a heating adhesive strength test that measures the adhesive strength of the helical coil 2.7φ after heat treatment at 120 to 200 ° C for 20 minutes and a helical coil 2.7φ after heat treatment at 180 ° C for 20 minutes are used in a heating atmosphere at 60 to 180 ° C. A heat resistant adhesive strength test was conducted to measure the adhesive strength, and the results are shown in the graphs of FIGS. 3 and 4. (Examples 1 and 2 are almost the same, so only Example 1 is shown) [Effect of the Invention] The thermosetting self-bonding enamel copper wire of the present invention is applied to an adhesive coating (A) obtained by adding a polyfunctional epoxy resin to a polyamide resin, and dissolving this in an organic solvent, and an alcohol-soluble copolymerized polyamide resin. It has a structure in which a cross-linking agent of the polyfunctional epoxy resin is added, and two kinds of paints of an adhesive paint (B) obtained by dissolving this in an organic solvent are alternately applied one by one through an insulating film and dried. Since each adhesive layer does not contain the polyfunctional epoxy resin and the cross-linking agent at the same time and has a separated structure, the drying temperature range can be widened and the shelf life can be improved. Further, as shown in FIG. 3 and FIG. 4, the adhesive strength by heating and the adhesive strength by heat in a heating atmosphere are also excellent, which is suitable for winding the coil of a small motor.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an embodiment of the thermosetting self-bonding enameled copper wire of the present invention, FIG. 2 is a cross-sectional view of a conventional self-bonding enameled copper wire, and FIG. 3 is heating. Adhesive force curve, FIG. 4 is a heat resistant adhesive force curve in a heating atmosphere. 1 ... Conductor, 2 ... Insulating film, 3 ... Adhesive film, 3a.3c ... Adhesive film (A), 3b.3d ... Adhesive film (B), 4 ... Thermosetting self-bonding enamel Copper wire, 5 ... Self-bonding enamel copper wire.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Internal reference number FI Technical display location C09J 177/00 JGB (56) References JP 48-31477 (JP, A) JP 50 -79769 (JP, A) JP 50-80487 (JP, A) JP 51-101520 JP, A) JP 62-237610 (JP, A) JP 62-262307 (JP, A) Kaihei 3-62412 (JP, A) JP-A-3-62413 (JP, A) JP-A-3-74011 (JP, A) JP-B-46-18639 (JP, B1)

Claims (1)

[Claims] 1. An adhesive coating (A) prepared by adding a polyfunctional epoxy resin to a polyamide resin having a molecular weight of 30,000 or more and having a film-forming property, and dissolving this in an organic solvent, and an alcohol-soluble co-polymer having a film-forming property of 30,000 or more. Two kinds of adhesive paints (B) prepared by adding a cross-linking agent of the above polyfunctional epoxy resin to a polymerized polyamide resin and dissolving it in an organic solvent are directly applied to the conductor or through another insulating film. Alternately coated and dried on each layer, and the polyfunctional epoxy resin remains unreacted inside the adhesive film (A) and the cross-linking agent remains unreacted inside the adhesive film. The thermosetting self-bonding enamel copper wire, wherein at least two layers of the adhesive coating (B) are provided.