JPH0777319B2 - Electronic component mounting device - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component inspection mounting for mounting an electronic component (leadless component) at a predetermined position on a printed circuit board.

2. Description of the Related Art In recent years, as leadless electronic components (chip components) have become widespread, there has been a demand for speeding up and reliability of a device that forms an electronic circuit by combining these electronic components.

An example of the above-described conventional component inspection apparatus will be described below with reference to the drawings. 5, 6, and 7 relate to a conventional electronic component inspection apparatus. In FIG. 5, 11 is a rotary table, which rotates at a constant angle with the spindle 7 as a fulcrum. A suction nozzle 4 is incorporated in the guide 3 so as to be vertically movable. A feeding tape 7 feeds the parts 6 at a constant pitch. Reference numeral 1 denotes a first table, which moves the electronic components 6 in blocks in the direction of arrow X. Reference numeral 9 denotes a second table, on which the substrate 8 can be placed and operated in the directions of arrows XY. With such a configuration, first, the electronic component 6 is sucked by operating the suction nozzle 4 at the suction position, moved to the mounting position on the rotary table 11, and the suction nozzle 4 is operated on the substrate to mount the electronic component 6. Let 6 and 7 are sectional views of the head portion of FIG. In FIG. 6, 10 is a spring, which pushes the suction nozzle 4 upward with a constant force.
Reference numeral 21 is a rotation stop pin, and 23 is a stopper, which stops the suction nozzle 4 at a constant height. 20 is a presser block which moves the suction nozzle up and down at the suction position and the mounting position. 13 is the exhaust air pressure path, mechanical valve
Connected to 14. Reference numeral 12 is a vacuum pneumatic path, which is connected to the dispersion joint 1. Tubes 15,17 and 19 are connected to pneumatic units. 18 is a vacuum switch, which can send an electric signal by the differential pressure of air pressure. In FIG. 7, reference numeral 24 is a switching piston, which is incorporated in the mechanical valve 14, and by operating this switching piston 24, the vacuum pneumatic pressure path 12 is switched to the exhaust pneumatic pressure path 13. At the same time, the reverse operation is possible.

The operation of the electronic component inspection apparatus configured as described above will be described below. At the suction position, the mechanical valve 145 switches the air pressure path to the vacuum air pressure path 12, and the suction nozzle 4 is lowered by the holding block 20.
The electronic component 6 is sucked and moved to the mounting position on the rotary table 11. Then, the mechanical block 14 switches the pneumatic pressure path from the vacuum pneumatic pressure path 12 to the exhaust pneumatic pressure path 13 immediately before mounting it on the board 8 by lowering it by the presser block 20 and mounting the electronic component 6 on the board 8. Put it on. At that time, in order to confirm whether the electronic component 6 was mounted on the substrate 8, the vacuum switch 18 was inspected by the difference in air pressure between vacuum and exhaust.

Problems to be Solved by the Invention However, in the above-mentioned configuration, when a suction error at the suction position, a drop during movement to the mounting position on the rotary table 11, a malfunction of the mechanical valve, etc. occur, the mounting position Even if electronic parts are not installed at the location set in step 1, the installed signal will be the vacuum switch.
Since it was sent from 18, it was not reliable. Even if the substrate 8 is mounted on the substrate 8, it cannot be confirmed whether the substrate 8 is mounted at the set position or not, so that there is a drawback that it is necessary to confirm it again in a subsequent step. In view of the above problem of the present invention, the substrate 8 is mounted at the mounting position. The electronic component itself mounted is inspected to improve reliability.

Means for Solving the Problems In order to solve the above problems, the present invention provides an electronic component mounting apparatus in which a plurality of suction heads capable of sucking electronic components are arranged around a rotatable table. When the electronic component sucked by the suction head is mounted on the substrate at a predetermined position, the position where the component on the substrate is mounted at the predetermined position is irradiated with light and the reflected light is received. An inspection means for inspecting the presence or absence of the electronic component after mounting is configured separately from the suction head.

Action The action of this technical means is as follows. In other words, the electronic components picked up by the suction nozzle are directly detected by the multiple optical detectors installed at the mounting position to confirm the electronic components mounted on the board. Disappears. As a result, reliability is improved in mounting.

Example Hereinafter, an example of the present invention will be described with reference to the accompanying drawings. In FIGS. 1 to 3, reference numeral 30 denotes a rotary table, which rotates at a constant angle as a fulcrum with 29 spindles. 31 is a guide,
The rotary table 30 is divided and attached. 37 is a suction nozzle, which is attached to the guide 31. 44 is a rotation stop pin, 49
Is a stopper that stops the suction nozzle 37 at a constant height. Reference numeral 38 is a spring, which pushes the suction nozzle 37 upward with a constant force. 43 is a holding block,
In the suction position and the mounting position, the suction nozzle 37
Up and down. 28 is the exhaust air pressure path, mechanical valve 46
Has been succeeded by. 26 is a vacuum pneumatic path, which is connected to the dispersion joint 48. 47 and 45 are tubes, each of which is connected to a pneumatic unit. In FIG. 4, a switching piston similar to that shown at 24 in FIG. 7 is incorporated in the mechanical valve 46, and the vacuum pneumatic path 26 is switched to the exhaust pneumatic path 28 by the operation of this switching piston. . At the same time, the reverse operation is possible. In FIGS. 1 and 2, reference numeral 35 denotes a first optical detector, which is attached to the bracket 33 by bolts 36. 32 is a fixed block, and the bracket 33 with the bolt 34
Is fixed. 50 is a second optical detector, which is attached to the bracket with bolts in the same manner as the first optical detector 35. Reference numeral 41 denotes an electronic component, which is sucked by the suction nozzle 37 from the suction position and is moved to the mounting position by the rotary table 30. Reference numeral 42 denotes a substrate on which the electronic component 41 sucked by the suction nozzle 37 is mounted on the upper surface. A light projecting axis 39 projects light onto an electronic component mounted on the substrate 42. Reference numeral 39 reflects the light projected on the electronic component mounted on the light emitting axis and is received by the light receiving axis of 40 to detect the electronic component.

The structure of the electronic component inspection device will be described in more detail with reference to FIGS. 1 to 4. FIG. 3 is a front view of the electronic component suction device, and FIG. 4 is a plan view of FIG. In these figures, from the suction position, the suction nozzle 37
Then, the sucked electronic component 41 is moved to the mounting position on the rotary table 30. Then, at the mounting position, the suction nozzle 37 is lowered, and at the same time, the mechanical valve 46
, Switch from vacuum air pressure path 26 to exhaust air pressure path 28,
The electronic component 41 is mounted on the upper surface of the substrate 42. Immediately after mounting, the first optical detector is operated to check whether or not the electronic component 41 is mounted, and the second optical detector is also operated at the same time.
The position of the electronic component 41 is detected, and these signals are fed back to the subsequent process.

In this embodiment, the presence / absence of the electronic component is inspected, but it is also possible to inspect the front and back of the component. Furthermore, several optical axes are applied to the component at the same time, and the displacement, presence / absence, and front / back of the component after mounting are confirmed. You can also inspect.

As described above, the present invention is one unit of the electronic component device, and at the mounting position, immediately after mounting the electronic component mounted on the substrate, the optical detector causes light to be projected onto the mounting point, An optical detector that detects the presence / absence of an electronic component and detects a positional shift is used, and the electronic component mounted on the board can be mounted with high quality.

[Brief description of drawings]

FIG. 1 is a front view of essential parts of an electronic component detecting device according to an embodiment of the present invention, FIG. 2 is a plan view of the same, FIG. 3 is a front sectional view of essential parts of an electronic component suction device, and FIG. A sectional view, FIG. 5 is a perspective view of a conventional electronic component adsorption device, FIG. 6 is a front sectional view of the electronic component adsorption device, and FIG. 7 is a plan sectional view of the same. 30 …… Rotary table, 35 …… First optical detector, 37 ……
Adsorption nozzle, 41 ... Electronic parts, 42 ... Substrate, 50 ... Second
Optical detector.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shintoru Seno 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-60-175483 (JP, A)

Claims (2)

[Claims] 1. An electronic component mounting apparatus comprising a plurality of suction heads capable of sucking electronic components around a rotatable table, wherein the electronic components sucked by the suction heads are placed on a substrate at a predetermined position. When mounting on top, an inspection means for inspecting the presence or absence of the electronic component after mounting by irradiating light to the position where the component on the board is mounted at the predetermined position and receiving the reflected light is provided. An electronic component mounting device configured separately from the suction head. 2. The electronic component mounting apparatus according to claim 1, wherein the inspection means is provided so as to irradiate several points of light at the same time to inspect the positional deviation, presence / absence, and front / back of the electronic component after mounting. .