JPH0780972B2 - Polymerizable composition for resin mold molding and resin mold - Google Patents
Polymerizable composition for resin mold molding and resin moldInfo
- Publication number
- JPH0780972B2 JPH0780972B2 JP4051734A JP5173492A JPH0780972B2 JP H0780972 B2 JPH0780972 B2 JP H0780972B2 JP 4051734 A JP4051734 A JP 4051734A JP 5173492 A JP5173492 A JP 5173492A JP H0780972 B2 JPH0780972 B2 JP H0780972B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- weight
- meth
- parts
- resin mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 title claims description 77
- 239000011347 resin Substances 0.000 title claims description 77
- 239000000203 mixture Substances 0.000 title claims description 24
- 238000000465 moulding Methods 0.000 title claims description 16
- 238000006116 polymerization reaction Methods 0.000 claims description 14
- 239000000945 filler Substances 0.000 claims description 12
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 12
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 8
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 8
- 229920001567 vinyl ester resin Polymers 0.000 claims description 8
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims description 6
- 229920006305 unsaturated polyester Polymers 0.000 claims description 6
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 4
- 239000000654 additive Substances 0.000 claims description 3
- 230000000996 additive effect Effects 0.000 claims description 3
- 239000012948 isocyanate Substances 0.000 claims description 3
- 150000002513 isocyanates Chemical class 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- 239000003365 glass fiber Substances 0.000 description 23
- 238000005259 measurement Methods 0.000 description 17
- 238000010586 diagram Methods 0.000 description 15
- 239000003505 polymerization initiator Substances 0.000 description 15
- 238000010276 construction Methods 0.000 description 12
- 150000003673 urethanes Chemical class 0.000 description 10
- 229920001228 polyisocyanate Polymers 0.000 description 8
- 239000005056 polyisocyanate Substances 0.000 description 8
- 229920005862 polyol Polymers 0.000 description 8
- 150000003077 polyols Chemical class 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 7
- -1 polymethylene Polymers 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- 229920006337 unsaturated polyester resin Polymers 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Natural products CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 5
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 5
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 229930185605 Bisphenol Natural products 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 3
- 239000004342 Benzoyl peroxide Substances 0.000 description 3
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 3
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 235000019400 benzoyl peroxide Nutrition 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000012662 bulk polymerization Methods 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000193 polymethacrylate Polymers 0.000 description 2
- 229920006389 polyphenyl polymer Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 229920002978 Vinylon Polymers 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- 238000007046 ethoxylation reaction Methods 0.000 description 1
- 229960005191 ferric oxide Drugs 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- GYVGXEWAOAAJEU-UHFFFAOYSA-N n,n,4-trimethylaniline Chemical compound CN(C)C1=CC=C(C)C=C1 GYVGXEWAOAAJEU-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、例えばFRP製品を成
形するための樹脂型、及びこの樹脂型成形用の重合性組
成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin mold for molding FRP products, for example, and a polymerizable composition for molding the resin mold.
【0002】[0002]
【従来技術】樹脂型は、金型に比べ短かい工期で安価に
製作できるため少量多品種のプラスチック製品の生産に
広く使用されている。樹脂型成形用の樹脂としては、不
飽和ポリエステル、ビニルエステル、エポキシ、ウレタ
ン、シリコン等が用いられ、該樹脂はガラス繊維等の強
化材、アルミニウムや鉄等の金属粉、又は水酸化アルミ
ニウムやガラス粉等の充填材と組み合わされて成形され
る。2. Description of the Related Art Resin molds are widely used in the production of a large number of small quantities of plastic products because they can be manufactured at a lower cost in a shorter construction period than molds. As the resin for resin molding, unsaturated polyester, vinyl ester, epoxy, urethane, silicon, etc. are used, and the resin is a reinforcing material such as glass fiber, metal powder such as aluminum or iron, or aluminum hydroxide or glass. It is molded in combination with a filler such as powder.
【0003】[0003]
【発明が解決しようとする課題】樹脂型は短かい工期に
製作できるとはいえ、いずれの樹脂も完全硬化までには
かなりの日数を要するため、数週間の工期は必要であ
る。製作日数を短かくするには、通常、硬化剤量を増や
したり、樹脂型を一度に厚く成形したり、又加熱加温を
行うといった方策が取られている。Although the resin mold can be manufactured in a short construction period, it takes a considerable number of days for all the resins to completely cure, so that a construction period of several weeks is necessary. In order to shorten the number of manufacturing days, measures such as increasing the amount of the curing agent, molding the resin mold thick at once, or heating and heating are usually taken.
【0004】しかし、このように樹脂の硬化反応を急激
に進めると、樹脂の発熱収縮によって寸法が狂ったり、
クラックやソリが発生する。従って、樹脂型は、熟練者
がゆっくりと時間をかけ樹脂の発熱を制御しながら成形
する必要があった。即ち、型としての要求特性を満たす
には、型成形の工期がある程度長引くことは避けられな
かった。However, when the curing reaction of the resin is rapidly progressed in this way, the dimensions may change due to heat shrinkage of the resin,
Cracks and warpage occur. Therefore, it is necessary for a skilled person to slowly mold the resin mold while controlling the heat generation of the resin. That is, in order to satisfy the required characteristics of the mold, it is inevitable that the molding period is extended to some extent.
【0005】本発明は、上記問題点に鑑み、外部からの
加熱加温なしに短時間で樹脂が完全に硬化し、且つ寸法
精度がよくクラックやソリのない耐久性のある樹脂型を
容易に成形できる材料を提供することを目的とする。In view of the above problems, the present invention facilitates a resin mold which is completely hardened in a short time without heating and heating from the outside, has good dimensional accuracy, and is durable and free from cracks and warps. The object is to provide a material that can be molded.
【0006】[0006]
【課題を解決するための手段】本発明者は、従来の樹脂
型にクラック、ソリや寸法の狂いが発生する原因は、樹
脂型の成形に使用される樹脂が完全に硬化していないこ
とにあり、このような型が実際に成形品を製造するため
に繰り返し加熱、冷却されると、更に型樹脂の反応が進
み、これが型として致命的な上記のような問題を引き起
こすことを突き止めた。そして、特定の重合性組成物が
常温でも数分で完全に硬化することを見い出し、本発明
を完成するに至った。The present inventors have found that the cause of cracks, warps and dimensional deviations in conventional resin molds is that the resin used for molding the resin mold is not completely cured. However, it has been found that when such a mold is repeatedly heated and cooled to actually manufacture a molded product, the reaction of the mold resin further proceeds, which causes the above-mentioned fatal problems as a mold. Then, they found that the specific polymerizable composition was completely cured in a few minutes even at room temperature, and completed the present invention.
【0007】すなわち、本発明は、(a) ヒドロキシアル
キル(メタ)アクリレートのヒドロキシル基と、ウレタ
ン基を有さずかつ2.0を越えるイソシアネート官能価
を有する多価イソシアネートのイソシアネート基との反
応により得られた多価(メタ)アクリレート(以下、単
に不飽和ウレタンという)、(b) メチルメタクリレー
ト、(c) ビニル系重合体からなる低収縮剤及び(d) 充填
材を含有してなる樹脂型成形用重合用組成物である。That is, the present invention provides the reaction of (a) a hydroxyl group of a hydroxyalkyl (meth) acrylate with an isocyanate group of a polyvalent isocyanate having no urethane group and having an isocyanate functionality of more than 2.0. the resulting polyvalent (meth) acrylates bets (hereinafter, simply referred to as unsaturated urethane), (b) methyl methacrylate, a resin comprising a low-profile additive and (d) filler (c) consisting vinyl polymer It is a composition for polymerization for molding.
【0008】本発明による重合用組成物は、上記成分
(a) 不飽和ウレタン、(b) メチルメタクリレート、(c)
低収縮剤及び(d) 充填材の他に、必要に応じて、(e) 不
飽和ポリエステル又はビニルエステル樹脂及び/又は
(f) 一般式:The composition for polymerization according to the present invention comprises the above components.
(a) unsaturated urethane, (b) methyl methacrylate, (c)
In addition to the low-shrinking agent and (d) filler, (e) unsaturated polyester or vinyl ester resin and / or
(f) General formula:
【化2】 (式中、Rは水素原子又はメチル基を意味する)で表さ
れる複数の(メタ)アクリレート基を有し、ウレタン基
又はヒドロキシル基を有さない化合物を含むこともあ
る。この場合、不飽和ポリエステル又はビニルエステル
樹脂(e) の添加により不飽和ウレタン(a) の使用量を減
らし、化合物(f) の添加によりメチルメタクリレート
(b) の使用量を減らして、コストダウンを達成できる。
また成分(e) 及び(f) は顔料のビヒクルの役目も果た
す。[Chemical 2] A compound having a plurality of (meth) acrylate groups represented by the formula (wherein R represents a hydrogen atom or a methyl group) and having no urethane group or hydroxyl group may be included. In this case, the amount of unsaturated urethane (a) used is reduced by adding unsaturated polyester or vinyl ester resin (e), and methyl methacrylate is added by adding compound (f).
Cost reduction can be achieved by reducing the amount of (b) used.
Components (e) and (f) also serve as a vehicle for the pigment.
【0009】不飽和ウレタン(a) は、ヒドロキシアルキ
ル(メタ)アクリレートのヒドロキシル基と、ウレタン
基を有さずかつ2.0を越えるイソシアネート官能価を
有するポリイソシアネートのイソシアネート基との反応
により、ヒドロキシアルキル(メタ)アクリレートから
誘導されたポリウレタンポリ(メタ)アクリレート樹脂
である。Unsaturated urethanes (a) are prepared by reacting the hydroxyl groups of hydroxyalkyl (meth) acrylates with the isocyanate groups of polyisocyanates which have no urethane groups and which have an isocyanate functionality of greater than 2.0. A polyurethane poly (meth) acrylate resin derived from an alkyl (meth) acrylate.
【0010】不飽和ウレタン(a) としてのヒドロキシア
ルキル(メタ)アクリレートは、ヒドロキシルアルキル
基中に2〜4個の炭素原子を含有する。ウレタン基を有
していないポリイソシアネートはたとえばポリメチレン
ポリフェニルポリイソシアネートである。ポリイソシア
ネートのイソシアネート官能価は好ましくは2.5〜
3.0である。Hydroxyalkyl (meth) acrylates as unsaturated urethanes (a) contain 2 to 4 carbon atoms in the hydroxylalkyl group. The polyisocyanate having no urethane group is, for example, polymethylene polyphenyl polyisocyanate. The isocyanate functionality of the polyisocyanate is preferably 2.5 to
It is 3.0.
【0011】低収縮剤(c) は、たとえば、塩化ビニル/
酢酸ビニル共重合体、ポリスチレン、飽和ポリエステ
ル、飽和ポリエステル/ポリ塩化ビニル混合物及びメタ
クリレート単独重合体又は共重合体のうちから選ばれ
る。The low shrinkage agent (c) is, for example, vinyl chloride /
It is selected from vinyl acetate copolymers, polystyrene, saturated polyesters, saturated polyester / polyvinyl chloride mixtures and methacrylate homopolymers or copolymers.
【0012】充填材(d) は、たとえば、鉄粉、アルミニ
ウム粉等の金属粉、ガラス粉、硅石粉、炭酸カルシウ
ム、水酸化アルミニウム等の無機充填材や顔料、又ミル
ドファイバー、ビニロン等の繊維状材料である。The filler (d) is, for example, metal powder such as iron powder and aluminum powder, glass powder, silica powder, calcium carbonate, inorganic filler and pigments such as calcium carbonate and aluminum hydroxide, and fibers such as milled fiber and vinylon. It is a material.
【0013】不飽和ポリエステル樹脂(e) は、たとえば
(i) マレイン酸及び/又はフマル酸、(ii)フタル酸及び
/又はイソフタル酸及び/又はテレフタル酸、(iii) エ
チレングリコール及び/又はプロピレングリコール、及
び(iv)アルコキシル化ビスフェノール類から誘導され得
る。The unsaturated polyester resin (e) is, for example,
can be derived from (i) maleic acid and / or fumaric acid, (ii) phthalic acid and / or isophthalic acid and / or terephthalic acid, (iii) ethylene glycol and / or propylene glycol, and (iv) alkoxylated bisphenols .
【0014】ビニルエステル樹脂(e) は、エポキシ樹脂
に(メタ)アクリル酸を反応させて得られ、必要に応じ
て更に不飽和ウレタンでヒドロキシル基をウレタン化し
たものである。The vinyl ester resin (e) is obtained by reacting an epoxy resin with (meth) acrylic acid and, if necessary, further urethanized the hydroxyl group with unsaturated urethane.
【0015】複数の(メタ)アクリレート基を有する化
合物(f) は、一般式:The compound (f) having a plurality of (meth) acrylate groups has the general formula:
【化3】 (式中、Qは有機ポリオールからヒドロキシル基を除去
した後に残った有機残基であり、nは少なくとも2の整
数である)によって表わされる。有機ポリオールは単純
なジオール、たとえばエチレングリコール、プロピレン
グリコール、ジエチレングリコール、1,4−ブタンジ
オール又は1,6−ヘキサンジオール:トリオール、た
とえばグリセリン又はトリメチロールプロパン:又はよ
り高官能性のポリオールであり得る。他の適当なポリオ
ールはポリエステルポリオール、たとえば上述したポリ
オールとアジピン酸のようなジカルボン酸との反応生成
物及びポリエーテルポリオール、たとえばエチレンオキ
シド及び/又はプロピレンオキシドに基づくポリオキシ
アルキレンポリオールを包含する。さらに別のポリオー
ルはビスフェノール類のビス−グリシジルエーテル類及
びオキシエチレン化又はオキシプロピレン化ビスフェノ
ール類を包含する。[Chemical 3] Where Q is the organic residue remaining after removing the hydroxyl groups from the organic polyol and n is an integer of at least 2. The organic polyol can be a simple diol such as ethylene glycol, propylene glycol, diethylene glycol, 1,4-butanediol or 1,6-hexanediol: triol, such as glycerine or trimethylolpropane: or a higher functionality polyol. Other suitable polyols include polyester polyols such as the reaction products of the above-mentioned polyols with dicarboxylic acids such as adipic acid and polyether polyols such as polyoxyalkylene polyols based on ethylene oxide and / or propylene oxide. Still other polyols include bis-glycidyl ethers of bisphenols and oxyethylenated or oxypropyleneized bisphenols.
【0016】したがって、化合物(f) は(メタ)アクリ
ロールハライドたとえばクロライドとビスフェノールの
エトキシ化及び/又はプロポキシ化によって誘導される
ジオールとの反応生成物、たとえば米国特許第2,89
0,202号明細書に記載されるごとき、式:Thus, compound (f) is a reaction product of a (meth) acrylol halide such as chloride with a diol derived by ethoxylation and / or propoxylation of bisphenol, eg US Pat. No. 2,89.
No. 0,202, the formula:
【化4】 で示される化合物であり得る。[Chemical 4] May be a compound represented by
【0017】上記重合性組成物の重合は、通常は塊状重
合によって行われるが、重合形態はこれに限定されな
い。塊状重合の場合、この分野で周知の方法を使用して
重合を行い得る。Polymerization of the above-mentioned polymerizable composition is usually carried out by bulk polymerization, but the form of polymerization is not limited to this. In the case of bulk polymerization, the polymerization can be carried out using methods well known in the art.
【0018】重合開始剤としては、所望の重合温度及び
重合速度に応じて、広範囲の重合開始剤を種々の濃度で
使用し得る。重合開始剤は例えば過酸化ベンゾイル、ア
セチルアセトンパーオキサイド、メチルエチルケトンパ
ーオキサイド等のパーオキシド類であり得る。重合開始
剤はナフテン酸コバルト、第3級アミン等の重合促進剤
と組合せて使用し得る。多くの場合に適当な組合せは過
酸化ベンゾイルとN,N−ジメチルアニリン又はN,N
−ジメチル−P−トルイジンとの組合せである。As the polymerization initiator, a wide range of polymerization initiators can be used in various concentrations depending on the desired polymerization temperature and polymerization rate. The polymerization initiator may be, for example, peroxides such as benzoyl peroxide, acetylacetone peroxide, methyl ethyl ketone peroxide and the like. The polymerization initiator may be used in combination with a polymerization accelerator such as cobalt naphthenate and a tertiary amine. In many cases suitable combinations are benzoyl peroxide and N, N-dimethylaniline or N, N
-Combination with dimethyl-P-toluidine.
【0019】上記重合体組成物の配合割合については、
不飽和ウレタン(a) +メチルメタクリレート(b) の合計
100重量部に対して、不飽和ウレタン(a) は好ましく
は10〜90重量部、特に好ましくは25〜50重量
部、低収縮剤(c) は好ましくは1〜25重量部、特に好
ましくは5〜15重量部、充填材(d) は好ましくは10
〜300重量部、特に好ましくは50〜150重量部で
ある。不飽和ポリエステル又はビニルエステル樹脂(e)
、及び複数の(メタ)アクリレート基を含む化合物(f)
の配合割合については、不飽和ウレタン+メチルメタ
クリレートの合計100重量部当りそれぞれ0〜100
重量部及び0〜50重量部が好ましい。Regarding the blending ratio of the above polymer composition,
The unsaturated urethane (a) is preferably 10 to 90 parts by weight, particularly preferably 25 to 50 parts by weight, and the low-shrinking agent (c) to 100 parts by weight of the total amount of the unsaturated urethane (a) + methyl methacrylate (b). ) Is preferably 1 to 25 parts by weight, particularly preferably 5 to 15 parts by weight, and the filler (d) is preferably 10
To 300 parts by weight, particularly preferably 50 to 150 parts by weight. Unsaturated polyester or vinyl ester resin (e)
And a compound (f) containing a plurality of (meth) acrylate groups
The blending ratio of each is 0 to 100 per 100 parts by weight of the total of unsaturated urethane and methyl methacrylate.
Preference is given to parts by weight and 0 to 50 parts by weight.
【0020】[0020]
【実施例】以下に本発明の実施例及び比較例を示す。EXAMPLES Examples and comparative examples of the present invention will be shown below.
【0021】まず、使用した樹脂(不飽和ウレタン/メ
チルメタクリレート/低収縮剤)の調製について説明す
る。First, the preparation of the resin (unsaturated urethane / methyl methacrylate / low-shrinking agent) used will be described.
【0022】樹脂(A):ポリイソシアネートとして、
4,4' −ジイソシアネートジフェニルメタンとポリメ
チレンポリフェニルポリイソシアネートとの混合物(平
均イソシアネート官能価2.6)186gをメチルメタ
クリレート536gに溶解し、触媒としてジブチル錫ジ
ラウレート1.6gを添加した後、2−ヒドロキシエチ
ルメタクリレート186gを添加し、残留イソシアネー
ト基の吸収が赤外分析で消失する迄ポリイソシアネート
と2−ヒドロキシエチルメタクリレートを反応させた。
こうして、2−ヒドロキシエチルメタクリレートのヒド
ロキシル基とポリイソシアネートのイソシアネート基と
の反応によりポリウレタンポリメタクリレートを調製
し、これをメチルメタクリレート中に溶解してなる溶液
を得た。更に低収縮剤として重量比で1:9のブチルア
クリレートとメチルメタクリレートの共重合体91gを
上記溶液に攪拌分散させた。この樹脂を(A)と称す
る。Resin (A): As polyisocyanate,
186 g of a mixture of 4,4′-diisocyanate diphenylmethane and polymethylene polyphenyl polyisocyanate (average isocyanate functionality of 2.6) was dissolved in 536 g of methyl methacrylate, and 1.6 g of dibutyltin dilaurate was added as a catalyst, followed by 186 g of hydroxyethyl methacrylate were added and the polyisocyanate was reacted with 2-hydroxyethyl methacrylate until the absorption of residual isocyanate groups disappeared by infrared analysis.
Thus, polyurethane polymethacrylate was prepared by reacting the hydroxyl group of 2-hydroxyethyl methacrylate with the isocyanate group of polyisocyanate, and a solution was obtained by dissolving this in methyl methacrylate. Further, 91 g of a copolymer of butyl acrylate and methyl methacrylate in a weight ratio of 1: 9 as a low shrinking agent was stirred and dispersed in the above solution. This resin is referred to as (A).
【0023】樹脂(B):低収縮剤として、今度は重量
比で6.1:1の塩化ビニルと酢酸ビニルの共重合体
(91g)を攪拌分散させた。この樹脂を(B)と称す
る。Resin (B): As a low-shrinking agent, a copolymer (91 g) of vinyl chloride and vinyl acetate (6.1 g in weight ratio) was dispersed by stirring. This resin is referred to as (B).
【0024】実施例1 樹脂(A)100重量部に対し、充填材として水酸化ア
ルミニウムを200重量部、重合促進剤として8%ナフ
テン酸コバルトを0.15重量部、重合開始剤としてア
セチルアセトンパーオキサイドを2.0重量部それぞれ
配合し、樹脂型成形用重合性組成物(A)を調製した。Example 1 With respect to 100 parts by weight of resin (A), 200 parts by weight of aluminum hydroxide as a filler, 0.15 parts by weight of 8% cobalt naphthenate as a polymerization accelerator, and acetylacetone peroxide as a polymerization initiator. 2.0 parts by weight were each mixed to prepare a polymerizable composition (A) for resin molding.
【0025】表面を鏡面研磨した30cm×30cmの正方
形ガラス板の四辺に、高さ15mmの木枠を設け、マスタ
ー型を構成した。このマスター型の内面にゲルコート
(日本フエロー(株)製NC−31173P)を塗布し
て6時間かけて硬化させた後、20℃で上記重合性組成
物(A)をマスター型内に注入し、1時間放置した後脱
型し、30cm×30cm×厚さ10mmの樹脂型を成形し
た。全工期は7時間であった。A master mold was constructed by providing a wooden frame of 15 mm in height on the four sides of a 30 cm × 30 cm square glass plate whose surface was mirror-polished. A gel coat (NC-31173P manufactured by Nippon Fellows Co., Ltd.) was applied to the inner surface of the master mold and cured for 6 hours, and then the polymerizable composition (A) was injected into the master mold at 20 ° C., After leaving for 1 hour, the mold was removed, and a resin mold of 30 cm × 30 cm × thickness 10 mm was molded. The total construction period was 7 hours.
【0026】実施例2 樹脂(B)100重量部に対し、充填材としてガラスパ
ウダーM−500S(日本フエロー(株)製)を200
重量部、重合促進剤としてジメチルアニリンを0.2重
量部、重合開始剤として過酸化ベンゾイルを2.0重量
部それぞれ配合し、樹脂型成形用重合性組成物(B)を
調製した。Example 2 To 100 parts by weight of resin (B), 200 glass powder M-500S (manufactured by Nippon Fellows Co., Ltd.) was used as a filler.
By weight, 0.2 parts by weight of dimethylaniline as a polymerization accelerator and 2.0 parts by weight of benzoyl peroxide as a polymerization initiator were mixed to prepare a polymerizable composition (B) for resin molding.
【0027】実施例1のものと同じマスター型にゲルコ
ート塗布せずに20℃で上記重合性組成物(B)を注入
し、1時間放置した後脱型し、30cm×30cm×厚さ1
0mmの樹脂型を成形した。全工期は1時間であった。The above-mentioned polymerizable composition (B) was poured into the same master mold as in Example 1 at 20 ° C. without coating with a gel coat, left for 1 hour, and then demolded to obtain 30 cm × 30 cm × thickness 1
A 0 mm resin mold was molded. The entire construction period was 1 hour.
【0028】実施例3 樹脂(A)100重量部に対し、充填材として水酸化ア
ルミニウムを200重量部、不飽和ポリエステル樹脂
(e) としてDK−810(大日本インキ(株)製)を2
0重量部、重合促進剤として8%ナフテン酸コバルトを
0.15重量部、重合開始剤としてアセチルアセトンパ
ーオキサイドを2.0重量部それぞれ配合し、樹脂型成
形用重合性組成物(C)を調製した。Example 3 200 parts by weight of aluminum hydroxide as a filler, 100 parts by weight of resin (A), unsaturated polyester resin
DK-810 (manufactured by Dainippon Ink and Chemicals, Inc.) as (e) 2
0 parts by weight, 0.15 parts by weight of 8% cobalt naphthenate as a polymerization accelerator, and 2.0 parts by weight of acetylacetone peroxide as a polymerization initiator were added to prepare a polymerizable composition (C) for resin molding. did.
【0029】実施例1のものと同じマスター型(グルコ
ートを塗布後6時間で硬化させたもの)に20℃で上記
重合性組成物(C)を注入し、1時間放置した後脱型
し、30cm×30cm×厚さ10mmの樹脂型を成形した。
全工期は7時間であった。添加された不飽和ポリエステ
ルは、型に何ら外観上の異状を起こさず、樹脂(A)と
共重合したものと考えられる。The above-mentioned polymerizable composition (C) was poured into the same master mold as that used in Example 1 (cured 6 hours after application of glucoat) at 20 ° C., left for 1 hour, and then demolded. A 30 cm × 30 cm × 10 mm thick resin mold was molded.
The total construction period was 7 hours. It is considered that the unsaturated polyester added did not cause any abnormal appearance in the mold and was copolymerized with the resin (A).
【0030】実施例4 樹脂(B)100重量部に対し、充填材として水酸化ア
ルミニウムを200重量部、ビニルエステル樹脂(e) と
してR−804(昭和高分子(株)製)を10重量部、
重合促進剤として8%ナフテン酸コバルトを0.15重
量部、重合開始剤としてアセチルアセトンパーオキサイ
ドを2.0重量部それぞれ配合し、樹脂型成形用重合性
組成物(D)を調製した。Example 4 With respect to 100 parts by weight of resin (B), 200 parts by weight of aluminum hydroxide as a filler and 10 parts by weight of R-804 (manufactured by Showa Polymer Co., Ltd.) as a vinyl ester resin (e). ,
0.15 parts by weight of 8% cobalt naphthenate was added as a polymerization accelerator, and 2.0 parts by weight of acetylacetone peroxide was added as a polymerization initiator, to prepare a polymerizable composition (D) for resin molding.
【0031】実施例1のものと同じマスター型(グルコ
ートを塗布後6時間で硬化させたもの)に20℃で上記
重合性組成物(D)を注入し、1時間放置した後脱型
し、30cm×30cm×厚さ10mmの樹脂型を成形した。
全工期は7時間であった。添加されたビニルエステル
は、型に何ら外観上の異状を起こさず、樹脂(A)と共
重合したものと考えられる。The polymerizable composition (D) was injected at 20 ° C. into the same master mold as used in Example 1 (cured 6 hours after application of the glucoat), left for 1 hour, and then demolded. A 30 cm × 30 cm × 10 mm thick resin mold was molded.
The total construction period was 7 hours. It is considered that the added vinyl ester did not cause any abnormal appearance in the mold and was copolymerized with the resin (A).
【0032】実施例5 樹脂(B)100重量部に対し、充填材として金属アル
ミニウム粉「AC−1003」(東洋アルミニウム
(株)製)を200重量部、不飽和ポリエステル樹脂
(e) としてDK−810(大日本インキ(株)製)を5
重量部と、複数の(メタ)アクリレート基を含む化合物
(f) としてトリメチロールプロパントリメタクリレート
を5重量部、重合促進剤として8%ナフテン酸コバルト
を0.2重量部、重合開始剤としてアセチルアセトンパ
ーオキサイドを2.0重量部それぞれ配合し、樹脂型成
形用重合性組成物(E)を調製した。Example 5 100 parts by weight of resin (B), 200 parts by weight of metallic aluminum powder "AC-1003" (manufactured by Toyo Aluminum Co., Ltd.) as a filler, unsaturated polyester resin
(e) DK-810 (manufactured by Dainippon Ink and Chemicals, Inc.) 5
A compound containing parts by weight and a plurality of (meth) acrylate groups
5 parts by weight of trimethylolpropane trimethacrylate as (f), 0.2 parts by weight of 8% cobalt naphthenate as a polymerization accelerator, and 2.0 parts by weight of acetylacetone peroxide as a polymerization initiator were added respectively, and resin molding was performed. A polymerizable composition (E) was prepared.
【0033】実施例1のものと同じマスター型(グルコ
ートを塗布後6時間で硬化させたもの)に20℃で上記
重合性組成物(B)を注入し、1時間放置した後脱型
し、30cm×30cm×厚さ10mmの樹脂型を成形した。
全工期は7時間であった。不飽和ポリエステル樹脂とト
リメチロールプロパントリメタクリレートの配合は、型
に何ら外観上の異状を起こさず樹脂(B)と共重合した
ものと考えられる。The above-mentioned polymerizable composition (B) was poured into the same master mold as that used in Example 1 (cured in 6 hours after application of glucoat) at 20 ° C., left for 1 hour and then demolded. A 30 cm × 30 cm × 10 mm thick resin mold was molded.
The total construction period was 7 hours. It is considered that the blend of the unsaturated polyester resin and trimethylolpropane trimethacrylate was copolymerized with the resin (B) without causing any abnormal appearance in the mold.
【0034】比較例1 マスター型として、表面を鏡面研磨した30cm×30cm
の正方形ガラス板を用い、その表面にゲルコート(日本
フエロー(株)製NC−31173P)を塗布して6時
間かけて硬化させた。その後、マスター型の上にガラス
繊維(S)を置き、重合開始剤を含ませた不飽和ポリエ
ステル樹脂(樹脂100重量部に対し開始剤1.0重量
部)を上記ガラス繊維(S)に注入し、この上をローラ
ーを数回往復させて脱泡させながらガラス繊維(S)に
樹脂を含浸させた。この含浸層を20℃で6時間かけて
硬化させた。Comparative Example 1 As a master mold, the surface was mirror-polished 30 cm × 30 cm
Gel plate (NC-3173P manufactured by Nippon Fellows Co., Ltd.) was applied to the surface of the square glass plate of No. 3 and cured for 6 hours. Then, the glass fiber (S) is placed on the master mold, and an unsaturated polyester resin containing a polymerization initiator (1.0 part by weight of the initiator to 100 parts by weight of the resin) is injected into the glass fiber (S). Then, the glass fiber (S) was impregnated with the resin while defoaming by reciprocating the roller several times over this. The impregnated layer was cured at 20 ° C. for 6 hours.
【0035】つぎに、上記樹脂型の上にガラス繊維
(M)を置き、上記と同様の操作でガラス繊維(M)に
樹脂を含浸させた。この含浸層の上にガラス繊維(C)
を置き、上記と同様の操作でガラス繊維(C)に樹脂を
含浸させた。この含浸層の上に再びガラス繊維(M)を
置き、上記と同様の操作でガラス繊維(M)に樹脂を含
浸させた。これら3層の含浸層を同時に20℃で6時間
かけて硬化させ、ガラス繊維(M+C+M)を成形し
た。Next, the glass fiber (M) was placed on the resin mold, and the glass fiber (M) was impregnated with the resin by the same operation as above. Glass fiber (C) on the impregnated layer
The glass fiber (C) was impregnated with the resin by the same operation as above. The glass fiber (M) was placed again on this impregnated layer, and the glass fiber (M) was impregnated with the resin by the same operation as above. These three impregnated layers were simultaneously cured at 20 ° C. for 6 hours to form glass fibers (M + C + M).
【0036】更に、上記3層の樹脂型の上にガラス繊維
(M)を置き、上記と同様の操作でガラス繊維(M)に
樹脂を含浸させた。この含浸層の上にガラス繊維(R)
を置き、上記と同様の操作でガラス繊維(R)に樹脂を
含浸させた。この含浸層の上にガラス繊維(M)を置
き、上記と同様の操作でガラス繊維(M)に樹脂を含浸
させた。この含浸層の上にガラス繊維(R)を置き、上
記と同様の操作でガラス繊維(R)に樹脂を含浸させ
た。この含浸層の上にガラス繊維(M)を置き、上記と
同様の操作でガラス繊維(M)に樹脂を含浸させた。こ
れら5層の含浸層を同時に20℃で24時間かけて硬化
させ、ガラス繊維(M+R+M+R+M)の不飽和ポリ
エステル樹脂型を成形した。Further, the glass fiber (M) was placed on the three-layer resin mold, and the glass fiber (M) was impregnated with the resin by the same operation as above. Glass fiber (R) on the impregnated layer
The glass fiber (R) was impregnated with resin by the same operation as above. The glass fiber (M) was placed on the impregnated layer, and the glass fiber (M) was impregnated with the resin by the same operation as above. The glass fiber (R) was placed on the impregnated layer, and the glass fiber (R) was impregnated with the resin by the same operation as above. The glass fiber (M) was placed on the impregnated layer, and the glass fiber (M) was impregnated with the resin by the same operation as above. These five impregnated layers were simultaneously cured at 20 ° C. for 24 hours to form a glass fiber (M + R + M + R + M) unsaturated polyester resin mold.
【0037】こうして、全厚さ10mmの9層の樹脂が得
られた。全工期は42時間であった。Thus, 9 layers of resin having a total thickness of 10 mm were obtained. The total construction period was 42 hours.
【0038】上記ガラス繊維(S)(M)(C)(R)
はいずれも旭ファイバーグラス(株)製のものであっ
て、(S)はサーフェスマット SM3600E、
(M)はストランドマット CM450、(C)はガラ
スクロス MG300、(R)はロービングクロスRH
600である。The above glass fibers (S) (M) (C) (R)
Are manufactured by Asahi Fiber Glass Co., Ltd., (S) is surface mat SM3600E,
(M) is strand mat CM450, (C) is glass cloth MG300, (R) is roving cloth RH
It is 600.
【0039】上記不飽和ポリエステル樹脂は昭和高分子
(株)製の158BQTNである。重合開始剤は日本油
脂(株)製のメチルエチルケトンパーオキサイド「パー
メックNである。The unsaturated polyester resin is 158BQTN manufactured by Showa Highpolymer Co., Ltd. The polymerization initiator is methyl ethyl ketone peroxide “Permec N” manufactured by NOF CORPORATION.
【0040】比較例2 表面ゲルコートを施さない点、及びイソシアネート系の
重合開始剤としてSADCAST1875(太洋鋳機
(株)製)を混合したポリウレタン樹脂SADCAST
537(太洋鋳機(株)製)(樹脂100重量部に対し
て重合開始剤36重量部)を樹脂(A)の代わりに用い
る点を除いて、実施例1と同じ操作を行って、樹脂型を
成形した。全工期は72時間であった。Comparative Example 2 Polyurethane resin SDACAST mixed with SADCAST 1875 (manufactured by Taiyo Kikai Co., Ltd.) as a point where no surface gel coat was applied and as an isocyanate type polymerization initiator
537 (manufactured by Taiyo Foundry Co., Ltd.) (36 parts by weight of a polymerization initiator relative to 100 parts by weight of resin) was used instead of the resin (A), and the same operation as in Example 1 was performed, A resin mold was molded. The total construction period was 72 hours.
【0041】比較例3 表面ゲルコートを施さない点、及びアミン系の重合開始
剤としてビレジンHL80(日本シーカ(株)製)を混
合したエポキシ樹脂ビレジンG49(日本シーカ(株)
製)(樹脂100重量部に対して重合開始剤36重量
部)を樹脂(A)の代わりに用いる点を除いて、実施例
1と同じ操作を行って、樹脂型を成形した。全工期はや
はり72時間であった。Comparative Example 3 Epoxy resin Virgin G49 (manufactured by Nippon Sika Co., Ltd.) mixed with Virgin HL80 (manufactured by Nippon Sika Co., Ltd.) as a surface gel coat and amine polymerization initiator.
A resin mold was molded in the same manner as in Example 1, except that (manufacturing) (36 parts by weight of polymerization initiator relative to 100 parts by weight of resin) was used instead of the resin (A). The total construction period was still 72 hours.
【0042】評価試験 実施例及び比較例で得られた各樹脂型について性能の評
価結果を下記に示す。Evaluation Test The evaluation results of the performance of the resin types obtained in the examples and comparative examples are shown below.
【表1】 表面平滑度及び10回使用後の表面平滑度の測定結果は
添付の図面に示すとおりである。[Table 1] The measurement results of the surface smoothness and the surface smoothness after 10 times of use are shown in the attached drawings.
【0043】各項目の測定方法はつぎのとおりである。The measuring method of each item is as follows.
【0044】・表面平滑度:(株)小坂研究所製の表面
粗さ測定器SE−40Dを用いて測定した。Surface smoothness: Measured using a surface roughness measuring device SE-40D manufactured by Kosaka Laboratory Ltd.
【0045】・測定条件:送り速さ0.5mm/秒、基準
長さ25.0mm、カットオフ値0.8mmとした。Measurement conditions: feed rate 0.5 mm / sec, reference length 25.0 mm, cutoff value 0.8 mm.
【0046】・ソリ:脱型型表面に直角定規を当て、そ
の水平面からの垂直方向へのソリを測定した。Warp: A right-angled ruler was applied to the surface of the demolding die, and the warp in the vertical direction from the horizontal plane was measured.
【0047】・線収縮率:現物の長さを測定した。Linear shrinkage: The actual length was measured.
【0048】・10回使用後の表面平滑度:各樹脂型を
用いてFRP(ゲルコート+M+M)を成形し、60℃
で3時間硬化後脱型し、これを10回繰り返した後の型
表面の平滑度を調べた。Mは旭ファイバーグラス(株)
製のガラス繊維ストランドマット CM450である。Surface smoothness after 10 times of use: FRP (gel coat + M + M) was molded using each resin mold, and 60 ° C.
After 3 hours of curing, the mold was removed, and this was repeated 10 times, and the smoothness of the mold surface was examined. M is Asahi Fiber Glass Co., Ltd.
CM450 manufactured by Fiberglass Strand Mat.
【0049】表1から明らかなように、実施例で得られ
た樹脂型は比較例のそれに比べ、いずれの項目において
も優れた結果を示した。As is clear from Table 1, the resin molds obtained in the examples showed excellent results in all items as compared with those in the comparative examples.
【0050】[0050]
【発明の効果】本発明によれば、外部からの加熱加温な
しに短時間で樹脂が完全に硬化し、且つ寸法精度が良く
て成形面の変形やクラックの発生のない耐久性に優れた
樹脂型を、極く短かい工期で容易に製造することができ
る。According to the present invention, the resin is completely cured in a short time without heating and heating from the outside, and the dimensional accuracy is good, and the molding surface is not deformed or cracked and is excellent in durability. The resin mold can be easily manufactured in an extremely short construction period.
【図1】表面平滑度の測定結果を示す図である。FIG. 1 is a diagram showing a measurement result of surface smoothness.
【図2】10回使用後の表面平滑度の測定結果を示す図
である。FIG. 2 is a diagram showing a measurement result of surface smoothness after 10 times of use.
【図3】表面平滑度の測定結果を示す図である。FIG. 3 is a diagram showing measurement results of surface smoothness.
【図4】表面平滑度の測定結果を示す図である。FIG. 4 is a diagram showing a measurement result of surface smoothness.
【図5】10回使用後の表面平滑度の測定結果を示す図
である。FIG. 5 is a diagram showing the measurement results of surface smoothness after 10 times of use.
【図6】表面平滑度の測定結果を示す図である。FIG. 6 is a diagram showing a measurement result of surface smoothness.
【図7】10回使用後の表面平滑度の測定結果を示す図
である。FIG. 7 is a diagram showing the measurement results of surface smoothness after 10 times of use.
【図8】表面平滑度の測定結果を示す図である。FIG. 8 is a diagram showing a measurement result of surface smoothness.
【図9】10回使用後の表面平滑度の測定結果を示す図
である。FIG. 9 is a diagram showing the measurement results of surface smoothness after 10 times of use.
【図10】表面平滑度の測定結果を示す図である。FIG. 10 is a diagram showing a measurement result of surface smoothness.
【図11】10回使用後の表面平滑度の測定結果を示す
図である。FIG. 11 is a diagram showing the measurement results of surface smoothness after 10 times of use.
【図12】表面平滑度の測定結果を示す図である。FIG. 12 is a diagram showing a measurement result of surface smoothness.
【図13】10回使用後の表面平滑度の測定結果を示す
図である。FIG. 13 is a diagram showing the measurement results of surface smoothness after 10 times of use.
【図14】表面平滑度の測定結果を示す図である。FIG. 14 is a diagram showing a measurement result of surface smoothness.
【図15】10回使用後の表面平滑度の測定結果を示す
図である。FIG. 15 is a diagram showing the measurement results of surface smoothness after 10 times of use.
Claims (4)
レートのヒドロキシル基と、ウレタン基を有さずかつ
2.0を越えるイソシアネート官能価を有する多価イソ
シアネートのイソシアネート基との反応により得られた
多価(メタ)アクリレート、(b) メチルメタクリレー
ト、(c) ビニル系重合体からなる低収縮剤及び(d) 充填
材を含有してなる樹脂型成形用重合用組成物。1. Reaction of (a) a hydroxyl group of a hydroxyalkyl (meth) acrylate with an isocyanate group of a polyvalent isocyanate having no urethane group and having an isocyanate functionality of more than 2.0. Obtained by
Polyvalent (meth) acrylates bets, (b) methyl methacrylate, (c) vinyl comprising a polymer low profile additive and (d) a resin molding for polymer compositions comprising a filler.
レートのヒドロキシル基と、ウレタン基を有さずかつ
2.0を越えるイソシアネート官能価を有する多価イソ
シアネートのイソシアネート基との反応により得られた
多価(メタ)アクリレート、(b) メチルメタクリレー
ト、(c) ビニル系重合体からなる低収縮剤及び(d) 充填
材と、(e) 不飽和ポリエステル又はビニルエステル樹脂
及び/又は(f) 一般式: 【化1】 (式中、Rは水素原子又はメチル基を意味する)で表さ
れる複数の(メタ)アクリレート基を有し、ウレタン基
又はヒドロキシル基を有さない化合物を含有してなる樹
脂型成形用重合性組成物。Wherein (a) the reaction of the hydroxyl group of a hydroxyalkyl (meth) acrylate, polyhydric iso <br/> isocyanate groups cyanate having an isocyanate functionality of over and 2.0 no urethane groups Obtained by
Polyvalent (meth) acrylates bets, (b) methyl methacrylate, (c) and a low profile additive comprising a vinyl polymer and (d) filler, (e) an unsaturated polyester or vinyl ester resin and / or (f) General formula: Polymerization for resin molding comprising a compound having a plurality of (meth) acrylate groups represented by the formula (wherein R represents a hydrogen atom or a methyl group) and having neither a urethane group nor a hydroxyl group. Sex composition.
れた樹脂型。3. A resin mold molded from the polymerizable composition according to claim 1.
れた樹脂型。4. A resin mold molded from the polymerizable composition according to claim 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4051734A JPH0780972B2 (en) | 1992-03-10 | 1992-03-10 | Polymerizable composition for resin mold molding and resin mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4051734A JPH0780972B2 (en) | 1992-03-10 | 1992-03-10 | Polymerizable composition for resin mold molding and resin mold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05247154A JPH05247154A (en) | 1993-09-24 |
| JPH0780972B2 true JPH0780972B2 (en) | 1995-08-30 |
Family
ID=12895130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4051734A Expired - Lifetime JPH0780972B2 (en) | 1992-03-10 | 1992-03-10 | Polymerizable composition for resin mold molding and resin mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0780972B2 (en) |
-
1992
- 1992-03-10 JP JP4051734A patent/JPH0780972B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05247154A (en) | 1993-09-24 |
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