JPH0778472B2 - Inspection method of mounted printed circuit board - Google Patents
Inspection method of mounted printed circuit boardInfo
- Publication number
- JPH0778472B2 JPH0778472B2 JP63046257A JP4625788A JPH0778472B2 JP H0778472 B2 JPH0778472 B2 JP H0778472B2 JP 63046257 A JP63046257 A JP 63046257A JP 4625788 A JP4625788 A JP 4625788A JP H0778472 B2 JPH0778472 B2 JP H0778472B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- inspection
- land
- solder bridge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明では、実装済プリント基板の検査方法に関するも
ので、特にハンダブリッジの検査・判定をコンピュータ
等で自動化する上での検査方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection method for a mounted printed circuit board, and more particularly to an inspection method for automating the inspection / judgment of a solder bridge by a computer or the like.
従来の技術 従来、実装済プリント基板の検査において、特にハンダ
ブリッジの検査に関してはほとんど人間の目に頼ってい
る。2. Description of the Related Art Conventionally, in the inspection of a mounted printed circuit board, in particular, the inspection of a solder bridge relies mostly on human eyes.
発明が解決しようとする課題 しかし、近年のプリント基板の小型化、部品の小型化、
実装密度の高集積化、および部品挿入機の高速化等に伴
い、今まで以上の正確さ、スピード等が要求されるよう
になり、目視検査では対応できなくなりつつある。ま
た、ハンダブリッジの検査は、どこにハンダブリッジが
発生するか予想をつけにくいため、検査手法が一般的に
複雑になりマイクロコンピュータ等で検査可能な簡単な
検査手法がないという問題点がある。Problems to be Solved by the Invention However, recent miniaturization of printed circuit boards, miniaturization of components,
With higher integration of mounting density and higher speed of a component insertion machine, more accuracy and speed than ever before are required, and it is becoming difficult to meet the requirements by visual inspection. Further, in the inspection of the solder bridge, it is difficult to predict where the solder bridge will occur, so that the inspection method is generally complicated and there is a problem that there is no simple inspection method that can be inspected by a microcomputer or the like.
本発明はかかる問題点に鑑み、ハンダブリッジの検査と
同時に部品の欠落も検査可能で、かつ簡単なアルゴリズ
ムであるため、マイクロコンピュータや電気回路で実現
可能な検査手法を提供することを目的とするものであ
る。In view of such a problem, the present invention has an object to provide an inspection method that can be implemented by a microcomputer or an electric circuit because it can inspect for missing parts at the same time as inspecting a solder bridge and has a simple algorithm. It is a thing.
課題を解決するための手段 本発明は、部品実装後のプリント基板におけるランドの
周辺に沿って、高さまたは輝度の少なくとも一方を順次
測定し、その測定値の変化を予じめ定められた変化と比
較し、その差異の有無によりハンダブリッジおよび部品
の欠落を判定する実装済プリント基板の検査方法であ
る。Means for Solving the Problems The present invention is to measure at least one of height and brightness sequentially along the periphery of a land on a printed circuit board after component mounting, and change the measured value in advance according to a predetermined change. Is a method for inspecting a mounted printed circuit board that determines whether or not a solder bridge and a component are missing based on the presence or absence of the difference.
作用 前記した方法によれば、マイクロコンピュータや電気回
路で実装済プリント基板上のハンダブリッジや部品の欠
落を検査・判定することが可能になり、検査装置の自動
化が容易に可能になるものである。Action According to the method described above, it becomes possible to inspect / determine a solder bridge or a missing component on a printed circuit board mounted by a microcomputer or an electric circuit, and it becomes possible to easily automate the inspection device. .
実施例 以下、本発明の目的を達成するための実施例を図面に従
って説明する。Embodiments Embodiments for achieving the object of the present invention will be described below with reference to the drawings.
第１図は電子部品が正常に実装されたプリント基板の拡
大図であり、3,4はチップ部品５の電極1,2が半田付けさ
れているランド部分、６はレジスト処理された回路パタ
ーンである。7,8は前記ランド3,4の外周近傍に沿って予
じめ規定された検査線路であり、この検査線路7,8の位
置および形状は予じめ自動検査機に覚え込ませてあり、
自動検査機はこの検査線路7,8に沿って、その高さある
いは輝度（反射率）を順次測定するよう構成されてい
る。FIG. 1 is an enlarged view of a printed circuit board on which electronic components are normally mounted. Reference numerals 3 and 4 are land portions to which electrodes 1 and 2 of a chip component 5 are soldered, and 6 is a resist-treated circuit pattern. is there. 7,8 is an inspection track preliminarily defined along the vicinity of the outer periphery of the lands 3,4, the position and shape of this inspection track 7,8 has been remembered in the preliminary automatic inspection machine,
The automatic inspection machine is configured to sequentially measure its height or brightness (reflectance) along the inspection lines 7 and 8.
第２図は、第１図の検査線路７に沿って自動検査機によ
り高さを測定した検査結果であり、ランド３の外周部分
を検査線路７に沿って点11,12,13,14,11の経路で走査し
た時の高さの変化を表している。すなわち、点12と13の
間にはチップ部品５の存在を示す部分Ａが、点14と11の
間には回路パターン６の存在を示す部分Ｂが検出され、
点11と12,点13と14の間にはなにも存在しないことを示
している。この第２図に示す波形は、正常な部品実装時
の波形として、予じめ検査機に記憶されてあり、この記
憶された波形と検査結果の波形を比較し、その差異の有
無により正常な部品実装が行われているか否かが判断さ
れるものである。FIG. 2 shows the inspection result of measuring the height along the inspection line 7 of FIG. 1 by an automatic inspection machine. The outer peripheral portion of the land 3 is measured along the inspection line 7 at points 11, 12, 13, 14, It shows the change in height when scanning along 11 paths. That is, a portion A indicating the presence of the chip component 5 is detected between the points 12 and 13, and a portion B indicating the presence of the circuit pattern 6 is detected between the points 14 and 11.
It shows that there is nothing between points 11 and 12 and points 13 and 14. The waveform shown in FIG. 2 is stored in the preliminary inspection machine as a waveform for normal component mounting. The stored waveform is compared with the waveform of the inspection result. It is determined whether or not component mounting is performed.
第３図は基板上にチップ部品５がハンダブリッジ18を伴
って実装された所を表している。なお、15,16は前記ラ
ンド3,4に近傍して配置された他のランド部であり、17
はそのランド部15,16間に実装された第２のチップ部品
である。FIG. 3 shows the chip component 5 mounted on the board together with the solder bridge 18. Incidentally, 15 and 16 are other land portions arranged near the lands 3 and 4, and
Is a second chip component mounted between the lands 15 and 16.
第４図は、第３図の様に実装された場合の検査結果であ
り、新たに点13と14の間にハンダブリッジ18が存在する
ことを示す区間Ｃが発生しており、点13と14の間にハン
ダブリッジが存在していることがわかる。また、第２図
と第４図において、点12から区間Ａが発生するまでの距
離Ｌを計測することによりチップ部品５の位置のずれも
検知できるものである。FIG. 4 shows the inspection result when the device is mounted as shown in FIG. 3, and a section C indicating that the solder bridge 18 exists between points 13 and 14 is newly generated. It can be seen that there is a solder bridge between 14. Further, in FIGS. 2 and 4, by measuring the distance L from the point 12 to the occurrence of the section A, the displacement of the position of the chip component 5 can be detected.
第５図は、第３図と同じ検査経路７で走査した時の輝度
変化を表している。高さ変化では検出不可能なハンダブ
リッジが存在する場合は、輝度情報も考慮して計測すれ
ば見逃がしがなくなることを示している。なぜなら、銅
箔部の外側を走査した場合、プリント基板面よりもハン
ダ面の方が反射率が大きく輝度が高くなるためである。
第５図で説明すると、点13と14の間にハンダブリッジ18
が存在していることを示す区間Ｄが生じている。なお、
点12と13の間の輝度が高くなっているのはチップ部品５
の電極部１の反射率が大きいためである。FIG. 5 shows the luminance change when scanning is performed on the same inspection path 7 as in FIG. It shows that if there is a solder bridge that cannot be detected by the height change, it will not be overlooked if the measurement is performed in consideration of the brightness information. This is because when the outside of the copper foil portion is scanned, the reflectance is higher and the brightness is higher on the solder surface than on the printed board surface.
Referring to FIG. 5, a solder bridge 18 is provided between points 13 and 14.
Section D indicating that is present. In addition,
The high brightness between points 12 and 13 is the chip component 5.
This is because the reflectance of the electrode part 1 is high.
第６図はプリント基板上にチップ部品５がずれて実装さ
れた場合を示している。FIG. 6 shows a case where the chip component 5 is mounted on the printed circuit board while being displaced.
第７図は、第６図の様に実装された場合の検査結果であ
り、第６図に示す様にランド３の外周部分を検査線路７
に沿って点11,12,13,14,11の経路で走査した時の高さ変
化を表している。ハンダブリッジは存在していないが、
点12と13の間の高さが第２図の点12と13間の高さに比較
して異常に低くなっており、部品が欠落していることを
示している。FIG. 7 shows the inspection result when mounted as shown in FIG. 6. As shown in FIG.
It shows the height change when scanning along the path of points 11, 12, 13, 14, and 11. There is no solder bridge,
The height between points 12 and 13 is unusually low compared to the height between points 12 and 13 in FIG. 2, indicating that parts are missing.
なお、以上の実施例ではランド部分は長方形になってい
るが、本発明は任意の形をしたランド部でも外接長方形
として走査することが可能であり、ランド部分の形によ
らないものである。Although the land portion has a rectangular shape in the above embodiments, the present invention can scan an arbitrarily shaped land portion as a circumscribing rectangle and does not depend on the shape of the land portion.
発明の効果 以上のように本発明によれば、部品が実装されたプリン
ト基板のランド部分の周辺に沿って高さと輝度の少なく
とも一方を測定することにより、人間の目では見つけら
れない様な細いハンダブリッジまでも検査することがで
き、しかも簡単な手法であるため、自動機に最適な検査
方法を提供することができるものである。EFFECTS OF THE INVENTION As described above, according to the present invention, by measuring at least one of height and brightness along the periphery of the land portion of the printed circuit board on which the component is mounted, it is possible to detect a fine line that cannot be found by human eyes. Since the solder bridge can be inspected and the method is simple, it is possible to provide an optimal inspection method for an automatic machine.
第１図は部品が実装されたプリント基板の要部拡大図、
第２図は本発明による同プリント基板の検査結果を示す
特性曲線図、第３図はハンダブリッジを伴って実装され
た場合のプリント基板の要部拡大図、第４図および第５
図は第３図のプリント基板の検査結果を示す特性曲線
図、第６図は基板上に部品がずれを伴って実装された場
合の要部拡大図、第７図は第６図のプリント基板の検査
結果を示す図特性曲線である。 1,2……電極、3,4……ランド部分、５……チップ部品、
６……回路パターン、7,8……検査線路、11,12,13,14…
…検査線路の点、15,16……ランド部分、17……第２の
チップ部品、18……ハンダブリッジ。FIG. 1 is an enlarged view of a main part of a printed circuit board on which components are mounted,
FIG. 2 is a characteristic curve diagram showing an inspection result of the same printed circuit board according to the present invention, FIG. 3 is an enlarged view of a main part of the printed circuit board when mounted with a solder bridge, FIG. 4 and FIG.
FIG. 6 is a characteristic curve diagram showing the inspection result of the printed circuit board of FIG. 3, FIG. 6 is an enlarged view of a main part when components are mounted on the substrate with a deviation, and FIG. 7 is a printed circuit board of FIG. It is a diagram characteristic curve showing the inspection result of. 1,2 …… electrodes, 3,4 …… land part, 5 …… chip parts,
6 ... Circuit pattern, 7,8 ... Inspection line, 11,12,13,14 ...
… Inspection line points, 15,16 …… Land part, 17 …… Second chip part, 18 …… Solder bridge.
Claims (2)
を半田付けする実装工程を経たプリント基板の前記ラン
ドの周辺に沿って順次高さを測定し、その測定された高
さの変化曲線と予じめ定められた変化曲線とを比較し、
その差異の有無によりハンダブリッジおよび部品の欠落
を判定することを特徴とする実装済プリント基板の検査
方法。1. A height is sequentially measured along the periphery of the land of a printed circuit board which has undergone a mounting step of soldering a predetermined electronic component to a predetermined land, and the change in the measured height is measured. Compare the curve with a predetermined change curve,
A method for inspecting a mounted printed circuit board, which is characterized by determining a solder bridge and a missing part based on the presence or absence of the difference.
を半田付けする実装工程を経たプリント基板の前記ラン
ドの周辺に沿って順次輝度を測定し、その測定された輝
度の変化曲線と予じめ定められた変化曲線とを比較し、
その差異の有無により半田ブリッジおよび部品の欠落を
判定することを特徴とする実装済プリント基板の検査方
法。2. A luminance is sequentially measured along the periphery of the land of a printed circuit board which has undergone a mounting process of soldering a predetermined electronic component to a predetermined land, and a change curve of the measured luminance is obtained. Compare with a predetermined change curve,
A method for inspecting a mounted printed circuit board, which is characterized in that a solder bridge and a missing part are determined based on the presence or absence of the difference.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63046257A JPH0778472B2 (en) | 1988-02-29 | 1988-02-29 | Inspection method of mounted printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63046257A JPH0778472B2 (en) | 1988-02-29 | 1988-02-29 | Inspection method of mounted printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01219656A JPH01219656A (en) | 1989-09-01 |
| JPH0778472B2 true JPH0778472B2 (en) | 1995-08-23 |
Family
ID=12742140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63046257A Expired - Lifetime JPH0778472B2 (en) | 1988-02-29 | 1988-02-29 | Inspection method of mounted printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0778472B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002023171A1 (en) * | 1999-03-18 | 2002-03-21 | Fujisawa Pharmaceutical Co., Ltd. | Object visual inspection method and object visual inspection apparatus |
-
1988
- 1988-02-29 JP JP63046257A patent/JPH0778472B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01219656A (en) | 1989-09-01 |
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