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JPH0778414B2 - Laser thickness gauge - Google Patents
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JPH0778414B2 - Laser thickness gauge - Google Patents

Laser thickness gauge

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Publication number
JPH0778414B2
JPH0778414B2 JP1255581A JP25558189A JPH0778414B2 JP H0778414 B2 JPH0778414 B2 JP H0778414B2 JP 1255581 A JP1255581 A JP 1255581A JP 25558189 A JP25558189 A JP 25558189A JP H0778414 B2 JPH0778414 B2 JP H0778414B2
Authority
JP
Japan
Prior art keywords
measured
light
laser
detection
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1255581A
Other languages
Japanese (ja)
Other versions
JPH03118407A (en
Inventor
憲司 松丸
敦郎 田沼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anritsu Corp
Original Assignee
Anritsu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anritsu Corp filed Critical Anritsu Corp
Priority to JP1255581A priority Critical patent/JPH0778414B2/en
Publication of JPH03118407A publication Critical patent/JPH03118407A/en
Publication of JPH0778414B2 publication Critical patent/JPH0778414B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、レーザ光の照射により反射する光の像の状態
から移動する被測定物の厚みを測定するレーザ厚み計に
関するものである。
TECHNICAL FIELD The present invention relates to a laser thickness meter for measuring the thickness of an object to be measured that moves from the state of an image of light reflected by laser light irradiation.

[従来の技術] 例えば、移動する板材等の被測定物の厚みを測定する場
合には、第3図に示すレーザ光を利用したレーザ変位計
が用いられていた。
[Prior Art] For example, when measuring the thickness of an object to be measured such as a moving plate material, a laser displacement meter using a laser beam shown in FIG. 3 has been used.

このレーザ変位計は、発光素子20、投光レンズ21、結像
レンズ22、ポジションセンサ23の内蔵された2つの検出
ヘッド24,25を備え、各検出ヘッド24,25は被測定物Wを
介して対向配置されており、発光素子20から出射された
光を投光レンズ21を介して被測定物Wに照射し、被測定
物Wから反射してくる光を結像レンズ22で結蔵させてポ
ジションセンサ23により検出し、この検出した光を各検
出ヘッド24,25毎に演算処理して、その結果から移動す
る被測定物Wの厚みを測定していた。
This laser displacement meter is provided with two detection heads 24 and 25 having a light emitting element 20, a light projecting lens 21, an imaging lens 22, and a position sensor 23 built in, and each detection head 24, 25 passes through an object to be measured W. The light emitted from the light emitting element 20 is applied to the object to be measured W through the light projecting lens 21, and the light reflected from the object to be measured W is stored in the imaging lens 22. The position sensor 23 detects the light, and the detected light is arithmetically processed for each of the detection heads 24 and 25, and the thickness of the moving object W to be measured is measured from the result.

[発明が解決しようとする課題] しかしながら、上述した従来のレーザ変位計は、同一に
構成される検出ヘッド24,25が被測定物Wを介して対向
配置されているので、被測定物Wとしてガラスのように
透光性を有する部材の厚みを測定する場合、一方の検出
ヘッド24の発光素子20(20a)から出射された光は被測
定物Wを透過して他方の検出ヘッド25の発光素子20(20
b)に導かれ、この発光素子20bは被測定物Wを透過して
きた光を検出し、この結果、発光素子20bから出射され
る光のパワーが低下して十分な光を被測定物Wに対して
照射することができず、誤差を招いて正確な厚み測定を
行なうことができなかった。
[Problems to be Solved by the Invention] However, in the above-described conventional laser displacement meter, since the detection heads 24 and 25 having the same structure are arranged to face each other with the object to be measured W interposed therebetween, When measuring the thickness of a translucent member such as glass, the light emitted from the light emitting element 20 (20a) of one detection head 24 passes through the object to be measured W and the other detection head 25 emits light. Element 20 (20
This light-emitting element 20b detects the light that has been transmitted through the object to be measured W, and as a result, the power of the light emitted from the light-emitting element 20b is reduced and sufficient light is transmitted to the object to be measured W. However, it was not possible to irradiate it, and an error was introduced, which made it impossible to perform accurate thickness measurement.

そこで、本発明は上述した問題点に鑑みてなされたもの
であって、その目的は、相手の発光素子からの光による
影響を受けずに誤差のない高精度な被測定物の厚み測定
が行なえるレーザ厚み計を提供することにある。
Therefore, the present invention has been made in view of the above-mentioned problems, and an object thereof is to perform highly accurate thickness measurement of an object to be measured without being affected by light from a light emitting element of a partner. The present invention is to provide a laser thickness gauge.

[課題を解決するための手段] 上記目的を達成するため、本発明によるレーザ厚み計
は、被測定物の測定面の法線に対して斜め方向からレー
ザ光を照射する投光系と、前記レーザ光の入射角に対し
て正反射の方向に配置された受光系とを備えた2組のレ
ーザ変位計の検出ヘッドを前記被測定物の両側に対向配
置し、該被測定物を前記検出ヘッドの間を通過させ、前
記各投光系より前記被測定物に対して同時に光を照射し
て被測定物の厚みを測定するレーザ厚み計において、 前記被測定物が透過性部材の場合で、その両側に対向す
る検出ヘッドの投光系及び受光系は、照射するレーザ光
の延長線上を除いた方向に配置され、かつ2組のレーザ
変位計の測定点が前記被測定物の測定面の同一法線上に
あることを特徴としている。
[Means for Solving the Problems] In order to achieve the above object, a laser thickness meter according to the present invention includes a projection system for irradiating a laser beam from an oblique direction with respect to a normal line of a measurement surface of an object to be measured, The detection heads of two sets of laser displacement meters, each of which has a light receiving system arranged in a direction of regular reflection with respect to the incident angle of the laser light, are arranged opposite to each other on both sides of the object to be measured, and the object to be measured is detected. In a laser thickness meter that passes between the heads and measures the thickness of the object to be measured by simultaneously irradiating the object to be measured from each of the light projecting systems, the object to be measured is a transparent member. The light-projecting system and the light-receiving system of the detection head, which are opposed to each other on both sides, are arranged in a direction excluding the extension line of the laser light to be irradiated, and the measurement points of two sets of laser displacement meters are the measurement planes of the object to be measured. It is characterized by being on the same normal line.

[作用] 被測定物の厚みを測定する際、各検出ヘッドの投光系か
らの光は、被測定物の測定面の法線上を測定点として、
この光の延長上で相手側の投光系からの光が重ならない
ように被測定物に対して照射される。そして、この光の
照射による被測定物からの反射光の検出結果に基づいて
被測定物の厚みが測定される。
[Operation] When measuring the thickness of the object to be measured, the light from the projection system of each detection head is measured on the normal line of the measuring surface of the object to be measured.
Due to the extension of this light, the light from the light projecting system on the other side is applied to the object to be measured so as not to overlap. Then, the thickness of the measured object is measured based on the detection result of the reflected light from the measured object due to the irradiation of the light.

[実施例] 第1図は本発明によるレーザ厚み計の一実施例を示す斜
視図、第2図はレーザ厚み計のブロック構成図である。
[Embodiment] FIG. 1 is a perspective view showing an embodiment of a laser thickness gauge according to the present invention, and FIG. 2 is a block diagram of the laser thickness gauge.

この実施例によるレーザ厚み計は、それぞれのレーザ変
位計1,2が検出系3,4を備えた検出ヘッド5,6、発光素子
ドライバ7、信号処理回路8を有し、各検出ヘッド5,6
共通に設けられた制御回路9、加算回路10とを備えて構
成され、各検出ヘッド5,6は各々の投受光面が直交した
状態で被測定物Wを介して対向配置されており、被測定
物Wに対し同時に光を照射して厚みの測定を行なってい
る。
In the laser thickness gauge according to this embodiment, each laser displacement gauge 1, 2 has a detection head 5, 6 having a detection system 3, 4, a light emitting element driver 7, and a signal processing circuit 8. 6
The detection heads 5 and 6 are arranged so as to face each other with the object to be measured W in a state in which their light emitting and receiving surfaces are orthogonal to each other. The measurement object W is irradiated with light at the same time to measure the thickness.

検出ヘッド5,6は一方のユニット5が被測定物Wの上面
の位置を検出し、他方のユニット6が被測定物Wの下面
の位置に検出している。各検出ヘッド5,6における検出
系3,4は発光素子3a,4a、投光レンズ3b,4b、結像レンズ3
c,4c、ポジションセンサ3d,4dから構成され、発光素子3
a,4aは所定波長の光を出射しており、投光レンズ3b,4b
は発光素子3a,4aからの光を集光して被測定物Wに照射
している。結像レンズ3c,4cは被測定物Wから反射して
くる光をポジションセンサ3d,4dの位置に結像させる。
ポジションセンサ3d,4dはこの結像した光を電気信号に
変換し検出信号として信号処理回路8に出力している。
なお、検出系3,4は、発光素子3a,4a、投光レンズ3b,4b
によって被測定物Wの測定面の法線に対して斜め方向か
らレーザ光を照射する投光系を構成し、レーザ光の入射
角に対して正反射の方向に配置された結像レンズ3c,4
c、ポジションセンサ3d,4dによって受光系を構成してい
る。これら投光系同士及び受光系同士は、第1図及び第
2図に示すように、同一光軸上に位置し、被測定物Wの
表面の法線上に測定点が位置するように被測定物Wの両
側に対向配置されている。
In the detection heads 5 and 6, one unit 5 detects the position of the upper surface of the measured object W, and the other unit 6 detects the position of the lower surface of the measured object W. The detection systems 3 and 4 in the detection heads 5 and 6 are light emitting elements 3a and 4a, light projecting lenses 3b and 4b, and an imaging lens 3
c, 4c, position sensors 3d, 4d, and light emitting element 3
a and 4a emit light of a predetermined wavelength, and the projection lenses 3b and 4b
Collects the light from the light emitting elements 3a and 4a and irradiates the object to be measured W. The imaging lenses 3c and 4c image the light reflected from the object W to be measured at the positions of the position sensors 3d and 4d.
The position sensors 3d and 4d convert the imaged light into an electric signal and output it as a detection signal to the signal processing circuit 8.
The detection systems 3 and 4 include light emitting elements 3a and 4a and light projecting lenses 3b and 4b.
An imaging lens 3c arranged in a direction of regular reflection with respect to the incident angle of the laser light, which constitutes a light projecting system for irradiating the laser light obliquely with respect to the normal to the measurement surface of the object to be measured W. Four
The position sensors 3d and 4d form a light receiving system. As shown in FIGS. 1 and 2, the light projecting systems and the light receiving systems are located on the same optical axis, and the measurement point is located on the normal line of the surface of the object W to be measured. The objects W are arranged so as to face each other on both sides.

ここで、被測定物Wの上面の位置を検出する検出ヘッド
5は、発光素子3aとポジションセンサ3dが形成する光路
L1が図中矢印Aで示す被測定物Wの進行方向と直交する
ように配置されている。また、被測定物Wの下面の位置
を検出する検出ヘッド6は、発光素子4aとポジションセ
ンサ4dが形成する光路L2が被測定物Wの進行方向と平行
に配置されている。すなわち、各検出ヘッド5,6の投受
光面5a,6aが互いに直交して被測定物Wの上下に配置さ
れており、各検出ヘッド5,6の光路L1,L2は互いに直交し
て相手側からの光が被測定物Wを介して入射されるのを
防止している。
Here, the detection head 5 for detecting the position of the upper surface of the object to be measured W has an optical path formed by the light emitting element 3a and the position sensor 3d.
L 1 is arranged so as to be orthogonal to the traveling direction of the object to be measured W indicated by arrow A in the figure. Further, in the detection head 6 for detecting the position of the lower surface of the object to be measured W, the optical path L 2 formed by the light emitting element 4a and the position sensor 4d is arranged parallel to the traveling direction of the object to be measured W. That is, the light emitting / receiving surfaces 5a, 6a of the respective detection heads 5, 6 are arranged above and below the object to be measured W orthogonal to each other, and the optical paths L 1 , L 2 of the respective detection heads 5, 6 are orthogonal to each other. The light from the other side is prevented from entering through the measured object W.

発光素子ドライバ7は制御回路9からの制御信号に基づ
いて発光素子3a,4aを駆動し、発光素子3a,4aより所定波
長の光を被測定物Wに向けて出射させている。
The light emitting element driver 7 drives the light emitting elements 3a and 4a based on a control signal from the control circuit 9, and causes the light emitting elements 3a and 4a to emit light of a predetermined wavelength toward the object to be measured W.

信号処理回路8はポジションセンサ3d,4dによって得ら
れる被測定物Wの光の像状態を示す検出信号から位置を
測定してその結果を加算回路10に出力しており、加算回
路10は各検出ヘッド5,6における信号処理回路8からの
位置データが揃った状態で2つのデータを加算して厚み
を演算してその結果を出力している。
The signal processing circuit 8 measures the position from the detection signal indicating the image state of the light of the object to be measured W obtained by the position sensors 3d and 4d, and outputs the result to the addition circuit 10, and the addition circuit 10 detects each detection. With the position data from the signal processing circuit 8 in the heads 5 and 6 aligned, two data are added to calculate the thickness and the result is output.

制御回路9は各検出ヘッド5,6における発光素子ドライ
バ7および信号処理回路8が同期駆動するべく制御信号
を出力している。
The control circuit 9 outputs a control signal for synchronously driving the light emitting element driver 7 and the signal processing circuit 8 in each of the detection heads 5 and 6.

次に、上記のように構成されるレーザ厚み計の動作につ
いて説明する。
Next, the operation of the laser thickness gauge configured as described above will be described.

被測定物Wの厚みlを測定する場合、まず、被測定物W
における上面の位置の検出については、被測定物Wの上
方に設けられた検出ヘッド6の発光素子ドライバ7aおよ
び信号処理回路8aに対し駆動の旨を示す制御信号が制御
回路9より出力されて稼動状態となる。このとき、被測
定物Wの下面の位置を検出する検出ヘッド5における発
光素子ドライバ7bおよび信号処理回路8bにも制御回路9
より駆動の旨を示す制御信号が出力されて稼動状態にあ
る。これにより、発光素子ドライバ7aが発光素子3aを駆
動すると、発光素子3aから所定波長の光が投光レンズ3b
を介して被測定物W側に照射される。この光の照射によ
り移動する被測定物Wからの反射光は結像レンズ3cでポ
ジションセンサ3dの位置に結像され、このポジションセ
ンサ3dで電気信号に変換され検出信号として信号処理回
路8aに出力される。
When measuring the thickness l of the measured object W, first, the measured object W
Regarding the detection of the position of the upper surface in the above, the control circuit 9 outputs a control signal indicating the driving to the light emitting element driver 7a and the signal processing circuit 8a of the detection head 6 provided above the object to be measured W to operate. It becomes a state. At this time, the light emitting element driver 7b and the signal processing circuit 8b in the detection head 5 for detecting the position of the lower surface of the object to be measured W are also controlled by the control circuit 9.
The control signal indicating the driving is output and the system is in the operating state. As a result, when the light emitting element driver 7a drives the light emitting element 3a, light having a predetermined wavelength is emitted from the light emitting element 3a.
It is irradiated to the measured object W side via. The reflected light from the object to be measured W that moves due to this irradiation of light is imaged at the position of the position sensor 3d by the imaging lens 3c, converted into an electric signal by this position sensor 3d, and output to the signal processing circuit 8a as a detection signal. To be done.

信号処理回路8aではポジションセンサ3dの被測定物Wの
光の像状態を示す検出信号から被測定物Wの上面位置を
測定してその結果を加算回路10に出力する。
The signal processing circuit 8a measures the upper surface position of the object to be measured W from the detection signal indicating the light image state of the object to be measured W of the position sensor 3d, and outputs the result to the adding circuit 10.

一方、被測定物Wにおける下面の位置の検出について
は、被測定物Wの下方に設けられた検出ヘッド6の発光
素子ドライバ7bおよび信号処理回路8bに対し駆動の旨を
示す制御信号が制御回路9より出力されて稼動状態とな
る。このとき、被測定物Wの上面の位置を検出した検出
ヘッド5における発光素子ドライバ7aおよび信号処理回
路8aにも制御回路9より駆動の旨を示す制御信号が出力
されて稼動状態にあり、被測定物に対して同時に光が照
射されることになるが、各検出ヘッド5,6の投受光面5a,
6aは互いに直交しているので、相手側からの光の影響を
受けて光のパワーを低下させるようなことはない。これ
以降は上述したように発光素子ドライバ7bが駆動されて
発光素子4aより被測定物Wに光が照射され、これによる
被測定物Wからの反射光をポジションセンサ4dが検出し
て信号処理回路8bに出力する。そして、信号出力回路8b
ではポジションセンサ4dの被測定物Wの光の像状態を示
す検出信号から被測定物Wの下面位置を測定してその結
果を加算回路10に出力する。さらに、加算回路10では各
検出ヘッド5,6による被測定物Wの上下面における位置
データを加算して厚みを演算し、その結果を表示出力し
ている。
On the other hand, regarding the detection of the position of the lower surface of the object to be measured W, a control signal indicating that the light emitting element driver 7b and the signal processing circuit 8b of the detection head 6 provided below the object to be measured W are driven by the control circuit. It is output from 9 and becomes an operating state. At this time, the control signal indicating the driving is output from the control circuit 9 to the light emitting element driver 7a and the signal processing circuit 8a in the detection head 5 which has detected the position of the upper surface of the object to be measured W and is in the operating state. Light will be irradiated to the measurement object at the same time, but the light emitting and receiving surfaces 5a of the detection heads 5 and 6,
Since 6a are orthogonal to each other, the power of light is not reduced by the influence of light from the other side. After this, as described above, the light emitting element driver 7b is driven and the light is emitted from the light emitting element 4a to the object to be measured W, and the position sensor 4d detects the reflected light from the object to be measured W and the signal processing circuit. Output to 8b. And the signal output circuit 8b
Then, the lower surface position of the object to be measured W is measured from the detection signal indicating the light image state of the object to be measured W of the position sensor 4d, and the result is output to the adding circuit 10. Further, the adder circuit 10 adds the position data on the upper and lower surfaces of the object to be measured W by the detection heads 5 and 6 to calculate the thickness, and outputs the result as a display.

従って、上述した実施例では、各検出ヘッド5,6の発光
素子3a,4aとポジションセンサ3d,4dとの間の光路、すな
わち、投受光面5a,6aが互いに直交した状態で被測定物
Wに対して光が同時に照射され、相手側から不要な光を
直接検出することがないので、従来のように相手側から
の光による発光素子3a,4aの出力パワーの低下を防止で
き、光の影響を受けて誤差を招くことなく正確な変位測
定を行なうことができる。
Therefore, in the above-mentioned embodiment, the optical path between the light emitting elements 3a, 4a of the respective detection heads 5, 6 and the position sensors 3d, 4d, that is, the light emitting / receiving surfaces 5a, 6a are orthogonal to each other, the object to be measured W is measured. Since the light is simultaneously emitted to the other side and unnecessary light is not directly detected from the other side, it is possible to prevent the output power of the light emitting elements 3a, 4a from being lowered by the light from the other side as in the conventional case. Accurate displacement measurement can be performed without being affected by the error.

ところで、上述した実施例では、各検出ヘッド5,6は発
光素子3a,4aとポジションセンサ3d,4dとの間の光路が互
いに直交し、互いに光の影響を受けにくい状態で配置し
た場合を例にとって説明したが、相手側からの光が直接
入射しない状態であれば、各検出ヘッド5,6を各々の光
路がずれた状態で配置するだけでも十分な効果が得られ
る。
By the way, in the above-described embodiment, the detection heads 5 and 6 are arranged such that the light paths between the light emitting elements 3a and 4a and the position sensors 3d and 4d are orthogonal to each other, and the detection heads 5 and 6 are arranged so as not to be affected by light. However, as long as the light from the other side is not directly incident, a sufficient effect can be obtained by arranging the detection heads 5 and 6 with their optical paths deviated from each other.

[発明の効果] 以上説明したように、本発明のレーザ厚み計によれば、
被測定物の両側に対向する検出ヘッドの投光系及び受光
系は、照射するレーザ光の延長線上で重ならない位置に
投受光面が配置され、かつ2組のレーザ変位計の測定面
が前記被測定物の測定面の法線上にある構成なので、相
手側の検出ヘッドの投光系から被測定物を透過してくる
光の影響を受けずに被測定物に対して十分な光を照射し
て高精度な厚み測定を行なうことができる。
As described above, according to the laser thickness meter of the present invention,
The light-projecting system and the light-receiving system of the detection head, which are opposed to both sides of the object to be measured, have their light-transmitting and light-receiving surfaces arranged at positions where they do not overlap each other on the extension line of the laser light to be irradiated, and the measurement surfaces of the two sets of laser displacement gauges are the above-mentioned. Since the configuration is on the normal to the measurement surface of the DUT, sufficient light is emitted to the DUT without being affected by the light transmitted from the projection system of the detection head on the other side. Therefore, highly accurate thickness measurement can be performed.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明によるレーザ厚み計の一実施例を示す斜
視図、第2図は同レーザ厚み計のブロック構成図、第3
図は従来のレーザ変位計による厚み測定の構成を示す斜
視図である。 1,2……レーザ変位計、3,4……検出系、5,6……検出ヘ
ッド、5a,6a……投受光面、7……発光素子ドライバ、
8……信号処理回路、9……制御回路、10……加算回
路、W……被測定物、L1,L2……光路、l……厚み(変
位)。
FIG. 1 is a perspective view showing an embodiment of a laser thickness gauge according to the present invention, FIG. 2 is a block diagram of the same laser thickness gauge, and FIG.
FIG. 1 is a perspective view showing a configuration of thickness measurement by a conventional laser displacement meter. 1,2 …… Laser displacement meter, 3,4 …… Detection system, 5,6 …… Detection head, 5a, 6a …… Projector / receiver surface, 7 …… Light emitting element driver,
8 ...... signal processing circuit, 9 ...... control circuit, 10 ...... adder circuit, W ...... DUT, L 1, L 2 ...... optical path, l ...... thickness (displacement).

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】被測定物の測定面の法線に対して斜め方向
からレーザ光を照射する投光系と、前記レーザ光の入射
角に対して正反射の方向に配置された受光系とを備えた
2組のレーザ変位計の検出ヘッドを前記被測定物の両側
に対向配置し、該被測定物を前記検出ヘッドの間を通過
させ、前記各投光系より前記被測定物に対して同時に光
を照射して被測定物の厚みを測定するレーザ厚み計にお
いて、 前記被測定物が透過性部材の場合で、その両側に対向す
る検出ヘッドの投光系及び受光系は、照射するレーザ光
の延長線上を除いた方向に配置され、かつ2組のレーザ
変位計の測定点が前記被測定物の測定面の同一法線上に
あることを特徴とするレーザ厚み計。
1. A light projecting system for irradiating a laser beam from an oblique direction with respect to a normal line of a measurement surface of an object to be measured, and a light receiving system arranged in a direction of regular reflection with respect to an incident angle of the laser beam. The detection heads of two sets of laser displacement gauges provided with are arranged opposite to each other on both sides of the object to be measured, the object to be measured is passed between the detection heads, and each of the light projecting systems moves the object to the object to be measured. In the laser thickness meter that simultaneously irradiates light to measure the thickness of the object to be measured, when the object to be measured is a transmissive member, the light projecting system and the light receiving system of the detection heads facing the both sides irradiate. A laser thickness meter, which is arranged in a direction other than an extension line of laser light, and wherein the measurement points of two sets of laser displacement meters are on the same normal line to the measurement surface of the object to be measured.
JP1255581A 1989-09-30 1989-09-30 Laser thickness gauge Expired - Lifetime JPH0778414B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1255581A JPH0778414B2 (en) 1989-09-30 1989-09-30 Laser thickness gauge

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1255581A JPH0778414B2 (en) 1989-09-30 1989-09-30 Laser thickness gauge

Publications (2)

Publication Number Publication Date
JPH03118407A JPH03118407A (en) 1991-05-21
JPH0778414B2 true JPH0778414B2 (en) 1995-08-23

Family

ID=17280709

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1255581A Expired - Lifetime JPH0778414B2 (en) 1989-09-30 1989-09-30 Laser thickness gauge

Country Status (1)

Country Link
JP (1) JPH0778414B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5696589A (en) * 1996-05-20 1997-12-09 Lockheed Martin Energy Systems, Inc. Optical caliper with compensation for specimen deflection and method
CN120538426B (en) * 2025-07-17 2026-02-13 四川汇正管道技术有限公司 A laser inspection device for pipe wall thickness detection

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5932907U (en) * 1982-08-25 1984-02-29 横河電機株式会社 Non-contact thickness gauge

Also Published As

Publication number Publication date
JPH03118407A (en) 1991-05-21

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