JPH0767873B2 - IC card manufacturing method - Google Patents

Description

The present invention relates to a method for manufacturing an IC card having an IC module built therein.

[Prior Art] Today, IC cards with built-in IC chips such as microcomputers and memories are being put to practical use. Since these IC cards have a larger storage capacity than conventional magnetic stripe cards, they can be used in various applications. Is considered to be used.

This IC card has an insulating substrate 25 as shown in Fig.8.
A thin metal wire 27 for mounting the IC chip 23 and connecting the IC chip 23 and an electrode 29 provided on the back surface of the insulating substrate 25, and the IC chip
An IC module 21 in which an IC chip 23 is sealed with a synthetic resin so as to cover 23 etc. is often used, and as shown in FIG.
A through hole 16 having a size substantially equal to that of the IC module 21.
An IC card substrate 15 such as vinyl chloride provided with is manufactured separately, the IC module 21 is inserted into the through hole 16 of the IC card substrate 15, and an epoxy resin is provided around the IC module 21 as shown in FIG. Or buffer resin 13 such as silicone resin,
It is manufactured by fixing the IC module 21 to the IC card substrate 15 and then fusing the front and back of the IC card substrate 15 with the oversheet 18 having a thickness of about 0.1 mm.

In addition, a small hole 19 is partially provided in the oversheet 18 on the back surface,
The electrode 29 of the IC module 21 provided on the back surface of the insulating substrate 25
Is exposed on the back surface of the IC card 10.

As another manufacturing method, the IC chip 23 is mounted on the insulating substrate 25, and the IC module 21 in which the IC chip 23 and the thin metal wires 27 and the like are exposed is inserted into the through hole 16 of the IC card substrate 15,
A manufacturing method in which the through hole 16 is filled with a synthetic resin to seal the IC chip 23 and the thin metal wire 27 and at the same time the IC module 21 is fixed to the IC card substrate 15 (for example, Japanese Patent Laid-Open No. 63-120694).
No.), and the IC module 21 is placed in a jig that has an IC card-shaped space, synthetic resin is injected into the space, and the synthetic resin is irradiated with ultraviolet rays to cure the resin. IC card with built-in IC module 21 by curing or curing the injected synthetic resin
There is also a method for producing 10 (for example, JP-A-60-217491).

[Problems to be Solved by the Invention] An IC card substrate is preformed, and the IC is inserted into the through hole of the IC card substrate.
Insert the module and fill the IC module with the filling resin
The method of fixing to the card board is
It is difficult to improve mass productivity because the manufacturing process is diverse, such as inserting and fixing the IC module and further surface treatment to remove the irregularities of the filling resin.

Further, in the manufacturing method in which the IC module is placed in the space of the jig and then the molten synthetic resin is injected into the space, the IC module is simply placed in the jig, and the IC module is thick. Since the size is about 0.5 mm and the plate is an extremely thin plate with a length and width of about 1 cm each, there is a drawback that the position of the IC module shifts when the resin injection speed is high, improving mass productivity. It was difficult to plan.

[Means for Solving the Problems] According to the present invention, a through hole communicating with a cavity is formed in a part of an injection molding die, and an IC module is placed in the cavity so as to close the through hole. A method for molding and manufacturing an IC card by suctioning an IC module in a cavity by suction through a hole and performing injection molding, wherein a peripheral movable part that is in close contact with a fixed mold as a movable mold, and an IC card. Cavity forming movable part that forms a cavity for forming a substrate between the fixed mold and a module fixing movable part that occupies an area in the cavity corresponding to the size of the IC module in the cavity forming movable part. In addition, a mold having a through hole communicating with the cavity from the outside is used for the movable part for fixing the module.
The front surface of the movable part for fixing the module is set to a position retracted from the front surface of the peripheral movable part by a distance equal to the thickness of the IC card, and the front surface of the cavity forming movable part is retracted from the front surface of the peripheral movable part and the module. A recess is formed at the position of the movable part for fixing the module while it is advanced from the front of the movable part for fixing, or the front face of the movable part for cavity formation is made to have a thickness of the IC card more than that of the front face of the peripheral movable part. A recess is formed at the position of the module-fixing movable part with the position retracted by an equal distance, and with the front face of the module-fixing movable part further retracted from the front face of the cavity-forming movable part. The IC module is inserted into the recess, and the through hole formed in the module fixing movable portion is closed by the IC module, and the IC module is placed in the movable mold by the through hole. After suction-fixing and then suction-fixing the IC module, make the front surface of the cavity forming movable part and the module fixing movable part flush with each other, and fix the cavity forming movable part and the module fixing movable part. The mold is clamped so that the gap with the mold is equal to the thickness of the IC card, and molten resin is injected into the cavity of the mold to form the IC card.

When clamping the mold, the mold fixing is not limited to the case where the front surface of the movable part for fixing the module is flush with the front surface of the movable part for forming the cavity, and the cavity is formed according to the thickness of the IC card substrate. Clamping is performed with the front surface of the movable part for module fixation slightly retracted from the front surface of the movable part, and the front surface of the movable part for module fixation is immediately in front of the movable part for cavity formation immediately after injection of molten resin. There is also a case to move forward so as to be in the same plane.

[Operation] According to the present invention, a through hole is provided in a mold for injection molding, and the IC module is sucked and fixed to the mold by the through hole. Therefore, a molten resin generated in a cavity when a synthetic resin is injected into the mold. It is possible to prevent the phenomenon that the position of the IC module is displaced due to the high-speed flow of.

Then, a mold having a cavity forming movable part and a module fixing movable part is used for the movable mold, and a recess is formed so that the position of the module fixing movable part is retracted from the cavity forming movable part. , If you place the IC module in the recess like inserting it and fix the IC module by suction,
Positioning of the IC module at a predetermined position in the cavity becomes extremely easy.

In addition, the molding method in which the module fixing movable part is clamped at a position slightly retracted from the cavity forming movable part, and the molten resin is injected into the mold, and then the module fixing movable part is advanced, Not only is the IC module suction-fixed to the mold, but the position of the IC module in the cavity is fixed by the step between the cavity forming movable part and the module fixing movable part. It is possible to more reliably prevent the shift.

[Embodiment] In the embodiment of the IC card manufacturing method according to the present invention, as shown in FIG. 1, the peripheral edge movable portion 32 which is in close contact with the fixed mold 47 and the IC as shown in FIG. 1 and FIG. A cavity forming movable part 35 that forms a cavity 43, which is a space for molding the card 10, between the fixed mold 47 and an area substantially corresponding to the size of the IC module 21 in the cavity forming movable part 35. Is a method for manufacturing the IC card 10 by injection molding using a movable mold 31 that includes a module fixing movable portion 38 that occupies the same and has a through hole 41 that communicates with the outside of the mold.

In this manufacturing method, first, the front surface of the movable portion 38 for fixing the module is
39 is set at a position retracted 0.76 mm from the front surface 33 of the peripheral movable portion 32, and the cavity forming movable portion 35 is set at a position advanced by 0.10 mm to 0.30 mm from the module fixing movable portion 38. A recess 44 is formed at the position of the module fixing movable portion 38 in the cavity forming movable portion 35. Then, with the back surface of the IC module 21 facing downward, the IC module 21 is placed in the recess 44.
By inserting the through hole 41 formed in the module fixed-like movable portion 38 into the IC module 21 as shown in FIG.
The insulating substrate 25 of FIG.
By connecting 41, suction is performed through the through hole 41, and the IC module 21 is attached to the front surface of the module fixing movable portion 38.
Adsorb to 39. As shown in FIG. 4, the front surface 36 of the cavity forming movable portion 35 is the same as the front surface 39 of the module fixing movable portion 38 while the IC module 21 is sucked and fixed to the module fixing movable portion 38. While moving the cavity forming movable part 35 backward so as to form a flat surface, the movable mold 31 as a whole is moved forward to bring the peripheral movable part 32 of the movable mold 31 into close contact with the fixed mold 47 to perform mold clamping. A flat plate-shaped IC card 10 having an IC module 21 built therein is manufactured by injecting a synthetic resin into a mold.

As described above, when the movable mold 31 having the through hole 41 communicating with the cavity 43 is used and the IC module 21 inserted into the cavity 43 by the through hole 41 is suction-fixed and injection molding is performed. The IC module 21 does not move in the cavity 43 even when the molten resin is introduced into the cavity 43 at a high speed, and the IC module 21 is arranged at a predetermined position in the cavity 43, that is, a predetermined position of the IC card substrate 15. It becomes possible to manufacture the IC card 10 by injection molding, and the IC card 10 injection-molded in this way has no unevenness due to the jig for fixing the IC module 21 to the IC card substrate 15, and the front and back are smooth. It can be mass-produced as an IC card 10 having a flat surface.

Also, using a movable mold 31 composed of a peripheral movable portion 32, a cavity forming movable portion 35, and a module fixing movable portion 38,
If the front surface 39 of the movable portion 38 for fixing the module corresponding to the size of the IC module 21 is retracted from the front surface 36 of the movable portion 35 for forming a cavity to form the recess 44, the IC module 21 in the movable mold 31 is formed. When the IC module 21 is inserted into a predetermined position in the cavity 43, the IC module 21 can always be inserted accurately and easily into the same position in the cavity 43.

Further, the above-mentioned embodiment is the front surface of the movable portion 38 for fixing the module.
The IC module 21 is inserted in a position in which 39 is retracted from the front surface 33 of the peripheral edge movable portion 32 by a distance of 0.76 mm which is equal to the thickness of the IC card 10, and the cavity forming movable portion 35 is inserted after the insertion of the IC module 21. In contrast to the case where the mold is retracted and the mold is clamped, as another molding method using the same movable mold 31, as shown in FIG. 5, the front surface 36 of the cavity forming movable portion 35 is moved to the peripheral movable portion 32. It is set at a position retracted 0.76 mm from the front surface 33, and the front surface 39 of the module fixing movable portion 38 is further retracted by a few mm from the front surface 36 of the cavity forming movable portion 35 to form a recess 44. After the IC module 21 is inserted into the recess 4 and the IC module 21 is suction-fixed to the module fixing movable portion 38, the module fixing movable portion 38 is moved forward to move the front surface 36 of the cavity forming movable portion 35.
And the front surface 39 of the movable part 38 for fixing the module are flush with each other, and the movable mold 31 as a whole is advanced so that the peripheral movable part 32 is brought into close contact with the fixed mold 47 as shown in FIG. Tightening is performed and injection molding is performed. Further, when the module fixing movable portion 38 is advanced to perform mold clamping, the module fixing movable portion 38 is arranged so that the front surface 36 of the cavity forming movable portion 35 is flush with the front surface 39 of the module fixing movable portion 38. Not only when performing injection molding after advancing the mold and performing mold clamping, the movable part for fixing the module
The front surface 39 of 38 is more than the front surface 36 of the movable portion 35 for forming a cavity.
Stop the forward movement at the position retracted by about 0.1 mm and clamp the mold,
Immediately after the synthetic resin is injected into the cavity 43, the module fixing movable part 38 may be moved forward again so that the front surface 39 of the module fixing movable part 38 is flush with the front surface 36 of the cavity forming movable part 35.

In this way, even when the front surface 36 of the cavity forming movable portion 35 is retracted from the front surface 33 of the peripheral edge movable portion 32 by 0.76 mm, which is equal to the thickness of the IC card 10, the front surface of the module fixing movable portion 38.
If 39 is further retracted from the front surface 36 of the cavity forming movable portion 35, it is easy to insert the IC module 21 into a predetermined position, and the module fixing movable immediately after the synthetic resin is injected into the mold. In the case of advancing the portion 38 again, a cavity forming movable portion which forms a gap for molding the IC card substrate 15 with the fixed mold 47 at the time of injection molding in which the molten resin is made to flow into the cavity 43. Since there is a step between the 35 and the movable part 38 for fixing the module that suction-fixes the IC module 21, the IC module 21 is caused by the flow of the molten resin.
It is possible to reliably prevent the displacement of the IC module 21 during the injection molding without the flow of the liquid.

In the above embodiment, the movable mold 31 is divided into a peripheral movable part 32, a cavity forming movable part 35, and a module fixing movable part 38, and the movable mold 31 is composed of three main members. As shown in FIG. 6, a space (cavity 43) for molding the IC card board 15 is formed by integrally forming the peripheral movable portion and the cavity-forming movable portion and having a close contact portion closely contacting with the fixed mold 47. A cavity forming movable die 37 which is a cavity forming movable die 37 that can be formed between the fixed die 47 and a cavity fixing movable portion 38 similar to the above-described embodiment at a predetermined position in the cavity 43. Then, since the movable mold 37 for forming the cavity can be configured by two main members, the mold fixing work which requires the manufacture of the mold and the alignment of the respective parts is facilitated, and the module is fixed. Front part 39 of the movable part 38 for The IC module 21 to facilitate the insertion fixed to a predetermined position in the cavity 43 by forming a recess 44 is retracted than the surface, the IC
By injection-molding the module 21 while suction-fixing it, the IC card 10 including the IC module 21 can be easily mass-produced.

As another embodiment of the present invention, in a mold capable of forming a cavity 43 for molding the IC card substrate 15, the movable mold 31 or the fixed mold 47 has a through hole 41 communicating from the cavity 43 to the outside. It is also possible to use an injection molding device in which the through hole 41 is simply connected to the suction device.

In this case, the manufacturing of the mold and the mold clamping work are extremely easy, and the IC module 21 is inserted into the position of the through hole 41 provided in the fixed mold 47 or the movable mold 31 while positioning the IC module 21 by an appropriate insertion device. Then, the through hole 41 is closed by the IC module 21, and the IC module 21 is suction-fixed in the mold by the suction device, and the IC module 21 is suction-fixed in the mold and clamped to perform injection molding. Is to do.

Further, as a modified example of the mold, there is a case where a plurality of module fixing movable parts 38 are provided. As an example of this case, as shown in FIG. 7, for example, a module fixing movable part 38 having four through holes 41 in a cavity 43 is provided, and each module fixing movable part 38 is provided with an IC module 21. The synthetic resin is injected into the cavity 43 while being inserted and placed and fixed by suction and the synthetic resin is injected into the cavity 43, whereby a large flat synthetic resin plate is injection-molded, and the IC module 21 is formed from the large flat synthetic resin plate. The IC card 10 including the IC module 21 is manufactured by punching out the IC card 10 so that the IC card 10 is included in each predetermined position.

Incidentally, the above-mentioned respective embodiments are based on the front surface of the cavity forming movable portion 35.
Although injection molding is performed with the gap between 36 and the front surface of the fixed mold 47 being 0.76 mm which is equal to the thickness of the IC card 10, the gap between the cavity forming movable part 35 and the fixed mold 47 is set to about 0.60 mm, It is also possible to attach the oversheets 18 to both sides or one side of the injection-molded IC card substrate 15 to form the IC card 10 having a predetermined thickness.

[Advantages of the Invention] The present invention uses a mold having a movable part for module fixing in which a through hole is formed and a movable part for cavity formation as a movable mold, and the movable part for module fixing is retracted to move the inside of the cavity. Since a recess is formed in the IC,
When inserting and fixing the module, it is possible to extremely easily position the IC module at a predetermined position.

Since the module fixing movable part is provided with the through hole communicating with the cavity, the IC module inserted in the cavity can be sucked and fixed by the through hole, and the front surface of the module fixing movable part and the cavity can be fixed. Even if the synthetic resin is injected into the cavity at a high speed with the front surface of the movable part for formation flush with the IC module, the IC module does not move and injection molding is possible to inject the synthetic resin at a high speed, facilitating the IC card. It can be molded and manufactured, and the mass productivity of IC cards can be dramatically improved.

In addition, when injection molding is performed with the front surface of the module fixing movable part slightly retracted from the front surface of the cavity forming movable part, and the module fixing movable part is moved forward immediately after the synthetic resin is apologized into the mold. Is a step portion formed by the movable portion for module fixing and the movable portion for forming the cavity during injection molding in which the synthetic resin is injected into the cavity at high speed. The position is fixed more securely, and even if the molten resin is injected into the cavity at high speed during injection molding, it is possible to reliably prevent the displacement of the IC module.

[Brief description of drawings]

1 is a sectional view of a movable mold used in the first embodiment of the present invention, and FIG. 2 is a partially cutaway perspective view of the movable mold.
3 and 4 are sectional views showing the procedure of the first embodiment, FIG. 5 is a sectional view showing the method of the second embodiment, and FIG. 6 is a view showing another embodiment, and FIG. FIG. 8 is a diagram showing an example of another movable mold, FIG. 8 is a diagram showing an IC module, FIG. 9 is a diagram showing a conventional IC card substrate, and FIG. 10 is a diagram showing a conventional IC card. FIG. 10 …… IC card, 15 …… IC card board, 18 …… Oversheet, 21 …… IC module, 23 …… IC chip, 25 ……
Insulating substrate, 29 ... Electrode, 31 ... Movable mold, 32 ... Peripheral movable part, 35 ... Cavity forming movable part, 38 ... Module fixing movable part, 41 ... Through hole, 43 ... Cavity , 47 ...
… Fixed mold.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-63-257694 (JP, A) JP-A-62-201216 (JP, A) Actual development Sho-60-138722 (JP, U)

Claims (2)

[Claims] 1. A mold having a cavity-forming movable portion that forms a space for molding an IC card substrate and a module-fixing movable portion that occupies an area in the cavity that substantially matches the size of the IC module, and , The movable part for module fixation is a movable mold with a through hole that communicates with the cavity from the outside, and the module is fixed with the front surface of the movable part for module fixation retracted from the front surface of the movable part for cavity formation. The IC module is placed on the movable part for use to block the through hole, and the IC module is sucked and fixed in the mold by the through hole while the front surface of the movable portion for forming the cavity and the front surface of the movable portion for fixing the module are the same. A method of manufacturing an IC card, characterized in that a mold is clamped as a flat surface and a synthetic resin is injected into a cavity of the mold. 2. A mold having a movable portion for forming a cavity that forms a space for molding an IC card substrate and a movable portion for fixing a module that occupies an area in the cavity that substantially matches the size of the IC module, and , The movable part for module fixation is a movable mold with a through hole that communicates with the cavity from the outside, and the module is fixed with the front surface of the movable part for module fixation retracted from the front surface of the movable part for cavity formation. The IC module is placed on the movable part for use to block the through hole, and the through hole allows the IC module to be sucked and fixed in the mold while the front surface of the movable part for module fixing is slightly smaller than the front surface of the movable part for cavity formation. After the mold is clamped in the retracted state, the synthetic resin is injected into the cavity, and then the front surface of the movable part for module fixing is advanced to the same plane as the front surface of the movable part for cavity formation. IC card manufacturing method according to claim.