JPH0772793B2 - Pellicle - Google Patents
PellicleInfo
- Publication number
- JPH0772793B2 JPH0772793B2 JP20796486A JP20796486A JPH0772793B2 JP H0772793 B2 JPH0772793 B2 JP H0772793B2 JP 20796486 A JP20796486 A JP 20796486A JP 20796486 A JP20796486 A JP 20796486A JP H0772793 B2 JPH0772793 B2 JP H0772793B2
- Authority
- JP
- Japan
- Prior art keywords
- pellicle
- mask substrate
- stabilizer
- substance
- foreign matter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 23
- 239000000126 substance Substances 0.000 claims description 21
- 239000003381 stabilizer Substances 0.000 claims description 18
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- CZNRFEXEPBITDS-UHFFFAOYSA-N 2,5-bis(2-methylbutan-2-yl)benzene-1,4-diol Chemical compound CCC(C)(C)C1=CC(O)=C(C(C)(C)CC)C=C1O CZNRFEXEPBITDS-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 229920001220 nitrocellulos Polymers 0.000 description 3
- 230000008022 sublimation Effects 0.000 description 3
- 238000000859 sublimation Methods 0.000 description 3
- NGFBEQCLQRWZGA-UHFFFAOYSA-N C.C=CC(C(=O)O)C1=CC(=C(C(=C1)C(C)(C)C)O)C(C)(C)C.C=CC(C(=O)O)C1=CC(=C(C(=C1)C(C)(C)C)O)C(C)(C)C.C=CC(C(=O)O)C1=CC(=C(C(=C1)C(C)(C)C)O)C(C)(C)C.C=CC(C(=O)O)C1=CC(=C(C(=C1)C(C)(C)C)O)C(C)(C)C Chemical compound C.C=CC(C(=O)O)C1=CC(=C(C(=C1)C(C)(C)C)O)C(C)(C)C.C=CC(C(=O)O)C1=CC(=C(C(=C1)C(C)(C)C)O)C(C)(C)C.C=CC(C(=O)O)C1=CC(=C(C(=C1)C(C)(C)C)O)C(C)(C)C.C=CC(C(=O)O)C1=CC(=C(C(=C1)C(C)(C)C)O)C(C)(C)C NGFBEQCLQRWZGA-UHFFFAOYSA-N 0.000 description 2
- 239000000020 Nitrocellulose Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- XCPFSALHURPPJE-UHFFFAOYSA-N (3,5-ditert-butyl-4-hydroxyphenyl) propanoate Chemical compound CCC(=O)OC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 XCPFSALHURPPJE-UHFFFAOYSA-N 0.000 description 1
- XYXJKPCGSGVSBO-UHFFFAOYSA-N 1,3,5-tris[(4-tert-butyl-3-hydroxy-2,6-dimethylphenyl)methyl]-1,3,5-triazinane-2,4,6-trione Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C)=C1CN1C(=O)N(CC=2C(=C(O)C(=CC=2C)C(C)(C)C)C)C(=O)N(CC=2C(=C(O)C(=CC=2C)C(C)(C)C)C)C1=O XYXJKPCGSGVSBO-UHFFFAOYSA-N 0.000 description 1
- HIIRHFCETUWEJE-UHFFFAOYSA-N 2-tert-butyl-6-[(3-tert-butyl-2-hydroxy-5-methylphenyl)methyl]-4-methylphenol;terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1.CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O HIIRHFCETUWEJE-UHFFFAOYSA-N 0.000 description 1
- QEGAVCABINQYQC-UHFFFAOYSA-N 4-[6-benzyl-3,5-bis(3,5-ditert-butyl-4-hydroxyphenyl)-2,4,6-trimethylcyclohexa-2,4-dien-1-yl]-2,6-ditert-butylphenol Chemical compound C=1C=CC=CC=1CC1(C)C(C=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(C=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1C1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 QEGAVCABINQYQC-UHFFFAOYSA-N 0.000 description 1
- ZVVFVKJZNVSANF-UHFFFAOYSA-N 6-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]hexyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCCCCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 ZVVFVKJZNVSANF-UHFFFAOYSA-N 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Natural products CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- JBTXGEJRJCNRLU-UHFFFAOYSA-N [2-(dihydroxyphosphanyloxymethyl)-3-hydroxy-2-(hydroxymethyl)propyl] dihydrogen phosphite Chemical compound OP(O)OCC(CO)(CO)COP(O)O JBTXGEJRJCNRLU-UHFFFAOYSA-N 0.000 description 1
- CGRTZESQZZGAAU-UHFFFAOYSA-N [2-[3-[1-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]-2-methylpropan-2-yl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]-2-methylpropyl] 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCC(C)(C)C2OCC3(CO2)COC(OC3)C(C)(C)COC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 CGRTZESQZZGAAU-UHFFFAOYSA-N 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、半導体装置製造用のガラスマスクの汚染や異
物付着を防止するためのペリクルに関する。Description: TECHNICAL FIELD The present invention relates to a pellicle for preventing contamination of a glass mask for manufacturing a semiconductor device and adhesion of foreign matter.
半導体装置の製造において、ウエハ上に微細な回路パタ
ーンを転写するために用いられるガラスマスクの品質
が、半導体装置の性能や歩留りを大きく左右する。とく
に、ガラスマスク上に付着する異物の数を低減すること
が歩留りの向上、製造コストの定価を招いて生産性を向
上すること、したがって、ガラスマスクを汚染から守り
異物の付着を防止するために、透明な膜からなるペリク
ルをマスク基板上に設けることについては、たとえば雑
誌「電子材料」1982年３月号、P52〜55（工業調査会発
行）に記載されているとおりである。In manufacturing a semiconductor device, the quality of a glass mask used for transferring a fine circuit pattern on a wafer greatly affects the performance and yield of the semiconductor device. In particular, to reduce the number of foreign substances that adhere to the glass mask improves yield, leads to a fixed manufacturing cost and improves productivity. Therefore, in order to protect the glass mask from contamination and prevent foreign substances from adhering. The provision of a pellicle composed of a transparent film on a mask substrate is as described, for example, in "Electronic Materials", March 1982, P52-55 (published by the Industrial Research Board).
ところで、ペリクルは、その目的達成のためには１ミク
ロン以下の極微細なゴミや異物からマスク基板を守る必
要があり、そのために種々の工夫がなされている。By the way, in order to achieve the purpose of the pellicle, it is necessary to protect the mask substrate from extremely fine dust or foreign matter of 1 micron or less, and various measures have been taken for that purpose.
たとえば特開昭60−75835号公報には、ペリクルをマス
ク基板に固定する粘接着剤としてマスク基板に対して接
着力の弱いものを使用して、ペリクルをマスク基板から
剥がした際に、粘接着剤がマスク基板に残ってマスク基
板を汚染する点を改良したようなペリクルが提案されて
いる。For example, in Japanese Patent Laid-Open No. 60-75835, a tacky adhesive for fixing the pellicle to the mask substrate is used that has a weak adhesive force to the mask substrate, and when the pellicle is peeled from the mask substrate, There has been proposed a pellicle which is improved in that the adhesive remains on the mask substrate and contaminates the mask substrate.
ところで、本発明者らの検討によれば、洗浄等の最善の
手段を用いてダストフリーの状態にされたペリクルを、
たとえば上記のような粘接着剤を用いてマスク基板上に
装着しても、その使用中に、ペリクルで完全に封鎖され
た空間内に存在するはずのペリクル基板回路パターン面
に異物が付着する現象を度々発生することが判った。By the way, according to the study by the present inventors, the pellicle made in a dust-free state by using the best means such as cleaning,
For example, even if it is mounted on a mask substrate using the adhesive agent as described above, foreign matter adheres to the circuit pattern surface of the pellicle substrate that should exist in the space completely closed by the pellicle during its use. It was found that the phenomenon occurs frequently.
また別には、ダストフリーのペリクルをダストフリーの
状態にしている容器内に保管、運搬しているうち、完全
に密閉されているにも関わらず、ペリクル膜表面等に異
物が付着している現象も度々発生することが判った。Another phenomenon is that while a dust-free pellicle is stored and transported in a dust-free container, foreign matter adheres to the pellicle membrane surface, etc. even though it is completely sealed. It was also found that it often occurs.
これらの原因を調べた結果、ペリクルを構成する部材、
特にその粘接着剤層に安定剤として一般的に用いられて
いる2,5−ジ−tert−アミルハイドロキノンが昇華して
再結晶するためであることが判った。As a result of investigating these causes, the members constituting the pellicle,
In particular, it was found that 2,5-di-tert-amylhydroquinone, which is generally used as a stabilizer in the adhesive layer, sublimes and recrystallizes.
本発明は以上に示したような従来のペリクルの問題点を
解決するものであって、使用時もしくは保管、運搬時に
異物を発生して、マクク基板あるはいペリクル自体を汚
染することのないペリクルを提供することを目的として
いる。The present invention solves the problems of the conventional pellicle as described above, and provides a pellicle that does not contaminate the muck substrate or the pellicle itself by generating foreign matter during use, storage, or transportation. It is intended to be provided.
すなわち本発明は、ペリクル枠の一方に透明なペリクル
膜および他方にマスク基板装着用の粘接着剤層が設けら
れてなるペリクルにおいて、ペリクルを構成する部材に
含まれる安定剤として、常温、常圧下で昇華もしくは蒸
発する物質を含まない安定剤を使用してなることを特徴
とするペリクルである。That is, the present invention provides a pellicle in which a transparent pellicle film is provided on one side of a pellicle frame and a tacky adhesive layer for mounting a mask substrate on the other side, and is used as a stabilizer contained in a member constituting the pellicle at room temperature, at all times. A pellicle characterized by using a stabilizer containing no substance that sublimes or evaporates under pressure.
本発明のペリクルは、透明なペリクル膜、ペリクル枠お
よび粘接着材層とから構成されている。その実施形態の
一列を第１図および第２図に示す。The pellicle of the present invention is composed of a transparent pellicle film, a pellicle frame, and an adhesive layer. One row of the embodiment is shown in FIG. 1 and FIG.
第１図において、ペリクル１はアルミニウムやステンレ
ス鋼等の金属あるいはポリエチレン、ポリプロピレン、
ポリスチレン等の合成樹脂などからなるペリクル枠３の
片面に、ニトロセルロース等からなる透明なペリクル膜
２が設けられており、かつペリクル枠の他方の面すなわ
ちマスク基板５に対峙する面には、粘接着剤層４が設け
られている。第２図は別の実施形態であって、粘接着剤
層４は発泡もしくは無発泡の合成樹脂テープ６の両面に
設けられた両面粘着テープによって形成されている。In FIG. 1, a pellicle 1 is a metal such as aluminum or stainless steel, or polyethylene, polypropylene,
A transparent pellicle film 2 made of nitrocellulose or the like is provided on one surface of a pellicle frame 3 made of a synthetic resin such as polystyrene, and the other surface of the pellicle frame, that is, the surface facing the mask substrate 5, is adhered. An adhesive layer 4 is provided. FIG. 2 shows another embodiment, in which the adhesive layer 4 is formed by a double-sided adhesive tape provided on both sides of a foamed or non-foamed synthetic resin tape 6.
本発明においては、ペリクルを構成する各構成部材、す
なわちペリクル膜、粘接着剤、両面粘着テープの基材で
ある合成樹脂テープ、あるいはペリクル枠などに含まれ
る安定剤として、常温、常圧下で昇華もしくは蒸発する
物質を含まない安定剤を使用することが重要である。本
発明において安定剤としては、ペリクルを構成する部材
の熱、光、酸素、オゾン等による劣化を防ぐ薬剤であ
る。In the present invention, each component constituting the pellicle, that is, the pellicle film, the adhesive, the synthetic resin tape that is the base material of the double-sided adhesive tape, or the stabilizer contained in the pellicle frame or the like, at room temperature and under normal pressure. It is important to use stabilizers that do not contain substances that sublime or evaporate. In the present invention, the stabilizer is a drug that prevents deterioration of the members constituting the pellicle due to heat, light, oxygen, ozone, and the like.
このような常温、常圧下で昇華もしくは蒸発する物質を
含まない安定剤としては、例えばテトラキス〔メチレン
（3,5−ジ−ｔ−ブチル−４−ヒドロキシフェニル）プ
ロピオネート〕メタン、1,3,5−トリス（４−ｔ−ブチ
ル−３−ヒドロキシ−2,6−ジメチルベンジル）−ｓ−
トリアジン−2,4,6−（1H,3H,5H）−トリオン、1,3,5−
トリメチル−2,4,6−トリス（3,5−ジ−ｔ−ブチル−４
−ヒドロキシフェニル）ベンジルベンゼン、エチレング
リコールビス〔3,3−ビス（３′−ｔ−ブチル−４′−
ヒドロキシフェニル）ブチレート〕、3,9−ビス〔２−
｛３−（３−ｔ−ブチル−４−ヒドロキシ−５−メチル
フェニル）プロピオニルオキシ｝−1,1−ジメチルエチ
ル〕2,4,8,10−テトラオキサスピロ〔5,5〕ウンデカ
ン、1,6−ヘキサンジオール−ビス〔３−（3,5−ジ−ｔ
−ブチル−４−ヒドロキシフェニル）プロピオネー
ト〕、2,2′−オキサミド−ビス−エチル−３（3,5−ジ
−ｔ−ブチル−４−ヒドロキシフェニル）プロピオネー
ト、2,2′−メチレン−ビス（４−メチル−６−ｔ−ブ
チルフェノール）テレフタレート、ビス（2,6−ジ−ｔ
−ブチル−４−メチルフェニル）ペンタエリスリトール
−ジ−フォスファイト、ペンタ（エリスリチル−テトラ
−β−メルカプトラウリル）プロピオネート等があげら
れる。Examples of such stabilizers that do not contain substances that sublime or evaporate at normal temperature and pressure include tetrakis [methylene (3,5-di-t-butyl-4-hydroxyphenyl) propionate] methane, 1,3,5 -Tris (4-t-butyl-3-hydroxy-2,6-dimethylbenzyl) -s-
Triazine-2,4,6- (1H, 3H, 5H) -trione, 1,3,5-
Trimethyl-2,4,6-tris (3,5-di-t-butyl-4
-Hydroxyphenyl) benzylbenzene, ethylene glycol bis [3,3-bis (3'-t-butyl-4'-
Hydroxyphenyl) butyrate], 3,9-bis [2-
{3- (3-t-Butyl-4-hydroxy-5-methylphenyl) propionyloxy} -1,1-dimethylethyl] 2,4,8,10-tetraoxaspiro [5,5] undecane, 1, 6-hexanediol-bis [3- (3,5-di-t
-Butyl-4-hydroxyphenyl) propionate], 2,2'-oxamido-bis-ethyl-3 (3,5-di-t-butyl-4-hydroxyphenyl) propionate, 2,2'-methylene-bis ( 4-methyl-6-t-butylphenol) terephthalate, bis (2,6-di-t
Examples include -butyl-4-methylphenyl) pentaerythritol-di-phosphite and penta (erythrityl-tetra-β-mercaptolauryl) propionate.
たとえば粘接着剤中には、通常安定剤が配合されている
が、粘接着剤用の安定剤として、一般的に用いられてい
る2,5−ジ−tert−アミルハイドロキノンは常温、常圧
下で昇華性を示して再結晶する。このような物質が粘接
着剤中に存在すると、たとえ極めて高い清浄度のもとで
ペリクルを製造し、また使用前に洗浄を行ってマスク基
板装着時には異物の存在を防止したとしても、使用中に
前記物質が昇華し、ペリクルとマスク基板とで構成され
る封鎖空間内に気体となって放出され、その後再結晶し
た前記物質がマスク基板上の回路パターン表面に付着し
て、半導体装置製造の歩留りを低下させる。For example, a stabilizer is usually blended in an adhesive, but as a stabilizer for an adhesive, 2,5-di-tert-amylhydroquinone, which is generally used, is usually kept at room temperature at room temperature. Recrystallizes under pressure and shows sublimation. If such a substance is present in the adhesive, even if the pellicle is manufactured under extremely high cleanliness and even if it is washed before use to prevent the presence of foreign matter when the mask substrate is mounted, it cannot be used. The substance sublimates therein and is released as a gas in the enclosed space formed by the pellicle and the mask substrate. Then, the recrystallized substance adheres to the surface of the circuit pattern on the mask substrate to manufacture a semiconductor device. Decrease the yield.
また、運搬ないし保管中においても、昇華後再結晶した
ものがペリクル枠やペリクル膜の表面に付着し、ペリク
ルをマスク基板に装着したのち、付着していた物質がマ
スク基板上に落下して歩留り低下させるのである。この
ような粘接着剤中の安定剤の問題は、ペリクル膜や合成
樹脂製ペリクル枠にも同様に発生する。よって本発明の
ペリクルを構成する部材中に含まれる安定剤は、常温、
常圧下で昇華、蒸発して再結晶または液滴化する物質を
含まないものである必要がある。Also, during transportation or storage, the recrystallized material after sublimation adheres to the surface of the pellicle frame or pellicle film, and after the pellicle is mounted on the mask substrate, the adhered substances fall onto the mask substrate and yield Lower it. The problem of the stabilizer in the tacky adhesive also occurs in the pellicle film and the synthetic resin pellicle frame. Therefore, the stabilizer contained in the member constituting the pellicle of the present invention,
It must be free of substances that sublimate or evaporate under normal pressure to recrystallize or become droplets.
安定剤におけるこのような問題は、粘接着材層の使用前
に該層に貼られている離型テープに含まれる離型剤でも
同様に発生する。すなわち、離型剤の一種であるヘキサ
メチルシクロシロキサンも常温、常圧下で昇華性を示し
て再結晶し、異物発生の原因となるので、離型剤につい
ても同様に常温、常圧下で蒸発または昇華して再結晶ま
たは液滴化する物質を含まないものを使用する。Such problems in the stabilizer also occur in the release agent contained in the release tape attached to the adhesive layer before using the adhesive layer. That is, hexamethylcyclosiloxane, which is a type of release agent, also recrystallizes at room temperature under normal pressure and recrystallizes, which causes the generation of foreign matter.The release agent also evaporates at room temperature under normal pressure. Use a substance that does not contain a substance that sublimes to recrystallize or becomes a droplet.
一方、蒸発性物質は昇華性物質と異なって再結晶化では
なく、液滴となってマスク基板上やペリクル膜面上に付
着するが、このような液滴が存在すると、その部分だけ
光線の屈折率が異なることになって、ウエハ上に適正な
回路パターン像が形成されなくなる。よって常温、常圧
下で蒸発して液滴化する物質の存在も好ましくない。On the other hand, unlike the sublimable substance, the evaporative substance is not recrystallized but becomes droplets and adheres to the mask substrate or the pellicle film surface. Since the refractive indexes are different, an appropriate circuit pattern image cannot be formed on the wafer. Therefore, the presence of a substance that evaporates into droplets at normal temperature and pressure is also undesirable.
本発明のペリクルは、上記のような常温、常圧下で昇華
もしくは蒸発する物質を含まない安定剤を各部剤に使用
して製造され、例えば第１図または第２図のようにマス
ク基板５に取付けて使用される。The pellicle of the present invention is manufactured by using a stabilizer that does not contain a substance that sublimates or evaporates at room temperature and pressure as described above for each part. For example, as shown in FIG. 1 or FIG. Used by mounting.
尚、本発明においては、それ自体で昇華あるいは蒸発す
る物質は勿論のこと、光により活性化して昇華もしくは
蒸発する物質も、昇華もしくは蒸発に包含される。In the present invention, not only substances that sublime or evaporate by themselves, but also substances that are activated by light to sublime or evaporate are included in sublimation or evaporation.
本発明によれば、ペリクルを構成する部材に含まれる安
定剤として、常温、常圧下で昇華もしくは蒸発する物質
を含まない安定剤を使用するようにしたので、ペリクル
の保管中、運搬中あるいは使用中に異物を発生する虞が
なくなり、よって半導体装置製造におけるマスク基板の
汚染、歩留りの低下を防止できる。According to the present invention, a stabilizer that does not contain a substance that sublimes or evaporates at room temperature and pressure is used as the stabilizer contained in the member that constitutes the pellicle. There is no possibility that foreign matter will be generated therein, so that it is possible to prevent contamination of the mask substrate and reduction in yield in the semiconductor device manufacturing.
以下に本発明の内容を好ましい実施例でもって説明する
が、本発明はとくにことわりのない限り何らこれらの例
に制限されるものではない。Hereinafter, the contents of the present invention will be described with reference to preferred examples, but the present invention is not limited to these examples unless otherwise specified.
実施例１ アルミニウム製のペリクル枠の片面にニトロセルロース
膜、他方の面にゴム系の粘接着剤層を設けたペリクルを
製作した。ニトロセルロース中には安定剤を配合せず、
粘接着剤には安定剤としてテトラキス〔メチレン（3,5
−ジ−ｔ−ブチル−４−ヒドロキシフェニル）プロピオ
ネート〕メタンを配合してある。Example 1 A pellicle having a nitrocellulose film on one surface of a pellicle frame made of aluminum and a rubber-based adhesive layer on the other surface was manufactured. No stabilizer is added to nitrocellulose,
Tetrakis [methylene (3,5
-Di-t-butyl-4-hydroxyphenyl) propionate] methane.
該ペリクルを洗浄して異物を完全に取り除き、マスク基
板に装着後180日放置した。その後、マスク基板上の異
物を調べたところ、異物の発生は全く認められなかっ
た。The pellicle was washed to completely remove foreign matter, and left on the mask substrate for 180 days. After that, when foreign matter on the mask substrate was examined, generation of foreign matter was not recognized at all.
比較例１ 粘接着剤に安定剤として2,5−ジ−tert−アミルハイド
ロキノンを用いるほかは実施例１と同様に行った。その
結果、ペリクル洗浄後は異物が全く存在しなかったにも
かかわらず、180日経過後は異物が発生していた。この
異物を採取し、赤外線吸収スペクトルを測定したとこ
ろ、2,5−ジ−tert−アミルハイドロキノンであること
が判った。Comparative Example 1 The procedure of Example 1 was repeated, except that 2,5-di-tert-amylhydroquinone was used as a stabilizer for the adhesive. As a result, the foreign matter was found to exist after 180 days even though there was no foreign matter after the pellicle cleaning. When this foreign substance was collected and its infrared absorption spectrum was measured, it was found to be 2,5-di-tert-amylhydroquinone.
第１図、第２図はペリクルをマスク基板に装着した状態
を示す断面図である。1 and 2 are cross-sectional views showing a state in which a pellicle is mounted on a mask substrate.
Claims (1)
び他方にマスク基板装着用の粘接着剤層が設けられてな
るペリクルにおいて、ペリクルを構成する部材に含まれ
る安定剤として、常温、常圧下で昇華もしくは蒸発する
物質を含まない安定剤を使用してなることを特徴とする
ペリクル。1. A pellicle in which a transparent pellicle film is provided on one side of a pellicle frame and a tacky adhesive layer for mounting a mask substrate on the other side of the pellicle frame. A pellicle comprising a stabilizer that does not contain a substance that sublimes or evaporates under pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20796486A JPH0772793B2 (en) | 1986-09-05 | 1986-09-05 | Pellicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20796486A JPH0772793B2 (en) | 1986-09-05 | 1986-09-05 | Pellicle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6364048A JPS6364048A (en) | 1988-03-22 |
| JPH0772793B2 true JPH0772793B2 (en) | 1995-08-02 |
Family
ID=16548438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20796486A Expired - Lifetime JPH0772793B2 (en) | 1986-09-05 | 1986-09-05 | Pellicle |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0772793B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2231175A1 (en) * | 1996-07-17 | 1998-01-22 | Mitsui Chemicals, Incorporated | Mask protective device |
| WO1998035270A1 (en) * | 1997-02-10 | 1998-08-13 | Mitsui Chemicals, Inc. | Method for sticking a pellicle on an article to be protected, pellicle-protected articles obtained by the method, pellicle for ultraviolet rays, and case for pellicles |
| JP2009063740A (en) * | 2007-09-05 | 2009-03-26 | Shin Etsu Chem Co Ltd | Pellicle frame |
| JP5391689B2 (en) * | 2008-12-26 | 2014-01-15 | 凸版印刷株式会社 | HAZE generation prediction substrate and HAZE generation prediction method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4255216A (en) | 1980-01-14 | 1981-03-10 | International Business Machines Corporation | Pellicle ring removal method and tool |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4453828A (en) * | 1981-12-02 | 1984-06-12 | Advanced Semiconductor Products, Inc. | Apparatus and methods for measuring the optical thickness and index of refraction of thin, optical membranes |
-
1986
- 1986-09-05 JP JP20796486A patent/JPH0772793B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4255216A (en) | 1980-01-14 | 1981-03-10 | International Business Machines Corporation | Pellicle ring removal method and tool |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6364048A (en) | 1988-03-22 |
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| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |