JPH0777252B2 - Lead frame for semiconductor device - Google Patents
Lead frame for semiconductor deviceInfo
- Publication number
- JPH0777252B2 JPH0777252B2 JP61296255A JP29625586A JPH0777252B2 JP H0777252 B2 JPH0777252 B2 JP H0777252B2 JP 61296255 A JP61296255 A JP 61296255A JP 29625586 A JP29625586 A JP 29625586A JP H0777252 B2 JPH0777252 B2 JP H0777252B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lead frame
- island portion
- plating
- island
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、半導体装置用リードフレームに係り、特に
その半導体装置用リードフレームのアイランド部の形状
に関するものである。The present invention relates to a lead frame for a semiconductor device, and more particularly to the shape of an island portion of the lead frame for a semiconductor device.
第４図は従来の半導体装置用リードフレームの平面図で
あり、図において、１は半導体素子が載置されるアイラ
ンド部、２はこのアイランド部１を支持する吊りリー
ド、４は部分メッキエリアである。FIG. 4 is a plan view of a conventional lead frame for a semiconductor device, in which 1 is an island portion on which a semiconductor element is mounted, 2 is a suspension lead for supporting the island portion 1, and 4 is a partial plating area. is there.
従来の半導体装置用リードフレームは以上のように構成
されているので、この半導体装置用リードフレームに部
分メッキを施す場合、部分メッキの治工具によってアイ
ランド部１が傾き、アイランド部１の側面あるいは裏面
に、余分なメッキが付着するなどの問題点があった。Since the conventional semiconductor device lead frame is configured as described above, when partial plating is applied to this semiconductor device lead frame, the island portion 1 is inclined by the jig for partial plating, and the side surface or the back surface of the island portion 1 is inclined. However, there was a problem that extra plating was attached.
この発明は上記のような問題点を解消するためになされ
たもので、半導体装置用リードフレームの部分メッキ時
の治工具によるアイランド部の傾きを防止できるととも
に、アイランド部の側面あるいは裏面に余分なメッキが
付着することを防止できる半導体装置用リードフレーム
を得ることを目的とする。The present invention has been made to solve the above problems, and can prevent the island portion from tilting due to a jig and tool during partial plating of a semiconductor device lead frame, and also can prevent the side surface or the back surface of the island portion from being excessive. An object of the present invention is to obtain a lead frame for a semiconductor device that can prevent plating from adhering to it.
〔問題点を解決するための手段〕 この発明に係る半導体装置用リードフレームは、半導体
装置用リードフレームのアイランド部に、吊りリードの
反対側から突出して、部分メッキエリアの外側まで導出
された突出部を設けたものである。[Means for Solving the Problems] A lead frame for a semiconductor device according to the present invention has a protrusion projecting from an opposite side of a suspension lead to an island portion of the lead frame for a semiconductor device and extending to the outside of a partial plating area. Parts are provided.
この発明における半導体装置用リードフレームは、半導
体装置用リードフレームのアイランド部に突出部を設け
ることにより、部分メッキ時での治工具によるアイラン
ド部の傾きを防止でき、かつアイランド部の側面あるい
は裏面に余分なメッキが付着することなく、部分メッキ
を施すことができる。The semiconductor device lead frame according to the present invention can prevent the island portion from tilting due to a jig during partial plating by providing the island portion of the semiconductor device lead frame with a protrusion, and the side surface or the back surface of the island portion can be prevented. Partial plating can be performed without extra plating.
第１図はこの発明の一実施例を示す半導体装置用リード
フレームの平面図であり、図中第４図と同一符号は同一
又は相当部分であるので説明は省略する。１はアイラン
ド部、２はこのアイランド部１を片側で支持する吊りリ
ード、３はアイランド部１から吊りリード２とは反対側
の周辺より突出し、かつ部分メッキエリア４より外側に
導出された突出部である。FIG. 1 is a plan view of a semiconductor device lead frame showing an embodiment of the present invention. In the figure, the same reference numerals as those in FIG. Reference numeral 1 is an island portion, 2 is a suspension lead that supports the island portion 1 on one side, and 3 is a protrusion portion that protrudes from the periphery of the island portion 1 on the opposite side to the suspension lead 2 and is led out from the partial plating area 4. Is.
次に動作について説明する。メッキエリア４のみを残し
て、図示しないメッキマスクを覆い、半導体装置用リー
ドフレームに部分メッキを施す。この場合メッキエリア
は突出部３の内側に設定されているため、メッキマスク
によって突出部３を押さえるので、アイランド１は傾か
ず、又アイランド部の側面または裏面に余分なメッキが
付着しない。Next, the operation will be described. Partial plating is applied to the lead frame for a semiconductor device by covering a plating mask (not shown) while leaving only the plating area 4. In this case, since the plating area is set inside the protruding portion 3, the protruding portion 3 is pressed by the plating mask, so that the island 1 does not tilt, and excess plating does not adhere to the side surface or the back surface of the island portion.
なお上記実施例では、アイランド部１の中央から突き出
た１本の突出部３を設けたものを示したが、これは第２
図、第３図に示すように２本設けてもよく、その位置及
び数は任意である。In addition, in the above-mentioned embodiment, the one protruding portion 3 protruding from the center of the island portion 1 is provided, but this is the second
Two pieces may be provided as shown in FIGS. 3 and, and the position and the number thereof are arbitrary.
以上のようにこの発明によれば、半導体装置用リードフ
レームのアイランド部に、これを支持する吊りリードと
は反対側の周辺より突出し、かつ部分メッキエリアの外
側まで導出された突出部を設けたので、極めて簡単な構
成にて、部分メッキ時での治工具によるアイランド部の
傾きが防止でき、またアイランド部の側面または裏面に
余分なメッキが付着しないので、高品質の半導体装置用
リードフレームが得られる効果がある。As described above, according to the present invention, the island portion of the semiconductor device lead frame is provided with the projecting portion projecting from the periphery opposite to the suspension lead supporting the semiconductor device and extending to the outside of the partial plating area. Therefore, with an extremely simple structure, the tilt of the island part due to the jigs and tools during partial plating can be prevented, and since extra plating does not adhere to the side surface or back surface of the island part, a high quality lead frame for semiconductor devices can be obtained. There is an effect to be obtained.
第１図はこの発明の一実施例による半導体装置用リード
フレームを示す平面図、第２図、第３図はこの発明の他
の実施例による半導体装置用リードフレームを示す平面
図、第４図は従来の半導体装置用リードフレームの平面
図である。 図中、１はアイランド部、２は吊りリード、３は突出
部、４は部分メッキエリアである。 尚、図中同一符号は同一又は相当部分を示す。1 is a plan view showing a lead frame for a semiconductor device according to an embodiment of the present invention, FIG. 2 and FIG. 3 are plan views showing a lead frame for a semiconductor device according to another embodiment of the present invention, and FIG. FIG. 6 is a plan view of a conventional lead frame for a semiconductor device. In the figure, 1 is an island portion, 2 is a suspension lead, 3 is a protruding portion, and 4 is a partial plating area. The same reference numerals in the drawings indicate the same or corresponding parts.
Claims (1)
のアイランド部を片側で支持する吊りリードとを備えた
半導体装置用リードフレームであって、前記アイランド
部の、前記吊りリードと反対側の周辺から突出し、かつ
部分メッキエリアの外側まで導出された突出部を設けた
ことを特徴とする半導体装置用リードフレーム。1. A lead frame for a semiconductor device, comprising: an island portion on which a semiconductor element is mounted; and a suspension lead that supports the island portion on one side, wherein the island portion is provided on the side opposite to the suspension lead. A lead frame for a semiconductor device, which is provided with a projecting portion projecting from the periphery and extending to the outside of the partial plating area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61296255A JPH0777252B2 (en) | 1986-12-11 | 1986-12-11 | Lead frame for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61296255A JPH0777252B2 (en) | 1986-12-11 | 1986-12-11 | Lead frame for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63148668A JPS63148668A (en) | 1988-06-21 |
| JPH0777252B2 true JPH0777252B2 (en) | 1995-08-16 |
Family
ID=17831203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61296255A Expired - Fee Related JPH0777252B2 (en) | 1986-12-11 | 1986-12-11 | Lead frame for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0777252B2 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5149884Y2 (en) * | 1973-03-19 | 1976-12-01 | ||
| JPS556130Y2 (en) * | 1975-07-08 | 1980-02-12 | ||
| JPS53135574A (en) * | 1977-05-02 | 1978-11-27 | Hitachi Ltd | Lead frame |
| JPS59119751A (en) * | 1982-12-25 | 1984-07-11 | Rohm Co Ltd | Semiconductor device |
| JPS60154649A (en) * | 1984-01-25 | 1985-08-14 | Hitachi Ltd | Lead frame and manufacture thereof |
| JPS60260142A (en) * | 1984-06-06 | 1985-12-23 | Shinko Electric Ind Co Ltd | Lead frame |
| JPS61116864A (en) * | 1984-11-12 | 1986-06-04 | Mitsubishi Electric Corp | Lead frame |
-
1986
- 1986-12-11 JP JP61296255A patent/JPH0777252B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63148668A (en) | 1988-06-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| LAPS | Cancellation because of no payment of annual fees |