JPH0767040B2 - Electronic component automatic mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention is designed to adsorb an electronic component by a suction nozzle and move the relative position between the suction nozzle and the printed board by a relative moving means to place it on the printed board. And an electronic component automatic mounting apparatus that sequentially mounts the components at predetermined positions.

(B) Conventional technology When sequentially mounting chip-shaped electronic components on a printed circuit board, a television camera captures the state in which components are adsorbed by adsorption pins (corresponding to the adsorption nozzles) from below, A technique for performing the position regulation is disclosed in JP-A-60-132399.

However, even if the positions of the pin and the component are regulated, if the pin is expanded or contracted due to a change in temperature around the component, the mounting position of the component is displaced by the amount of the deviation.
There was a case where the initial setting position was shifted due to so-called temperature change of component parts in the apparatus, change over time, and the like.

(C) Problem to be Solved by the Invention This is to cope with the deviation from the initial set position due to temperature change, aging change, etc. of component parts in the apparatus.

(D) Means for Solving the Problems In the present invention, therefore, the electronic component is sucked by the suction nozzle, and the relative position between the suction nozzle and the printed circuit board is moved by the relative movement means so that the predetermined position on the printed circuit board is reached. A recognition camera for recognizing the rotation center position of the suction nozzle in an electronic component automatic mounting device that sequentially mounts the components,
A first storage means for storing a relative reference position between the camera and the nozzle rotation center, a nozzle rotation center position recognized by the camera, and a relative reference position previously stored in the first storage means are stored. Comparing means for comparing, calculating means for calculating the amount of deviation compared by the comparing means, second storage means for storing the amount of deviation obtained by the calculating means, and the second means after recognizing by the recognizing camera. There is a command means for issuing a command to the relative moving means so as to mount the part where the nozzle is attracted at a predetermined position on the printed circuit board based on the deviation amount stored in the second storage means.

(E) Action The recognition camera recognizes the rotation center position of the suction nozzle when the recognition timing comes because the recognition start switch is pressed, the temperature sensor detects the set temperature, or the timer reaches the set time. The means compares the relative reference position stored in the first storage means with the nozzle rotation center recognized by the camera, calculates the deviation amount by the calculation means, and stores it in the second storage means. After the recognition by the recognition camera, the relative position is moved by the command of the command unit based on the displacement amount stored in the second storage unit, and the electronic component sucked by the suction nozzle is mounted on the predetermined position of the printed circuit board. .

(F) Example Hereinafter, an example of the present invention will be described in detail with reference to FIGS. 1 to 6.

FIG. 2 is a diagram showing an electronic component automatic mounting apparatus to which an embodiment of the present invention is applied.

(1) is an electronic component automatic mounting apparatus for mounting a chip-shaped electronic component (not shown) on a printed circuit board (2).

(3) and (4) are a pair of conveyors for carrying the substrate (2).

(5) is a suction head unit having a suction nozzle (6), which is moved by driving the suction head unit drive unit (5A). That is, it can be moved in the X direction by the X-direction drive source along the X-axis direction guide body (7), and the guide body (7) is moved by the Y-direction drive source in the Y-axis direction guide bodies (8) and (9). Can be moved along. Therefore, the head portion (5) can move in the XY directions.

(10) is a tape feeder unit that feeds the components housed in the tape (11) one pitch at a time, and the supply reel (13) is housed in the box (12).

(14) is a parts magazine in which the parts are stored in a vertically stacked state.

(15) is a parts tray on which parts are placed.

(16) is a recognition camera provided in the vicinity of the conveyor (4), and recognizes the position of the suction nozzle (6) when it is moved upward by its drive system.

FIG. 1 is a configuration circuit diagram of one embodiment.

(17) is a keyboard (18) as an input device for setting various data, and a screen selection key (2
0), a recognition start switch (20A) as a condition giving means for giving a predetermined condition of pressing a switch for starting the position recognition of the nozzle (6), and a start key (21) for starting a component mounting operation. Various data is generated by operating each key of the keyboard (18) in the operating section.

(22) is a CPU as a control device, and the recognition camera (1
6) Position data of the suction nozzle (6) with respect to the camera (16) center in a state in which the component moved to the camera (16) center recognized by 6) is not sucked,
Comparison means (24) for comparing the center position of the recognition camera (16) stored in the RAM (23) as the first storage means and the reference position data at which the rotation center of the suction nozzle (6) coincides. The calculation means (25) for calculating the deviation amount compared by the comparison means (24) and the suction nozzle (6) in the RAM (23) in consideration of only the deviation amount obtained by the calculation means (25).
And a command means (26) for issuing a command to the suction head drive section (5A) to move the suction head section (5) to move it to the set position stored therein.

The reference position data stored in the RAM (23), which is the first storage means, is the amount of deviation when the center of the camera (16) and the rotation center of the suction nozzle (6) do not match and there is a deviation. May be stored.

The amount of deviation obtained by the calculation means (25) is the RA
It is stored in a predetermined area of M (23).

Further, the function of the RAM (23) described above may be separately provided in two storage means.

(27) stores the program related to component mounting operation
ROM.

Reference numeral (28) is a nozzle rotation unit that rotates the suction nozzle (6) by driving the rotation unit drive unit (28A), and the nozzle (6) is rotated about its axis. Further, the rotation center of the nozzle (6) is not always the axial center of the nozzle (6).

(29) is an interface and (30) is an address counter.

The operation will be described in detail below with reference to the drawings.

The mounting operation on the board (2) is performed according to the flowchart regarding the component mounting operation shown in FIG.

First, the start key (21) is pressed to start the electronic component automatic mounting device.

When the worker presses the recognition start switch (20A) for recognizing the position of the suction nozzle (6), the position recognition is performed according to the flowchart shown in FIG. That is, by driving the suction head drive unit (5A), the suction head unit (5) is moved onto the recognition camera (16), the arrival position of the suction nozzle (6) is recognized, and the nozzle position data is detected. And the reference position data, which is the matching position data of the center of the recognition camera (16) and the rotation center of the suction nozzle (6) stored in the RAM (23) by the comparison means (24), were compared, and there was no deviation. In that case, if there is a deviation, the deviation amount is calculated by the calculating means (25), and the deviation amount is stored in the RAM (23).

When the displacement amount of the nozzle (6) is stored in the RAM (23), the component mounting operation is performed in consideration of the displacement amount according to the program relating to the component mounting operation shown in FIG. That is, the address counter (30) is cleared, and the board (2) is taken in and positioned at the component mounting work station position.

Then, the suction head portion (5) is moved to the first component (R ₁ ) take-out position, the suction nozzle (6) sucks the first component (R ₁ ), and the nozzle (6) moves the component (R ₁ ). It is moved to the component recognition station that recognizes the suction state of ₁ ), and the positional deviation of the component is recognized and corrected by the recognition camera unit (not shown). That is, the rotation part drive part (28A) is adjusted so that the first part (R ₁ ) is at the angle Z ₁ shown in FIG.
The nozzle rotating part (28) is rotated by. Then, the suction head unit (5) is located at the first device position shown by the address counter (30), that is, at the coordinates (X ₁ , Y ₁ ) on the substrate (2) shown in FIG. The component (R ₁ ) is installed at a position that takes into account the amount of misalignment of the nozzle (6) stored in ().

In addition, in this embodiment, the amount of misalignment of the nozzle (6) is stored in RAM (2
3) Once stored inside, when moving to the mounting position,
Although the deviation amount is taken into consideration, the invention is not limited to this, and when the positional deviation of the nozzle (6) is recognized, the positional deviation of the nozzle (6) is corrected by the above-mentioned component recognition station, and the deviation according to the program of FIG. It may be moved to the mounting position (X ₁ , Y ₁ ). Thereafter, the address counter (30) is stepped up and the suction head unit (5) goes to pick up the next component, and the component is mounted at the mounting position according to the above operation. By repeating this operation, the component mounting on one board (2) is completed.

Then, this board (2) is discharged, the next board (2) is taken in, and the components are sequentially mounted on the board (2) in the same manner as described above.

Further, in the present embodiment, the recognition timing for recognizing the position of the suction nozzle (6) is performed before the substrate (2) is taken in, but the present invention is not limited to this, and the operator can arbitrarily select the recognition start switch (20A). It can be done when pressed. Further, this recognition timing may be designated and automatically performed. Another embodiment using this automatic designation will be described below.

(31) shown in FIG. 7 is a temperature sensor (32) provided in the vicinity of the suction nozzle (6) for detecting the temperature in the room where the electronic component automatic mounting device (1) is installed, and the temperature sensor (32). ), A temperature detector (33) for sending a signal to the CPU (22) when the temperature exceeds a set temperature, and temperature detecting means as a condition giving means. When the room temperature detected by the temperature detecting means (31) exceeds the set temperature, a signal indicating that the temperature has exceeded the set temperature is sent to the CPU (22), and the position of the nozzle (6) is recognized.

Further, (34) shown in FIG. 8 is a timer as a condition applying means for designating the recognition timing by time, and the recognition is performed at a certain set time. This timer (34)
The set time is set at a fixed interval, that is, how many times the wearing operation is repeated until the recognition operation is performed, and in consideration of the temperature, the time zone that is part of the day is particularly frequent. The recognition interval may be changed.

Further, reference numeral (35) shown in FIG. 9 is a board as a condition giving means for recognizing when the board (2) is completely discharged and it is detected that the board (2) is ejected. The position of the suction nozzle (6) may be recognized for each substrate or every several substrates by the discharge detection sensor.

Further, the recognition timing may be written in the program and the above-described nozzle recognition operation may be performed when a predetermined condition is given.

From the above, it goes without saying that the recognition timing for recognizing the position of the suction nozzle (6) is not limited to the example given as the embodiment.

Further, although the recognition camera (16) is provided in order to recognize the rotation center of the suction nozzle (6) in the embodiment, the role of the camera (16) is to recognize the suction state of the component by the suction nozzle (6). It may be provided in the recognition camera section of the recognition station.

At this time, looking at the parts with the camera part, the nozzle (6)
Since the focal length is slightly different from that of, it is necessary to vertically move the suction head section (5) by a driving source such as a pulse motor to perform focusing.

In this embodiment, the RAM (23) serving as the first storage means stores reference position data indicating a relative position between the center of the recognition camera (16) and the center of rotation of the nozzle, and the recognition camera (16) stores the reference position data. When the recognized rotation center position of the suction nozzle (6) deviates from the reference position data, the deviation amount is calculated.
It was stored in a predetermined area of RAM (23) and the mounting head was moved with reference to the reference position data and the amount of deviation.
Every time the recognition camera (16) recognizes the nozzle rotation center in the predetermined area storing the reference position data of 3), the recognition camera (16) newly recognized instead of the reference position data.
The deviation amount between the center and the nozzle rotation center may be stored, and the deviation amount may be updated and stored for each subsequent recognition of the nozzle center. However, in this way, when the reference position data is such that the rotation center of the suction nozzle (6) coincides with the center of the recognition camera (16), the deviation amount obtained by the calculation means (25) is the recognition camera. (16) Since the amount of misalignment between the center and the nozzle rotation center matches, the same thing is done.

Further, in this embodiment, the suction nozzle (6) is provided in the movable suction head section (5), and the command means (26) commands the suction head section drive section (5A) for moving the suction head section (5). As shown in the case where a plurality of suction nozzles are provided on the periphery of the rotating disc and the components are sucked at the suction position and the components are mounted on the printed circuit board at the mounting position by the rotation of the rotating disc. , When the table on which the printed circuit board is mounted moves in the XY directions and parts are mounted at predetermined positions, the amount of deviation obtained by the calculation means (25) is set in the drive source that drives the table. You can issue a command based on.

(G) Effect of the Invention With the above configuration, even if the component parts in the device deviate from the initial set positions due to temperature changes, changes over time, etc., there is no effect on the parts device operation.

[Brief description of drawings]

FIG. 1 is a schematic circuit diagram of an essential part of an electronic component automatic mounting apparatus to which an embodiment of the present invention is applied, FIG. 2 is a perspective view of the same, FIG. 3 is a diagram showing a recognition camera setting position, and FIG. FIG. 5 is a flow chart showing the operation, FIG. 5 is a flow chart showing the nozzle position recognition operation, FIG. 6 is a program relating to the component mounting operation, and FIGS. 7 to 9 are diagrams showing other embodiments. (6) …… Suction nozzle, (16) …… Recognition camera, (22)
…… CPU, (23) RAM, (24) …… Comparison means, (25) ……
Calculation means, (26) …… Instruction means.

Claims (1)

[Claims] 1. An electronic component automatic system for sucking an electronic component by a suction nozzle, moving a relative position between the suction nozzle and a printed circuit board by a relative moving means, and sequentially mounting the component at a predetermined position on the printed circuit board. In the mounting device, a recognition camera that recognizes a rotation center position of the suction nozzle, a first storage unit that stores a relative reference position between the camera and the nozzle rotation center, and a nozzle rotation center position recognized by the camera. And a relative reference position stored in advance in the first storage means, a comparison means for calculating the deviation amount compared by the comparison means, and a deviation amount obtained by the calculation means. After being recognized by the second storage means and the recognition camera, the nozzle is attracted to a predetermined position of the printed circuit board based on the deviation amount stored in the second storage means. Automatic electronic part mounting apparatus characterized by comprising an instruction unit that issues a command to said relative movement means to mount a component are.