JPH0769159B2 - Inspection equipment - Google Patents
Inspection equipmentInfo
- Publication number
- JPH0769159B2 JPH0769159B2 JP1276578A JP27657889A JPH0769159B2 JP H0769159 B2 JPH0769159 B2 JP H0769159B2 JP 1276578 A JP1276578 A JP 1276578A JP 27657889 A JP27657889 A JP 27657889A JP H0769159 B2 JPH0769159 B2 JP H0769159B2
- Authority
- JP
- Japan
- Prior art keywords
- image
- inspection
- inspection object
- reflection plate
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007689 inspection Methods 0.000 title claims description 68
- 238000003384 imaging method Methods 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000005452 bending Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000001788 irregular Effects 0.000 description 2
- 210000000746 body region Anatomy 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000005337 ground glass Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
Landscapes
- Image Processing (AREA)
- Image Analysis (AREA)
- Length Measuring Devices By Optical Means (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、半導体装置などの側面および下面に位置す
るリードなどの曲がり,浮き上がりなどを検査する検査
装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection device for inspecting a bend or a lift of a lead or the like located on a side surface or a lower surface of a semiconductor device or the like.
〔従来の技術〕 従来の検査装置の一例を第3図に基づいて説明する。[Prior Art] An example of a conventional inspection apparatus will be described with reference to FIG.
支持台21の中央部に側面にリード20を有する半導体装置
等よりなる被検査体22を載置する検査台23が設けられて
いる。この検査台23の両方の外側には、被検査体22の側
面とリード20を写し出す画像反射板24が保持台25に一体
的に設けられ、係止ピン26で回動自在に支持台21の一部
に取付けられている。また、画像反射板24の上方には、
ランプ27がその照射光を被検査体22に照射するようにし
たカバー28と共に配置されている。さらに、被検査体22
の上方には画像反射板24で反射した被検査体22の側面と
リード20の像を撮像するCCDカメラなどの撮像装置29が
設けられている。An inspection table 23 is provided at the center of the support table 21, on which an inspected object 22 made of a semiconductor device or the like having leads 20 on its side surface is placed. On both outsides of the inspection table 23, an image reflection plate 24 for projecting the side surface of the inspection object 22 and the leads 20 is integrally provided on a holding table 25, and is rotatably supported by a locking pin 26 of the supporting table 21. Installed in part. Also, above the image reflector 24,
A lamp 27 is arranged together with a cover 28 adapted to irradiate the object 22 with the irradiation light. Further, the inspection object 22
An image pickup device 29 such as a CCD camera for picking up an image of the side surface of the object 22 to be inspected and the lead 20 reflected by the image reflection plate 24 is provided above.
このような構成において、ランプ27の光を被検査体22の
側面とリード20に照射して、その画像を位置調整した画
像反射板24で被検査体22の上方に設けられた撮像装置29
に反射させて、リード20の画像をモニタ(図示ぜず)に
写し出してリード20の曲がりや浮き上がり,本数の欠け
を検査する。In such a structure, the side surface of the inspection object 22 and the leads 20 are irradiated with the light of the lamp 27, and the imaging device 29 provided above the inspection object 22 by the image reflector 24 whose position is adjusted.
Then, the image of the leads 20 is displayed on a monitor (not shown) and the leads 20 are inspected for bending, rising, and missing.
しかしながら上記のような構造では、被検査体のリード
が内側に曲げられている場合、ランプからの照射光はリ
ードの表面の湾曲により均一な画像にはならず、検査台
とその上に載置した被検査体のリードの接面部付近が暗
部となり、そのままモニタに写し出されて、微細なリー
ドの浮き上がりなどの不良を正確に検査・判定すること
ができないという問題を有していた。また、光は被検査
体の外側に配置したランプより照射されるので、検査台
上に載置した被検査体周辺の不必要な部分まで照射して
しまい、余分な光が乱反射してしまうので、これもまた
不良を正確に検査・判定することができないという問題
を有していた。However, with the above structure, when the lead of the DUT is bent inward, the irradiation light from the lamp does not form a uniform image due to the curvature of the surface of the lead, so However, there is a problem in that the vicinity of the contact surface of the lead of the inspected object becomes a dark portion and is directly displayed on the monitor, so that it is impossible to accurately inspect / determine a defect such as a fine lead floating. In addition, since light is emitted from a lamp arranged outside the inspection object, unnecessary light around the inspection object placed on the inspection table is also irradiated, and extra light is diffusely reflected. However, this also has a problem that the defect cannot be accurately inspected and judged.
この発明の目的は、リードなどが内側に曲げられている
被検査体においても、そのリードなどと検査台との接面
部付近に暗部を生ずることなく、また不必要な部分に照
射された光による乱反射の発生をなくし、正確に検査・
判定できる検査装置を提供することである。The object of the present invention is to prevent light from irradiating an unnecessary portion without producing a dark portion in the vicinity of the contact surface between the lead or the like and the inspection table even when the lead or the like is bent inward. Accurate inspection by eliminating the occurrence of diffuse reflection
An object of the present invention is to provide an inspection device capable of making a determination.
この発明の検査装置は、被検査体が載置される画像反射
板を設けた検査台と、前記検査台上の前記画像反射板の
下方に配設された光源と、前記画像反射板の被検査体が
載置される領域内の一部を貫通し、前記画像反射板より
突出して設けられ、前記光源からの光を前記被検査体と
前記画像反射板との接面部分に照射する照射部と、前記
被検査体と前記画像反射板との接面部分を挟んで前記照
射部に対向する位置に配置した撮像装置とを備えたもの
である。The inspection apparatus of the present invention includes an inspection table provided with an image reflection plate on which an object to be inspected is mounted, a light source arranged below the image reflection plate on the inspection table, and an object to be covered by the image reflection plate. Irradiation that penetrates a part of the region where the inspection object is placed and is provided so as to project from the image reflection plate, and irradiates light from the light source to the contact surface portion between the inspection object and the image reflection plate. And an image pickup device arranged at a position facing the irradiation unit with a contact surface portion between the object to be inspected and the image reflection plate sandwiched therebetween.
この発明の構成により、照射光が被検査体の外側からで
はなく、被検査体の直下、すなわち被検査体領域の内側
下方から照射されるので、被検査体が曲面を有していて
も、被検査体と画像反射板との接面部分で曲面による暗
部を生ずることなく、正確な像が得られ、また外側から
光を照射しないため、不必要な箇所が照射されることが
なくなり、乱反射の発生を防止し、正確な像が得られ
る。また、接面部分において、影の実像と画像反射板に
写った反射像とを同時に撮像できるので、特に被検査体
の微細なリードの曲がり、浮き上がりに関しては、精度
よく検査・判定を行うことができる。With the configuration of the present invention, the irradiation light is emitted not directly from the outside of the inspection object but directly below the inspection object, that is, below the inside of the inspection object region, so that the inspection object has a curved surface. Accurate images can be obtained without causing dark areas due to curved surfaces at the contact surface between the object to be inspected and the image reflector, and unnecessary light is not emitted from the outside, so irregular reflection is eliminated. It is possible to prevent the occurrence of noise and obtain an accurate image. In addition, since the real image of the shadow and the reflection image reflected on the image reflection plate can be simultaneously imaged at the contact surface portion, it is possible to perform accurate inspection / judgment, particularly with respect to minute bending and rising of the lead of the inspection object. it can.
この発明の検査装置の一実施例を第1図および第2図に
基づいて説明する。An embodiment of the inspection apparatus of the present invention will be described based on FIGS. 1 and 2.
この検査装置は、第1図に示すように、リード3を有し
た半導体装置の被検査体2を載置して被検査体2の下側
面2aとリード3を裏面より写し出す低歪率の画像反射板
4が検査台1の上面に設けられている。その周囲には載
置される被検査体2の位置を規制する位置決め部5が台
座5aで検査台1の上面より隙間を開けて設けられてい
る。また、検査台1の内部には、光を照射する高周波点
灯型蛍光灯よりなる光源としてのランプ7と、検査台1
と画像反射板4の一部を貫通して被検査体2の下方に位
置する照射部6とからなる照明装置8が設けられてい
る。この照射部6は、ランプ7の照射光を透過散乱させ
る磨りガラスまたは高分子材料からなり、画像反射板4
と被検査体2の間の領域にその透過散乱光を照射するこ
とができる。As shown in FIG. 1, this inspection apparatus has an image with a low distortion rate in which an object to be inspected 2 of a semiconductor device having leads 3 is placed and the lower side surface 2a of the object to be inspected 2 and the leads 3 are projected from the back surface. The reflection plate 4 is provided on the upper surface of the inspection table 1. A positioning portion 5 for restricting the position of the object 2 to be inspected to be mounted is provided around the base 5a with a gap from the upper surface of the inspection table 1. Further, inside the inspection table 1, a lamp 7 as a light source, which is a high-frequency lighting fluorescent lamp that emits light, and an inspection table 1 are provided.
An illuminating device 8 is provided, which includes an illuminating section 6 that is located below the DUT 2 and that penetrates part of the image reflecting plate 4. The irradiation unit 6 is made of ground glass or a polymer material that transmits and scatters the irradiation light of the lamp 7.
It is possible to irradiate the area between the inspection object 2 and the transmitted scattered light.
さらに、検査台1と位置決め部5との隙間から被検査体
2の下側面2aとリード3の像およびその反射像を撮像し
てモニタ(図示せず)に写し出すように、リード3と画
像反射板4との接面部分を挟んで照射部6に対向する位
置にCCDカメラよりなる撮像装置9が設けられている。
なお、この撮像装置9は被検査体2の四方の下側面2aと
リード3を一度に撮像できるように4台設置してもよい
し、1台または2台設置し4箇所または2箇所の移動よ
り被検査体2の四方の各下側面2aとリード3を撮像して
もよい。Further, from the gap between the inspection table 1 and the positioning part 5, the image of the lower side surface 2a of the inspected object 2 and the lead 3 and its reflection image are picked up and reflected on the monitor (not shown) so as to be projected on a monitor (not shown). An image pickup device 9 composed of a CCD camera is provided at a position facing the irradiation unit 6 with a surface contacting with the plate 4 interposed therebetween.
It should be noted that this imaging device 9 may be installed in four units so that the lower side surface 2a of the four sides of the inspection object 2 and the leads 3 can be imaged at one time, or one unit or two units are installed and four or two positions are moved. Alternatively, the four lower side surfaces 2a and the leads 3 of the inspection object 2 may be imaged.
上記の構成において、ランプ7より照射された光は、照
射部6により透過散乱され被検査体2とリード3の裏面
より照射される。この透過散乱された照射光は、第2図
に示すように、被検査体2の下側面2aとリード3による
影の実像10を作り出す。また、この影の実像10は画像反
射板4に写り被検査体2の下側面2aとリード3による影
の虚像11も同時に作り出す。そして、被検査体2の下側
面2aとリード3による影の実像10および反射像11は、撮
像装置9により撮像されてモニタに写し出され、正規の
被検査体と比べてリード3の状態が合格許容範囲内であ
るか否かの検査を行い合否の判定を行う。In the above structure, the light emitted from the lamp 7 is transmitted and scattered by the irradiation unit 6 and is emitted from the back surfaces of the DUT 2 and the leads 3. As shown in FIG. 2, the transmitted and scattered irradiation light produces a real image 10 of a shadow formed by the lower surface 2a of the inspection object 2 and the leads 3. Further, the real image 10 of the shadow is reflected on the image reflecting plate 4, and the virtual image 11 of the shadow by the lower side surface 2a of the inspection object 2 and the lead 3 is also produced at the same time. Then, the real image 10 and the reflected image 11 of the shadow of the lower surface 2a of the inspection object 2 and the leads 3 are picked up by the image pickup device 9 and displayed on the monitor, and the state of the leads 3 is passed as compared with the regular inspection object. A pass / fail judgment is made by inspecting whether or not it is within an allowable range.
第2図(a)ないし(d)に撮像装置9により撮像され
モニタに写し出された被検査体2の下側面2aとリード3
による影の実像10および反射像11の例を示して説明す
る。2 (a) to 2 (d), the lower surface 2a and the lead 3 of the device under test 2 imaged by the imaging device 9 and displayed on the monitor.
An example of the real image 10 and the reflected image 11 of the shadow by will be described.
第2図(a)はリードの曲がりや浮き上がりのない正常
な状態を示す影の実像10および反射像11、第2図(b)
はリードの1本が横に曲がった状態(A部)の不良品を
示す影の実像10および反射像11、第2図(c)はリード
の1本が曲がりすぎて他のリード3よりも浮き上がった
状態(B部)の不良品を示す影の実像10および反射像1
1、第2図(d)はリードのうち1本の曲がりが少なく
他のリードが浮き上がった状態(C部)の不良品を示す
影の実像10および反射像11である。FIG. 2 (a) is a shadow real image 10 and a reflection image 11 showing a normal state without bending or lifting of the lead, and FIG. 2 (b).
Is a real image 10 and a reflection image 11 of a shadow showing a defective product in which one of the leads is bent laterally (section A), and FIG. 2 (c) shows that one of the leads is bent too much and other leads 3 Real image 10 and reflected image 1 of the shadow showing the defective product in the raised state (part B)
1 and FIG. 2 (d) are a shadow real image 10 and a reflection image 11 showing a defective product in a state where one of the leads has little bending and the other lead is lifted (C portion).
このように、被検査体2の下側面2aとリード3を撮像す
る撮像装置9が、被検査体2の下側面2aとリード3とを
影として撮像することができる。そして、照射光が被検
査体2の外側からではなく、被検査体2の直下、すなわ
ち被検査体領域の内側下方から照射されるので、被検査
体2が内側に曲げられたリード3を有していても、リー
ド3と画像反射板4との接面部分に暗部を生ずることが
なく、正確な像が得られ、また外側から光を照射しない
ため、不必要な箇所が照射されることがなくなり、乱反
射の発生を防止し、正確な像が得られ、正確な検査・判
定を行うことができる。また、被検査体2の下側面2aと
リード3による影の実像10と、画像反射板4に写る影の
実像10の反射像11とを同時に撮像して検査することがで
き、リード3の浮き上がり不良に関しては約2倍の精度
で合否の判定を行うことが可能となる。In this way, the imaging device 9 that images the lower surface 2a of the inspection object 2 and the leads 3 can image the lower surface 2a of the inspection object 2 and the leads 3 as shadows. Since the irradiation light is emitted not directly from the outside of the inspection object 2 but directly below the inspection object 2, that is, below the inside of the inspection object region, the inspection object 2 has the lead 3 bent inward. However, a dark image does not occur at the contact surface between the lead 3 and the image reflection plate 4, an accurate image can be obtained, and light is not emitted from the outside, so unnecessary portions are illuminated. It is possible to prevent the occurrence of irregular reflection, obtain an accurate image, and perform accurate inspection / judgment. Further, the real image 10 of the shadow by the lower surface 2a of the object 2 to be inspected and the leads 3 and the reflection image 11 of the real image 10 of the shadow reflected on the image reflection plate 4 can be simultaneously picked up and inspected, and the lead 3 is lifted up. With respect to a defect, it is possible to make a pass / fail determination with about twice the accuracy.
この発明の検査装置は、被検査体が載置される画像反射
板を設けた検査台と、検査台上の画像反射板の下方に配
設された光源と、画像反射板の被検査体が載置される領
域内の一部を貫通し、画像反射板より突出して設けら
れ、光源からの光を被検査体と画像反射板との接面部分
に照射する照射部と、被検査体と画像反射板との接面部
分を挟んで照射部に対向する位置に配置した撮像装置と
を備えたことにより、照射光が被検査体の外側からでは
なく、被検査体の直下、すなわち被検査体領域の内側下
方から照射されるので、被検査体が曲面を有していて
も、被検査体と画像反射板との接面部分で曲面による暗
部を生ずることなく、正確な像が得られ、また外側から
光を照射しないため、不必要な箇所が照射されることが
なくなり、乱反射の発生を防止し、正確な像が得られ、
正確な検査・判定を行うことができる。また、接面部分
において、影の実像と画像反射板に写った反射像とを同
時に撮像できるので、特に被検査体の微細なリードの曲
がり、浮き上がりに関しては、精度よく検査・判定を行
うことができる。The inspection apparatus according to the present invention includes an inspection table provided with an image reflection plate on which an inspection object is placed, a light source arranged below the image reflection plate on the inspection table, and an inspection object of the image reflection plate. An irradiation unit that penetrates a part of the area to be placed and is projected from the image reflection plate, and irradiates light from the light source to the contact surface portion between the inspection object and the image reflection plate, and the inspection object. Since the imaging device is provided at a position facing the irradiation unit with the surface contacting with the image reflection plate interposed therebetween, the irradiation light does not come from outside the inspection object but directly below the inspection object, that is, the inspection object. Since the light is emitted from below the inside of the body region, an accurate image can be obtained without causing a dark portion due to the curved surface at the contact surface portion between the inspection object and the image reflection plate even if the inspection object has a curved surface. Also, since no light is radiated from the outside, unnecessary spots are not illuminated and diffuse reflection is generated. To prevent, correct image is obtained,
Accurate inspection / judgment can be performed. In addition, since the real image of the shadow and the reflection image reflected on the image reflection plate can be simultaneously captured at the contact surface portion, it is possible to accurately inspect / determine particularly the minute bending and rising of the lead of the inspection object. it can.
第1図(a)はこの発明の検査装置の一実施例の平面
図、第1図(b)はその側断面図、第2図(a)ないし
(d)はそれにより得られる撮像図、第3図は従来の検
査装置の側面図である。 4……画像反射板、6……照射部、7……ランプ、8…
…照明装置、9……撮像装置、10……実像、11……反射
像FIG. 1 (a) is a plan view of an embodiment of the inspection apparatus of the present invention, FIG. 1 (b) is a side sectional view thereof, and FIGS. 2 (a) to (d) are imaging views obtained by the same. FIG. 3 is a side view of a conventional inspection device. 4 ... Image reflector, 6 ... Irradiation part, 7 ... Lamp, 8 ...
... Illumination device, 9 ... Imaging device, 10 ... Real image, 11 ... Reflected image
Claims (1)
検査台と、前記検査台上の前記画像反射板の下方に配設
された光源と、前記画像反射板の被検査体が載置される
領域内の一部を貫通し、前記画像反射板より突出して設
けられ、前記光源からの光を前記被検査体と前記画像反
射板との接面部分に照射する照射部と、前記被検査体と
前記画像反射板との接面部分を挟んで前記照射部に対向
する位置に配置した撮像装置とを備えた検査装置。1. An inspection table provided with an image reflecting plate on which an object to be inspected is mounted, a light source arranged below the image reflecting plate on the inspection table, and an object to be inspected of the image reflecting plate. An irradiating unit that penetrates a part of the area where the slab is placed, is provided so as to project from the image reflection plate, and irradiates light from the light source to a contact surface portion between the inspection object and the image reflection plate. An inspection apparatus, comprising: an imaging device disposed at a position facing the irradiation unit with a contact surface portion between the inspection object and the image reflection plate being sandwiched therebetween.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1276578A JPH0769159B2 (en) | 1989-10-23 | 1989-10-23 | Inspection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1276578A JPH0769159B2 (en) | 1989-10-23 | 1989-10-23 | Inspection equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03137502A JPH03137502A (en) | 1991-06-12 |
| JPH0769159B2 true JPH0769159B2 (en) | 1995-07-26 |
Family
ID=17571422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1276578A Expired - Fee Related JPH0769159B2 (en) | 1989-10-23 | 1989-10-23 | Inspection equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0769159B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190055546A (en) * | 2017-11-15 | 2019-05-23 | 주식회사 고영테크놀러지 | Inspection apparatus |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0739942B2 (en) * | 1991-10-08 | 1995-05-01 | 正和産業株式会社 | Appearance inspection device |
| JP2006258433A (en) * | 2005-03-15 | 2006-09-28 | Susumu Nakatani | Measuring instrument for flatness, etc. and measuring method for flatness, etc. |
| JP6786593B2 (en) | 2015-08-26 | 2020-11-18 | アーベーベー・シュバイツ・アーゲーABB Schweiz AG | Target inspection equipment and methods from multiple viewpoints |
| CN115684015A (en) * | 2022-11-01 | 2023-02-03 | 江苏芯缘半导体有限公司 | Chip appearance detection mechanism |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62194403A (en) * | 1985-09-11 | 1987-08-26 | Matsushita Electronics Corp | Visual inspection instrument |
| JPS62274205A (en) * | 1986-05-23 | 1987-11-28 | Hitachi Tokyo Electron Co Ltd | Lead flatness inspection method and device |
-
1989
- 1989-10-23 JP JP1276578A patent/JPH0769159B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190055546A (en) * | 2017-11-15 | 2019-05-23 | 주식회사 고영테크놀러지 | Inspection apparatus |
| WO2019098686A1 (en) * | 2017-11-15 | 2019-05-23 | 주식회사 고영테크놀러지 | Inspection device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03137502A (en) | 1991-06-12 |
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| LAPS | Cancellation because of no payment of annual fees |