JPH0774759B2 - Method for manufacturing pyroelectric linear array infrared detection element - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a pyroelectric linear array infrared detecting element which can be used for measuring atmospheric components, measuring temperature distribution, monitoring crime and disaster prevention in the field of infrared measurement. is there.

[0002]

2. Description of the Related Art In recent years, in addition to a single element, an infrared detecting element has been actively developed in a linear array type in which elements are linearly arranged or in a two-dimensional type in which elements are arranged in a plane. There is.

A conventional method for manufacturing a pyroelectric linear array infrared detecting element will be described below. FIG. 3 shows the structure of a conventional pyroelectric linear array infrared detection element. In FIG. 3, 1 is a pyroelectric element plate, 2 is a light receiving electrode, 3
Is a bonding pad, 4 is a reflective electrode, 5 is a lead wire for taking out signals, 7 is a groove for separating elements, 8 is a ceramic element support base, 11 is a conductive adhesive, and 12 is a receiving surface of a common electrode. .

The manufacturing method of the conventional pyroelectric linear array infrared detecting element having the above-described structure will be described below.

In order to manufacture a pyroelectric linear array infrared detector, in the case of a lead titanate-based ceramic pyroelectric material,
After mechanically processing into a thin plate to form a pyroelectric element plate 1, a light receiving electrode 2 also serving as an infrared ray absorbing member on one surface and a reflecting electrode 4 also serving as an infrared ray reflecting member on the opposite surface are vapor-deposited. Install using. Further, after the pad portion (aluminum or gold) 3 for taking out the lead wire 5 for taking out the signal by bonding is formed by vapor deposition on the side of the electrode also serving as infrared ray absorption, the sensitivity due to the diffusion of the absorbed infrared ray, that is, heat In order to minimize the decrease in the temperature, the element support base 8 is hollowed at a position corresponding to the infrared light receiving surface, and an insulating adhesive is used on the light receiving electrode side, and the opposite electrode side is taken out as a common electrode. The adhesive 11 is used to adhere and fix it on the receiving surface of the common electrode. After that, separation processing is performed by forming grooves 7 for element separation in the required number of elements. (For example, JP-A-56-7739)

[0006]

However, in the above-mentioned conventional structure, since the conductive adhesive is used for extracting the lead on the side of the common ground electrode, the signal is extracted due to the incomplete electrical conduction. However, there are problems such as an increase in noise due to the generation of an element that cannot be processed, the fact that an ohmic contact does not occur even when a signal is obtained, and the conductive adhesive deteriorates due to aging.

The present invention solves the above-mentioned problems of the prior art. Signals are completely taken out from all of the pyroelectric elements arranged in a large number, and the change with time in a bad environment (particularly in high temperature) is prevented. It is an object of the present invention to provide a method for manufacturing a pyroelectric linear array infrared detection element that can withstand even the above.

[0008]

In order to achieve this object, the present invention provides a pyroelectric element plate formed of a pyroelectric element material.
The process of preparing and receiving light on one side of the pyroelectric element plate
The step of forming a pole and the other side of the pyroelectric element plate
Forming a light emitting electrode, and forming a first bond on the light receiving electrode.
Forming a bonding pad, and forming a first pad on the reflective electrode.
Forming the second bonding pad, and
N pieces (N is 2
Each of the above (integer) lead wires extending in the first direction.
Before the first bonding step
Note One lead wire on the second bonding pad
While extending in a second direction that is substantially orthogonal to the first direction,
Second bonding process for bonding N locations at equal intervals
And a space that can substantially accommodate the one lead wire.
The pyroelectric element plate is mounted on a supporting table having the reflecting electrode side.
The step of adhering and fixing, and the pyroelectric element plate that has been adhered and fixed
Each has a lead wire on the side of the first bonding pad.
The lead wire on the second bonding pad side is a bond
The received light so that it is divided into N pyroelectric elements
Punch the pyroelectric element plate from the electrode side until cut into the support base.
And a separate processing step for separate processing, wherein the one lead
The line is in contact with the separation processing means used in the separation processing step.
So that there is no bonding
Method for manufacturing pyroelectric linear array infrared detectors
Is the law. Also, the second bonding process is
N lead wires at approximately equal intervals on the pad.
Each of them is bonded, and the second bonder is attached to the support base.
Each lead wire bonded in the bonding process can be taken out.
A space is provided, and a bond is formed in the second bonding process.
Each of the assembled lead wires is used in the separation process.
Each of them is extended in the first direction so that the separating means does not come into contact with each other.
It may be.

[0009]

With the above structure, the present invention makes it possible to take out a signal by bonding from the common ground electrode of all necessary elements, and it is possible to eliminate the occurrence of an element from which a signal cannot be obtained or an element with high noise. .

[0010]

(Embodiment 1) A first embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a structural diagram of a pyroelectric infrared detector according to the first embodiment of the present invention. First, the lead titanate pyroelectric element material is polished to a thickness of 30 μm, and then 1.5 × 2 m
A rectangular pyroelectric element plate 1 of m is formed. Then, a thin film is formed by vapor deposition with nichrome as the light receiving electrode 2 on one surface of the pyroelectric element plate 1 with an area resistance of 400Ω and on the other surface of the reflecting electrode 4 with an area resistance of 50Ω. afterwards,
Aluminum is formed on one end of each of the nichrome thin films on both surfaces as a bonding pad 3 for taking out a lead wire by vapor deposition to have a width of 0.5 mm and a thickness of 1 μm. Reflection electrode side 4 using the processed plate of the pyroelectric element plate as a common electrode
To the metal plate using electron wax, and the lead wire 6 on the common electrode side (gold, diameter 30 μm)
Are formed by bonding in the element pitch direction (perpendicular to the electrode direction). At this time, the bonding pitch is adjusted according to the pitch between the elements of 0.4 mm, and the length of the lead wire is adjusted so as to fit within the space (width of 0.2 mm) provided in the element support base. After that, the pyroelectric element plate is peeled off from the metal plate, the electron wax is dissolved and washed with toluene, the central portion is hollowed out, and further, an L-shaped groove 9 is formed on one of the long sides so that the lead wire of the common electrode is set. The epoxy-based insulating adhesive is used to bond and fix the ceramic support 8 on the surface. Separation of the pyroelectric element plate was performed using a dicer, and the element was separated into five elements with a groove width of about 20 μm and a pitch of 0.4 mm. Similarly to the common electrode, the lead wire 5 of each element is taken out by bonding a gold wire.

In this way, the lead wire can be taken out from the common electrode side located on the lower surface by bonding, and after bonding the pyroelectric element plate with a conductive adhesive to separate the pyroelectric element plate, all the elements become the light receiving elements. It is possible to eliminate defects such as that the device does not work, or noise is generated even if it works.

(Embodiment 2) FIG. 2 shows a second embodiment of the present invention. The method of processing the pyroelectric element material and the method of forming the electrodes are the same as those in the first embodiment, but the lead wire 5 for taking out the signal from the bonding pad 3 which becomes the common electrode 4 is taken out in parallel with the direction of the element separation processing. In this method, it is necessary to take out the common electrode lead wires 6 of the common electrode 4 by the number of elements, but the common electrode lead wires 6 are cut during the element separation process by the dicer required in the first embodiment. Since it is not necessary to make a slack in the common electrode lead wire in order to escape from this, the bonding work is simplified. In this case, in order to take out the lead wire 6 for the common electrode, the groove 10 of the ceramic element support base is formed on the ceramics support base 8 in parallel between the electrodes with a depth and width equal to or larger than the diameter of the lead wire for the common electrode. Groove 10 of ceramic element support base
The pitch is determined according to the pitch between elements. The subsequent processing method is the same as in the first embodiment.

[0014]

As described above, the present invention is based on the second bond
One lead wire on the bonding pad
The separation processing means is displaced to the side of the support so that it does not come into contact.
The direction of arrangement of each pyroelectric element formed by separation processing
While extending, bond at approximately equal intervals and then
On a support having a space that can substantially accommodate the lead wires of
Either fix the pyroelectric element plate on the reflective electrode side with adhesive, or
Separately process each lead wire on the second bonding pad
Make sure that the separation processing means used in the process do not touch each other.
While extending in the direction of 1, each of the
After the wiring, there is a space where each lead wire can be taken out.
Pyroelectric element plate is bonded and fixed on the scraped support by the reflective electrode side
By separating and processing, it is possible to eliminate the occurrence of elements that can not take out signals, which occurred when using a conventional conductive adhesive, and that even if a signal is obtained, it is not ohmic contact or conductive adhesion It is possible to realize an excellent method for manufacturing a pyroelectric linear array infrared detection element that can eliminate the drawback that noise increases due to deterioration due to aging of the agent.

[Brief description of drawings]

FIG. 1A is a plan view of a pyroelectric linear array infrared detection element according to a first embodiment of the present invention. FIG. 1B is a sectional view of the pyroelectric linear array infrared detection element. Sectional view of array infrared detector

FIG. 2A is a plan view of a pyroelectric linear array infrared detection element according to a second embodiment of the present invention. FIG. 2B is a sectional view of the pyroelectric linear array infrared detection element. Sectional view of array infrared detector

3A is a plan view of a conventional pyroelectric linear array infrared detection element, FIG. 3B is a sectional view of the same pyroelectric linear array infrared detection element, and FIG. 3C is a sectional view of the same pyroelectric linear array infrared detection element.

[Explanation of symbols]

 1 Pyroelectric element plate 2 Light receiving electrode 3 Bonding electrode 4 Reflective electrode 5 Signal extraction lead wire 6 Common electrode lead wire 7 Groove for separating elements 8 Ceramic element support base 9 L-shaped groove of ceramic element support base 10 Groove of ceramic element support base 11 Conductive adhesive 12 Common electrode receiving surface

Claims (2)

[Claims] 1. A pyroelectric element plate formed from a pyroelectric element material.
And the step of receiving light on one surface of the pyroelectric element plate.
Step of forming electrodes, and on the other surface of the pyroelectric element plate
Forming a reflective electrode, and forming a first void on the light receiving electrode.
Forming a bonding pad, and
Forming a second bonding pad, and
N pads on the bonding pad at approximately equal intervals (where N is
2 or more) lead wires each extending in the first direction
First bonding step for bonding in the same manner,
Place one lead on the second bonding pad.
While extending in a second direction that is substantially orthogonal to the first direction
Second bonding for N bonding at approximately equal intervals
Process and space for substantially accommodating the one lead wire
The pyroelectric element plate on the support plate having
And the step of adhering and fixing the same, and the pyroelectric element plate adhered and fixed
Each has a lead wire on the side of the first bonding pad.
The lead wire on the second bonding pad side is a bond
The receiving unit is divided so that it is divided into N pieces of pyroelectric elements that are loaded.
The pyroelectric element plate from the photoelectrode side to the notch in the support
And a separation processing step for separating the
The separation wire is connected to the separation processing means used in the separation processing step.
To prevent it from being displaced toward the side of the support base.
Method of manufacturing a pyroelectric linear array infrared detector is grayed. 2. A second bonding step comprises a second bonding step.
N lead wires at approximately equal intervals on the pad.
Each of them is bonded, and the second bonder is attached to the support base.
Each lead wire bonded in the bonding process can be taken out.
A space is provided, and a bond is formed in the second bonding process.
Each of the assembled lead wires is used in the separation process.
Each of them is extended in the first direction so that the separating means does not come into contact with each other.
The method for manufacturing a pyroelectric linear array infrared detection element according to claim 1 .