JPH0770810B2 - Method for manufacturing multilayer printed circuit board - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method for manufacturing a multilayer printed circuit board, and in particular,
The present invention relates to a manufacturing method suitable for identifying a substrate information of an inner layer from the appearance when a multilayer printed circuit board is manufactured by laminating a board on which a conductive pattern is formed on an impermeable board such as epoxy resin.

[Prior art]

When manufacturing a multilayer printed circuit board, a so-called power supply / ground layer may be shared by each printed circuit board, and a plurality of types of printed circuit boards may be manufactured by changing only the wiring pattern of the signal layer. Conventionally, a substrate on which a conductor pattern such as a power supply / ground line common to a plurality of product names is formed is arranged on the front surface layer and a back surface layer, and a substrate on which a conductor pattern unique to the substrate product name is formed is arranged in an inner layer. When manufacturing a multilayer printed circuit board, the board information such as the board name and history is formed on the inner layer board by a conductor pattern, and this is displayed through the board of the surface layer to display the appearance of each printed circuit board. It was possible to identify from.

FIG. 2 is an enlarged view of a board information display portion of a multilayer printed circuit board of this type, in which (a) is a plan view and (b) is a sectional view. In the figure, 1 is the surface of a printed circuit board, 3 and 5 are front and back layer substrates on which a conductor pattern common to a plurality of product names is formed, 4 is an inner layer substrate on which a conductor pattern unique to the board product name is formed, and 6 is a through hole. is there. Here, the inner layer substrate 4
By forming a character of the board information by the conductor pattern 2 ', this is transmitted through the board 3 and displayed on the surface 1 of the printed circuit board.

Note that, as publicly known documents related to this, for example,
56-15076 is mentioned.

[Problems to be Solved by the Invention]

As described above, the conventional technique cannot be adopted when a multilayer printed circuit board is manufactured by laminating a substrate having a conductive pattern formed on an impermeable base material such as epoxy resin. Therefore, in such a case, the printed circuit board surface is printed with imprintable ink or the like to print the board information, or the surface layer board is formed with characters of the inner layer board information by a conductor pattern. I had no choice. However, the imprinting method using immortal ink or the like has a possibility that a printing error may occur in the imprinting process, and thus lacks reliability. In addition, the method of forming the board information of the inner layer with the conductor pattern on the board of the surface layer also corresponds to the board information of the inner layer even if the conductor pattern of the board of the surface layer is common to multiple product names (power supply / ground line, etc.). Therefore, it is necessary to prepare a mask, and the mask management cost is increased with an increase in the mask manufacturing cost and the number of masks.

An object of the present invention is to share a power supply / ground layer of the front and back layers in each printed circuit board, and to change only the wiring pattern of the signal layer of the inner layer to manufacture a multilayer printed circuit board of a plurality of types.
Even if the substrates on the front and back layers are impermeable, the substrate information on the inner layers can be displayed easily and reliably, and the substrate information can be identified from the appearance of the printed circuit board.

[Means for Solving the Problems]

In order to achieve the above-mentioned object, the present invention arranges a first substrate on which a conductor pattern common to a plurality of product names is formed on a front surface layer and a back surface layer, and forms a conductor pattern unique to the board product name that characterizes each printed circuit board. The formed second substrate is placed on an intermediate layer (inner layer) and laminated to form a multilayer printed circuit board,
That is, the perforation pattern indicating the board information of the board is formed by a through hole penetrating each of the stacked boards.

[Action]

Through hole patterns that penetrate through each of the stacked substrates, board information of the inner layer that characterizes each printed circuit board is displayed on the printed circuit board surface. Therefore, even when the substrate is impermeable, it is possible to easily and surely identify each printed circuit board from the appearance.

〔Example〕

 An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows an embodiment of a multilayer printed circuit board according to the present invention.
In particular, it is an enlarged view of the board information display portion. In FIG. 1, (a) is a plan view, (b) is a cross-sectional view, 1 is the surface of a printed circuit board, 3 and 5 are boards on which a conductor pattern common to a plurality of product names is formed (first board), Reference numeral 4 denotes a board on which a conductor pattern unique to the board product name is formed (second board), 2 denotes a perforation pattern indicating board information of the board 4, and 6
Is a normal through hole.

Here, the substrate 3 and the substrate 5 on which a conductor pattern common to a plurality of product names is formed are arranged in the front surface layer and the back surface layer, and the substrate 4 on which a conductor pattern unique to the substrate product name is formed is arranged in an inner layer (intermediate layer). These substrates 3, 4, and 5 are laminated, and a through hole 6 penetrating each of the laminated substrates 3, 4 and 5 is formed. At this time, similarly, the through hole penetrating each of the substrates 3, 4 and 5 is used to form the perforation pattern 2 indicating the substrate information of the inner layer substrate 4. As a result, even when the substrate 3 of the surface layer is impermeable, the substrate information of the inner layer substrate 4 characterizing the printed circuit board is displayed on the surface 1 of the printed circuit board, and the product name of the printed circuit board is identified from the appearance. can do. For the drilling pattern 2, simply add the drilling NC data to the normal through hole 6 NC data.
It can be easily formed with the hole 6 by the conventional drilling equipment.

〔The invention's effect〕

As is apparent from the above description, according to the present invention, when manufacturing a multilayer printed circuit board, the board information of the inner layer board on which the conductor pattern unique to the board item name is formed is the information of the through hole penetrating each board. Since it is formed as a perforated pattern, even when the substrate of the surface layer cannot penetrate the inner layer pattern, the inner layer substrate information characterizing each printed circuit board can be easily and reliably displayed on the surface of the printed circuit board. can do. Therefore, it is also necessary to create a mask corresponding to the board item name to form the outermost layer conductor pattern that is common to multiple product names, as in the case where the inner layer board information is displayed on the outermost layer in the conventional manner. In addition, the number of mask management steps can be reduced due to the mask production cost and the increase in masks.

[Brief description of drawings]

FIG. 1 is a view showing an embodiment of a multilayer printed circuit board according to the present invention, and FIG. 2 is a view showing a conventional board information display example by an inner layer pattern transmission method. 1 ... Printed circuit board surface, 2 ... Hole pattern, 3,
4, 5 ... Board, 6 ... Through hole.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-55-50686 (JP, A) Actually opened 59-91768 (JP, U) Actually opened 61-171271 (JP, U)

Claims (1)

[Claims] 1. A second substrate on which a first substrate on which a conductor pattern common to a plurality of product names is formed is arranged on a front surface layer and a back surface layer, and a conductor pattern peculiar to the substrate product name which characterizes each printed circuit board is formed. A method of manufacturing a multilayer printed circuit board by disposing an intermediate layer, wherein the first substrate is a front surface layer and a back surface layer, and the second substrate is an intermediate layer, and the multilayer printed circuit board is laminated. A method for manufacturing a multi-layer printed circuit board, characterized in that a perforation pattern indicating board information of the second board is formed by a through hole penetrating each of the pre-laminated boards.