JPH0770451B2 - Molding equipment for electronic parts - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a molding apparatus for an electronic component manufactured by mounting a wire on a powder that hardens under pressure.

[Prior Art] As an electronic component, for example, a tantalum capacitor is formed by connecting a wire to an element portion. For this element portion, a dielectric powder having a property of hardening when pressed is used. , Fill the die with this dielectric powder,
It is conventionally known that the powder in the die is inserted into a wire and pressed by a punch to perform molding.

In the above-mentioned conventional molding method, the diamond is filled with the dielectric powder, and the wire is inserted into the punch so that the wire protrudes by a length necessary for inserting the wire or longer, and the punch is lowered. By doing so, the wire is inserted into the powder, and the punch presses the dielectric powder to perform molding.

[Problems to be Solved by the Invention] By the way, when the wire is inserted into the dielectric powder, the resistance is large, and even if the wire is inserted straight, it may be bent by the resistance. In particular, if the wire is made of a soft thin wire material, it is necessary to take a large insertion length of the wire, even when the embedded length is short, for example, when the dimension of the element part is large. In such a case, there is a drawback in that the resistance when the soft wire is inserted into the dielectric powder causes the wire to bend easily and the wire cannot be inserted sufficiently.

The present invention has been made to solve the above problems, and an object thereof is to smoothly and without bending the wire regardless of the length to be inserted into the powder. An object of the present invention is to provide a molding device for electronic parts that can be inserted into powder.

[Means for Solving the Problems] In order to achieve the above-mentioned object, the present invention provides a die filled with a powder that hardens in a pressed state, a punch for pressing the powder, and a punch. A wire feeding means for feeding a wire guided through the wire so as to be inserted into the powder; and a wire feeding means for punching the wire when the punch abuts or comes close to the powder in the die in a non-pressurized state. It is characterized in that it is configured to be inserted into the powder from a state in which it is slightly projected from the above, and insertion operation means for controlling the wire to be pulled out from the punch so as to have a predetermined insertion length.

[Operation] A predetermined amount of powder is filled in the die, and the punch is moved toward the die. At this time, the wire is slightly projected from the punch or is positioned inside the punch. Then, when the punch is brought into contact with the die in a non-pressurized state or comes close to a state where it faces the die with a slight gap, the wire feeding means is operated by the inserting operation means to first move the wire. The tip of the punch is made to slightly project, and other portions are restricted by the punch. Even with a soft wire, if the protrusion amount is short, the rigidity is high, and the wire is smoothly inserted into the powder without bending. If there is no or only a small distance between the punch and the powder, there is no risk of bending while pushing the wire into the powder. Therefore, the wire can be surely inserted into the predetermined position by the operation of the wire feeding means. Then, the powder in the die is pressed and hardened by pressurizing the powder by lowering the punch, so that the molding is performed.

Embodiments Embodiments of the present invention will be described in detail below with reference to the drawings.

First, FIG. 1 shows the overall structure of the molding apparatus.

In the figure, reference numerals 1 and 1 denote guide rods erected on a base 2, a table 4 supporting a lower punch unit 3 is mounted on the guide rod 1, and an upper punch plate 5 is provided with a cam mechanism or the like. It is mounted so that it can be raised and lowered by the raising and lowering drive means. An upper punch unit 7 and a feeding means 9 for a wire 8 are mounted on the upper punch plate 5.

As shown in FIG. 2, the lower punch unit 3 has a die 10 having a filling portion 10a for filling the dielectric powder P,
The die 10 is fixed to the table 4 with screws 11. A lower punch 12 is provided below the die 10 so as to be able to move up and down along a lower punch guide 13. When the lower punch 12 is raised, its tip portion is filled with a filling portion 10a of the die 10.
You can come inside. This lower punch
In order to move up and down the lower punch 12, a push-up rod 14 which is driven up and down by a lifting mechanism (not shown) such as a cam mechanism is provided at the lower part of the lower punch 12. The lower punch 12 and the push-up rod 14 are respectively provided with a return spring 1
5,16 are working.

Next, the upper punch unit 7 is, as shown in FIG.
It is configured by mounting a punch holder 22 having an upper punch 21 mounted at a tip thereof on a support block 20 vertically provided on the upper punch plate 5, and a guide 23 is mounted on the support block 20 in an axial direction thereof. A pipe 24 through which the wire 8 is inserted is attached to the guide 23. A lower blade 25 is attached to the upper punch 21, and an upper blade 26 for cutting the wire 8 by sliding on the lower blade 25 in the horizontal direction along the lower blade 25 has an upper blade holder. The upper blade holder 27 is mounted on the upper blade holder 27, and an operating rod 28 is provided to operate the upper blade holder 27. The actuating rod 28 is held in a non-cut state of the wire 8 by a spring 29, and the actuating member 30
When (see FIG. 1) is actuated and the actuating rod 28 is pushed, the upper blade 26 moves in the horizontal direction and the wire 8 can be cut. The wire insertion portion 27a of the upper blade holder 27 has a funnel shape in order to protect the wire 8 from being damaged when the wire is cut.

Further, the wire feeding means 9 is provided with chuck members 34, 35 attached to first and second chuck bases 32, 33 which are vertically mounted on a rod 31 standing on the upper punch plate 5. Of these chuck members 34, 35, the lower first chuck member 34 is for performing the operation of pulling down the wire 8, and the second chuck member 35 located above is for raising the upper punch plate 5. At times, it is provided to pull up the wire 8 by a predetermined amount. Each of these chuck members 3
4,35 has a structure as shown in FIG. That is, each chuck member 34, 35 has a solenoid 36, 37, respectively, the solenoid pin 38,
Movable chuck pieces 40 and 41 are connected to the tip of 39. The movable chuck pieces 40, 41 are always held in a state of being separated from the fixed chuck pieces 42, 43 by a distance equal to or more than the diameter of the wire 8, and when the solenoids 36, 37 are operated, the movable chuck pieces 42, 43 are kept. The wires 40 and 41 are close to the fixed chuck pieces 42 and 43, and the wire 8 can be held between them.

Thus, the chuck base 32 and the upper punch plate 5 described above are used.
4 and the chuck bases 32 and 33, respectively.
4,45 are compressed, and as a result, the chuck base 32,3
3 moves up and down following the upper punch plate 5, and when the upper punch plate 5 lowers, the chuck base 32 further lowers against the spring 44 in a direction closer to the upper punch plate 5. The operation of the chuck base 32 allows the wire 8 to be inserted into the dielectric powder P in the die 10. Also,
The chuck base 33 is lowered by a predetermined amount against the spring 45 when the upper punch plate 5 is raised, whereby the tip of the wire 8 slightly projects from the upper punch 21 when the upper punch 21 is in the raised position. It is structured so that it can be pulled out to the desired position.

Insertion actuating means 46 are provided for lowering the chuck base 32 against the spring 44. The insertion actuating means 46 has a lever 48 which swings around a fulcrum 47, one end of the lever 48 is connected to the chuck base 32, and the other end thereof can be brought into contact with and separated from a reciprocating shaft 49. It is like this. Then, the reciprocating shaft 49
An adjusting bolt 50 is continuously provided in the shaft, and the moving stroke of the chuck base 32 can be adjusted by screwing the adjusting bolt 50 in and out.

Further, stopper bolts 52, 52 are screwed into the top plate portion 51 mounted on the upper end portion of the guide rod 1 in order to lower the chuck base 33 against the spring 45. The stopper bolt 52 is an end plate 53 attached to the upper end of the rod 31.
When the upper punch plate 5 rises in this state, the chuck base 33 relatively moves in a direction of approaching the upper punch plate 5. It is like this. The amount of movement of the chuck base 33 can also be adjusted by appropriately screwing the stopper bolt 52 in and out.

The present embodiment has the above-mentioned structure, and its operation will be described with reference to FIG.

First, hold the upper punch plate 5 in the raised position,
While holding the wire 8 slightly protruding from the upper punch 21, a predetermined amount of the dielectric powder P is supplied into the filling portion 10a of the die 10 mounted on the table 4.

Therefore, the wire 8 is chucked by the first chuck member 34, the second chuck member 35 is opened, and the elevating and lowering drive means 6 is operated to move the upper punch plate 5 to the position shown in FIG. As shown in a), the upper punch 21 in the upper punch unit 7 mounted on the upper punch plate 5 is lowered until it faces the dielectric powder P in the die 10 with a slight gap. At this time, since the chuck member 34 descends following the lowering of the upper punch plate 5, the tip of the wire 8 maintains a slight gap with the dielectric powder P, or descends to a position where it contacts.

In the above-mentioned state, the reciprocating shaft 49 of the insertion actuating means 46 is raised. As a result, the lever 48 has a fulcrum 47.
The chuck base 32 attached to the other end of the lever 48 descends along the rod 31 against the spring 44. As a result, the chuck member 34 mounted on the chuck base 32 descends and the wire 8 chucked by the chuck member 34 is pulled down. As a result, as shown in FIG. 5 (b), the tip of the wire 8 is embedded in the dielectric powder P.

Here, when the wire 8 is brought into contact with the dielectric powder P, most of the wire 8 is guided by the upper punch 21,
Since the wire 8 protrudes from the upper punch 21 only for an extremely short length, the rigidity can be remarkably improved even though the wire 8 is thin and flexible as a whole. Even if there is resistance, it is surely inserted into the dielectric powder P without bending. However, the wire 8 must be embedded in the dielectric powder P by a predetermined length, but by making the chuck base 32 by the lever 48 have a required descending stroke,
The wire 8 can be pushed into the dielectric powder P by the required length. From the start of insertion of the wire 8 to the embedding at a predetermined position, the upper punch 21 and the surface of the dielectric powder P have substantially no gap or only a slight gap. Thus, the wire 8 does not have the possibility of bending during its insertion operation.

When the insertion of the wire 8 is completed in this way, the elevating and lowering drive means 6 is operated to slightly lower the upper punch plate 5, and the upper portion of the filling portion 10a of the die 10 as shown in FIG. Cover it. As mentioned above,
Since the wire 8 is inserted into the dielectric powder P by the required length, the first chuck member 34 is opened in this state. Moreover, since the second chuck member 35 is also opened, the wire 8 is not regulated.

Therefore, as shown in FIG. 5 (d), the lower punch 12 is raised by the push-up rod 14, and at the same time, the upper punch 21 is further lowered as shown in FIG. 5 (e). The molding is performed by pressing the dielectric powder P in the die 10. When the lower punch 12 is raised, the wire 8 tends to be pushed upward. However, since the chuck members 34 and 35 are both in the chuck-released state, it is possible to prevent the wire 8 from being subjected to an excessive force. You can

After the completion of the molding of the dielectric powder P, as shown in FIG. 5 (f), the operating rod 28 is operated to move the upper blade 26 in the horizontal direction to cut the wire 8.

After the above-mentioned work is completed, as shown in FIG. 5 (g), the upper punch unit 7 is raised and the lower punch unit is moved.
When 12 is further raised, the work W molded with the wire inserted can be taken out.

After the dielectric powder is molded in this way, preparations for the next molding operation are made. That is, when the above-mentioned cutting is performed, the wire 8 is chucked by the second chuck member 35. At this time, the first chuck member 34 is already open, and the upper punch plate 5 is raised in this state. As a result, the tip of the wire 8 is held at the previous cutting position. However, when it comes close to the stroke end of the upper punch plate 5, the second chuck member 35 comes into contact with the stopper bolt 52, and the chuck member 35 does not rise any more, and the wire 8 chucked to it. Also stops at that position. On the other hand, since the upper punch plate 5 is further raised to the stroke end thereof, the tip of the wire 8 is slightly projected from the upper punch 21 in the upper punch unit 7 mounted on the upper punch plate 5. Was extended to
Return to the original state.

As described above, the insertion of the wire 8 into the dielectric powder P and the pressure molding of the dielectric powder P are sequentially performed.

Thus, the insertion length of the wire 8 into the dielectric powder P is
This can be done by appropriately screwing in and out an adjusting bolt 50 connected to a reciprocating shaft 49 that rotates the lever 48. Also, the insertion length of the wire 8 needs to be changed according to the size of the work W.
By changing the protrusion amount of 50, it becomes possible to change the insertion length of the wire to the optimum size according to the work size, which makes it versatile as a molding device for electronic parts such as tantalum capacitors. You will be able to have it.

In the above-described embodiment, the wire 8 is inserted while the upper punch 21 is placed close to the dielectric powder P. However, in this case, the dielectric powder P is used when the wire 8 is inserted. Although the resistance can be further reduced and smooth insertion is possible, since the wire 8 is inserted into the dielectric powder P in a state where the rigidity is increased by slightly projecting the wire 8, the upper punch 21 is inserted into the dielectric powder P. It may be performed in a state of being in contact with. However, when the wire 8 is inserted, the upper punch 21 causes the dielectric powder P
Need not be pressurized. Further, the wire 8 is always arranged at a position where it can be slightly seen from the surface of the upper punch 21, but if the wire 8 is forcibly pulled down when it is caught midway, It is for tightening, and the protruding length thereof needs to be short, and the wire 8 may be in a non-projecting state. Further, although one wire 8 is shown as being inserted, a plurality of wires may be attached.

[Effects of the Invention] As described in detail above, according to the present invention, when the punch is brought into contact with or close to the powder in the die in a non-pressurized state, the wire feeding means is operated by the insertion operation means. Then, the tip of the wire is slightly projected from this punch, and the tip is inserted into the powder from a state of having high rigidity, and the wire is pulled out from the punch so as to have a predetermined insertion length. Even if the wire is thin and flexible, and the insertion length is long, the inconvenience of bending the wire due to the resistance at the time of insertion into the powder can be surely prevented, and the wire can be securely attached to the powder within a predetermined range. It has the effect of being able to insert only the length.

[Brief description of drawings]

FIG. 1 is an overall configuration diagram of an electronic component forming apparatus showing an embodiment of the present invention, FIG. 2 is a sectional view of a lower punch unit, and FIG.
FIG. 4 is a cross-sectional view of the upper punch unit, FIG. 4 is an explanatory view of the structure of the chuck member, and FIGS. 5 (a), (b), (c),
(D), (e), (f), (g) is explanatory drawing which shows the process of molding an electronic component. 3: Lower punch unit, 4: Table, 7: Upper punch unit, 8: Wire, 9: Wire feeding means, 10: Die, 12: Lower punch, 13: Lower punch guide, 21: Upper punch, 22: Punch holder , 25: Lower blade, 26: Upper blade, 32, 33: Chuck base, 34, 3
5: chuck member, 46: insertion actuating means, 49: adjusting bolt.

Claims (2)

[Claims] 1. A die filled with a powder that hardens under pressure, a punch for pressing the powder, and a wire feeding means for feeding a wire guided through the punch so as to insert the wire into the powder. When the punch comes into contact with or comes close to the powder in the die in a non-pressurized state, the wire feeding means is inserted into the powder from a state in which the wire is slightly projected from the punch, and a predetermined insertion is made. An apparatus for molding an electronic component, comprising: an insertion actuating means for controlling the wire to be pulled out from the punch so as to have a length. 2. A molding apparatus for electronic parts according to claim 1, wherein the wire feeding stroke can be adjusted by the wire feeding means.