JPH0770825B2 - Solder connection device - Google Patents

Description

Description: FIELD OF THE INVENTION The present invention relates to a solder connecting device for connecting a printed wiring board (hereinafter, simply referred to as a board) to a lead of an electronic component (hereinafter, simply referred to as a component) by soldering. Regarding

[Background of the Invention] SL447-5E Laser Soldering Device One of the methods for connecting electronic parts to a board is to connect the leads of the electronic parts by soldering on the wiring pattern of the board.

As a device for making such a connection, for example, the 19th
A solder connecting device as shown in the figure has been proposed.

That is, in FIG.
An orthogonal coordinate type robot 3 is arranged which moves in a plane parallel to the surface of the table 2. The arm 4 of the robot 3 includes an optical fiber 5 as a radiation beam generation source (not shown).
A radiation head 7 having an optical system 6 connected by is supported. The robot 3 is controlled by the control device 8. A pair of positioning pins 9 are erected on the table 2, and reference holes formed on the substrate 10 are used to form the positioning pins 9.
The substrate 10 is positioned by being fitted to. Therefore, the substrate 10 is provided with reference holes that fit with the positioning pins 9, 9 and the reference holes are separated from each other by an appropriate distance.

In such a solder connecting device, after paste-like solder is printed and applied at a predetermined position of the substrate 10 on which a required wiring pattern is formed, leads of electronic components such as integrated circuit elements are placed on the solder. The board 10 on which the electronic components are mounted in this manner is placed on the table 2 so that the board holes fit into the positioning pins 9. In this state, the robot 3 is operated to irradiate the leads and solder of the component with a continuous or intermittent radiation beam emitted from the optical system 6 while moving the radiation head 7 in a predetermined path. Is melted and the connection is made.

In such an apparatus, when the substrate 10 is warped, the distance between the irradiation position of the radiation beam on the optical system 6 and the substrate 10 is changed, or the electronic component lead is separated from the substrate 10, and the heating amount by the radiation beam varies. To do. For this reason, there are drawbacks such as insufficient melting of solder, burnout of leads of the substrate 10 and components, or short-circuiting between adjacent leads due to solder flow.

[Object of the Invention]

In view of the above-mentioned drawbacks of the prior art, the object of the present invention is to be able to completely correct the warp of the board regardless of the direction, and to always accurately determine the solder connection surface of the board with respect to the irradiation beam. It is an object of the present invention to provide a solder connecting device which can be positioned at a position and thus can stably connect the wiring pattern of the substrate and the lead of the component.

[Outline of Invention]

In order to achieve the above object, in the present invention, a transfer means for conveying the supplied printed wiring board to a positioning position along the horizontal direction which is the surface of the printed wiring board, and a tip end of the printed wiring board is a reference hole of the printed wiring board. Has a positioning pin that can be fitted to
Further, the positioning portion is fitted in the reference hole of the printed wiring board conveyed to the positioning position by the transfer means, and the first positioning portion for positioning the printed wiring board at the predetermined position in the horizontal direction, and the printed wiring in the predetermined direction in the horizontal direction. A second positioning portion that vertically moves the printed wiring board at a position to position the upper surface of the printed wiring board at a predetermined position in the vertical direction, an irradiation portion that emits a beam, and the irradiation portion scans the solder connection surface of the printed wiring board. And a heating unit including a scanning unit. The first and second positioning parts move the printed wiring board to a predetermined position in the vertical direction at a predetermined position in the horizontal direction when the second positioning part moves the peripheral portion of the printed wiring board in the vertical direction. It is characterized in that it has a means for pinching and clamping it to correct the warp of the printed wiring board.

Example of Invention

An embodiment of the present invention will be described below with reference to FIGS.

1 and 2 show the overall structure of the solder connecting device according to the present invention. In the figure, the solder connecting device is a transfer means A for transferring the substrate 10 along the pedestal 21.
The positioning means B for positioning the board 10 fed by the transfer means A in the horizontal and vertical directions and for correcting the warp of the board 10 and irradiating the connecting position on the board with a light beam for soldering. It is composed of a heating means C for melting and connecting the wiring pattern of the substrate 10 and the leads of the components.

The transfer means A is, as shown in FIGS. 1 to 7,
A guide part A1 forming a transfer path for the substrate 10 and a transfer part A2 for pushing and transferring the substrate 10 are provided.

The guide portion A1 of the substrate 10 is, as shown in FIGS. 1 and 3, each pair of rails supported by support bases 22 arranged on both sides of the positioning means B arranged in the central portion of the mount 21. It has 23, 24. A step 25 for supporting the substrate 10 is formed on each of the facing surfaces of the rails 23, 24.

Further, as shown in FIGS. 1, 3, and 5, a lid 26 is attached to each of the portions of the rail 23 other than the board supply position and the board take-out position of the rail 24, and the board 10 being transferred is being transferred. It prevents the rising of.

The transfer part A2 of the substrate 10 is arranged to transfer the substrate 10 from the supply position to the take-out position. Further, as shown in FIG. 4, a pair of rails 29 are supported by a plurality of sets 27 fixed to the pedestal 21 via a support 28 in parallel with the rails 23 and 24 at a predetermined interval. A slider 31 that rotatably supports a pair of rollers 30 so as to sandwich the rail 29.
Can slide back and forth along the rail 29. Two sliders 31 are arranged along each rail 29. As shown in FIGS. 5 and 6, the slider 31 is provided with a shaft 32 slidably passing through the central portion thereof, and a claw 33 for pushing the substrate 10 is attached to the upper end of the shaft 32. ,
An arm 34 for moving the claw 33 up and down is attached to the lower end.

As shown in FIG. 6, grooves 35 and 36 are formed in the lower part of the shaft 32 at predetermined intervals, and the balls 38 of the ball plunger 37 attached to the slider 31 are fitted therein. Therefore, when the ball 38 is fitted in the groove 35, the shaft 32 is in the raised position, and the claw 33 is at a height capable of pressing the end surface of the substrate 10.

Further, when the ball 38 is fitted in the groove 36, the shaft 32 is in the lowered position, and the claw 33 is in a position lower than the lower surface of the substrate 10. Set the base so that it is located at the moving end of the slider 31.
A groove 42 into which the arm 34 is removably fitted is formed in a piece 41 that is coupled to a rod 40 of a cylinder 39 supported by 27 and that slidably fits into the base 27. And the groove 42
When the arm 34 enters the
When is slid, the arm 34 moves up and down by the groove 42, and the claw 33 can be moved up and down. Bearings 43 are formed at both ends of the slider 31 in the traveling direction. A shaft 44 inserted into the bearing 43 and a connecting piece 45 and a connecting piece 45 connected to the shaft 44 are provided between the bearings 43 on the opposite surface side of the pair of sliders 31 arranged in the transfer direction of the substrate 10. Are connected by a connecting rod 46 extending from.

Further, the other bearing 43 of the slider 31 has a shaft 47 inserted into the bearing 43, a spring 48 hooked to the shaft 47, and a connecting piece 50 holding a pin 49 hooked with the spring 48. One ends of chains 52 and 53 are connected via a pin 51 supported by the connecting piece 50. The other ends of the chains 52 and 53 are respectively provided with a pin 54 and a pin 54 as shown in FIG.
A connecting piece 55 that supports 54 is connected to a connecting rod 57 that slidably penetrates a bearing 56 supported by the support 28. The chains 52 and 53 are wound around sprockets 58 and 59, which are arranged opposite to each other on both ends of the rail 29. As shown in FIG. 3, the sprocket 59 is provided with a bevel gear (not shown) which meshes with a bevel gear (not shown) mounted on a shaft 61 rotatably supported by a bearing. The shaft 61 includes a rotating shaft 63 of a motor 62 and a connecting piece 64.
Are connected through.

Therefore, when the motor 62 rotates, the sprocket 59 rotates via the shaft 61 and moves the chain 53. Then,
The slider 31 is pulled by the chain 53 and moves along the rail 29. At this time, if the claw 33 of the slider 31 is raised, the substrate 10 is pushed to transfer the substrate 10.

Further, when the claw 33 is lowered, the claw 33 can move without contacting the substrate 10.

The positioning means B is shown in FIGS. 1 to 3 and 8
As shown in FIG. 1 to FIG. 13, a first positioning portion B1 for holding the substrate 10 for horizontal positioning, a second positioning portion B2 for vertical positioning of the substrate 10, and a mechanism for supporting them. And part B3.

The mechanism B3 is supported by a frame 65 fixed to the pedestal 21, as shown in FIGS. This frame 65
The base 69 fixed with the three bearings 68 slidably fitted to the three shafts 67 fixed to the three bearings 66 established in
It is fixed to a bracket 72 connected to a rod 71 of a cylinder 70 attached to the lower surface of the frame 65.

Therefore, the base 69 moves the shaft by the operation of the cylinder 70.
Go up and down along 67. The base 69 supports the first and second positioning portions B1 and B2.

The first positioning portion B1 is slidable by a pin 74 on a pair of support bases 73 fixed to both ends of the base 69, as shown in FIGS. 1, 3, 8, and 9. And a rail 76 supported by the spring and pushed up by a spring 75.
The rail 76 is arranged between the rails 23 and 24 and forms a passage for the substrate 10. Therefore, the rail 76 has a ninth
As shown in the figure, a step 77 is formed and a lid 78 is attached.

In addition, a positioning hole 79 is formed in the rail 76. Above the hole 79, a base 80 fixed to the mount 21 is provided.
Positioning pin 82 supported by bracket 81 on
Are arranged. Then, when the rail 76 is raised by the operation of the cylinder 70, the hole 79 is fitted with the pin 82 to position the rail 76. As shown in FIG. 11, the mechanism for positioning the substrate 10 is composed of a main positioning portion B11 on the right side of the drawing and a sub-positioning portion B12 on the left side of the drawing.

The main positioning portion B11 is a bearing 83 fixed to the rail 76.
Supported by. A positioning pin 88 is supported at one end of a shaft 84 that slidably penetrates the bearing 83 and at one end of a plate 87 connected to a rod 86 of a cylinder 85 supported by the bearing 83. The tip of this pin 88 is the substrate
The board 10 is positioned by fitting into the reference holes 11a of the board 10.

The sub-positioning portion B12 is a bearing 89 fixed to the rail 76.
Supported by. One end of a pair of shafts 90 slidably passing through the bearing 89 and a cylinder supported by the bearing 89.
A bearing 93 is connected to a rod 92 of 91. The bearing 93 supports a shaft 96 that slidably penetrates the bearing 93 and has springs 94 and 95 at both ends of the bearing 93 inserted therein. A positioning pin 98 is supported on one end of the shaft 96 via a support member 97. The tip of this pin 98 is fitted into the reference hole 11b of the substrate 10 to position the substrate 10.

As shown in FIG. 12, the pins 88 and 98 are formed so that the outer diameter is larger than the inner diameter d of the reference holes 11a and 11b of the substrate 10 and the tips are conical. The reference holes 11a and 11b are provided at positions separated from each other on the substrate 10. Therefore, the pin
When 88 and 98 are inserted into the reference holes 11a and 11b, the conical surfaces of the pins 88 and 98 come into contact with the edges of the reference holes 11a and 11b for positioning, so that the pin 88,98 and the reference holes 11a and 11b There is no play, and accurate positioning can be performed.

Further, the pin 88 is fitted in the reference hole 11a to position the reference point of the substrate 10, and the pin 98 is fitted in the reference hole 11b to regulate the inclination of the substrate 10. Further, variations in the distance between the reference holes 11a and 11b are absorbed by the sliding of the shaft 96. At this time, the stresses of the springs 94 and 95 change, but when the pin 98 is removed from the reference hole 11b, the shaft 96 moves to a place where the stresses of the springs 94 and 95 are balanced.

The second positioning portion B12 is shown in FIGS. 2, 8 and 1
As shown in FIG. 0, a fixing plate 99 is fixed on the pedestal 21 above the substrate 10 positioned by the first positioning portion B11 so as to be positioned perpendicular to the transfer direction of the substrate 10. There is. The lower end surface of the fixing plate 99 is set to have the same height as the lower end surface of the bracket 81. The rod 102 of the cylinder 101 supported by the base 69 has an eighth
As shown in FIG. 10 and FIG.
A push-up plate 103 that faces is supported. Therefore,
When the cylinder 101 is operated, the push-up plate 103 is raised, and the substrate 10
Push up to move the rail 7 between the fixed plate 99 and the push-up plate 103.
The warp of the substrate 10 in the direction perpendicular to 6 is corrected and the substrate 10 can be fixed.

On the other hand, the board 10 is fixed between the lower surface of the bracket 81 and the upper surface of the rail 76 so that the warp of the board 10 in the direction parallel to the rail 76 is corrected and fixed. That is, both ends of the board 10 parallel to the carrying direction are sandwiched by the bracket 81 and the rail 76, and both ends orthogonal to the carrying direction are fixed plate 99 and the push-up plate 10.
It is sandwiched by 3 and, therefore, the peripheral edge of the substrate is sandwiched by their cooperation, so that the warp is completely corrected. Therefore, the bracket 81, the rail 76, the fixing plate 99,
The push-up plate 103 constitutes a warp correction means.

Further, in that case, the upper surface of the substrate 10 is the bracket 81 as described above.
Since the rail 76 is in contact with the lower surfaces of both the fixed plate 99 and the fixed plate 99 and the rail 76 is supported by the spring force of the spring 75, even if the thickness of the substrate 10 changes, the change is absorbed by the spring 75.
The top surface of substrate 10 is always positioned horizontally at the same height.

The heating means C is shown in FIGS. 1, 2 and 14 to 14.
An irradiation unit that irradiates the substrate 10 with a light beam as shown in FIG.
C1 and a scanning section C2 for scanning the irradiation section C1 along the surface of the substrate 10 are provided.

As shown in FIGS. 1 and 2, the irradiation section C1 is mounted on the pedestal.
A laser oscillator 120 placed in contact with the optical fiber 21, an optical fiber 121 that guides the laser light oscillated by the laser oscillator 120, and a laser beam connected to the tip of the optical fiber 121 to connect the laser light to the substrate 10.
And an optical system 122 that emits the light toward. A part of the optical fiber 121 is wound in a coil,
It follows the movement of the optical system 122 and does not get in the way.

The scanning unit C ₂ is supported on the pedestal by a pair of rails 123 arranged in the transfer direction of the substrate 10. On one side of this rail 123, a feed screw 125 is attached by a bearing 124.
Is rotatably supported. A rotary shaft of a motor 127 supported by a support 126 is coupled to a side surface of the rail 123 at one end of the feed screw 125. Feed screw 1
A frame 128 having a nut screwed with 25 is slidably supported on the rail 123. This frame 128
A feed screw 130 is rotatably supported by a bearing 129. One end of the feed screw 130 is connected to the frame 128.
A rotation shaft of a motor 132 supported by a support 131 is coupled to the. A slider 133 having a nut that is screwed onto the feed screw 130 is slidably supported by the frame 128. The slider 133 supports a movable base 134 that can be slid and fixed in the vertical direction. As shown in FIG. 14, a rotary table 137 having a hole 136 slidably fitted in a screw 135 provided upright on the movable table 134 is fixed to the movable table 134 at an arbitrary angle. The moving table 134 has a fourteenth
As shown in FIG. 15 and FIG. 15, the openings 138 are annularly arranged.
A nozzle 139 having is arranged. The optical system 122,
It is supported by the turntable 137.

Therefore, when the motor 127 is operated, the frame 128 moves in the transfer direction of the substrate 10, and when the motor 132 is operated, the slider 133 moves in the direction perpendicular to the substrate feeding direction. By controlling both these movements, the optical system 12
2 can be moved to any position in a plane parallel to the substrate 10.

Further, in order to prevent vapor of flux or the like generated by heating the solder from adhering to the optical system 122, compressed air is ejected from the nozzle 139.

In the above structure, the substrate 10 is preliminarily coated with solder at a predetermined position, and the component is mounted so that the lead is positioned on the solder. The substrate 10 is placed on the rail 23 of the transfer means A. When the cylinder 39 operates, the claw 33 rises to a position facing the end surface of the substrate 10. Then, the motor
When 62 operates, the slider 31 is moved and the substrate 10 is pushed by the claw 33 to feed the substrate 10 from the supply position of the rail 23 to the positioning position on the rail 76. When the slider 31 reaches the moving end, the motor 62 stops, the cylinder 39 operates to lower the claw 33 from the lower surface of the substrate 10, and then the motor 62 reverses to move the claw 33.
To the original position.

On the other hand, in the positioning position, the cylinder 8 of the positioning means B is
5, 91 actuate to lower the positioning pins 88, 98, and the pins 88, 98 are fitted into the reference holes 11a, 11b of the substrate 10 to position the substrate 10 in the horizontal direction. At this time, the reference hole
Even if the position of the reference hole 11b is slightly deviated from that of the reference hole 11a, the positioning pin 98 is moved by the spring force of the springs 94 and 95 to the reference hole 11b.
Since it is surely fitted in, it is possible to absorb the variation between the reference holes 11a and 11b.

This state is shown in FIG. Then, the cylinder 101 is operated as shown in FIG.
Is raised and brought into contact with the lower surface of the substrate 10. In this state
17 Operate the cylinder 70 as shown in Fig. (C) and
Raise 69. Then, as the base 69 rises, first, the hole 79 of the rail 76 is fitted into the pin 82 to guide the rail 76 in the vertical direction, and then the substrate 10 supported by the rail 76 is fixed to the bracket 81 and the fixing plate 99. The vertical positioning is performed in contact with. At this time, since the board 10 is sandwiched from the fixing plate 99 and the push-up plate 103, and between the rail 76 and the lower surface of the bracket 81 in four directions, the warpage is completely corrected, and the upper surface is positioned and fixed at a predetermined position. It will be in a state of being.
In this state, the laser oscillator 120 of the heating means C is operated to oscillate the laser light, and the motors 127 and 132 are operated to move the optical system 122 along a predetermined path. Then, the substrate 1 emits the laser light emitted from the optical system 122.
Irradiating the connection position of 0 to melt the solder and connect the wiring pattern of the substrate 10 and the lead of the component. At this time, since the upper surface of the substrate 10 is positioned and fixed in the predetermined position as described above, and the warp of the substrate 10 is completely corrected,
Solder connection surface of wiring pattern on substrate 10 and optical system
A constant distance is always provided between the lead wire 122 and 122 over the entire surface of the substrate, so that the solder connection surface of the wiring pattern and the lead can be stably connected.

The distance h between the optical system 122 and the substrate 10 is set so that the laser light 140 emitted from the optical system 122 is equal to the optical system 122 as shown in FIG.
If the substrate 10 is set to be irradiated after passing through the focal point f of 122, the problem such as burning of the substrate 10 does not occur even if the interval h changes due to the vibration of the entire apparatus.
A stable connection can be made. When all the connections on the board 10 are completed, the laser oscillator 120 stops oscillating light, and when the optical system 122 returns to its original position, the motors 127 and 132 stop.

Then, as shown in FIG. 17 (B), the cylinder 70 operates to lower the base 69. Then, the rail 76 becomes the same height as the rails 23 and 24. Then, as shown in FIG. 17 (A), the cylinder 101 operates to lower the push-up plate 103 and simultaneously operate the cylinders 85 and 91 to disengage the positioning pins 88 and 98 from the substrate 10. The substrate 10 is ready for transfer.

Next, when the cylinder 39 is operated to raise the claw 33 and then the motor 62 is operated to move the slider 31, the substrate 10 pushed by the claw 33 moves from the rail 76 to the rail 24.
Be transferred to. In this way, the substrate 10 transferred to the take-out position of the rail 24 is taken out from the rail 24 and sent to the next step.

In this way, the wiring pattern on the substrate 10 and the component leads can be connected.

According to the above-described embodiment, when the substrate 10 is transferred, the substrate 10 is positioned at the positioning position in the transfer (horizontal) direction by the main and sub positionings B11 and B12 of the first positioning unit B1.
In the positioned state, the board 10 is raised by the second positioning portion B2 and the upper surface of the board is positioned at a predetermined position, so that the warp of the board can be completely corrected, and the warp of the board is not affected. Can be surely corrected. Also,
The ability to position the top surface of the board in place allows the board to
Even if the plate thickness of 10 changes, it is not affected by it.
Therefore, the distance between the solder connection surface on the board and the component lead is constant over the almost entire surface of the board 10 between the irradiation section C1 and the optical system 122, and connection can be performed under stable conditions.

Further, since the peripheral portion of the substrate is sandwiched in order to correct the warp of the substrate 10, even if the irradiation unit C1 scans the substrate 10 for the connection work, the scanning is not hindered.

Furthermore, since the positioning pin 98 of the sub-positioning portion B12 is supported by the spring force of the springs 94 and 95 so as to be movable parallel to the substrate surface, there is variation between the reference holes 11a and 11b on the substrate 10. In this case, the reference hole 11b can be reliably fitted. Therefore, in addition to the variation between the reference holes, variation in the outer circumference of the substrate is not affected. Moreover, since the substrate 10 is positioned based on the reference holes 11a and 11b, there is no fear that the relative positional relationship between the solder connection surface or the component on the substrate and the irradiation portion C1 is changed.

〔The invention's effect〕

As described above, according to the present invention, the transfer means, the first and second positioning portions, and the heating means are provided, and the first and second positioning portions vertically move the peripheral portion of the printed wiring board. Since it is configured to have a means for correcting the warp of the printed wiring board by sandwiching the printed wiring board along with the printed wiring board, even if the printed wiring board warps, the printed wiring board can be surely warped regardless of its direction. The entire surface can be straightened, and the upper surface of the printed wiring board is always positioned at a predetermined position based on the reference hole of the printed wiring board. As a result, the leads of the electronic component can be reliably and stably connected to the wiring pattern of the printed wiring board even if there are variations in the outer circumference and thickness of the printed wiring board, resulting in high solder connection. To be reliable There is an effect that can be said.

[Brief description of drawings]

1 is a plan view of a solder connecting device according to the present invention, FIG. 2 is a partially cutaway side view of FIG. 1, FIG. 3 is a plan view of a transfer means in FIG. 1, and FIG. 4 is an E of FIG. -E sectional view, fifth
FIG. 6 is an enlarged view showing a connection state of the slider, the chain and the connecting rod, FIG. 6 is an enlarged sectional view of the slider, FIG. 7 is an enlarged view showing the connection state of the chain and the connecting rod, and FIG. 8 is a view in FIG. A front view showing the positioning means, FIG. 9 is a sectional view taken along line JJ of FIG. 8, FIG. 10 is a sectional view taken along line KK of FIG. 9, and FIG. 11 is a sectional view taken along line LL of FIG. 12 is an enlarged view of the positioning pin, FIG. 13 is a sectional view taken along the line MM in FIG. 9, and FIG. 14 is a front view showing a support mechanism of the optical system of the heating means in FIG.
Fig. 15 is a side sectional view of Fig. 14, Fig. 16 is a bottom view of Fig. 14,
FIG. 17 is a process diagram showing the operation sequence of the positioning means,
(A) is a diagram showing a state where the substrate is supplied to the connection position and the horizontal positioning is finished, (B) is a diagram showing a state where the push-up plate is lifted and is in contact with the substrate, (C) is a substrate FIG. 18 is a view showing a fixed state in which the vertical direction and the warp are corrected, FIG. 18 is a front view showing a heating state by a heating means, and FIG. 19 is a perspective view of a conventional solder connecting device. A: transfer means, B1: first positioning section, B2: second positioning section, C: heating means, C1: irradiation section, C2: scanning section, 10: substrate, 11a, 11b …… Reference hole, 14 …… 88,98 …… Positioning pin.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shigeo Shiono 1-1-1 Kokubuncho, Hitachi City, Ibaraki Hitachi Kokubun Factory, Hitachi Ltd. (72) Inventor Osamu Isshiki 1-1-1 Kokubuncho, Hitachi City, Ibaraki Prefecture No. 1 Stock company, Hitachi, Ltd. Kokubun Plant (72) Inventor Takeshi Kawana, 292, Yoshida-cho, Totsuka-ku, Yokohama, Kanagawa Prefecture, Ltd., Hitachi, Ltd., Institute of Industrial Science (56) Reference JP-A-59-92163 (JP, A) )

Claims (1)

[Claims] 1. A printed wiring board having reference holes provided at positions spaced apart from each other, a solder applied on a wiring pattern formed on an upper surface, and an electronic component having leads mounted on the solder, In a solder connecting device for positioning based on the reference hole and heating and melting the solder connecting surface on the positioned substrate to join the wiring pattern and the lead, the printed wiring board supplied and the printed wiring board Transfer means for transporting to a positioning position along the horizontal direction that is a surface,
The tip portion has a positioning pin that can be fitted into the reference hole of the printed wiring board, and the positioning portion is fitted into the reference hole of the printed wiring board that has been transported to the positioning position by the transfer means.
Positioning the printed wiring board at a predetermined horizontal position 1st
And a second positioning unit for vertically moving the printed wiring board at a predetermined horizontal position to position the upper surface of the printed wiring board at a predetermined vertical position, an irradiation unit that emits a beam, and the second positioning unit. A heating unit configured to scan the irradiation unit onto the solder connection surface of the printed wiring board, and the second positioning unit of the first and second positioning units positions the printed wiring board at a predetermined horizontal position. A solder connecting device comprising means for correcting the warp of the printed wiring board by sandwiching the peripheral portion of the printed wiring board along the vertical direction when the printed wiring board is moved to a predetermined position in the vertical direction.