JPH0770425B2 - Capacitor manufacturing method - Google Patents
Capacitor manufacturing methodInfo
- Publication number
- JPH0770425B2 JPH0770425B2 JP62235209A JP23520987A JPH0770425B2 JP H0770425 B2 JPH0770425 B2 JP H0770425B2 JP 62235209 A JP62235209 A JP 62235209A JP 23520987 A JP23520987 A JP 23520987A JP H0770425 B2 JPH0770425 B2 JP H0770425B2
- Authority
- JP
- Japan
- Prior art keywords
- sprayed metal
- metal electrode
- solder
- capacitor
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003990 capacitor Substances 0.000 title claims description 21
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000002184 metal Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 description 12
- 238000005476 soldering Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 238000010301 surface-oxidation reaction Methods 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は電子機器，電気機器に用いられるチップ型フィ
ルムコンデンサ等のコンデンサの製造方法に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a capacitor such as a chip type film capacitor used in electronic equipment and electric equipment.
従来の技術 近年、電子機器，電気機器の小型化，簿型化および高密
度化に伴い電子部品のチップ化および面実装化が進んで
いる。コンデンサにおいては、チップ型のセラミックコ
ンデンサ，固体電解コンデンサが市場に普及している。
一方フィルムコンデンサにおいてもはんだ付け時の耐熱
性を向上したポリフェニレンサルファイド（以下PPSと
略す。）フィルムを誘電体としたチップ型フィルムコン
デンサの普及がめざましい。2. Description of the Related Art In recent years, as electronic devices and electric devices have become smaller, more book-shaped, and have higher densities, electronic parts have been made into chips and surface-mounted. Regarding capacitors, chip-type ceramic capacitors and solid electrolytic capacitors have become popular in the market.
On the other hand, for film capacitors, the spread of chip-type film capacitors with a dielectric material of polyphenylene sulfide (PPS) film, which has improved heat resistance during soldering, is remarkable.
しかしながらフィルムコンデンサの場合、セラミックコ
ンデンサ等に比べ形状が大きいという問題を有しており
特に小型化への取組みがさかんに行なわれている。その
一例として耐熱性実力を材料開発および工法開発等によ
り改善し外装を必要最小限に止めて製品に占める外装比
率を低下させることにより小型化を実現している。この
時外部電極には従来コムリードと蒸着金属とを電気的に
接続する目的で設けていた溶射金属を用いている。従来
は溶射金属材質とし亜鉛もしくは亜鉛合金等が選ばれて
いたが外部電極として用いる場合は実装の際のはんだ付
け性を向上させる必要があり、はんだが選ばれている。However, the film capacitor has a problem that it has a larger shape than that of a ceramic capacitor or the like, and efforts have been particularly made for downsizing. As an example, we have achieved miniaturization by improving the heat resistance ability through material development and method development, etc., and keeping the exterior to the minimum necessary to reduce the proportion of exterior in the product. At this time, as the external electrode, a sprayed metal which is conventionally provided for the purpose of electrically connecting the comb lead and the vapor-deposited metal is used. In the past, zinc or zinc alloy was selected as the sprayed metal material, but when it is used as an external electrode, it is necessary to improve solderability at the time of mounting, and solder is selected.
しかし溶射金属の材質をはんだにしても、その表面の酸
化状態、表面の凹凸状態により実装時のはんだ付け性が
大きく左右される問題は残る。However, even if the material of the sprayed metal is solder, there remains a problem that the solderability at the time of mounting is greatly affected by the oxidation state of the surface and the uneven state of the surface.
従来技術についてチップ型積層フィルムコンデンサの例
を図面を用いて説明する。An example of a chip-type laminated film capacitor will be described with reference to the related art with reference to the drawings.
第２図ａ従来技術で得られた完成品斜視図を示す。素子
１は溶射金属電極２と切断面３を有しており溶射金属電
極２の表面状態８は研摩により全面が平滑状態となって
いる。FIG. 2a shows a perspective view of a finished product obtained by the prior art. The element 1 has a sprayed metal electrode 2 and a cut surface 3, and the surface state 8 of the sprayed metal electrode 2 is made smooth by polishing.
第２図ｂは第２図ａの完成品を得るための研摩工程の代
表例を示した工程斜視図である。2b is a process perspective view showing a typical example of the polishing process for obtaining the finished product of FIG. 2a.
４は長尺素子で切断面３と溶射金属電極２とを有してい
る。また溶射金属電極２には未加工面７がありこれをグ
ラインダー９を回転させることで研摩加工面８が得られ
る。この方法により溶射時あるいは加熱工程で発生した
溶射金属電極の表面酸化は除去できる。A long element 4 has a cut surface 3 and a sprayed metal electrode 2. The sprayed metal electrode 2 has an unprocessed surface 7, and a grinded surface 9 is rotated to obtain a polished surface 8. By this method, the surface oxidation of the sprayed metal electrode generated during spraying or in the heating step can be removed.
しかしながら前述の従来技術では研摩するグラインダー
の表面粗度が小さいことにより回転時の摩擦抵抗が大き
く発熱し研摩面を再度酸化させることがある。また研摩
面が平滑になるために実装時のはんだ付けの際表面のは
んだが溶融しにくくクリームはんだもしくははんだ槽の
溶融はんだとの結合が不完全になる等の問題があった。However, in the above-mentioned prior art, since the surface roughness of the grinder to be ground is small, the frictional resistance during rotation may be large and heat may be generated to oxidize the ground surface again. Further, since the polished surface is smooth, there is a problem that the solder on the surface is difficult to melt during soldering at the time of mounting and the connection with the cream solder or the molten solder in the solder bath becomes incomplete.
発明が解決しようとする問題点 以上述べたように外部電極として用いる溶射金属の表面
酸化、表面凹凸状態は実装の際のはんだ付け性に多大の
影響を及ぼす。Problems to be Solved by the Invention As described above, the surface oxidation and surface irregularity of the sprayed metal used as the external electrode have a great influence on the solderability during mounting.
本発明は上記問題点に鑑み、実装の際のはんだ付け性を
向上したコンデンサの製造方法を提供することを目的と
する。The present invention has been made in view of the above problems, and an object thereof is to provide a method of manufacturing a capacitor having improved solderability during mounting.
問題点を解決するための手段 前記目的を達成するために本発明のコンデンサの製造方
法は、外部電極として用いる溶射金属電極表面を切削刃
で切削することにより0.5〜2.0mmの間隔で高さ50〜100
μｍの突起部を素子厚み方向に連続して設けることを特
徴としている。Means for Solving the Problems In order to achieve the above-mentioned object, the method for producing a capacitor of the present invention is a sprayed metal electrode surface used as an external electrode, and a height of 50 at intervals of 0.5 to 2.0 mm by cutting with a cutting blade. ~ 100
It is characterized in that the projections of μm are continuously provided in the element thickness direction.
作用 本発明のチップ型フィルムコンデンサの製造方法により
溶射金属電極の表面を切削することで加熱工程で発生し
た酸化膜が除去され、かつ表面に素子厚み方向に連続し
た凹凸部を形成することにより低熱容量部を設け、さら
にはんだの表面張力を利用し実装時のはんだ付け性を向
上している。The oxide film generated in the heating step is removed by cutting the surface of the sprayed metal electrode by the method for manufacturing the chip-type film capacitor of the present invention, and the unevenness portion continuous in the element thickness direction is formed on the surface to reduce the A heat capacity part is provided and the surface tension of the solder is used to improve solderability during mounting.
実施例 以下、本発明の実施例について図面を参照しながら説明
する。Examples Hereinafter, examples of the present invention will be described with reference to the drawings.
第１図ａは本発明のチップ型フィルムコンデンサの要部
工程で得られた完成品斜視図を示す。FIG. 1a is a perspective view of a finished product obtained in the main process of the chip type film capacitor of the present invention.
素子１は切断面３と溶射金属電極２を有している。この
溶射金属電極２の表面６は高さｔ（50〜100μｍ）の突
起部が間隔ｐ（0.5〜2.0mm）で設けられている。The element 1 has a cut surface 3 and a sprayed metal electrode 2. The surface 6 of the sprayed metal electrode 2 is provided with protrusions having a height t (50 to 100 μm) at intervals p (0.5 to 2.0 mm).
第１図ｂは本発明のチップ型フィルムコンデンサの要部
工程の一例を示す工程斜視図である。FIG. 1B is a process perspective view showing an example of a main process of the chip type film capacitor of the present invention.
４は長尺素子で、切断面３と溶射金属電極２を有してい
る。溶射金属電極２には未加工面がありこれをエンドミ
ル５を回転させることで切削した表面６を得ている。こ
の切削面の形成される凹凸部の深さおよび間隔はエンド
ミル５の刃の高さ、間隔ならびに回転数等により決定し
ている。この要部工程により得られた素子のはんだ付け
性は以下に述べる理由により向上する。Reference numeral 4 is a long element having a cut surface 3 and a sprayed metal electrode 2. The sprayed metal electrode 2 has an unprocessed surface, and the end mill 5 is rotated to obtain a surface 6 cut. The depths and intervals of the uneven portions on which the cutting surface is formed are determined by the height of the blade of the end mill 5, the interval, the number of revolutions, and the like. The solderability of the element obtained by this main part process is improved for the reasons described below.
（ｉ） エンドミルで切削することで加熱工程で発生し
た酸化膜が完全に除去される。さらに切削刃を用いるこ
とにより切削時に発生する摩擦による発熱が少なく加工
時の酸化膜発生を防止できる。(I) By cutting with an end mill, the oxide film generated in the heating step is completely removed. Further, by using a cutting blade, heat generation due to friction generated during cutting is small, and the generation of an oxide film during processing can be prevented.
（ii） エンドミルで切削することで溶射金属電極面に
一定間隔の突起部を素子厚み方向に連続して形成でき
る。これは、はんだ実装の時に熱容量の小さい突起部か
ら溶融が始まることを利用し実装時に用いるクリームは
んだ，溶融はんだとなじませ素子厚み方向にはんだの表
面張力を利用しはんだを引上げはんだ付け面積の拡大を
図っている。(Ii) By cutting with an end mill, projections at regular intervals can be continuously formed on the surface of the sprayed metal electrode in the element thickness direction. This is because melting starts from the protrusion with a small heat capacity during solder mounting, so that it fits into the cream solder and molten solder used during mounting, and the surface tension of the solder is used in the element thickness direction to pull up the solder and increase the soldering area. I am trying to
本発明では積層フィルムコンデンサの例で説明したが巻
回型フィルムコンデンサの場合も同方法により目的は達
成できる。In the present invention, the example of the laminated film capacitor has been described, but the same method can be used to achieve the object in the case of a wound film capacitor.
発明の効果 以上の様に本発明は、実装の際のはんだ付け性の改善に
よりはんだ付け時の作業性，信頼性を大幅に向上するこ
とが可能であり、工業的，社会的に大きい効果をもたら
すものである。EFFECTS OF THE INVENTION As described above, according to the present invention, it is possible to significantly improve workability and reliability during soldering by improving the solderability during mounting, and to achieve great industrial and social advantages. To bring.
第１図ａは本発明の要部工程で得られた完成品の斜視
図、第１図ｂは本発明のチップ型フィルムコンデンサの
製造方法における要部工程を示す工程斜視図、第２図ａ
は従来のチップ型フィルムコンデンサの製造方法で得ら
れた完成品の斜視図、第２図ｂは従来のチップ型フィル
ムコンデンサの製造方法を示す工程斜視図である。 １……素子、２……溶射金属電極、３……切断面、４…
…長尺素子、５……エンドミル、６……切削面、７……
未加工面、８……研摩面、９……グラインダー。FIG. 1a is a perspective view of a finished product obtained in the main process of the present invention, FIG. 1b is a process perspective view showing the main process in the method for manufacturing a chip-type film capacitor of the present invention, and FIG.
FIG. 2 is a perspective view of a finished product obtained by the conventional method for manufacturing a chip-type film capacitor, and FIG. 2B is a process perspective view showing the method for manufacturing a conventional chip-type film capacitor. 1 ... element, 2 ... sprayed metal electrode, 3 ... cut surface, 4 ...
… Long element, 5 …… End mill, 6 …… Cutting surface, 7 ……
Unprocessed surface, 8 ... Polished surface, 9 ... Grinder.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 大嶋 邦雄 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 小林 康夫 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 野津 範人 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (56)参考文献 実開 昭57−148838（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kunio Oshima 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Yasuo Kobayashi 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. 72) Inventor Norito Nozu 1006, Kadoma, Kadoma-shi, Osaka, Matsushita Electric Industrial Co., Ltd. (56) References: Showa 57-148838 (JP, U)
Claims (1)
て用い、かつこの溶射金属電極を切削刃で切削すること
により0.5〜2.0mmの間隔で高さ50〜100μｍの突起部を
素子厚み方向に連続して設けることを特徴とするコンデ
ンサの製造方法。1. A projection having a height of 50 to 100 μm at intervals of 0.5 to 2.0 mm is formed by using a sprayed metal electrode applied to an element as an external electrode and cutting the sprayed metal electrode with a cutting blade. A method for manufacturing a capacitor, characterized in that the capacitor is continuously provided on the.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62235209A JPH0770425B2 (en) | 1987-09-18 | 1987-09-18 | Capacitor manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62235209A JPH0770425B2 (en) | 1987-09-18 | 1987-09-18 | Capacitor manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6477916A JPS6477916A (en) | 1989-03-23 |
| JPH0770425B2 true JPH0770425B2 (en) | 1995-07-31 |
Family
ID=16982695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62235209A Expired - Lifetime JPH0770425B2 (en) | 1987-09-18 | 1987-09-18 | Capacitor manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0770425B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101422938B1 (en) * | 2012-12-04 | 2014-07-23 | 삼성전기주식회사 | Embedded multilayer capacitor and method of manufacturing thereof, print circuit board having embedded multilayer capacitor |
| KR101452079B1 (en) * | 2012-12-28 | 2014-10-16 | 삼성전기주식회사 | Embedded multilayer capacitor and print circuit board having embedded multilayer capacitor |
| CN107256797A (en) * | 2013-03-14 | 2017-10-17 | 三星电机株式会社 | Embedded multi-layer ceramic electron element |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0888144A (en) * | 1994-09-14 | 1996-04-02 | Nitsuko Corp | Chip-shaped film capacitor |
| JP4715000B2 (en) * | 2001-02-22 | 2011-07-06 | パナソニック株式会社 | Manufacturing method of chip-type electronic component |
| US7453114B2 (en) * | 2005-08-05 | 2008-11-18 | Sbe, Inc. | Segmented end electrode capacitor and method of segmenting an end electrode of a capacitor |
| JP5471686B2 (en) * | 2010-03-24 | 2014-04-16 | 株式会社村田製作所 | Manufacturing method of multilayer ceramic electronic component |
| JP2012142478A (en) * | 2011-01-05 | 2012-07-26 | Murata Mfg Co Ltd | Laminate type electronic component and manufacturing method thereof |
| JP7435775B2 (en) | 2020-06-16 | 2024-02-21 | 株式会社村田製作所 | Electronic components and electronic component manufacturing methods |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57148838U (en) * | 1981-03-12 | 1982-09-18 |
-
1987
- 1987-09-18 JP JP62235209A patent/JPH0770425B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101422938B1 (en) * | 2012-12-04 | 2014-07-23 | 삼성전기주식회사 | Embedded multilayer capacitor and method of manufacturing thereof, print circuit board having embedded multilayer capacitor |
| TWI482183B (en) * | 2012-12-04 | 2015-04-21 | Samsung Electro Mech | Embedded multilayer ceramic electronic component and method of manufacturing the same, and printed circuit board having embedded multilayer ceramic electronic component therein |
| KR101452079B1 (en) * | 2012-12-28 | 2014-10-16 | 삼성전기주식회사 | Embedded multilayer capacitor and print circuit board having embedded multilayer capacitor |
| CN107256797A (en) * | 2013-03-14 | 2017-10-17 | 三星电机株式会社 | Embedded multi-layer ceramic electron element |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6477916A (en) | 1989-03-23 |
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