JPH0777665B2 - Soldering method and soldering device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a soldering method and a soldering device for dropping solder in a molten state onto a work to perform soldering.

(Prior Art) As a method for automatically attaching solder only to a specific place on a work such as a printed wiring board, there has been proposed a method using a soldering iron in the shape of a serpent (Japanese Patent Publication Sho).
46-34209). This is to supply a fixed amount of thread solder to the soldering iron-like soldering iron, melt it, and drop it onto a work through a hole provided at the bottom of this soldering iron. However, in this case, since the soldering time of the soldering iron becomes uneven, the thread solder may fall onto the work before it is sufficiently melted and soldering may be incomplete, resulting in poor soldering reliability. There was a problem.

In addition, a needle valve is provided on the bottom of the crucible-shaped soldering iron, and the solder is melted in advance in this crucible-shaped soldering iron.
It is also proposed that a predetermined amount of solder is dropped onto a work by opening and closing a needle valve (Actual No. 50-77427). However, in this case, it was impossible to control the minute amount of solder dropped due to the surface tension of the molten solder itself.

On the other hand, since the soldering iron becomes dirty due to the adhesion of tars and the like, it is necessary to regularly clean the iron tip. However, if the apparatus is stopped for this cleaning, the work efficiency will be significantly reduced.

Further, in the method in which the molten solder is dropped onto the work, if the preheating of the work is insufficient and the temperature is low, the compatibility between the solder and the work becomes poor, and there is a problem that a so-called sticking state is likely to occur.

(Object of the invention) The present invention has been made in view of such circumstances, and it is possible to improve the reliability of soldering by dropping a certain amount of solder heated and melted at an appropriate temperature onto a work. A first object of the present invention is to provide a soldering method capable of managing a small amount of solder and further improving the work efficiency without the need for cleaning the iron tip.

Further, the present invention provides a soldering method capable of improving the familiarity between the work and the solder, preventing the occurrence of incomplete soldering such as the state of the soldering, and further improving the reliability of the soldering. The second purpose.

A third object of the present invention is to provide a soldering device used directly for carrying out the first invention.

(Structure of the Invention) According to the present invention, the first object is to assemble a plurality of iron elements having at least a surface of a solder contact portion made of a solder repellent material, and to move upward between the iron element collecting portions. To form a solder melting part that opens and supplies a certain amount of solder pieces to the solder melting part from above, melts the solder pieces in the solder melting part and temporarily holds them, and then separates the plurality of iron elements from each other. Then, the molten solder is dropped onto the work to achieve the soldering, which is achieved by a soldering method.

The second object is achieved by adding a step of reheating the solder on the work by bringing a high temperature iron tip relatively close to the work after the dropping of the molten solder in the first invention.

Further, the third object is a soldering device for performing soldering by melting solder and dropping it on a work, and at least the surface of a solder contact portion is formed of a solder repellent material and opens upward in a gathered state thereof. A plurality of iron elements forming a solder melting section, a solder supply section for supplying a fixed amount of solder pieces from above to the solder melting section, and a soldering section for collecting the solder elements and supplying the solder pieces to the solder melting section. A soldering device, characterized in that the solder piece is melted, and then a plurality of iron elements are separated from each other and a molten solder is dropped onto a work.

(Embodiment) FIG. 1 is a perspective view of an embodiment of a soldering apparatus used in the soldering method of the present invention, FIG. 2 is a front view thereof, and FIG. 3 is a sectional view taken along line III-III of FIG. FIG. 4 is an operation explanatory view of the solder cutting section, and FIG. 5 is a conceptual explanatory view of the soldering method.

In these drawings, reference numeral 10 is a base, and on the base 10, a solder supply unit 12, a soldering unit 14, a work fixing base 16 are provided.
Is installed.

The solder supply unit 12 includes a movable table 18, a vertical wall 20 standing on the movable table 18, thread solder reels 22 and 22 rotatably attached to the side surface of the vertical wall 20, and the thread solder reels. A pair of feed rollers 28, 28 for feeding the yarn solder 24 supplied from 22 to the yarn solder cutting section 26. The movable table 18 is slidably held by guide rails 30 penetrating the vicinity of the left and right ends of the movable table 18, and the entire solder supply section 12 is movable forward and backward by an air cylinder 32. The feed rollers 28, 28 have guide grooves 28a, 28a for guiding the thread solder 24, and are driven by a motor 33. Reference numerals 34 and 36 are brackets provided with guide holes for guiding the thread solder 24 before and after the feed rollers 28, 28.

The solder cutting section 26 includes a cylindrical cutter 38 and a cylindrical holder 40 that slidably holds the cutter 38. The rear portion (left side in FIGS. 3 and 4) of the cutter 38 has a reduced diameter, and a piston 42 is attached to the end thereof. The piston 42 slides in an air cylinder 44 attached to the rear portion of the holder 40 in an airtight manner.

When the cutter 38 is in the retracted position (FIG. 4 (A)), the thread solder 24 is inserted into the through holes 48, 48 of the cutter 38 that communicate with the holes 46, 46 of the holder 40, and the cutter 38 is removed by the air cylinder 44. When moved to the forward position (FIG. 4 (B)), the thread solder 24 in the holes 48, 48 is cut. Then, the cut solder pieces are supplied to the soldering portion 14 through the other guide holes 50, 50 of the holder 40. When the cutter 38 moves from the retracted position to the advanced position, the piston 42 collides with the rear surface of the holder 40, and the impact causes the solder pieces in the holes 48, 48 to drop. It does not stop falling. A guide hole 50 below the hole 48 regulates the falling direction of the solder piece that falls due to impact. 52, 54
Is a pin and a guide groove for restricting the rotation of the cutter 38.

The solder cutting portion 26 configured as described above is attached to the stay 56 of the vertical wall 20 via the holder 40.

Reference numeral 58 denotes a stand of the soldered portion 14, which holds a bracket 62 movably up and down via a diaphragm 60 attached to the upper portion thereof. A left arm 64 is fixed to the bracket 62 so as to extend downward to the left, and a right arm 66 is pivotally attached so as to extend downward to the right. A plate-like trowel element 68a is attached to the lower end of the left arm 64 so as to extend obliquely downward to the right, and a lever element 68b is attached to the lower end of the right arm via a stay 70 so as to extend obliquely downward to the left. . Therefore, the both iron elements 68a and 68b face each other so as to gather at the lower ends thereof, and form a V-shaped iron 72 in a front view. Both iron elements 68a, 68b have a nichrome heater inside, and their surfaces are covered with a solder repellent material such as ceramic, fluororesin, stainless steel or the like.

The solder cutting section 26 faces the space surrounded by the left and right arms 64, 66 and the iron elements 68a, b, and the solder cutting section 26 is provided by the air cylinder 32 only when the solder piece is supplied.
Go up (see Figure 4). Solder cutting part 26 when moving forward
Each iron element 68 so that it is located directly below the guide holes 50, 50 of the
Two guide grooves 74 are provided in a and b, and these guide grooves 74 form a solder melting portion when the iron element 72 is assembled.

The opposing portions of the iron elements 68a and 68b have a slight gap such that molten solder does not drop even when they are assembled. Therefore, the opposing portions of both iron elements 68a and 68b will not collide and be damaged during assembly.

76 is an air cylinder attached to the bracket 62,
Pull the trowel element 68b with the right arm 66 to open the trowel 72. Reference numeral 78 is a stopper for adjusting the opening amount of the iron 72. Since the center of rotation of the right arm 66 is deviated to the left from the facing portion of the iron elements 68a and 68b, when the iron 72 is opened, the iron element 68b moves upward and does not hit the work 86. Absent.

The work fixing base 16 is composed of a base 80 fixed to the base 10, a slider 82 removably mounted on the base 80, and a pair of leaf springs 84, 84, and the work 86 is a slider.
It is placed on the upper surface of 82 and is sandwiched by leaf springs 84 from the left and right.

This device is controlled by a control unit (not shown) as described below.

After fixing the work 86 to the work fixing base 26, the feed roller is driven to feed the thread solder 24 to the cutting portion 26, and the cup 38 is moved to bring the solder pieces 24, which have been cut to a certain size, on the iron 72 in the assembled (closed) state. Drop it on. The solder pieces 24 drop into the solder melting portion formed by the guide groove 74 of the iron 72 and are melted there and temporarily held. Since the holding period is constant, the melted solder 24A is always heated and melted at a constant and appropriate temperature. Further, since the iron elements 68a and 68b are made of the solder repellent material, the molten solder is present in the solder melting portion in a single spherical state due to the surface tension without adhering to the iron elements 68a and 68b (see FIG. 5 ( A)).

Next, the trowel 72 is opened by separating the trowel elements 68a and 68b, and the molten solder 24A is dropped on the work 86 (FIG. 8B). At this time, since the inner surface of the iron 72 is formed of the solder repellent material, the molten solder 24A moves onto the work 86 without remaining on the iron 72,
The amount of solder dropped can be controlled to be constant ((C) in the figure).

Next, push down the closed iron 72 with the diaphragm 60,
Approach or contact the solder 24A on the work (Fig. (D)). The soldered portions of the solder 24A and the work 86 are instantly heated by the iron 72 having a large amount of heat, and the re-melted solder 24A and the heated work 86 become compatible with each other. Immediately thereafter, the soldering can be completed by returning the iron 72 to the upper side ((E) in the same figure). Instead of lowering the iron 72, move the work 86 upward to
The 72 and the solder 24A may be brought close to or in contact with each other.

The tar that adheres to the inner surface of the iron 72 is
Burned away by the heat of. Therefore, the soldering iron 72 pulled up at the time of completion of soldering can immediately perform the next soldering work without cleaning.

In the above embodiment, since the two solder melting parts are provided,
Two sets of guide grooves 74 are provided in 72, but one set may be provided in the case of one point attachment, and the guide grooves may not be provided as long as molten solder can be held.

Further, the opening and closing of the iron 72 is not limited to the case where only one iron element is moved, and it goes without saying that both iron elements may be moved. In addition, 3 iron elements that form the iron
As described above, these may be assembled to form a solder-melted portion, and the present invention also includes such.

In the present embodiment, the iron element and the entire outer surface were made of ceramic, but it is sufficient if at least the solder melting portion and the portion that comes into contact with the solder during additional heating (FIG. 5 (D)) are covered with the solder repellent material. Is.

Note that the solder supplied to the iron is not limited to the thread solder cut to a fixed size, and ball solder, grain solder, or the like may be used as long as the quantitative property can be maintained. Although solder containing a resin is preferable, solder without a resin may be used, or a spray type resin may be used in combination.

(Effect of the Invention) As described above, in the first invention, a plurality of soldering iron elements formed of a solder repellent material are assembled into a solder melting portion, and a fixed amount of solder pieces supplied to the solder melting portion is used here. After being melted and temporarily held, it was dropped onto the work. Therefore, the solder can be always heated and melted at an appropriate temperature, the reliability of soldering is improved, and the management of a small amount of solder becomes easy. Furthermore, the work efficiency is improved without the need to clean the iron tip.

Further, in the second aspect of the invention, since the solder is dropped on the work and the trowel is approached to reheat the solder, the reliability of soldering can be further improved.

Further, according to the third invention, an apparatus directly used for implementing the first invention can be obtained.

[Brief description of drawings]

1 is a perspective view of an embodiment of a soldering apparatus used in the soldering method of the present invention, FIG. 2 is a front view thereof, FIG. 3 is a sectional view taken along the line III-III of FIG. 2, and FIG. FIG. 5 is an explanatory diagram of the operation of the solder cutting section, and FIG. 5 is a conceptual explanatory diagram of the soldering method. 12 …… Solder supply section, 14 …… Soldering section, 16 …… Work fixing table, 24,24A …… Solder, 26 …… Solder cutting section, 60
...... Diaphragm, 68a, 68b ...... Iron element, 74 ...... Guide groove, 76 ...... Air cylinder, 86 ...... Work piece.

Claims (3)

[Claims] 1. A plurality of iron elements having at least a surface of a solder contact portion formed of a solder repellent material are assembled to form a solder melting portion that opens upward between the assembly portions of these solder elements, and the solder melting is performed. By supplying a certain amount of solder pieces from above to the part, melting the solder pieces in the solder melting portion and temporarily holding the solder pieces, by separating the plurality of iron elements from each other and dropping the molten solder onto the work, A soldering method characterized by performing soldering. 2. A plurality of iron elements having at least a surface of a solder contact portion formed of a solder repellent material are gathered to form a solder melting portion which opens upward between the gathering portions of these iron elements, and the solder melting is performed. A certain amount of solder piece is supplied to the part from above, and the solder piece is melted in the solder melting part and temporarily held, and then the plurality of iron elements are separated from each other to allow the molten solder to drop onto the work, and thereafter, A soldering method, characterized in that the iron element is brought relatively close to the work and the solder on the work is reheated. 3. A soldering apparatus for performing soldering by melting solder and dripping it onto a work, wherein at least a surface of a solder contact portion is formed of a solder repellent material, and a solder melting portion which opens upward in a state of being aggregated with each other. A plurality of iron elements forming a solder, a solder supply section for supplying a fixed amount of solder pieces from above to the solder melting section, and a soldering section that collects the solder elements and supplies the solder pieces to the solder melting section. And a controller for separating the plurality of iron elements from each other and dropping the molten solder onto the work.