JPH0777270B2 - Infrared detector - Google Patents
Infrared detectorInfo
- Publication number
- JPH0777270B2 JPH0777270B2 JP4344609A JP34460992A JPH0777270B2 JP H0777270 B2 JPH0777270 B2 JP H0777270B2 JP 4344609 A JP4344609 A JP 4344609A JP 34460992 A JP34460992 A JP 34460992A JP H0777270 B2 JPH0777270 B2 JP H0777270B2
- Authority
- JP
- Japan
- Prior art keywords
- superlattice
- inas
- band
- infrared
- conduction band
- Prior art date
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- Expired - Lifetime
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Description
【発明の詳細な説明】Detailed Description of the Invention
【0001】[0001]
【産業上の利用分野】本発明は、赤外線検出器に関す
る。FIELD OF THE INVENTION This invention relates to infrared detectors.
【0002】[0002]
【従来の技術】赤外イメージセンサ材料としては、従来
からHgTeとCdTeの混晶であるHgCdTeが主
として用いられてきた。これは、HgCdTeの光電変
換効率が高いこと、またHgTe−CdTe系が全率固
溶であるため、HgTeとCdTeの組成比を変えるこ
とによって広い範囲で検出する赤外線波長を設定できる
利点があることなどの理由による。2. Description of the Related Art HgCdTe, which is a mixed crystal of HgTe and CdTe, has been mainly used as an infrared image sensor material. This is because the photoelectric conversion efficiency of HgCdTe is high, and because the HgTe-CdTe system is a solid solution at all rates, there is an advantage that the infrared wavelength to be detected in a wide range can be set by changing the composition ratio of HgTe and CdTe. Etc.
【0003】しかしながら、HgCdTeには、大面積
高均一のウェハが得られにくい,機械的強度が低い,主
にHg原子の拡散及び抜け出しによる熱的不安定さなど
の問題がある。そのため、ウェハの強度や熱的安定さが
HgCdTeに比べて高いIII−V族化合物半導体の
タイプII超格子を用いた赤外センサが提案又は試作さ
れている。However, HgCdTe has problems that it is difficult to obtain a large-area and highly-uniform wafer, its mechanical strength is low, and thermal instability is caused mainly by the diffusion and escape of Hg atoms. Therefore, an infrared sensor using a type II superlattice of a III-V group compound semiconductor, in which the strength and thermal stability of the wafer are higher than that of HgCdTe, has been proposed or prototyped.
【0004】たとえば、Applied Physic
s Letters(アプライド・フィジックス・レタ
ーズ)Vol,52,1581(1988)に開示され
たInSb/InAsSb系歪超格子や、特開昭62−
85476号公報に開示されたInAs/GaSb系超
格子などがある。前者は、格子歪によってタイプIIに
したInSb/InAsSb系歪超格子のp/i/n構
造を作り、超格子成長軸方向にバイアス電圧をかけてフ
ォトダイオードとして動作させるものである。格子歪に
より、InSb−InAsSb間の空間間接遷移エネル
ギーギャップは、InAsSbのバンドギャップより小
さくなるので、InAsSbよりも長波長の赤外線を検
出することができる。後者は、InAs/GaSb系タ
イプII超格子を、InAsの電子井戸に局在した電子
とGaSbの正孔井戸に局在した重い正孔からなる電気
双極子との直列接続として考えたものである。超格子成
長方向にパルス的に赤外光を入射すると、GaSb正孔
井戸−InAs電子井戸間で空間間接遷移による電荷移
動が起こり、超格子成長軸方向に瞬間的に起電力を生ず
るから、超格子を上下から挾むように超格子成長面に平
行に取り付けられた一対の電極によってこれを検出す
る。For example, Applied Physic
s Letters (Applied Physics Letters) Vol, 52, 1581 (1988) and strained InSb / InAsSb strain superlattice, and JP-A-62-1
There is an InAs / GaSb-based superlattice disclosed in Japanese Patent No. 85476. The former is to form a p / i / n structure of an InSb / InAsSb strained superlattice which is type II by lattice strain, and applies a bias voltage in the superlattice growth axis direction to operate as a photodiode. Due to the lattice strain, the spatial indirect transition energy gap between InSb and InAsSb is smaller than the band gap of InAsSb, and thus infrared rays having a longer wavelength than InAsSb can be detected. In the latter, the InAs / GaSb type II superlattice is considered as a series connection of electrons localized in the InAs electron well and electric dipoles of heavy holes localized in the GaSb hole well. . When infrared light is incident in a pulse in the superlattice growth direction, charge transfer occurs due to a spatial indirect transition between the GaSb hole well and the InAs electron well, and an electromotive force is instantaneously generated in the superlattice growth axis direction. This is detected by a pair of electrodes mounted parallel to the superlattice growth surface so as to sandwich the lattice from above and below.
【0005】[0005]
【発明が解決しようとする課題】ところで、InSb/
InAsSb系は、格子歪を保ったまま超格子成長する
のは技術的に容易でなく、従って生産性も高くない。一
方、InAs/GaSb系はMBE成長によって比較的
容易に超格子構造を得ることができるが、先に延べた赤
外線検出器は、パルス赤外光を検出するためのものであ
って、連続して赤外光を検出するイメージセンサとして
用いることはできない。超格子成長面に平行に取り付け
られた一対の電極からInAs/GaSb系超格子成長
軸に沿ってバイアス電流を印加し、光伝導型赤外線検出
器として動作させることが考えられるが、この場合、次
のような不都合が起こる。By the way, InSb /
In the InAsSb system, it is technically not easy to grow the superlattice while maintaining the lattice strain, and therefore the productivity is not high. On the other hand, the InAs / GaSb system can obtain a superlattice structure relatively easily by MBE growth, but the infrared detector extended earlier is for detecting pulsed infrared light and is continuously used. It cannot be used as an image sensor for detecting infrared light. It is considered that a bias current is applied from a pair of electrodes mounted parallel to the superlattice growth surface along the InAs / GaSb superlattice growth axis to operate as a photoconductive infrared detector. In this case, Such inconvenience occurs.
【0006】まず、GaSbの価電子帯頂上がInAs
の伝導帯下端よりも上にあるので、超格子周期が大きく
なると、次第に半金属状態に近づき暗電流の増加を招
く。これを防ぐには、InAs,GaSb各層の厚さを
薄くして伝導帯サブバンド準位を上げ、価電子帯サブバ
ンド準位を下げてやればよい。しかし、伝導帯及び価電
子帯サブバンド準位を変化させると、検出可能な赤外線
の波長も変化するから、超格子各層の厚さの制御だけ
で、暗電流と検出赤外線波長を同時に制御するのは難し
い。InAs/GaSbの厚さが薄い場合(特開昭62
−85476号公報の例ではInAs/GaSb=3n
m/5nm)には、特に困難であり、再現性よく量産す
るには無理がある。First, the top of the valence band of GaSb is InAs.
Since it is above the lower end of the conduction band, the superlattice period gradually increases, and the dark current gradually approaches the semimetal state, which causes an increase in dark current. In order to prevent this, the thickness of each layer of InAs and GaSb may be reduced to raise the conduction band subband level and lower the valence band subband level. However, when the conduction band and valence band sub-band levels are changed, the wavelength of infrared light that can be detected also changes. Therefore, by controlling the thickness of each layer of the superlattice, the dark current and the infrared wavelength of detection can be controlled simultaneously. Is difficult When the thickness of InAs / GaSb is thin (Japanese Patent Application Laid-Open No. 62-62160)
In the example of Japanese Patent Laid-Open No. 85476, InAs / GaSb = 3n
m / 5 nm) is particularly difficult, and it is impossible to mass-produce with good reproducibility.
【0007】また、超格子成長面に平行に電極を取り付
ける形式では、超格子成長軸に沿ってバイアス電流を流
すことになるが、InAs/GaSb間の伝導帯バンド
オフセットが約0.9eVあり、事実上電流を流すのは
難しい。さらに、InAs伝導帯の高い移動度を利用で
きず、応答速度が速くならないという不都合が生ずる。
加えて、受光面である超格子成長面に読み出し電極を取
り付けるため、受光面積が減少し、感度が低下するとい
う問題もある。Further, in the type in which the electrodes are mounted parallel to the superlattice growth surface, a bias current is caused to flow along the superlattice growth axis, but the conduction band band offset between InAs / GaSb is about 0.9 eV, In fact, it is difficult to pass an electric current. In addition, the high mobility of the InAs conduction band cannot be used, and the response speed does not increase.
In addition, since the read electrode is attached to the superlattice growth surface which is the light receiving surface, there is a problem that the light receiving area is reduced and the sensitivity is lowered.
【0008】本発明の目的は、III−V族化合物半導
体からなるAlXGa1-XSb/InAs(x>0.3)
超格子を用い、AlXGa1-XSb/InAs(x>0.
3)超格子端面に電極を取り付け、超格子面と平行にバ
イアス電流を流すことによって、超格子構造を変化させ
なくとも、Al組成を変化させて検出赤外線波長を制御
することができ、かつInAs伝導帯の高い移動度によ
り高速応答が可能で、かつ受光面積が大きく感度の高い
赤外線検出器を提供することにある。An object of the present invention is to form Al X Ga 1-X Sb / InAs (x> 0.3) composed of a III-V group compound semiconductor.
Using a superlattice, Al x Ga 1-x Sb / InAs (x> 0.
3) By attaching an electrode to the end face of the superlattice and flowing a bias current in parallel with the superlattice face, the detected infrared wavelength can be controlled by changing the Al composition without changing the superlattice structure. An object of the present invention is to provide an infrared detector capable of high-speed response due to the high mobility of the conduction band and having a large light receiving area and high sensitivity.
【0009】[0009]
【課題を解決するための手段】前記目的を達成するた
め、本発明の赤外線検出器は、メサ構造と、一対の電極
とを有する赤外線検出器であって、メサ構造は、絶縁性
基板にエピタキシャル成長させたAlXGa1-XSb/I
nAs(x>0.3)超格子のメサ構造であり、一対の
電極は、前記メサ構造の側面に取付けられ、メサ構造の
超格子面方向にバイアス電流を印加するものである。In order to achieve the above object, an infrared detector of the present invention is an infrared detector having a mesa structure and a pair of electrodes, wherein the mesa structure is epitaxially grown on an insulating substrate. Al X Ga 1-X Sb / I
The mesa structure is an nAs (x> 0.3) superlattice, and the pair of electrodes is attached to the side surface of the mesa structure and applies a bias current in the superlattice plane direction of the mesa structure.
【0010】また、タイプII超格子であるInAs/
AlXGa1-XSb超格子のAlXGa1-XSb価電子帯サ
ブバンドからInAs伝導帯サブバンドへの空間間接遷
移により赤外線の検出を行うものである。InAs / which is a type II superlattice
Infrared radiation is detected by the spatial indirect transition from the Al X Ga 1-X Sb valence band subband to the InAs conduction band subband of the Al X Ga 1-X Sb superlattice.
【0011】[0011]
【作用】このような構造にすることによって、第一に、
AlSb/InAs系超格子がAlSb価電子帯上端か
らInAs伝導帯下端への230meVの空間間接遷移
エネルギーギャップをもち、GaSb/InAs系超格
子がGaSb価電子帯上端からInAs伝導帯下端への
−150meVの空間間接遷移エネルギーギャップをも
つことから、Al組成を変化させることによって、超格
子周期が十分長い場合、0から230meVの範囲の空
間間接遷移エネルギーギャップをもつ超格子を作製する
ことができる(ただし、超格子周期が短い場合は空間間
接遷移エネルギーギャップの上限は230meVより大
きくなる)。[Operation] By adopting such a structure, firstly,
The AlSb / InAs superlattice has a spatial indirect transition energy gap of 230 meV from the top of the AlSb valence band to the bottom of the InAs conduction band, and the GaSb / InAs superlattice has -150 meV from the top of the GaSb valence band to the bottom of the InAs conduction band. Since it has a spatial indirect transition energy gap of, by changing the Al composition, a superlattice having a spatial indirect transition energy gap in the range of 0 to 230 meV can be produced when the superlattice period is sufficiently long (however, , The upper limit of the spatial indirect transition energy gap is larger than 230 meV when the superlattice period is short).
【0012】したがって、GaSb/InAs系超格子
がGaSb価電子帯上端からInAs伝導帯下端への負
の空間間接遷移エネルギーギャップをもつことからく
る、超格子周期を小さな値の範囲で制御しなければなら
ないという制限が緩和される。Therefore, the superlattice period must be controlled within a small range because the GaSb / InAs superlattice has a negative spatial indirect transition energy gap from the upper end of the GaSb valence band to the lower end of the InAs conduction band. The restriction that it does not happen is relaxed.
【0013】図1に超格子構造をAlXGa1-XSb/I
nAs=5nm/10nmとした場合の、伝導帯,軽い
正孔帯及び重い正孔帯各サブバンドの基底準位間の差を
組成xに対して計算した結果を示す。図1において、h
h1−e1が重い正孔−伝導帯間の空間間接遷移エネルギ
ーギャップを、1h1−e1が軽い正孔−伝導帯間の空間
間接遷移エネルギーギャップを示している。図1からわ
かるように、超格子周期、より正確にはAlXGa1-XS
b,InAs各層の厚さを変化させることなく、Al組
成を変化させることによって、検出赤外線波長を制御す
ることができる。Al組成が小さくAlXGa1-XSb/
InAs超格子系が半金属状態に近づくと、赤外線検出
器として用いた場合の暗電流が増加するので、暗電流の
増加を防ぐために、AlXGa1-XSbの重い正孔帯サブ
バンド基底準位からInAs伝導帯サブバンド基底準位
へのエネルギーギャップの下限を100meVとする
と、許容されるAl組成xの範囲はx>0.3となる。FIG. 1 shows a superlattice structure of Al X Ga 1-X Sb / I.
The results of calculating the difference between the ground states of the conduction band, the light hole band, and the heavy hole band subbands with respect to the composition x when nAs = 5 nm / 10 nm are shown. In FIG. 1, h
h 1 -e 1 indicates the space indirect transition energy gap between the heavy hole and the conduction band, and 1 h 1 -e 1 indicates the space indirect transition energy gap between the light hole and the conduction band. As can be seen from FIG. 1, the superlattice period, or more accurately, Al X Ga 1-X S
The detected infrared wavelength can be controlled by changing the Al composition without changing the thickness of each of the b and InAs layers. Small Al composition, Al X Ga 1-X Sb /
When the InAs superlattice system approaches a semi-metallic state, the dark current when used as an infrared detector increases. Therefore, in order to prevent the dark current from increasing, the heavy hole band subband basis of Al x Ga 1 -x Sb is used. When the lower limit of the energy gap from the level to the InAs conduction band subband ground level is 100 meV, the allowable Al composition x range is x> 0.3.
【0014】第二に、本発明の構造の赤外線検出器は超
格子面と平行にバイアス電流を印加できるように取り付
けられた一対の電極から電圧変化を読み出す形式である
ため、パルス状の赤外光だけでなく連続赤外光を検出す
ることができ、赤外イメージセンサに適している。また
このような構造にすることによって、InAs伝導帯の
高い移動度を利用できるので、応答の高速な赤外線検出
器が得られる。Secondly, since the infrared detector having the structure of the present invention is of a type in which a voltage change is read from a pair of electrodes attached so that a bias current can be applied in parallel with the superlattice plane, a pulsed infrared ray is detected. It can detect not only light but continuous infrared light, and is suitable for infrared image sensors. Further, with such a structure, the high mobility of the InAs conduction band can be utilized, so that an infrared detector with a fast response can be obtained.
【0015】第三に、バイアス電流印加及び信号読み出
し電極は、エピタキシャル成長させたAlXGa1-XSb
/InAs超格子のメサ構造の側面に取り付けられてい
るので、赤外光入射面である超格子面の遮蔽は最小限に
抑えられ、高感度の赤外線検出器が得られる。Thirdly, the bias current application and signal readout electrodes are epitaxially grown Al X Ga 1 -X Sb.
Since the / InAs superlattice is attached to the side surface of the mesa structure, shielding of the superlattice surface, which is the infrared light incident surface, is minimized, and a highly sensitive infrared detector can be obtained.
【0016】[0016]
【実施例】以下に本発明の実施例を図を用いながら説明
する。図2に示すように、Al0.5Ga0.5Sb 5nm
/InAs 10nm超格子3は絶縁性GaAs基板1
上に厚さ1μmのGaSbバッファー層2を介して15
0周期エピタキシャル成長させられる。この超格子層3
は図2に示すように、メサ型に加工され、メサの側面に
一対のAu電極4が取り付けられる。Embodiments of the present invention will be described below with reference to the drawings. As shown in FIG. 2, Al 0.5 Ga 0.5 Sb 5 nm
/ InAs 10nm superlattice 3 is an insulating GaAs substrate 1
15 through the GaSb buffer layer 2 having a thickness of 1 μm
Epitaxial growth is performed for 0 period. This superlattice layer 3
2, is processed into a mesa shape, and a pair of Au electrodes 4 are attached to the side surfaces of the mesa.
【0017】赤外線を検出する際には、電極4の両端か
らAl0.5Ga0.5Sb 5nm/InAs 10nm超
格子3の層方向にバイアス電流を印加しておけば、赤外
光の照射によって発生したキャリアによって電極4の両
端に電圧変化が生ずるから、これを読み取る。When detecting infrared rays, if a bias current is applied from both ends of the electrode 4 in the layer direction of the Al 0.5 Ga 0.5 Sb 5 nm / InAs 10 nm superlattice 3, the carriers generated by the irradiation of infrared light will be generated. As a result, a voltage change occurs across the electrode 4, which is read.
【0018】図2の超格子構造に対応するサブバンド準
位を図3に示す。Al組成x=0.5では、InAsの
伝導帯下端はAl0.5Ga0.5Sbの価電子帯上端よりも
55meVだけ上にあり、周期の十分大きな超格子に対
して55meVの空間間接遷移エネルギーギャップをも
つ。図2の例では、超格子周期が15nmと比較的短い
ため、伝導帯,重い正孔帯及び軽い正孔帯は、図3に示
すようにサブバンドを形成し、各サブバンドの基底準位
は、伝導帯についてはもとの伝導帯下端よりも上に、正
孔帯についてはもとの価電子帯上端よりも下に位置す
る。図3では伝導帯及び正孔帯について、それぞれ基底
準位と第1励起準位に対応する許容帯を斜線で示してい
る。e1,e2がそれぞれ伝導帯サブバンドの基底準位及
び第1励起準位を、hh1,hh2がそれぞれ重い正孔帯
サブバンドの基底準位及び第1励起準位を、1h1,1
h2がそれぞれ軽い正孔帯サブバンドの基底準位及び第
1励起準位を表す。hh1とhh2は幅が狭く、斜線を描
けないので、実線のみで示した。EC及びEVは、それぞ
れ伝導帯下端及び価電子帯上端を示す。図3から、重い
正孔帯のサブバンド幅が非常に狭く、価電子帯波動関数
との重なりが小さいのに対して、軽い正孔帯では、サブ
バンド幅が広く、価電子帯波動関数との重なりが大きい
ことがわかる。したがって、図2の赤外線検出器は、e
1−1h1=265meVのエネルギーに対応するカット
オフ波長4.7μmの赤外線検出器として動作する。Subband levels corresponding to the superlattice structure of FIG. 2 are shown in FIG. At the Al composition x = 0.5, the lower end of the conduction band of InAs is 55 meV above the upper end of the valence band of Al 0.5 Ga 0.5 Sb, and a spatial indirect transition energy gap of 55 meV for a superlattice with a sufficiently large period. Hold. In the example of FIG. 2, since the superlattice period is 15 nm, which is relatively short, the conduction band, the heavy hole band, and the light hole band form subbands as shown in FIG. Is located above the bottom of the original conduction band for the conduction band and below the top of the original valence band for the hole band. In FIG. 3, for the conduction band and the hole band, the permissible bands corresponding to the ground level and the first excitation level are shown by hatching. e 1 and e 2 are the ground level and the first excitation level of the conduction band subband, and hh 1 and hh 2 are the ground level and the first excitation level of the heavy hole band subband, respectively, 1h 1 , 1
h 2 represents the ground level and the first excitation level of the light hole band subband, respectively. Since hh 1 and hh 2 are narrow in width and cannot draw diagonal lines, they are shown only by solid lines. E C and E V indicate the bottom of the conduction band and the top of the valence band, respectively. From FIG. 3, it can be seen that the heavy hole band has a very narrow subband width and little overlap with the valence band wavefunction, whereas the light hole band has a wide subband width and has a valence band wavefunction. It can be seen that there is a large overlap. Therefore, the infrared detector of FIG.
It operates as an infrared detector with a cut-off wavelength of 4.7 μm corresponding to an energy of 1 −1 h 1 = 265 meV.
【0019】以上の実施例では、超格子構造をAl0.5
Ga0.5Sb 5nm/InAs10nmとしたが、A
l組成xはx=0.5に限るものではなく、x(>0.
3)の値を変えることによって赤外線検出器のカットオ
フ波長を制御することができる。また超格子周期もAl
XGa1-XSb 5nm/InAs 10nmに限るもの
ではなく、Al組成xを決めた上でAlXGa1-XSb層
及びInAs層の厚さを変えて赤外線検出器のカットオ
フ波長を変化させることもできる。In the above embodiments, the superlattice structure is made of Al 0.5.
Ga 0.5 Sb 5 nm / InAs 10 nm was used.
The l composition x is not limited to x = 0.5, but x (> 0.
The cut-off wavelength of the infrared detector can be controlled by changing the value of 3). Also, the superlattice period is Al
Not limited to X Ga 1-X Sb 5 nm / InAs 10 nm, but change the cut-off wavelength of the infrared detector by changing the thickness of the Al X Ga 1-X Sb layer and InAs layer after determining the Al composition x. You can also let it.
【0020】[0020]
【発明の効果】以上説明したように本発明によれば、超
格子周期を変化させなくとも、Al組成を変化させて検
出赤外線波長を制御することができ、かつInAs伝導
帯の高い移動度により高速応答が可能で、かつ受光面積
が大きく感度の高い赤外線検出器が得られる。As described above, according to the present invention, the detected infrared wavelength can be controlled by changing the Al composition without changing the superlattice period, and the high mobility of the InAs conduction band can be obtained. An infrared detector capable of high-speed response and having a large light-receiving area and high sensitivity can be obtained.
【図1】超格子構造をAlXGa1-XSb/InAs=5
nm/10nmとした場合の、伝導帯,軽い正孔帯及び
重い正孔帯サブバンドの基底準位間の差をAl組成xに
対して計算した結果を示す図である。FIG. 1 shows a superlattice structure of Al x Ga 1 -x Sb / InAs = 5.
It is a figure which shows the result of having calculated with respect to Al composition x the difference between the ground levels of a conduction band, a light hole band, and a heavy hole band subband in the case of nm / 10 nm.
【図2】本発明の実施例を示す図である。FIG. 2 is a diagram showing an example of the present invention.
【図3】図2のAl0.5Ga0.5Sb/InAs超格子に
対応するサブバンド図である。FIG. 3 is a subband diagram corresponding to the Al 0.5 Ga 0.5 Sb / InAs superlattice of FIG.
1 絶縁性GaAs基板 2 GaSbバッファー層 3 Al0.5Ga0.5Sb/InAs超格子 4 Au電極 hh1−e1 重い正孔−伝導帯間の空間間接遷移エネル
ギーギャップ 1h1−e1 軽い正孔−伝導帯間の空間間接遷移エネル
ギーギャップ EC 伝導帯下端 EV 価電子帯上端 e1 伝導帯サブバンド基底準位 e2 伝導帯サブバンド第一励起準位 1h1 軽い正孔帯サブバンド基底準位 1h2 軽い正孔帯サブバンド第一励起準位 hh1 重い正孔帯サブバンド基底準位 hh2 重い正孔帯サブバンド第一励起準位1 Insulating GaAs substrate 2 GaSb buffer layer 3 Al 0.5 Ga 0.5 Sb / InAs superlattice 4 Au electrode hh 1 -e 1 Heavy hole-space indirect transition energy gap between conduction bands 1h 1 -e 1 Light hole-conduction Spatial indirect transition energy gap between bands E C bottom of conduction band E V top of valence band e 1 conduction band subband ground level e 2 conduction band subband first excitation level 1h 1 light hole band subband ground level 1h 2 light hole band subband first excitation level hh 1 heavy hole band subband ground level hh 2 heavy hole band subband first excitation level
Claims (2)
線検出器であって、 メサ構造は、絶縁性基板にエピタキシャル成長させたA
lXGa1-XSb/InAs(x>0.3)超格子のメサ
構造であり、 一対の電極は、前記メサ構造の側面に取付けられ、メサ
構造の超格子面方向にバイアス電流を印加するものであ
ることを特徴とする赤外線検出器。1. An infrared detector having a mesa structure and a pair of electrodes, wherein the mesa structure is epitaxially grown on an insulating substrate.
l X Ga 1-X Sb / InAs (x> 0.3) superlattice mesa structure, a pair of electrodes is attached to the side surface of the mesa structure, and a bias current is applied in the direction of the superlattice surface of the mesa structure. An infrared detector characterized in that
XGa1-XSb超格子のAlXGa1-XSb価電子帯サブバ
ンドからInAs伝導帯サブバンドへの空間間接遷移に
より赤外線の検出を行うことを特徴とする請求項1に記
載の赤外線検出器。2. A type II superlattice, InAs / Al.
The infrared ray according to claim 1, wherein the infrared ray is detected by a spatial indirect transition from the Al X Ga 1-X Sb valence band subband to the InAs conduction band subband of the X Ga 1-X Sb superlattice. Detector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4344609A JPH0777270B2 (en) | 1992-12-24 | 1992-12-24 | Infrared detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4344609A JPH0777270B2 (en) | 1992-12-24 | 1992-12-24 | Infrared detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06196745A JPH06196745A (en) | 1994-07-15 |
| JPH0777270B2 true JPH0777270B2 (en) | 1995-08-16 |
Family
ID=18370595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4344609A Expired - Lifetime JPH0777270B2 (en) | 1992-12-24 | 1992-12-24 | Infrared detector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0777270B2 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI261934B (en) | 2003-09-09 | 2006-09-11 | Asahi Kasei Emd Corp | Infrared sensing IC, infrared sensor and method for producing the same |
| JP5260909B2 (en) * | 2007-07-23 | 2013-08-14 | 住友電気工業株式会社 | Light receiving device |
| WO2009101739A1 (en) * | 2008-02-12 | 2009-08-20 | Nec Corporation | Surface-emitting laser and method for manufacturing the same |
| WO2009101740A1 (en) * | 2008-02-12 | 2009-08-20 | Nec Corporation | Semiconductor light receiving element |
| US8373153B2 (en) * | 2009-05-26 | 2013-02-12 | University Of Seoul Industry Cooperation Foundation | Photodetectors |
| US8809834B2 (en) | 2009-07-06 | 2014-08-19 | University Of Seoul Industry Cooperation Foundation | Photodetector capable of detecting long wavelength radiation |
| JPWO2012046603A1 (en) * | 2010-10-06 | 2014-02-24 | 住友電気工業株式会社 | Light receiving element, optical sensor device, and method for manufacturing light receiving element |
| JP5606374B2 (en) * | 2011-03-29 | 2014-10-15 | 旭化成エレクトロニクス株式会社 | Method for producing compound semiconductor laminate for quantum infrared sensor and quantum infrared sensor |
| JP6660052B2 (en) * | 2016-02-24 | 2020-03-04 | 国立大学法人京都工芸繊維大学 | Optical switching element |
| CN113937176B (en) * | 2021-10-01 | 2024-04-30 | 苏州焜原光电有限公司 | InAs/AlxGa1-xSb slow-changing superlattice transition layer, InAs/GaSb barrier infrared detector with slow-changing transition layer and growth method |
-
1992
- 1992-12-24 JP JP4344609A patent/JPH0777270B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06196745A (en) | 1994-07-15 |
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