JPH0779190B2 - Method for manufacturing three-dimensional molded substrate - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a three-dimensional molded substrate.

[0002]

2. Description of the Related Art For example, in order to integrally form a circuit pattern inside a molded product having a U-shaped cross section such as a box shape, as shown in FIG. 4 and FIG. Convex portion 71 that enters into the concave portion 61 of the mold 60
A predetermined circuit pattern 6 on the mold surface of the movable side mold 70 having
The circuit film 66 having 5 is arranged, and after the mold is clamped, the resin material P is injected to form the circuit pattern integrally with the molding of the molded product. In the figure, reference numeral 64 is a sprue hole, 67 is a stripper plate, 68 is a block member provided on the stripper plate 67, and 69.
Is a projecting member for peeling the circuit film.

However, in the past, this circuit film 6 was used.
When arranging 6 on the movable die surface, as shown in FIG. 4, the circuit film 66 whose predetermined position is confirmed by the positioning sensor 75 is pressed and fixed by the film presser 76 provided on the feed side. . However, although such a method is generally suitable for forming a circuit pattern on the surface of a general plate-shaped molded product, it is extremely difficult to position the circuit film in the case of a three-dimensional molded product having a U-shaped cross section. .

That is, as can be easily understood from FIG. 5 showing the mold clamping state, when the circuit film 66 is fed to the surface of the convex portion 71 of the movable side mold 70 during the mold clamping, the film is projected on the convex portion surface. The upper surface of the movable-side mold convex portion, which is a functionally important portion that serves as the bottom surface inside the concave portion of the molded product, is likely to cause a pattern shift in this portion.

[0005]

Therefore, the present invention is
It is an object of the present invention to provide a method for manufacturing a circuit board molded product in which a circuit film is accurately arranged on the inner bottom surface of such a three-dimensional molded product and the circuit pattern is not displaced.

[0006]

That is, the present invention is
In forming a circuit pattern integrally with the molding of a molded product by arranging a circuit film on the mold surface of a movable mold having a convex portion that enters the concave portion of a fixed mold having a concave portion,
A convex surface portion that abuts the convex portion of the movable side mold via the circuit film is provided in the concave portion of the fixed side mold, and the movable side mold surface corresponding to the convex surface portion is smaller than the convex surface portion. The present invention relates to a method for manufacturing a three-dimensional molded substrate, characterized in that a circuit film suction hole is provided, and the circuit film is suction-fixed to the movable die surface by the suction hole to mold a substrate molded product.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 is a perspective view showing an example of a three-dimensional molded substrate obtained by the manufacturing method of the present invention together with a cross section, FIG. 2 is a schematic sectional view showing the method of manufacturing the three-dimensional molded substrate of the present invention, and FIG. It is a schematic sectional drawing.

As shown in FIG. 1, a three-dimensional molded substrate 10 obtained by the manufacturing method of the present invention has a substrate body 11 having a U-shaped cross section such as a box shape, and an inner bottom face portion 14 thereof is made of copper. The circuit pattern 12 made of foil or conductive paste is integrally formed. In addition, as shown in the figure, the three-dimensional molded substrate 10 has a plurality of holes 1 for attachment.
3, 13 are formed.

An embodiment of a method for manufacturing a three-dimensional molded substrate according to the present invention will be described with reference to FIGS. 2 and 3. The injection mold shown in FIGS. 2 and 3 is composed of a fixed mold 20 having a concave portion 21 and a movable mold 30 having a convex portion 31 which is inserted into the concave portion 21. The circuit film 40 is arranged on the mold surface to integrally form a circuit pattern simultaneously with the molding of the molded product. Reference numeral 29 is a sprue hole, 49 is a positioning sensor that determines the position of the circuit film 40, 57 is a stripper plate, and 58.
Is a block member provided on the stripper plate, and 59 is a protruding member for peeling the circuit film.

In the concave portion 21 of the fixed-side mold 20, a convex surface portion 23 is provided so as to come into contact with the convex portion 31 of the movable-side mold 30 via the circuit film on the mold surface 22 thereof. As the projecting surface portion 23, a projecting portion provided to form a hole for mounting a molded product can be used, and a plurality of projecting surface portions 23 are provided at appropriate positions of the molded product as so-called discarding hole projecting portions.

On the other hand, in the convex portion 31 of the movable side die 30, a circuit film suction hole portion 33 is formed in a die surface 32 corresponding to the projecting surface portion 23. The circuit film suction hole 33 is connected to a suction device (not shown) such as a vacuum pump provided outside the machine, and the circuit film 40 is attached to the mold surface 32 after completion of the circuit film positioning at the time of mold opening. Adsorb and fix to. The size of the circuit film suction hole 33 is formed to be smaller than the upper area of the projecting surface portion 23 so as to come into contact with and be closed by the projecting surface portion 23 during mold clamping.

Circuit film 40 used in the present invention
A known transfer film in which a circuit pattern 42 made of copper or a conductive paste is formed on the surface of a flexible film member 41 is preferably used. The circuit film 40 of this embodiment is provided with a sensor mark 45, and when the positioning sensor 49 senses the sensor mark 45, the circuit film 40 is arranged at a target position on the mold surface 32. ing.

First, on the upper surface of the convex portion 31 of the movable side mold 30 in the mold open state, the circuit film 40 is formed by a film feeder (not shown) outside the machine and the circuit pattern 42 thereof is the concave portion of the fixed side mold 20. It is sent so that it is on the 21st side. The sensor mark 45 of the circuit film 40 is sensed by the positioning sensor 49, and the circuit film 40 is arranged at a predetermined position on the die surface. Then, the circuit film adsorption hole 33 adsorbs the circuit film 40 on the die surface 32 of the convex portion 31. Fixed.

Next, the stripper plate 57 advances toward the movable mold 30 side to bring the circuit film 40 into close contact with the surface of the convex portion 31 of the fixed mold 30. At this time, an appropriate tension is applied to the circuit film 40 so that the circuit film 40 can be smoothly brought into close contact with the convex portion 31.

Subsequently, the movable side mold 30 is replaced with the fixed side mold 20.
When the convex portion 31 of the movable-side mold 30 enters the concave portion 21 of the fixed-side mold 20 and is clamped, the convex mold 25 of the fixed-side mold 20 causes the stripper plate 57 to move. The block member 58 is extruded toward the convex portion 31 of the movable side mold 30 to form the molded product cavity 35 between the concave portion 21 and the convex portion 31 and fix the circuit film 40.

The cavity 3 is provided by an injection device (not shown).
A resin material P is injected into the resin 5 to form the circuit pattern 42 integrally with the molding of the molded product. Circuit film suction hole 3 provided on the convex portion 31 of the movable mold 30.
Since 3 is formed smaller than the projecting surface portion 23,
It is closed by the projecting surface portion 23 of the fixed-side mold 20 during mold clamping. Therefore, the injected resin material P does not leak out of the mold through the circuit film suction holes 33.

After opening the mold, the stripper plate 57
Only the film member 41 is peeled off from the circuit film 40 by the projecting member 59. In the embodiment, the stripper plate type mold has been described, but it goes without saying that the present invention can also be applied to a normal protruding pin type mold.

[0018]

As shown and described above, according to the method for manufacturing a three-dimensional molded substrate of the present invention, the circuit film can be set accurately, quickly and easily on the mold surface of the movable mold. Therefore, it is possible to surely arrange the film without shifting or rubbing even on a three-dimensionally molded substrate, which has conventionally been difficult to arrange the film such as a U-shape,
It is possible to obtain a highly accurate three-dimensional molded substrate.

[Brief description of drawings]

FIG. 1 is a perspective view showing an example of a three-dimensional molded substrate obtained by a manufacturing method of the present invention.

FIG. 2 is a schematic cross-sectional view showing a method of manufacturing a three-dimensional molded substrate of the present invention.

FIG. 3 is a schematic cross-sectional view showing the mold clamped state.

FIG. 4 is a schematic cross-sectional view showing a conventional method for manufacturing a three-dimensional molded substrate.

FIG. 5 is a schematic cross-sectional view showing the time of mold clamping.

[Explanation of symbols]

 10 Three-dimensional Molded Substrate 11 Substrate Body 12 Circuit Pattern 13 Hole 20 Fixed Side Mold 21 Recessed 23 Recessed Surface 30 Movable Side Mold 31 Convex 32 Mold Surface 33 Circuit Film Adsorption Hole 40 Circuit Film 42 Circuit Pattern

 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-4-69221 (JP, A) JP-A-63-164394 (JP, A)

Claims (1)

[Claims] 1. When a circuit film is arranged on the mold surface of a movable mold having a convex portion which is inserted into the concave portion of a fixed mold having a concave portion, a circuit pattern is integrally formed at the same time when a molded product is molded. In the concave portion of the fixed-side mold, a convex surface portion that comes into contact with the convex portion of the movable-side mold via the circuit film is projected, and the movable-side mold surface corresponding to the convex surface portion is formed from the convex surface portion. A method for producing a three-dimensional molded substrate, characterized in that a small circuit film suction hole is provided, and the circuit film is suction-fixed to the movable mold surface by the suction hole to mold a substrate molded article.