JPH077876B2 - Conductive resin film and method for manufacturing the same - Google Patents
Conductive resin film and method for manufacturing the sameInfo
- Publication number
- JPH077876B2 JPH077876B2 JP1198991A JP19899189A JPH077876B2 JP H077876 B2 JPH077876 B2 JP H077876B2 JP 1198991 A JP1198991 A JP 1198991A JP 19899189 A JP19899189 A JP 19899189A JP H077876 B2 JPH077876 B2 JP H077876B2
- Authority
- JP
- Japan
- Prior art keywords
- zinc oxide
- film
- resin film
- whisker
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 title claims description 42
- 239000011347 resin Substances 0.000 title claims description 42
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 238000000034 method Methods 0.000 title description 12
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 114
- 239000011787 zinc oxide Substances 0.000 claims description 58
- 239000007822 coupling agent Substances 0.000 claims description 17
- 239000013078 crystal Substances 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 14
- 239000011230 binding agent Substances 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 235000014692 zinc oxide Nutrition 0.000 description 52
- 238000000576 coating method Methods 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 14
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 12
- 239000000243 solution Substances 0.000 description 11
- -1 spheres Substances 0.000 description 11
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 9
- 239000011521 glass Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 229910000077 silane Inorganic materials 0.000 description 9
- 239000000945 filler Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 239000006087 Silane Coupling Agent Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000004417 polycarbonate Substances 0.000 description 5
- 229920000515 polycarbonate Polymers 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000002002 slurry Substances 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910003437 indium oxide Inorganic materials 0.000 description 3
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 239000004419 Panlite Substances 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000000635 electron micrograph Methods 0.000 description 2
- 238000009503 electrostatic coating Methods 0.000 description 2
- 229910000464 lead oxide Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 239000010944 silver (metal) Substances 0.000 description 2
- DCVWZWOEQMSMLR-UHFFFAOYSA-N silylperoxysilane Chemical compound [SiH3]OO[SiH3] DCVWZWOEQMSMLR-UHFFFAOYSA-N 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- JZLWSRCQCPAUDP-UHFFFAOYSA-N 1,3,5-triazine-2,4,6-triamine;urea Chemical compound NC(N)=O.NC1=NC(N)=NC(N)=N1 JZLWSRCQCPAUDP-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- AIFLGMNWQFPTAJ-UHFFFAOYSA-J 2-hydroxypropanoate;titanium(4+) Chemical compound [Ti+4].CC(O)C([O-])=O.CC(O)C([O-])=O.CC(O)C([O-])=O.CC(O)C([O-])=O AIFLGMNWQFPTAJ-UHFFFAOYSA-J 0.000 description 1
- ZKSPHENWXBWOPM-UHFFFAOYSA-N 2-methylprop-2-enoic acid oxochromium Chemical compound CC(=C)C(=O)O.O=[Cr] ZKSPHENWXBWOPM-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- ITUPIWSEJOQEFR-UHFFFAOYSA-K CC(C)O[Ti+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O Chemical compound CC(C)O[Ti+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O ITUPIWSEJOQEFR-UHFFFAOYSA-K 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 239000004373 Pullulan Substances 0.000 description 1
- 229920001218 Pullulan Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910052776 Thorium Inorganic materials 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 229910026551 ZrC Inorganic materials 0.000 description 1
- SMEGJBVQLJJKKX-HOTMZDKISA-N [(2R,3S,4S,5R,6R)-5-acetyloxy-3,4,6-trihydroxyoxan-2-yl]methyl acetate Chemical compound CC(=O)OC[C@@H]1[C@H]([C@@H]([C@H]([C@@H](O1)O)OC(=O)C)O)O SMEGJBVQLJJKKX-HOTMZDKISA-N 0.000 description 1
- OTCHGXYCWNXDOA-UHFFFAOYSA-N [C].[Zr] Chemical compound [C].[Zr] OTCHGXYCWNXDOA-UHFFFAOYSA-N 0.000 description 1
- PEQYWQJRQVAUAZ-UHFFFAOYSA-L [Cr](=O)(=O)(Cl)Cl.C(C(=C)C)(=O)O Chemical compound [Cr](=O)(=O)(Cl)Cl.C(C(=C)C)(=O)O PEQYWQJRQVAUAZ-UHFFFAOYSA-L 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
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- 229940081735 acetylcellulose Drugs 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
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- 229910045601 alloy Inorganic materials 0.000 description 1
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- 238000004458 analytical method Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
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- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002003 electron diffraction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
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- 238000007654 immersion Methods 0.000 description 1
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- 229910052738 indium Inorganic materials 0.000 description 1
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- 238000007733 ion plating Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 1
- 235000013980 iron oxide Nutrition 0.000 description 1
- VBMVTYDPPZVILR-UHFFFAOYSA-N iron(2+);oxygen(2-) Chemical class [O-2].[Fe+2] VBMVTYDPPZVILR-UHFFFAOYSA-N 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- VUZPPFZMUPKLLV-UHFFFAOYSA-N methane;hydrate Chemical compound C.O VUZPPFZMUPKLLV-UHFFFAOYSA-N 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- LYGJENNIWJXYER-UHFFFAOYSA-N nitromethane Chemical compound C[N+]([O-])=O LYGJENNIWJXYER-UHFFFAOYSA-N 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- KQJBQMSCFSJABN-UHFFFAOYSA-N octadecan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCCCCCCCCCCCCCCCC[O-].CCCCCCCCCCCCCCCCCC[O-].CCCCCCCCCCCCCCCCCC[O-].CCCCCCCCCCCCCCCCCC[O-] KQJBQMSCFSJABN-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
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- 239000005011 phenolic resin Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
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- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
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- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
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- 239000004800 polyvinyl chloride Substances 0.000 description 1
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- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 235000019423 pullulan Nutrition 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- SKRWFPLZQAAQSU-UHFFFAOYSA-N stibanylidynetin;hydrate Chemical compound O.[Sn].[Sb] SKRWFPLZQAAQSU-UHFFFAOYSA-N 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052713 technetium Inorganic materials 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
- 235000015041 whisky Nutrition 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Conductive Materials (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は導電性樹脂膜とその製造方法に関し、さらに詳
しくは、シート,フィルム,ペースト,塗料等の形態で
用いる静電気帯電防止材や静電塗装用導電塗料,回路配
線,電極取り出し,電気接点,導電フィルム,面発熱
体,電磁シールド材,コロナ放電防止材などの広範囲な
分野の導電性樹脂膜に関する。Description: FIELD OF THE INVENTION The present invention relates to a conductive resin film and a method for producing the same, and more particularly, to an antistatic material or electrostatic coating used in the form of a sheet, film, paste, paint or the like. The present invention relates to conductive resin films in a wide range of fields such as conductive paints, circuit wiring, electrode extraction, electrical contacts, conductive films, surface heating elements, electromagnetic shield materials, and corona discharge prevention materials.
従来の技術 従来より、導電性樹脂膜として、導電性フィラー添加形
のものがあった。2. Description of the Related Art Conventionally, as a conductive resin film, there has been a conductive filler added type.
樹脂膜に配合して導電性を付与する素材、即ちフィラー
としては、銀,銅,アルミニウム,ニッケル,パラジウ
ム,鉄等の金属,題化硅素,酸化錫,酸化インジウム,
酸化鉛等の金属化合物、カーボン等の非金属の結晶体や
非結晶体で、フレーク状,粉末状,球状,繊維状の形態
で使用されている。また、これらのフィラーの表面に、
金属や金属酸化物等の導電性材料をコートして用いるこ
ともよく知られている。Materials that are added to the resin film to impart conductivity, that is, fillers include metals such as silver, copper, aluminum, nickel, palladium, iron, silicon oxide, tin oxide, indium oxide,
It is a metallic compound such as lead oxide or the like, and a non-metal crystalline or non-crystalline material such as carbon, which is used in the form of flakes, powder, spheres, or fibers. Also, on the surface of these fillers,
It is also well known to coat and use a conductive material such as metal or metal oxide.
発明が解決しようとする課題 しかるに、これらのフィラーを用いて導電性を上げるに
は、フィラーの寸法を十分微細化する等により分散を完
全にし、しかもその上、大量に投入することが不可欠で
あった。However, in order to increase the conductivity by using these fillers, it is indispensable to completely disperse the filler by making the dimensions of the filler sufficiently small and to add it in a large amount. It was
しかるに、導電物質の大量の添加は、塗膜の機械的性質
を低下させるとともに、銅,アルミニウム,鉄などでは
表面酸化層の形成による導電性の低下、銅,鉄酸化物に
よる塗膜の劣化などの欠点があった。そこで安価で安定
性の高いカーボンブラックが使用されてきたが、色相が
限定される欠点があった。However, the addition of a large amount of conductive material deteriorates the mechanical properties of the coating film, and the conductivity of copper, aluminum, iron, etc. decreases due to the formation of a surface oxide layer, and the coating film deteriorates due to copper and iron oxides. There was a drawback. Therefore, inexpensive and highly stable carbon black has been used, but it has a drawback that the hue is limited.
本発明は、樹脂分に対して低比率に配合するだけで、適
切な導電性が得られ、色相が限定されず、酸化劣化の無
いフレキシビリティーに富んだ導電性樹脂膜とその製造
方法の提供を目的とする。The present invention provides a conductive resin film having a proper flexibility, a hue that is not limited, and a flexible flexible conductive film that is free from oxidative deterioration and a method for manufacturing the same, by only blending the resin component in a low ratio. For the purpose of provision.
課題を解決するための手段 本発明者らは、上記目的に鑑み、鋭意研究の結果、以下
の手段により目的が達せられることを発明した。Means for Solving the Problems In view of the above-mentioned object, the present inventors have invented that, as a result of earnest research, the object can be achieved by the following means.
すなわち、本発明は核部とこの核部から異なる4軸方向
に伸びた針状結晶部からなる酸化亜鉛ウイスカを配合し
た導電性樹脂膜である。That is, the present invention is a conductive resin film containing a zinc oxide whisker comprising a core and needle-shaped crystal parts extending in different four-axis directions from the core.
また、本発明は核部とこの核部から異なる4軸方向に伸
びた針状結晶部を具備し、かつ少なくとも前記針状結晶
部の一部が導電性材料によりコートされた酸化亜鉛ウイ
スカを配合した導電性樹脂膜である。The present invention further comprises a zinc oxide whisker comprising a core portion and needle-shaped crystal portions extending from the core portion in different four-axis directions, and at least a part of the needle-shaped crystal portion is coated with a conductive material. It is a conductive resin film.
さらに本発明は、針状結晶部の基部の径が0.1〜14μm
であり、基部から先端までの長さが3〜200μmである
テトラポット状酸化亜鉛ウイスカを配合した導電性樹脂
膜である。Furthermore, in the present invention, the diameter of the base of the needle-shaped crystal part is 0.1 to 14 μm.
And a conductive resin film containing a tetrapot-shaped zinc oxide whisker having a length from the base to the tip of 3 to 200 μm.
次に、本発明は、テトラポット状酸化亜鉛ウイスカまた
は、少なくとも一部が導電性材料によりコートされたテ
トラポット状酸化亜鉛ウイスカを、バインダ溶液に配合
する第1工程と、さらに製膜し加熱または乾燥する第2
工程より成る導電性樹脂膜の製造方法である。Next, the present invention provides a first step of blending a tetrapot-shaped zinc oxide whisker or a tetrapot-shaped zinc oxide whisker at least a part of which is coated with a conductive material in a binder solution, and further forming a film and heating or Second to dry
It is a method for producing a conductive resin film, which comprises steps.
また、本発明は、テトラポット状酸化亜鉛ウイスカまた
は、少なくとも一部が導電性材料によりコートされたテ
トラポット状酸化亜鉛ウイスカを、カップリング剤で表
面処理する第1工程と、このウイスカをバインダ溶液に
配合する第2工程と、さらに製膜し加熱または乾燥する
第3工程より成る導電性樹脂膜の製造方法である。The present invention also provides a first step of surface-treating a tetrapot-shaped zinc oxide whisker or a tetrapot-shaped zinc oxide whisker, at least a part of which is coated with a conductive material, with a binder solution. And a third step of further forming a film and heating or drying the same, and a method for producing a conductive resin film.
作用 本発明に使用する酸化亜鉛ウイスカは、3次元構造でテ
トラポット状の立体的な特異な構造を有するために、塗
膜中に配合された場合には、ウイスカの針状結晶部が他
のウイスカの針状結晶部と極めて効率的な接触をもたら
すため、極めて少ない配合で効率的に導電パスを形成す
ることが可能となる。これは、従来、電気的接触に有利
だとされてきた単純な線状繊維体あるいはフレーク状フ
ィラーと比較しても接触確率が極めて高いものである。
このようにして、本発明では、低配合率で容易に樹脂中
に導電パスが形成されることとなるので、フレキシビリ
ティーに富んだ導電性樹脂膜が製膜できる。Action The zinc oxide whiskers used in the present invention have a three-dimensional structure and a tetrapod-like three-dimensional peculiar structure. Therefore, when incorporated in the coating film, the whisker needle-shaped crystal parts are different from other ones. Since it brings about an extremely efficient contact with the needle-shaped crystal part of the whisker, it becomes possible to form the conductive path efficiently with an extremely small amount. This has a very high contact probability as compared with a simple linear fiber body or flake filler which has been conventionally considered to be advantageous for electrical contact.
In this way, in the present invention, a conductive path is easily formed in the resin with a low compounding ratio, so that a conductive resin film having a high degree of flexibility can be formed.
また、特に、溶剤型のバインダ溶液を使用する場合に
は、製膜時に、3次元方向に大きな膜の収縮が起こる。
この時、3次元方向に膜中のウイスカ同士の接触が強く
なり、従ってウイスカ同士の接触抵抗が小さくなり膜の
導電性が高くなる。このプロセスは、3次元ウイスカ独
特の、極めて強い効果である。In particular, when a solvent-type binder solution is used, a large film shrinkage occurs in the three-dimensional direction during film formation.
At this time, the contact between the whiskers in the film becomes strong in the three-dimensional direction, so that the contact resistance between the whiskers becomes small and the conductivity of the film becomes high. This process is an extremely strong effect unique to the 3D whiskers.
次にバインダ溶液の種類により、酸化亜鉛ウイスカの表
面に表面処理を施こしたものと、施こさないものを使い
分けることができる。これは、特にバインダ溶液中にお
けるウイスカの分散性を考慮して選択するものである。Next, depending on the kind of the binder solution, it is possible to selectively use zinc oxide whiskers whose surface is treated or not. This is selected in consideration of the dispersibility of the whiskers in the binder solution.
また、酸化亜鉛ウイスカは、白色で導電性(約10Ω−c
m)のある安定な物質で、この表面にさらに良好な導電
物質をコートすることにより低抵抗化が図れる。Zinc oxide whiskers are white and conductive (about 10Ω-c
It is a stable substance with m), and the resistance can be reduced by coating a better conductive substance on this surface.
次に、ウイスカの大きさに関しては、大き過ぎるウイス
カは折損し易く、また沈降し易いため分散が不十分とな
り導電性が低下する。Next, regarding the size of the whiskers, if the whiskers are too large, the whiskers are likely to be broken or settle, so that the dispersion is insufficient and the conductivity is lowered.
また小さ過ぎるウイスカは、導電パスの形成効率が低下
するため導電性が低下し好ましくない。ただ一般的傾向
としては、大きい方が接触点が少なくて導電パスが形成
されるため、効果的な導電パスの形成を促す。On the other hand, a whisker that is too small is not preferable because the efficiency of forming a conductive path decreases and the conductivity decreases. However, as a general tendency, the larger the number of contact points, the more the conductive path is formed, which promotes the formation of an effective conductive path.
実施例 以下に、本発明を実施例により具体的に説明するが、本
発明はこれらの実施例のみに限定されるものではない。Examples The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples.
本発明では、フィラーあるいは導電性フィラーとしては
全く新規な形状の酸化亜鉛ウイスカを用いる。In the present invention, a zinc oxide whisker having a completely new shape is used as the filler or the conductive filler.
この酸化亜鉛ウイスカは、テトラポット構造をしてお
り、その電子顕微鏡写真を第1図に示す。This zinc oxide whisker has a tetrapot structure, and its electron micrograph is shown in FIG.
このテトラポット状酸化亜鉛ウイスカは、製造的には、
表面に酸化皮膜を有する金属亜鉛粉末を、酸素を含む雰
囲気下で加熱処理して生成させることができる。得られ
た酸化亜鉛ウイスカはみかけの嵩比重0.02〜0.1を有
し、70wt%以上の高収率で極めて量産性に富んでいる。This tetrapot zinc oxide whisker is
Metal zinc powder having an oxide film on its surface can be produced by heat treatment in an atmosphere containing oxygen. The obtained zinc oxide whiskers have an apparent bulk specific gravity of 0.02 to 0.1, and have a high yield of 70 wt% or more, and are extremely mass-producible.
このウイスカのX線回折図をとると、すべて酸化亜鉛の
ピークを示し、一方電子線回折の結果も、転移,格子欠
陥の少ない単結晶性を示した。また、不純物含有量も少
なく、原子吸光分析の結果、酸化亜鉛が99.98%であっ
た。The X-ray diffraction pattern of this whisker showed all zinc oxide peaks, while the electron diffraction results also showed single crystallinity with few transitions and lattice defects. In addition, the content of impurities was also small, and the result of atomic absorption analysis was 99.98% zinc oxide.
ところで、酸化亜鉛ウイスカの針状結晶部が、4軸以外
に、3軸あるいは2軸、さらには1軸のものが混入する
場合があるが、これは4軸のウイスカの一部が折損した
もである。また板状晶の酸化亜鉛が混入する場合も認め
られた。By the way, the needle-shaped crystal part of zinc oxide whiskers may be mixed with triaxial, biaxial, or even uniaxial ones in addition to the quadriaxial ones. Is. It was also observed that zinc oxide in plate form was mixed.
次に、大きなウイスカ(長さが200μmより大で、径が1
4μmより大)が大きな割合(例えば60wt%以上)を占
める系、あるいは、小さなウイスカ(長さが3μmより
小で、径が0.1μmより小)が大きい割合(例えば80wt
%以上)を占める系では導電性が低下し好ましくない。Next, a large whisker (length greater than 200 μm, diameter 1
A system in which a large proportion (more than 4 μm) occupies a large proportion (for example, 60 wt% or more), or a small whisker (a length smaller than 3 μm and a diameter smaller than 0.1 μm) is large (for example 80 wt%).
% Or more), the conductivity decreases, which is not preferable.
特に、カップリング剤で表面処理した酸化亜鉛ウイスカ
を使用する場合においては、針状結晶部の基部から先端
までの長さが3〜80μmで、基部の径が0.7〜8μmの
場合に好ましい導電性樹脂膜が得られ易い。In particular, when using zinc oxide whiskers surface-treated with a coupling agent, it is preferable that the length from the base to the tip of the needle-shaped crystal part is 3 to 80 μm and the diameter of the base is 0.7 to 8 μm. A resin film is easily obtained.
次に導電性材料をコートした酸化亜鉛ウイスカを用いた
導電性樹脂膜について記す。Next, a conductive resin film using zinc oxide whiskers coated with a conductive material will be described.
テトラポット構造の酸化亜鉛ウイスカ表面への金属コー
ト法としては、無電解めっき,電解めっき等の化学めっ
き法や、種々のCVD法あるいは、真空蒸着,イオンプレ
ーティング,スパッタリング等やPVD法や塗布コート,
浸潰コート,スプレーコート法等が用いられる。As a metal coating method for the surface of zinc oxide whiskers having a tetrapot structure, there are various chemical vapor deposition methods such as electroless plating and electrolytic plating, various CVD methods, vacuum deposition, ion plating, sputtering, PVD method and coating coating. ,
Immersion coating, spray coating, etc. are used.
また、コートされる導電性材料は、Ag,Cu,Au,Cr,Al,Mo,
W,Zn,Ni,Cd,Co,Fe,Pt,Sn,Ta,Nb,Pb,As,Sb,Zr,Ti,La,Bi,
Mg,Hg,Ir,Th,V,Tc,Ru,Hf,Re,Os,Tl,In,Ga,U,Si,B,K,Na,
Sr,Be,Ca,Ba,Ra,Li,Sc,Y,Ac,O,C,N等の元素の単体ある
いは複数種類の合金,化合物,混合物で、目的の使用条
件で目的に応じた導電性を示す材料が選択され、特に光
反応酸化,還元,化学反応,経時変化等による導電性劣
化の少ない材料が好ましく、その点でAg,Au,Cu,Cr,Ni,A
l等の金属や酸化錫アンチモン,酸化インジウム等の金
属酸化物系導電材が特に効果的である。The conductive material to be coated is Ag, Cu, Au, Cr, Al, Mo,
W, Zn, Ni, Cd, Co, Fe, Pt, Sn, Ta, Nb, Pb, As, Sb, Zr, Ti, La, Bi,
Mg, Hg, Ir, Th, V, Tc, Ru, Hf, Re, Os, Tl, In, Ga, U, Si, B, K, Na,
Sr, Be, Ca, Ba, Ra, Li, Sc, Y, Ac, O, C, N, etc. Single or multiple kinds of alloys, compounds, and mixtures, with conductivity suitable for the purpose under the intended use conditions A material exhibiting the following is selected, and a material that is less likely to deteriorate in conductivity due to photoreactive oxidation, reduction, chemical reaction, aging, etc. is particularly preferable. In that respect, Ag, Au, Cu, Cr, Ni, A
Metals such as l and metal oxide-based conductive materials such as antimony tin oxide and indium oxide are particularly effective.
本来、酸化亜鉛ウイスキ自体が半導電性であり、ある程
度の電気を通しる材料であるため、必ずしも一個のウイ
スカの表面全体をコートする必要がなく、目的に応じて
部分的なコートで十分効果を発揮する。コートする導電
性材料は、25Å以上の厚さがあれば酸化亜鉛の導電性−
光依存性を弱める効果が出始め、100Å以上で実効的に
充分となり、複合系の導電特性が安定する。Originally, zinc oxide whiskey itself is semi-conductive and is a material that conducts electricity to some extent, so it is not always necessary to coat the entire surface of one whisker, and partial coating is sufficient depending on the purpose. Demonstrate. If the conductive material to be coated has a thickness of 25 Å or more, the conductivity of zinc oxide-
The effect of weakening the light dependence begins to appear, and 100 Å or more is effectively sufficient, and the conductive properties of the composite system stabilize.
次に、本発明は、溶剤型と無溶剤型の樹脂膜に対して適
用される。とりわけ、溶剤型のバインダ溶液を用いるこ
とにより極めて有効な導電性樹脂膜が得られる。Next, the present invention is applied to solvent type and solventless type resin films. In particular, by using a solvent type binder solution, an extremely effective conductive resin film can be obtained.
次にバインダ溶液とは、樹脂を溶媒(溶剤)中に分散ま
たは溶解させた低粘度の溶液(例えば1〜50wt%溶液)
のことで、使用する樹脂としてはポリカーボネート,ポ
リスチレン,ポリフェニレンオキシド,アクリル樹脂,
アルキッド樹脂,アセチルセルロース,シアノエチル化
セルロース,シアノエチル化プルラン等の有機溶媒に溶
解し易い樹脂が特に好ましいが、ポリ塩化ビニル,ポリ
プロピレン,ポリエチレン,塩素化ポリエチレン,ポリ
エチレンテレフタレート,ポリブチレンテレフタレー
ト,ポリアミド,ポリスルホン,ポリエーテルイミド,
ポリエーテルスルホン,ポリフェニレンサルファイド,
ポリエーテルケトン,ポリエーテルエーテルケトン,ABS
樹脂,ポリブタジエン,メチルメタアクリレート,ポリ
アクリルニトリル,ポリアセタール,ポリカーボネー
ト,エチレン−酢ビ共重合体,ポリ酢酸ビニル,エチレ
ン−テトラフロロエチレン共重合体、芳香族ポリエステ
ル,ポリ弗化ビニル,ポリ弗化ビニリデン,ポリ塩化ビ
ニリデン,テフロン等単独樹脂、または複数樹脂の共重
合体の熱可塑性樹脂の場合は、溶媒中に分散または溶解
させて用いることができる。Next, a binder solution is a low-viscosity solution (for example, 1 to 50 wt% solution) in which a resin is dispersed or dissolved in a solvent.
Therefore, the resins used are polycarbonate, polystyrene, polyphenylene oxide, acrylic resin,
Resins that are easily soluble in organic solvents such as alkyd resins, acetyl cellulose, cyanoethylated cellulose, and cyanoethylated pullulan are particularly preferable, but polyvinyl chloride, polypropylene, polyethylene, chlorinated polyethylene, polyethylene terephthalate, polybutylene terephthalate, polyamide, polysulfone, Polyetherimide,
Polyether sulfone, polyphenylene sulfide,
Polyetherketone, polyetheretherketone, ABS
Resin, polybutadiene, methyl methacrylate, polyacrylonitrile, polyacetal, polycarbonate, ethylene-vinyl acetate copolymer, polyvinyl acetate, ethylene-tetrafluoroethylene copolymer, aromatic polyester, polyvinyl fluoride, polyvinylidene fluoride In the case of a single resin such as polyvinylidene chloride or Teflon, or a thermoplastic resin of a copolymer of a plurality of resins, it can be used by dispersing or dissolving it in a solvent.
その他、エポキシ樹脂,不飽和ポリエステル樹脂,ウレ
タン樹脂,シリコン樹脂,メラミン−ユリア樹脂,フェ
ノール樹脂などの熱硬化性樹脂も同様に用いることがで
きる。In addition, thermosetting resins such as epoxy resin, unsaturated polyester resin, urethane resin, silicone resin, melamine-urea resin, and phenol resin can be similarly used.
使用する溶媒は、ジクロロメタン,ジクロロエタン,ク
ロロホルム,アセトン,メチルエチルケトン,ニトロメ
タン,アセトニトリル,アクリロニトリル,ジメチルホ
ルムアミド,ジメチルスルフォキサイド,ピリジン,ジ
オキサン,メチレンクロライド,テトラヒドロフラン,
トルエン,キシレン,シクロヘキサノン,酢酸メチル,
酢酸ブチル,メタノール,エタノール,ブチルアルコー
ル四塩化炭素,水等の有機溶媒等を単独または混合して
用いることができる。The solvent used is dichloromethane, dichloroethane, chloroform, acetone, methyl ethyl ketone, nitromethane, acetonitrile, acrylonitrile, dimethylformamide, dimethyl sulfoxide, pyridine, dioxane, methylene chloride, tetrahydrofuran,
Toluene, xylene, cyclohexanone, methyl acetate,
Organic solvents such as butyl acetate, methanol, ethanol, butyl alcohol carbon tetrachloride, and water can be used alone or in combination.
次に、酸化亜鉛ウイスカと樹脂との配合比率は、ウイス
カの大きさと、表面処理の種類,樹脂の種類,使用する
溶媒の種類,目的とする導電性の高さに依存するため限
定するものではないが、2Vol.%以上で効果があり、特
に4〜50Vol.%さらに好ましくは、4〜20Vol.%で安定
した導電性樹脂膜が得られる。Next, the compounding ratio of zinc oxide whisker and resin depends on the size of the whisker, the type of surface treatment, the type of resin, the type of solvent used, and the desired high conductivity, so it is not limited. Although not present, it is effective at 2 Vol.% Or more, and particularly 4 to 50 Vol.%, More preferably 4 to 20 Vol.%, A stable conductive resin film can be obtained.
配合した溶液は、マグネチックスターラーなどで、テト
ラポット状ウイスカの折損に注意して充分攪拌を行な
う。The mixed solution is thoroughly stirred with a magnetic stirrer, etc., paying attention to breakage of the tetrapot whiskers.
その後、ドクターブレード,スプレー,キャスティン
グ,刷毛塗り、バーコート,スピンナー等の適当な方法
で製膜する。After that, a film is formed by an appropriate method such as doctor blade, spraying, casting, brush coating, bar coating, spinner and the like.
次に加熱または乾燥して導電性樹脂膜が完成するが、特
に熱可塑性樹脂を用いた粒子(粒子径はウイスカの平均
長さ以下が必要)分散系の場合は、樹脂の軟化点以上の
温度で樹脂を融解させた後に製膜が完了する場合があ
る。Next, the conductive resin film is completed by heating or drying, but particularly in the case of particles using a thermoplastic resin (the particle size must be less than the average length of whiskers) dispersion system, the temperature above the softening point of the resin The film formation may be completed after the resin is melted by.
次に、カップリング剤で表面処理した酸化亜鉛ウイスカ
を用いることにより導電性の高い樹脂膜を得ることがで
きる。Then, a zinc oxide whisker surface-treated with a coupling agent is used to obtain a highly conductive resin film.
カップリング剤としては、シラン系あるいはクロム系あ
るいはチタン系カップリング剤それに、シリルパーオキ
サイド系,有機リン酸系が使用できるが、特にシランカ
ップリング剤が有効である。As the coupling agent, a silane-based coupling agent, a chromium-based coupling agent, a titanium-based coupling agent, a silyl peroxide-based coupling agent, and an organic phosphoric acid-based coupling agent can be used, and the silane coupling agent is particularly effective.
シランカップリング剤としては、γ−グリシドオキシプ
ロピルトリメトキシシラン(A-187),γ−メタクリル
オキシプロピルトリメトオキシシラン(A-174)、ビニ
ル−トリス(ベターメトキシエトキシ)シラン(A-17
2)、γ−アミノプロピルトリエトキシシラン(A-110
0)、ビニルトリエトキシシラン、ベータ,3,4エポキシ
シクロヘキシルエチルトリメトキシシラン、ガンマメル
カプトプロピルトリメトキシシランなどが用いられ、特
に、A−187系が有効である。クロム系カップリング剤
としては、メタクリレートクロミッククロライド(MCC:
Volan;DuPot社製品名)、Valchrome 5015(Valchem社製
品名)などが用いられる。As the silane coupling agent, γ-glycidoxypropyltrimethoxysilane (A-187), γ-methacryloxypropyltrimethoxysilane (A-174), vinyl-tris (bettermethoxyethoxy) silane (A-17
2), γ-aminopropyltriethoxysilane (A-110
0), vinyltriethoxysilane, beta, 3,4 epoxycyclohexylethyltrimethoxysilane, gammamercaptopropyltrimethoxysilane and the like are used, and the A-187 system is particularly effective. As a chromium-based coupling agent, methacrylate chromic chloride (MCC:
Volan; DuPot product name), Valchrome 5015 (Valchem product name) and the like are used.
チタン系カップリング剤としては、テトライソプロピル
チタネート,テトラブチルチタネート,テトラステアリ
ルチタネート,イソプロポキシチタニウムステアレー
ト,チタニウムラクテートなどが使用できる。As the titanium-based coupling agent, tetraisopropyl titanate, tetrabutyl titanate, tetrastearyl titanate, isopropoxy titanium stearate, titanium lactate or the like can be used.
次に、シリルパーオキサイド系カップリング剤として
は、 (CH3)4-nSi(OO t-butyl)n などが使用できる。Next, as a silyl peroxide type coupling agent, (CH 3 ) 4-n Si (OO t-butyl) n Etc. can be used.
また、有機リン酸系カップリング剤としては、 などが使用できる。Further, as the organic phosphoric acid-based coupling agent, Etc. can be used.
また、カップリング剤による表面処理の仕方は、一般的
な粉体の表面処理方法が適用できる。Further, as the method of surface treatment with the coupling agent, a general powder surface treatment method can be applied.
例えばシランカップリング剤を例にとると、 1)シランカップリング剤を水(少量のHClを含む)か
溶剤(少量の酢酸を含む)に溶解する。Taking a silane coupling agent as an example, 1) The silane coupling agent is dissolved in water (containing a small amount of HCl) or a solvent (containing a small amount of acetic acid).
2)100℃以下に加熱する(カップリング剤分子が加水
分解する)。2) Heat to 100 ° C or below (hydrolysis of coupling agent molecules).
3)この溶液中に処理しようとする酸化亜鉛ウイスカを
入れ、よく分散したスラリーを作る(粉体表面にカップ
リング剤分子の反応層が形成される)。3) Put zinc oxide whiskers to be treated in this solution to make a well-dispersed slurry (a reaction layer of coupling agent molecules is formed on the powder surface).
4)酸化亜鉛ウイスカを処理液から分離,乾燥後、150
℃以下に加熱処理をする。4) Separate the zinc oxide whiskers from the treatment liquid and dry it to 150
Heat it to below ℃.
以上の工程により表面処理が完了する。The surface treatment is completed by the above steps.
次に、カップリング剤を酸化亜鉛ウイスカに対して、0.
005wt%〜10wt%処理することにより効果が現われる
が、特に0.01〜5wt%の範囲において効果が大きいこと
がわかった。Next, the coupling agent was added to the zinc oxide whiskers at 0.
It was found that the effect was exhibited by the treatment of 005 wt% to 10 wt%, but the effect was particularly large in the range of 0.01 to 5 wt%.
本発明においては、酸化亜鉛ウイスカまたは導電性材料
をコートした酸化亜鉛ウイスカを単独で樹脂膜に配合す
ることにより充分導電性を付与することができるが、導
電化の目的によっては、他のフィラー例えば、銀,銅,
金,アルミニウム,ニッケル,パラジウム,鉄,ステン
レス鋼,酸化錫,酸化インジウム,酸化鉛,炭化硅素,
炭化ジルコニウム,炭化チタニウム,高導電性カーボ
ン,グラファイト,アセチレンブラック等の粉末、フレ
ーク,ビーズ,繊維あるいは、上記材料をコートした各
種粉末,フレーク,ビーズ,繊維さらには、導電性材料
をコートしない生のテトラポット構造酸化亜鉛ウイスカ
を併用,混合することも可能である。In the present invention, zinc oxide whiskers or zinc oxide whiskers coated with a conductive material can be added to the resin film to impart sufficient conductivity, but depending on the purpose of conductivity, other fillers such as , Silver, copper,
Gold, aluminum, nickel, palladium, iron, stainless steel, tin oxide, indium oxide, lead oxide, silicon carbide,
Powders, flakes, beads, fibers of zirconium carbide, titanium carbide, highly conductive carbon, graphite, acetylene black, etc., or various powders coated with the above materials, flakes, beads, fibers, and raw materials not coated with a conductive material. It is also possible to use and mix tetrapot zinc oxide whiskers together.
実施例1 まず、テトラポット状酸化亜鉛ウイスカを用意した。こ
のウイスカの針状結晶部の基部から先端までの長さは3
〜30μmで基部の径が0.7〜3μmに分布していた。Example 1 First, a tetrapot-shaped zinc oxide whisker was prepared. The length from the base to the tip of the needle-shaped crystal part of this whisker is 3
The diameter of the base portion was distributed to 0.7 to 3 μm at ˜30 μm.
次に、A-187シランカップリング剤を用いてシラン処理
を施した。即ち、まずA-187を塩酸水溶液(PH-5)に溶
解した。このとき、A-187の量は、処理するウイスカの
量に対して1wt%であった。次にこの溶液を80℃で1時
間加熱し、その後、充分乾燥した酸化亜鉛ウイスカを投
入し、充分攪拌してよく分散したスラリーを得た。次に
このスラリーを減圧ろ過し、80℃で3時間乾燥後、充分
ほぐし、150℃で8時間加熱して表面処理を完了した。Next, silane treatment was performed using an A-187 silane coupling agent. That is, first, A-187 was dissolved in a hydrochloric acid aqueous solution (PH-5). At this time, the amount of A-187 was 1 wt% with respect to the amount of whiskers to be treated. Next, this solution was heated at 80 ° C. for 1 hour, and thereafter, a sufficiently dried zinc oxide whisker was added and sufficiently stirred to obtain a well-dispersed slurry. Next, this slurry was filtered under reduced pressure, dried at 80 ° C. for 3 hours, sufficiently loosened, and heated at 150 ° C. for 8 hours to complete the surface treatment.
次に、ビーカに30ccのジクロロメタンを用意し、1gのポ
リカーボネート粉末(帝人化成(株)、パンライトK-13
00)をマグネチックスターラで攪拌しながら投入し、ポ
リカーボネート樹脂ワニスを得た。Next, prepare 30 cc of dichloromethane in a beaker and add 1 g of polycarbonate powder (Panlite K-13, Teijin Chemicals Ltd.).
00) was charged with stirring with a magnetic stirrer to obtain a polycarbonate resin varnish.
さらにこのワニス中にシラン処理したテトラポット状酸
化亜鉛ウイスカ1gを投入し、充分攪拌し、分散させた
後、ガラス板上に流延し、ドクターブレードで製膜し
た。次に、60℃の乾燥機器で1時間乾燥し、冷却後ガラ
ス板より剥し、評価測定に供した。製膜した膜の膜厚は
平均200μmであった。またウイスカの配合比率は約17V
ol.%(50wt%)であった。Further, 1 g of a tetrapot-shaped zinc oxide whisker treated with silane was put into this varnish, sufficiently stirred and dispersed, and then cast on a glass plate to form a film with a doctor blade. Next, it was dried with a drying device at 60 ° C. for 1 hour, cooled, peeled from the glass plate, and subjected to evaluation measurement. The average thickness of the formed film was 200 μm. The whisker content is about 17V.
It was ol.% (50 wt%).
作成した膜を6mm×30mm角に切断し、両端をクリップで
はさんで長手方向の抵抗値を測定した。この抵抗値の読
みと、膜厚を考慮して体積抵抗率(Ω−cm)を計算し
た。その結果を第1表に示した。The prepared film was cut into a 6 mm × 30 mm square, and both ends were clipped to measure the resistance value in the longitudinal direction. The volume resistivity (Ω-cm) was calculated in consideration of the reading of the resistance value and the film thickness. The results are shown in Table 1.
この膜は、表面が滑らかで、フレキシビリティーに富ん
でいた。この測定法で、105Ω−cm以下の膜は静電塗装
用等の導電膜として使え、その適用用途は極めて広い。The film had a smooth surface and was highly flexible. According to this measuring method, a film of 10 5 Ω-cm or less can be used as a conductive film for electrostatic coating, and its application is extremely wide.
比較例1 実施例1と同じ大きさのテトラポット状酸化亜鉛ウイス
カをシラン処理を施さずに用いることにより、実施例1
と全く同様に製膜して、評価した結果を第1表に示し
た。この膜はウイスカ同志の凝集が激しく、表面がボソ
ボソで極めて悪い膜質となった。Comparative Example 1 By using a tetrapot-shaped zinc oxide whisker having the same size as in Example 1 without silane treatment, Example 1 was used.
Table 1 shows the evaluation results obtained by forming a film in exactly the same manner as in. In this film, whiskers were strongly aggregated, and the surface was messy, resulting in extremely poor film quality.
比較例2 大きな形状のテトラポット状酸化亜鉛ウイスカを用意
し、実施例1と全く同様にして、膜を作成し、評価した
結果を第1表に示した。この膜の表面は若干凹凸が大き
かった。Comparative Example 2 A tetrapod-shaped zinc oxide whisker having a large shape was prepared, a film was formed in the same manner as in Example 1, and the evaluation results are shown in Table 1. The surface of this film was slightly uneven.
比較例3 小さな形状のテトラポット状酸化亜鉛ウイスカを用意
し、実施例1と全く同様にして、膜を作成し、評価した
結果を第1表に示した。Comparative Example 3 A tetrapod-shaped zinc oxide whisker having a small shape was prepared, a film was prepared in the same manner as in Example 1, and the evaluation results are shown in Table 1.
比較例4 市販の亜鉛華(1号:フランス法)を用意し、シラン処
理から製膜,測定まで実施例1と全く同様にして、膜を
作成し、評価した結果を第1表に示した。Comparative Example 4 A commercially available zinc white (No. 1: French method) was prepared, and a film was prepared and evaluated in exactly the same manner as in Example 1 from silane treatment to film formation and measurement. The results are shown in Table 1. .
比較例5 実施例1で用意したシラン処理のテトラポット状酸化亜
鉛ウイスカを準備した。Comparative Example 5 The silane-treated tetrapot-shaped zinc oxide whiskers prepared in Example 1 were prepared.
次に、300℃に加熱したブラベンダー中で、ポリカーボ
ネート樹脂ベレット(帝人化成(株)、パンライトK-13
00)と上記ウイスカを混練し(配合比率は50wt%)、同
じく、300℃下でプレスして、厚さ200μmの膜を製膜し
た。Next, in a Brabender heated to 300 ° C, a polycarbonate resin beret (Tanjin Kasei Co., Ltd., Panlite K-13) was used.
00) and the above whiskers were kneaded (mixing ratio was 50 wt%) and pressed at 300 ° C. to form a film having a thickness of 200 μm.
次にこの膜を、実施例1と同様に評価し、その結果を第
1表に示した。Next, this film was evaluated in the same manner as in Example 1, and the results are shown in Table 1.
実施例2 テトラポット状酸化亜鉛ウイスカを実施例1と同様にシ
ラン処理し、組成1の配合で充分混合したのち、ガラス
板上に、スプレー塗装し、常温で30分乾燥したのち、評
価した。その結果を第1表に示した。Example 2 Tetrapot-shaped zinc oxide whiskers were treated with silane in the same manner as in Example 1, thoroughly mixed with the composition of Composition 1, spray-coated on a glass plate, dried at room temperature for 30 minutes, and then evaluated. The results are shown in Table 1.
また膜厚は200μmであった。 The film thickness was 200 μm.
実施例3 テトラポット状酸化亜鉛ウイスカを実施例1と同様にシ
ラン処理し、組成2の配合で充分混合したのち、ガラス
板上に流延し、ドクターブレードで200μm厚に製膜
し、室温6時間で自然乾燥した後、評価した。結果を第
1表に示した。Example 3 A tetrapot-shaped zinc oxide whisker was treated with silane in the same manner as in Example 1, sufficiently mixed with the composition of Composition 2, cast on a glass plate, and formed into a film having a thickness of 200 μm with a doctor blade, and then at room temperature. After air-drying for time, it was evaluated. The results are shown in Table 1.
実施例4 まず、実施例1でシラン処理した酸化亜鉛ウイスカを用
意した。次に、直径0.5μmに粉砕したポリプロピレン
の微粉末を用意し、両者をジクロロメタン中で充分攪拌
分散しながら均一なスラリーを得た。ウイスカの配合比
率は35wt%であった。このスラリーをガラス板上に塗布
し、ドクターブレードで製膜して、60℃雰囲気で、1時
間乾燥した。次に、260℃の恒温槽中に10分間入れ、ポ
リプロピレンを溶解させ、製膜した。この膜(厚さ200
μm)をガラス板より剥し、評価した結果を第1表に示
した。 Example 4 First, the silanized zinc oxide whiskers of Example 1 were prepared. Next, fine polypropylene powder pulverized to a diameter of 0.5 μm was prepared, and both were sufficiently stirred and dispersed in dichloromethane to obtain a uniform slurry. The whisker content was 35 wt%. This slurry was applied on a glass plate, formed into a film with a doctor blade, and dried in an atmosphere at 60 ° C. for 1 hour. Next, it was placed in a constant temperature bath at 260 ° C. for 10 minutes to dissolve polypropylene and form a film. This film (thickness 200
(μm) was peeled from the glass plate and the evaluation results are shown in Table 1.
実施例5 生成したままの酸化亜鉛ウイスカを組成3の配合で充分
混合したのち ガラス板上に流延し、常温で1時間、続いて80℃で4時
間乾燥した後、評価した。膜厚は平均200μmとなるよ
うにした。その結果を第2表に示した。 Example 5 As-produced zinc oxide whiskers were thoroughly mixed in the composition 3 and then It was cast on a glass plate, dried at room temperature for 1 hour, and then dried at 80 ° C. for 4 hours, and then evaluated. The average film thickness was 200 μm. The results are shown in Table 2.
実施例6 別のサイズの生成したままの酸化亜鉛ウイスカを用いて
実施例5と全く同様に評価し、その結果を第2表に示し
た。このとき膜厚は同じく200μmとなるように製膜し
た。Example 6 Using another size of as-produced zinc oxide whiskers, evaluation was performed in exactly the same manner as in Example 5, and the results are shown in Table 2. At this time, the film was formed so that the film thickness was also 200 μm.
実施例7 酸化亜鉛ウイスカの表面に、無電解メッキの手法で、銀
メッキした。自然状態に堆積したこのウイスカの山に1
対のテスタ(Kaise社製、ディジタルマルチメータSK-65
11)の針を挿入したところ0.2Ωを示した。Example 7 The surface of a zinc oxide whisker was silver-plated by a method of electroless plating. 1 on this mountain of whiskers that has naturally accumulated
Paired tester (Kaise, Digital Multimeter SK-65
When the needle of 11) was inserted, it showed 0.2Ω.
この銀メッキウイスカを用いて、実施例1と同様に、ポ
リカーボネートの膜を製膜し。このとき膜厚は平均160
μmであった。この膜の評価結果を第2表に示した。Using this silver-plated whisker, a polycarbonate film was formed in the same manner as in Example 1. At this time, the average film thickness is 160
was μm. The evaluation results of this film are shown in Table 2.
実施例8〜13 各種のバインダおよび、各種の酸化亜鉛ウイスカを用い
て、導電性シートを製膜し、評価した結果を第2表に示
した。膜厚はいずれも平均200μmとなるようにし、固
形分全体に対する酸化亜鉛ウイスカの配合は10Vol.%で
あった。Examples 8 to 13 A conductive sheet was formed into a film using various binders and various zinc oxide whiskers, and the evaluation results are shown in Table 2. The film thicknesses were all set to an average of 200 μm, and the content of zinc oxide whiskers was 10 vol.% Based on the entire solid content.
比較例6 ポリカーボネートのシートを作成し(200μm厚)、評
価をしたところ、第2表に示す通りの結果が得られた。Comparative Example 6 A polycarbonate sheet was prepared (thickness: 200 μm) and evaluated, and the results shown in Table 2 were obtained.
比較例7 市販の亜鉛華(1号:フランス法)を用意し、ポリカー
ボネート中に配合(33wt%;10Vol.%)したシート(約2
00μm厚)の評価結果を第2表に示した。Comparative Example 7 A commercially available zinc white (No. 1: French method) was prepared and blended in polycarbonate (33 wt%; 10 Vol.%) Sheet (about 2
The evaluation results for the thickness of 00 μm) are shown in Table 2.
比較例8 微細な酸化亜鉛ウイスカを用意し、実施例5と同様に評
価したところ、第2表の通りの結果であった。なお、膜
厚は約200μmであった。Comparative Example 8 When fine zinc oxide whiskers were prepared and evaluated in the same manner as in Example 5, the results shown in Table 2 were obtained. The film thickness was about 200 μm.
比較例9 長さ200〜300μm、基部の径が14〜16μmφのテトラポ
ット状酸化亜鉛ウイスカを用意し、実施例5と全く同様
にして製膜したところ、表面の凹凸の多い悪い膜質とな
り、体積抵抗値は約7×105Ω−cmであった。このとき
膜厚は、150〜400μmとなり、粗な面であった。Comparative Example 9 A tetrapot-shaped zinc oxide whisker having a length of 200 to 300 μm and a diameter of the base portion of 14 to 16 μm was prepared and formed into a film in exactly the same manner as in Example 5, which resulted in a bad film quality with many surface irregularities and a volume. The resistance value was about 7 × 10 5 Ω-cm. At this time, the film thickness was 150 to 400 μm, which was a rough surface.
実施例14 電子顕微鏡1500倍の視野において、針状結晶部の基部の
径が0.1〜3μmで、基部から先端までの長さが3〜30
μmのテトラポット形状をした酸化亜鉛ウイスカを用意
した。 Example 14 In a field of view of 1500 times with an electron microscope, the diameter of the base of the needle-shaped crystal part is 0.1 to 3 μm, and the length from the base to the tip is 3 to 30.
A zinc oxide whisker having a μm-tetrapod shape was prepared.
次に組成4の配合で混合し、 酸化亜鉛ウイスカ 9g ポリ塩化ビニル−アクリル共重合体樹脂 12g 組成4 メチルエチルケトン 50g トルエン 15g メチルイソブチルケトン 25g 容器中にてガラス棒で3分間よく攪拌した。Next, the composition 4 was mixed and mixed, and zinc oxide whiskers 9 g polyvinyl chloride-acrylic copolymer resin 12 g composition 4 methyl ethyl ketone 50 g toluene 15 g methyl isobutyl ketone 25 g were well stirred in a container for 3 minutes with a glass rod.
この塗料をガラス板上に薄く流延し、3時間自然乾燥し
た後、さらに、80℃で15時間乾燥した。This coating material was thinly cast on a glass plate, naturally dried for 3 hours, and further dried at 80 ° C. for 15 hours.
得られた塗膜は白色で、平滑な表面状態であり、この塗
膜上の2点間(中央部で距離:5cm)を金属(銀メッキ)
針で押え、DC100Vを課電すると20μA流れ、良好な導電
性を示すことがわかった。またこの塗膜は平均100μm
の厚さであった。The coating film obtained was white and had a smooth surface condition. A metal (silver plating) was applied between two points on this coating film (distance: 5 cm at the center).
It was found that when it was pressed down with a needle and a voltage of 100 V DC was applied, 20 μA flowed, indicating good conductivity. This coating has an average of 100 μm
Was the thickness of.
発明の効果 以上のように本発明の導電性樹脂膜とその製造方法によ
れば、少量のウイスカを配合するだけで適切な導電性が
得られることにより、フレキシビリティに富んだ導電性
樹脂膜が得られ、しかも色相が限定されず安定な膜とな
る。EFFECTS OF THE INVENTION As described above, according to the conductive resin film of the present invention and the method for producing the conductive resin film, a conductive resin film rich in flexibility can be obtained because suitable conductivity can be obtained only by adding a small amount of whiskers. The obtained film is stable and the hue is not limited.
本発明の応用範囲は前述した如く、極めて広範囲であ
り、その産業性は極めて大なるものがある。As described above, the application range of the present invention is extremely wide, and its industrial applicability is extremely great.
第1図は本発明の導電性樹脂膜に用いられる酸化亜鉛ウ
イスカの結晶構造を示す電子顕微鏡写真である。FIG. 1 is an electron micrograph showing the crystal structure of zinc oxide whiskers used in the conductive resin film of the present invention.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 H01B 1/20 B 7244−5G (72)発明者 北野 基 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 ▲吉▼田 英行 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (56)参考文献 特開 平3−48500(JP,A)─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification number Internal reference number FI Technical indication location H01B 1/20 B 7244-5G (72) Inventor Moto Kitano 1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric Sangyo Co., Ltd. (72) Inventor ▲ Yoshi ▼ Hideyuki Ta, 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) Reference JP-A-3-48500 (JP, A)
Claims (5)
た針状結晶部からなる酸化亜鉛ウイスカーを配合した導
電性樹脂膜。1. A conductive resin film containing a zinc oxide whisker comprising a core and needle-shaped crystal parts extending in four different axial directions from the core.
た針状結晶部を具備し、かつ、少なくとも前記針状結晶
部の一部が導電性材料によりコートされた酸化亜鉛ウイ
スカーを配合した導電性樹脂膜。2. A zinc oxide whisker comprising a core portion and needle-shaped crystal portions extending from the core portion in different four-axis directions, and at least a part of the needle-shaped crystal portion is coated with a conductive material. Blended conductive resin film.
り、基部から先端までの長さが3〜200μmである請求
項1または2記載の導電性樹脂膜。3. The conductive resin film according to claim 1, wherein the base of the needle-shaped crystal portion has a diameter of 0.1 to 14 μm, and the length from the base to the tip is 3 to 200 μm.
少なくとも一部が導電性材料によりコートされたテトラ
ポット状酸化亜鉛ウイスカを、バインダ溶液に配合する
第1工程と、さらに製膜し加熱または乾燥する第2工程
より成る導電性樹脂膜の製造方法。4. A tetrapot-shaped zinc oxide whisker, or
A method for producing a conductive resin film comprising a first step of blending a tetrapot-shaped zinc oxide whisker at least a part of which is coated with a conductive material in a binder solution, and a second step of further forming a film and heating or drying.
少なくとも一部が導電性材料によりコートされたテトラ
ポット状酸化亜鉛ウイスカを、カップリング剤で表面処
理する第1工程と、このウイスカをバインダ溶液に配合
する第2工程と、さらに製膜し加熱または乾燥する第3
工程より成る導電性樹脂膜の製造方法。5. A tetrapot-shaped zinc oxide whisker, or
A first step in which a tetrapot-shaped zinc oxide whisker at least a part of which is coated with a conductive material is surface-treated with a coupling agent, a second step in which the whisker is mixed with a binder solution, and a film is formed and heated or Third to dry
A method for producing a conductive resin film, which comprises steps.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22501788 | 1988-09-08 | ||
| JP63-225017 | 1988-09-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02168698A JPH02168698A (en) | 1990-06-28 |
| JPH077876B2 true JPH077876B2 (en) | 1995-01-30 |
Family
ID=16822767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1198991A Expired - Lifetime JPH077876B2 (en) | 1988-09-08 | 1989-07-31 | Conductive resin film and method for manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH077876B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005108956A (en) * | 2003-09-29 | 2005-04-21 | Matsushita Electric Ind Co Ltd | Chip electronic components |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05117447A (en) * | 1991-10-31 | 1993-05-14 | Matsushita Electric Ind Co Ltd | Conductive resin composition and electronic component storage container |
| JP2002057485A (en) * | 2000-06-01 | 2002-02-22 | Yokohama Rubber Co Ltd:The | Composition of electric wave absorbing body |
| JP5061005B2 (en) * | 2008-03-26 | 2012-10-31 | 株式会社神戸製鋼所 | Conductive resin film |
| JP2008179834A (en) * | 2008-04-01 | 2008-08-07 | Ricoh Co Ltd | Elastic conductive resin |
| CN108117656A (en) * | 2017-12-22 | 2018-06-05 | 歌尔股份有限公司 | Vibrating diaphragm for sound-producing device and preparation method thereof |
| CN114316440B (en) * | 2022-03-17 | 2022-07-12 | 宁波博利隆复合材料科技有限公司 | Antistatic polypropylene-based composite material, and preparation method and application thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH077875B2 (en) * | 1988-12-19 | 1995-01-30 | 松下電器産業株式会社 | Radio wave absorber |
-
1989
- 1989-07-31 JP JP1198991A patent/JPH077876B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005108956A (en) * | 2003-09-29 | 2005-04-21 | Matsushita Electric Ind Co Ltd | Chip electronic components |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02168698A (en) | 1990-06-28 |
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