JPH0777311B2 - Electronic component lead straightening method and apparatus - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component lead straightening method and apparatus, and in particular, a potential component lead straightening component suitable for flat package electronic component lead straightening such as LSI. A method and its apparatus.

[Background of the Invention]

For the conventional lead straightening of electronic parts, see
As described in Japanese Patent Laid-Open No. 58-80900, there has been proposed a method in which a plurality of leads are mechanically sandwiched by a hide and oscillated to eliminate the elastic memory of the leads and correct the state to an appropriate state.

However, in a flat package type component such as an LSI, a plurality of leads for connecting a main body (sealing portion) 1 forming a circuit and a printed circuit board (not shown) as shown in FIGS. 2 and heat dissipation fin 3 for heat dissipation
And the lead 2 has a cross-sectional size of 0.2 mm × 0.1.
5 mm, the lead 2 has a hitch p of 0.508 mm, and the number of leads 2 on one side is about 40. Therefore, in order to securely connect the leads 2 to the printed circuit board, variations in the height direction of the leads 2 (below It is necessary to hold down Δh to 0.1 mm or less. This is called the float. However, if the tip of the lead 2 is swung while the both ends of the lead 2 are sandwiched by the mechanical guide as proposed above, the end lead of the main body 1 Unnecessary force may be applied to the glass 1'inserted between the root of the glass 2 and the glass 1 ', which may damage the glass 1', making it difficult to stably correct the lead 2.

[Object of the Invention]

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned conventional problems and provide a lead straightening method for an electronic component with less mechanical loss and a device therefor.

[Outline of Invention]

In order to achieve the above object, the present invention inserts and restrains the root portions of a plurality of leads protruding from both ends of a flat package type electronic component by an upper die movable with an elastic member for correction and a fixed lower die. , The tip of the lead is grasped by a lower die connected to an upper die spring member movable by an oscillating cylinder, and the upper tip of the oscillating tip is a fulcrum with the point of being restrained by the upper die for correction and the lower die. The mold and the lower mold are oscillated in the vertical direction to eliminate the elastic memory at the tip of the lead, and the position of the oscillating upper and lower dies is positioned at a predetermined position.

In addition, a root upper part of a plurality of leads protruding from both ends of the fracquet package type electronic component is inserted by an elastic member for correction and restrained by an upper mold and a fixed lower mold, and a swing for gripping the tip part of the lead. An upper die movable by a moving cylinder and a lower die connected to a spring member, and a swinging upper die and a lower die in a vertical direction with a point constrained by the correction upper die and the lower die as a fulcrum. And a means for positioning the position of the swinging upper and lower dies at a predetermined position.

Therefore, the floating Δh of the tip 2b of the lead 2 can be suppressed and corrected, and the breakage of the sealing glass 1'of the LSI body 1 can be prevented.

Example of Invention

1 to 5 showing an embodiment of the present invention will be described below.

1 is a sectional front view showing an electronic component lead straightening apparatus according to the present invention, FIG. 2 is a sectional side view of FIG. 1, FIG. 3 is a top view of FIG. 1, and FIG. FIG. 5 is a plan view taken along the line BB of FIG. 1, and FIG. 5 is a plan view taken along the line CC of FIG.

In the figure, reference numeral 8 is a rectangular base, and four guide bars 9 and two spring guide bars 10 are fixed in parallel to each other so as to project upward from the upper surface. The lower slide base 11 has a square shape, and the lower swinging die 6 is fixed to the upper surface thereof, and the base 8 is provided at the center thereof.
A through hole 11a is formed in which the upper part of the lower correction die 4 fixed at the center position of the upper surface of the above is freely movably moved in the vertical direction.
It is instructed to be freely fitted so as to be slidable in the vertical direction so that it is always pressed up and down via. 13 is a central slide base, and the central part is formed into a square shape, and the trapezoidal parts, which are formed so that the width becomes smaller as they go outward, are fixed to one body. A through hole 15a is formed at the center position of the upper part of the straightening upper die 5 facing the upper straightening lower die so as to be freely movable in the vertical direction. The spring guide 10 is slidably supported in the up-down direction so as to be constantly pressed upward via the spring 14 through the spring guide 10. Reference numeral 15 denotes an upper slide base, which is angular and is loosely fitted in the four guide bars 9 so as to be slidable in the vertical direction, and the correction upper die 5 is fixedly supported at the center of the lower surface. 16 is a plate and the above center slide base 13
Formed in the same shape as and connecting plates at both ends
It is fixed to one body via 17 and is loosely fitted in the above four guide bars 9 so as to be slidable in the vertical direction.
A spring 18, which is constantly pressed upward, is inserted between the spring 18 and 15. 19 is a pressurizing device such as a hydraulic place and is supported by a supporting mechanism (not shown), and the tip end of the piston rod 19a is fixedly fitted to the plate 16. Reference numeral 20 denotes two stopper bolts, which are fastened to the lower surface of the lower slide base 11 and fixed by a lock nut 21. A cylinder 22 is connected to a slide plate 24, which is fixedly supported on one end of the base 8 through a support plate 23, and the tip end of a piston rod 22a of which is horizontally slidably supported on the base 8. Then, the slide plate 24 is inserted between the base 8 and the lower end surface 20a of the head of the stopper bolt 20 and positioned at the vertical position of the lower correction die 4 via the stopper bolt 20 and the lower and lower slide bases 11. I'm trying to do it. An opening groove 4a for inserting the LSI body 1 is formed on the upper surface of the straightening lower die 4, and an opening for inserting the LSI body 1 and the radiation fin 3 is formed on the lower surface of the straightening upper die 5. The groove 5a is formed. The upper mold 5 for straightening has a mounting portion 5b of the upper slide base 15 formed in a large diameter, and a stepped surface 5c is formed between the mounting portion 5b and the tip small diameter portion 15a.

Since the lead straightening device for electronic parts according to the present invention is configured as described above, first, the operation of the pressure device 19 is stopped, and
Piston rod due to the resilience of the individual springs 12, 14, 18
When 19a is pushed up in the direction of the arrow D'and the plate 16, the connecting plate 17 and the middle slide base 13 are respectively raised from the positions shown in FIG. 1, the swinging upper die 7 rises and is separated from the correction lower die 6. At the same time, the central slide base 13 has a stepped surface 5c.
The upper straightening die 5 is lifted through the above to be separated from the lower straightening die 4.

In this state, the LSI main body 1 to be straightened is inserted into the opening groove 4a of the lower straightening plate 4 and positioned. In this case, the lower mold 6 for swinging
Is slightly pushed up by the elastic force of the spring 12, but most of the leads 2 of the LSI body 1 are installed in the opening groove 4a of the lower straightening die 4.

Then, the pressurizing device 19 is driven to push down the piston rod 19a in the direction of arrow D to lower the plate 16, the connecting plate 17 and the middle slide base 13, respectively.
Elastic force of the upper slide base 15 and straightening upper mold 5
Moves downward and inserts and restrains the root portion 2a of the lead 2 with the lower correction die 4. In this case, the lower die 6 for swinging is the spring 12
The tip end portion 2b of the lead 2 is slightly lifted upward because it is pushed upward by the elastic force of the lower straightening die 4.

After that, the piston rod 19 is driven by the driving of the pressurizing device 19.
When a is further pushed down in the direction of arrow D, the spring 18 bends and the middle slide base 13 descends, and at the same time the swinging upper die 7 also lowers and the tip of the lead 2 between the swinging lower die 6 and the lower swinging die 6.
Hold 2b and hit the elastic force of spring 12 to push it down.

Then, when the middle slide base 13 is lowered to a predetermined position, the driving of the pressure device 19 is temporarily stopped and the rod 19a is pushed up in the direction of the arrow D ', and the root portion 2a of the lead 2 is moved by the elastic force of the spring 18. It is restrained between the straightening upper die 5 and the straightening lower die 4, and at the same time, the spring 12 and the spring.
The elastic force of 14 lifts the tip 2b of the lead 2 slightly upward with the tip 2b inserted between the swing lower die 6 and the swing upper die 7.

Then, when the pressure device 19 is driven and the rod 19a is pushed down in the direction of the arrow D, the tip 2b of the lead 2 is pushed downward by the lower swing die 6 and the upper swing die 7.

In this way, when the tip end 2b of the lead 2 is oscillated in the vertical direction a predetermined number of times, the driving of the pressurizing device 19a is temporarily stopped, and the oscillating lower die 6 and the oscillating upper die 7 are positioned above, the cylinder 22 is driven to move the slide plate 24 in the lower direction 4 for swinging through the piston rod 22a and is inserted between the lower end face 20 of the head portion of the stopper bolt 20 and the base 8, and the lower slide base 11 is inserted. Since the upper and lower swing dies 6 and 7 are positioned in the vertical direction, the floating of the tips 2b of the leads 2 inserted in the dies 6 and 7 can be regulated to a constant level.

Then, when the driving of the pressurizing device 19 is stopped and the rod 19 is pushed up in the direction of the arrow D ', the elastic force of the spring 14 pushes the middle slide base 13 and the upper slide base 15 upward, so The mold 5 is separated from the correction lower mold 4, and at the same time, the swing upper mold 7 is separated from the swing lower mold 6. Also, due to the elastic force of the spring 12, the tip of the lead 2
2b is lifted and the root portion 2a of the lead 2 is lifted up from the opening groove 4a of the lower straightening die 4, so that the LSI 1 can be easily removed from the lower straightening die 4.

Therefore, the pressurizing device 19 is driven or stopped to operate the rod 19
The tip 2b of the lead 2 swings with the lower die 6 and the upper die for swinging while the root portion 2a of the lead 2 is restrained between the lower straightening die 4 and the upper straightening die 5 only by moving a vertically. The mold 7 can be swung by vertical movement and the slide plate 24 is moved to move the slide plate 24 to the lower end surface 20a of the head of the stopper bolt 20 and the base 8.
It is possible to regulate the correction of the lead 2 by inserting it between the lead wire and the lead wire.

〔The invention's effect〕

Since the present invention is as described above, it is possible to prevent breakage of the glass inserted between the end of the LSI body and the root of the lead when correcting the lead, and the lead is made to have a predetermined size. Since the correction can be performed, the floating of the leads can be reduced when the electronic component is mounted on the substrate, and the reliability of soldering can be improved.

[Brief description of drawings]

1 is a sectional front view showing an electronic component lead straightening apparatus according to the present invention, FIG. 2 is a sectional side view of FIG. 1, FIG. 3 is a top view of FIG. 1, and FIG. BB arrow plane view, FIG. 5 is a CC arrow plane view of FIG. 1, FIG. 6 is a perspective view of a flat package type electronic component (LSI) to which the present invention is applied, and FIG. FIG. 6 is an enlarged perspective view of a portion A of FIG. 6, FIG. 8 is a cross-sectional view of FIG. 7, and FIG. 9 is a cross-sectional view showing the principle of an electronic component lead straightening apparatus according to the present invention. 1 ... LSI main body, 2 ... Lead, 3 ... Radiating fin, 4 ... Straightening lower die, 5 ... Straightening upper die, 6 ... Swing lower die, 7 ... Swing upper die, 8 ...... Base, 9,10 ...... Guide bar, 11 ...... Lower slide base, 12,14,18 ...... Spring, 13 ...... Middle slide base, 15 ...... Upper slide base, 16 ...... Plate, 17 ...... Connecting plate, 19 ... Pressure device, 20 ... Stopper bolt, 21 ... Lock nut, 22 ... Cylinder, 23 ... Support plate, 24 ... Slide plate.

Claims (2)

[Claims] 1. A flat package type electronic component has a plurality of leads extending from both ends, and the roots of the plurality of leads are restrained by interposing and restraining an upper mold and a fixed lower mold which are movable by elastic members for correction, and are movable by a rocking cylinder. The tip of the lead is grasped by the upper die and the lower die connected to the elastic member, and the swing upper die and the lower die are moved in the vertical direction with the point constrained by the correction upper die and the lower die as a fulcrum. A method for straightening a lead of an electronic component, which comprises rocking to erase the elastic memory of the tip of the lead, and positioning the position of the rocking upper and lower dies in a predetermined manner. 2. An upper die and a fixed lower die, which are movable by an elastic member for correction, which inserts and restrains the root portions of a plurality of leads protruding from both ends of a flat package type electronic component, and the leading end portions of the leads. An upper die movable by a rocking cylinder to be gripped, a lower die connected to an elastic member, and a point constrained by the correction upper die and the lower die as a fulcrum, and the swinging upper die and the lower die are vertically moved. An electronic component lead straightening device comprising: a swinging unit; and a unit for positioning the position of the swinging upper and lower dies at a predetermined position.