JPH0767011B2 - Method for manufacturing hybrid integrated circuit device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method for manufacturing a hybrid integrated circuit device in which external connection terminals can be attached to a circuit board in the same manner as electronic components.

[Conventional technology]

A method of connecting the external connection terminal to the land electrode of the circuit board in the conventional example will be described with reference to FIG.

In FIG. 11, the circuit board 21 is, for example, a ceramic board or the like, and at least one main surface of the circuit board 21 is printed with a thick film of a conductive paste and then fired to produce a land electrode 25.
And a predetermined wiring pattern not shown is formed.

Then, a paste-like solder is applied on a wiring pattern (not shown), and the electronic components 24, 24 'are placed on it. For example, the electronic component 24 is a flat package IC, and the electronic component 24 'is a chip type surface mount electronic component.

Next, heat is applied to the reflow process while the electronic components 24 and 24 'are placed on the wiring pattern. As a result,
The electronic components 24 and 24 'are electrically connected to the wiring pattern on the circuit board 21.

Further, the plurality of terminal leads 23 composed of the U-shaped terminal portion 26 and the lead portion 27 are connected by a tie bar 22. The terminal leads thus connected by the tie bar 22
23 are collectively soldered to each land electrode 25 on both edges of the circuit board 21. After that, the terminal lead 23 is cut from its base end so that the portion of the tie bar 22 is separated from the terminal lead 23. The ends of the terminal leads 23 are bent at right angles so that the circuit board 21 can be easily placed on a mother circuit board (not shown).

The hybrid integrated circuit device is manufactured as described above. 11th
The hybrid integrated circuit device shown in the figure shows an example of a dual in-line type, but a single in-line type is also manufactured in the same manner. Further, the case where the electronic components 24 and 24 'are mounted on one main surface of the circuit board 21 has been described, but the electronic components 24 and 24 can be provided on both main surfaces. Further, the circuit board 21 to which the electronic components 24 and 24 'and the terminal leads 23 are soldered can be covered with resin.

[Problems to be Solved by the Invention]

In order to mechanically and electrically connect the terminal leads 23 of the circuit board 21 and the land electrodes of the mother circuit board (not shown), the terminal leads 23 must be arranged individually.

However, if somewhere is touched during transportation or work of the circuit board 21, the terminal lead 23 bends, causing a mounting failure between the terminal lead 23 of the circuit board 21 and the land electrode of the mother circuit board. That is, even if the terminal lead 23 of the circuit board 21 moves to the correct position on the land electrode on the mother circuit board, if there is even one terminal lead 23 that is not aligned as described above, the mounting is defective.

In addition, after connecting the terminal leads 23 of the circuit board 21 and the land electrodes of the mother circuit board, for example, the device is dropped during work, or force is applied to the substrate surface of the device in the horizontal direction for some reason. When the voltage is applied, the terminal lead 23 of the circuit board 21 is bent due to its weakness, and the circuit board 21 tilts on the mother circuit board. In such a case, the wiring pattern of the circuit board 21 and the wiring pattern of the mother circuit board may come into contact with each other to cause a short circuit accident.

Further, in order to attach the electronic components 24 and 24 'and the terminal lead 23 to the circuit board 21 as in the above-mentioned conventional example, it has to be performed in separate steps.

The present invention is for solving the above problems,
It is an object of the present invention to provide a method for manufacturing a hybrid integrated circuit device which is strong against a horizontal impact of a circuit board and which can be handled as one component when attaching the terminal lead and the circuit board.

It is another object of the present invention to provide a method for manufacturing a hybrid integrated circuit device, which can mount an electronic component and a terminal lead on a circuit board in the same process.

[Means for Solving the Problems]

In order to achieve the above object, a method of manufacturing a hybrid integrated circuit device according to the present invention comprises a first step of forming a wiring pattern and a land electrode at predetermined positions on a surface of a circuit board, and an electronic component including the wiring pattern. A second step of mounting on each of the land electrodes a columnar member for external connection terminals having at least two mountable planes around the terminal lead on the peripheral surface of the heat resistant insulating member, and the wiring. The third step is to electrically connect the pattern, the electronic component, the land electrode, and the terminal lead of the columnar member for external connection terminal by soldering by reflow processing.

In the method for manufacturing a hybrid integrated circuit device according to the present invention, the wiring pattern and the land electrode are formed at predetermined positions on the surface of the large-sized circuit board including a plurality of regions on the surface divided by the dividing grooves. Steps and electronic parts are mounted on the wiring pattern, and external connection terminal columnar members having at least two mountable planes around the peripheral surface of the heat-resistant insulating member are mounted on the land electrode. A second step of placing the wiring pattern, the electronic component, the land electrode, and a third step of electrically connecting the land electrode and the terminal lead of the external connection terminal columnar member by soldering by reflow processing; And a fourth step of obtaining individual circuit boards by dividing according to the dividing grooves.

[Action]

A land electrode and a wiring pattern are formed on at least one surface of the insulating substrate. Then, a columnar member for external connection terminals, which has a terminal lead around the peripheral surface of the insulating member, is mounted on the land electrode, and an electronic component is mounted on the wiring pattern. After that, the land electrode and the terminal lead of the columnar member for external connection terminal, and the wiring pattern and the electronic component are electrically connected by a solder reflow process to form a hybrid integrated circuit device. The electronic component and the columnar member for external connection terminal are mounted on the circuit board using, for example, a mounter device.

The hybrid integrated circuit device manufactured as described above is mounted on the wiring pattern of the mother circuit board using a mounter device, for example, and then connected to each other by a reflow process.

For large circuit boards with split grooves, regardless of whether it is a dual in-line type or a single in-line type,
The electronic component and the columnar member for external connection terminal can be attached by the same method as described above. Then, finally, the individual hybrid integrated circuit devices are obtained by dividing along the dividing grooves.

As described above, the external connection terminal columnar member in which the terminal lead is wound around the peripheral surface of the insulating member is treated in the same manner as the electronic component, and therefore the electronic component and the external connection terminal columnar member are wired on the circuit board. The steps of attaching to the pattern can be the same.

Further, since the columnar member for external connection terminal does not bend from the terminal lead even if it receives an impact, it is highly reliable against the impact during the manufacturing of the hybrid integrated circuit device and after the completion of the product.

〔Example〕

An embodiment of the present invention will be described with reference to FIGS. In FIG. 1, the hybrid integrated circuit device comprises a circuit board 1, an external connection terminal columnar member 2 having terminal leads 3 wound around its peripheral surface, and electronic components 4 and 4 '.

Then, the circuit board 1 is obtained, for example, by forming a land electrode 1 ′ and a wiring pattern (not shown) on a ceramic insulating member by thick film printing of a conductive paste, and then firing it. Further, the columnar member 2 for external connection terminal
The terminal lead 3 is wound around its peripheral surface by a method described later as shown in FIGS. 2 and 3. The electronic components 4 and 4'are, for example, flat package ICs or surface mount chip type electronic components.

Next, a solder paste is attached to the land electrodes 1'of the circuit board 1 and the wiring pattern (not shown) by printing. Then, the external connection terminal columnar member 2
And the electronic components 4 and 4'are mounted on the predetermined land electrode 1'or on the wiring pattern by using a mounter device, for example. Then, the circuit board 1 on which the columnar member 2 for external connection terminals and the electronic components 4 and 4'is mounted is put into a reflow furnace (not shown), and a reflow process is performed. As a result, the terminal lead 3 and the land electrode 1 ′, which are wound around the peripheral surface of the external connection terminal columnar member 2, the wiring pattern and the electronic component 4,
4'is electrically connected. As the columnar member 2 for external connection terminal, an insulating member that can withstand the temperature of the reflow furnace is used.

The case where the external connection terminal columnar member 2 and the electronic components 4 and 4'are attached to the wiring pattern and the land electrode 1'formed on one surface of the circuit board 1 has been described above. When the land electrode 1'and the wiring pattern are formed on both main surfaces of No. 1 and the columnar member 2 for external connection terminal and the electronic components 4, 4'are respectively mounted on the land electrode 1'and the wiring pattern, The solder reflow may be performed in two steps. However, if a semi-dry solder paste is used, the circuit board 1
The columnar member 2 for external connection terminals and the electronic components 4, 4 ′ mounted on both surfaces of the external connection terminal columnar member 2 and the electronic components 4, 4 ′ mounted on the lower surface of the circuit board 1 are dropped. Since it does not, only one reflow process is required.

After such a reflow process, the circuit board 1 may be used if necessary.
A resin is applied on the top to form an exterior.

A dual in-line type hybrid integrated circuit device has been described as an embodiment of the present invention as shown in FIG.
The same is applied to a single in-line type hybrid integrated circuit device.

Next, another embodiment of the present invention will be described with reference to FIGS.

In FIG. 4, the large-sized circuit board 6 is formed with the dividing groove 5 having a size that constitutes one hybrid integrated circuit device. Then, the external connection terminal columnar member 2 is mounted at the positions corresponding to both end edges of one hybrid integrated circuit device in the same manner as described above, and the land electrode 1'formed on the large-sized circuit board 6 is formed.
And the terminal lead 3 of the columnar member 2 for external connection terminal are electrically connected. Although only the columnar member 2 for external connection terminals is shown in FIG. 4, electronic components 4 and 4'are also attached at the same time.

After that, the individual hybrid integrated circuit devices are produced by dividing according to the dividing grooves 5.

In FIG. 5, similarly to the above, the columnar member 2 for external connection terminal is attached to a position corresponding to one end edge of the circuit board 1 to form a single in-line type hybrid integrated circuit device.

Next, a sixth method for manufacturing the columnar member 2 for external connection terminals will be described.
It will be described with reference to FIGS.

The columnar member 2 for external connection terminal is an insulating member and can be arbitrarily selected such as a square, rectangular, hexagonal or round cross section. However, the external connection terminal columnar member 2 needs to have at least two flat surfaces that can be placed on the circuit board 1 side and the mother circuit board side (not shown).

By selecting the outer shape of the external connection terminal columnar member 2, it is possible to change the height of the hybrid integrated circuit device or the effective area of the hybrid integrated circuit substrate on which electronic circuit components, land electrodes, wiring patterns, etc. are provided.

The terminal lead 3 is made of, for example, a tin-plated copper wire member, and is mounted so as to circulate along the peripheral surface of the external connection terminal columnar member 2 as described above.

Further, for example, the terminal lead 3 is formed in a shape having an open portion 8 at the lower end, as shown in FIG. The cross section of the terminal lead 3 can be a round shape, a square shape, or a rectangular conductor.

Next, the upper portion of the terminal lead 3 having the shape shown in FIG. 6 (a) is formed as a bent portion 8 ', and the terminal lead 3 is opened in the direction of both ends arrow shown in FIG. 6 (b).

On the other hand, an adhesive is previously attached to the position where the terminal lead 3 of the columnar member 2 for external connection terminal is arranged. Therefore, the terminal lead 3 whose lower end is widened by the automatic machine is automatically placed at the position where the adhesive for the external connection terminal columnar member 2 is attached.

After that, the pressing members 9 to 11 simultaneously press the periphery of the terminal lead 3 from both ends shown in FIG. Alternatively, after the pressing member 9 presses the upper portion of the terminal lead 3, the pressing members 10 and 11 similarly press the side portions from both sides.

Due to such pressing, the terminal lead 3 is circulated along the peripheral surface of the external connection terminal columnar member 2 as shown in FIG.

It should be noted that when the terminal lead 3 was placed on the columnar member 2 for external connection terminal, an adhesive was applied in advance, but the external connection terminal for external connection terminal was formed by the pressing force of the pressing members 9 to 11 without attaching the adhesive. It is possible to cut into the columnar member 2. Alternatively, a groove 7 shown by a dotted line may be formed in advance in the external connection terminal columnar member 2 as shown in FIG. 6 (e), and the terminal lead 3 may be pushed into the groove 7. When the groove 7 is provided in this way, the arrangement of the terminal leads 3 is difficult to shift,
Further, the excess solder does not penetrate into the gap of the groove 7 due to the surface tension, and the adjacent terminal leads 3 are not short-circuited.

Further, another embodiment of the method for mounting the terminal lead on the columnar member 2 for external connection terminal will be described with reference to FIGS. 7 to 10 (a) and (b).

In FIG. 7, the lead frame 14 is formed by press working from a metal strip member so as to be composed of a desired number of terminal leads 3 and a frame portion 16 having both ends connected to each other. The opening 15 is a pilot hole in the above-mentioned press working and the like. The lead frame 14 thus formed is placed so as to be passed between the pressing blocks 17 and 17 'corresponding to a press die as shown in FIG. The pressing blocks 17 and 17 'are arranged to be slightly narrower than the distance between the one side surfaces of the external connection terminal columnar member 2.

Next, the columnar member 2 for external connection terminal is pressed by a pressing member not shown in FIG. 9 (a) and FIG. 10 (a).
As shown, it is pushed between the pressing blocks 17 and 17 '. By pressing the columnar member 2 for external connection terminals, the terminal leads 3 of the lead frame 14 are laid along the three side surfaces of the columnar member 2 for external connection terminals. Then, both ends of the terminal lead 3 and the connected frame portion 16 are led out from between the pressing blocks 17 and 17 'and the external connection terminal columnar member 2.

After that, in the lead frame 14, the frame portion 16 connecting the terminal leads 3 is cut by a press or the like. Then, as shown in FIG. 9A, the both ends of the terminal lead 3 are bent by the pressing members 18, 18 'so as to circulate around one side surface of the columnar member 2 for external connection terminal, and the
It is molded as shown in FIG. In addition, terminal lead 3
At the time of press-molding in a U-shape, as shown in FIG. 10 (a), one side is fixed by a pin 19 so that the lead frame 14 does not move, and as shown in FIG. 10 (b), only the other side is fixed. You can also fold it.

The terminal lead 3 is attached to the columnar member 2 for external connection terminal by tightening the pressing members 18 and 18 '.
An adhesive may be applied to the external connection terminal columnar member 2 in advance, or a double-sided adhesive film may be attached. By doing so, even if an excessive external force is applied to the external connection terminal columnar member 2 and the terminal lead 3, the positional relationship between the two does not become dislocated.

Terminal lead 3 using the lead frame 14 as above
In the attachment to the external connection terminal columnar member 2, since there is no displacement in the positional relationship between the two, it is possible to further narrow the space between the terminal leads 3.

The columnar member 2 for external connection terminals provided with such terminal leads 3 is treated in the same manner as one electronic circuit component and attached to the circuit board 1 to form a hybrid integrated circuit device. At the same time, since the hybrid integrated circuit device does not have long terminal leads as in the conventional example, it is treated as one electronic circuit component and attached to the mother circuit board.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments. Various design changes can be made without departing from the present invention described in the claims.

For example, the shape of the terminal lead 3 may be U-shape, L-shape, frame or the like other than the above-mentioned embodiment.
In addition, in the case of the above-mentioned U-shape, the attachment to the columnar member for external connection terminals may be carried out only from above on the adhesive portion of the columnar member for external connection terminals. Further, in the case of a frame body, the opening portion in this embodiment is cut and attached so that the portion is widened.

The lead frame can be formed by etching as well as pressing.

〔The invention's effect〕

According to the present invention, the columnar member for external connection terminal provided with the terminal lead and the hybrid integrated circuit device to which the column member is attached are treated as one component. Therefore, the terminal lead is attached to the circuit board, and the hybrid integrated circuit device Both can be mounted on the mother circuit board quickly and accurately.

According to the present invention, the terminal leads are arranged so as to circulate on the peripheral surface of the external connection terminal columnar member, and the external connection terminal columnar member is provided on the circuit board. Therefore, it is strong against external shock. A hybrid integrated circuit device including a circuit board provided with a columnar member for external connection terminals as in the present invention is displaced from the mother circuit board when a drop accident or a horizontal force is applied to the hybrid integrated circuit board, or The wiring patterns do not short-circuit.

According to the present invention, since the terminal lead is attached to the external connection terminal columnar member by using the lead frame, the terminal leads can be accurately arranged without any displacement in the positions between the terminal leads. It becomes possible to narrow it.

[Brief description of drawings]

FIG. 1 is an explanatory view of assembly of a hybrid integrated circuit device according to the present invention,
2 is a perspective view of an external connection terminal according to the present invention, FIG. 3 is a cross-sectional view of the external connection terminal according to the present invention, and FIG. 4 is an explanatory view of a columnar member assembly for external connection terminal in a dual in-line type hybrid integrated circuit device; FIGS. 6A to 6E are explanatory views for assembling the columnar member for external connection terminals in the single-inline type hybrid integrated circuit device, and FIGS. FIG. 7 is an explanatory view of a lead frame in the present invention, FIG. 8 is an explanatory view of molding of a terminal lead in the present invention, and FIGS. 9 (a) and 9 (b) circulate the terminal lead in the present invention around a columnar member for external connection terminals. Explanatory views, FIGS. 10 (a) and 10 (b) are explanatory views of another embodiment in which the terminal lead according to the present invention is wound around the columnar member for external connection terminal, and FIG. FIG. 1 ... Circuit board 1 '... Land electrode 2 ... External connection terminal columnar member 3 ... Terminal lead 4 ... Electronic component 4' ... Electronic component 5 ... Separation groove 6 ... Large circuit board 7 ... Groove 8 …… Opening portion 8 ′ …… Bending portion 9 or 11 …… Pressing member 14 …… Lead frame 15 …… Opening hole 16 …… Frame portion 17,17 ′ …… Pressing block 18,18 ′ …… Pressing Material 19 …… Pin

Claims (2)

[Claims] 1. A first step of forming a wiring pattern and a land electrode 1'at predetermined positions on the surface of a circuit board 1, and electronic parts 4, 4'on the wiring pattern, a heat-resistant insulating member. The second step of mounting the external connection terminal columnar members 2 each having at least two mountable planes around the terminal lead 3 on the peripheral surface of the above, respectively, on the land electrode 1 ', the wiring pattern and the electronic component. 4, 3 ', and the third step of electrically connecting the land electrode 1'and the terminal lead 3 of the columnar member 2 for external connection terminal by soldering by reflow treatment. Device manufacturing method. 2. A wiring pattern and a land electrode 1'are formed at predetermined positions on the surface of a large-sized circuit board 6 consisting of a plurality of regions on the surface divided by dividing grooves 5.
And the electronic parts 4 and 4'on the wiring pattern, and the external connection terminal columnar member 2 having at least two mountable planes around the terminal lead 3 around the peripheral surface of the heat resistant insulating member. Second step of mounting on land electrode 1 ', soldering of the wiring pattern, electronic parts 4, 4', land electrode 1 ', and terminal lead 2 of external connection terminal columnar member 2 by reflow treatment And a fourth step of obtaining the individual circuit boards 1 by dividing the large-sized circuit board 6 according to the dividing grooves 5 of the large-sized circuit board 6, as described above. .