JPH0781849B2 - Electronic parts lead shape inspection device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for inspecting lead shapes such as lead pitch, lead bending and flatness of electronic parts.

[0002]

2. Description of the Related Art For example, a flat package type IC
When an electronic component such as (integrated circuit) is mounted on a printed wiring board, if the lead of the electronic component is bent or lifted, a connection failure may occur with the terminal portion of the printed wiring board. A device for inspecting whether the lead shape of the above is within an allowable range is used.

The inspection methods used in this type of lead shape inspection apparatus are roughly classified into a transmission method and a projection method. Hereinafter, each method will be briefly described.

<Transmission Method> Referring to FIG. In the figure, reference numeral 1 is a flat package type IC to be inspected, and a large number of leads 2 are led out from both sides of the package body 1a. The IC 1 is placed on the inspection stage 3. The gap between the lower surface of the package body 1a of the IC 1 and the inspection stage 3 is irradiated with light from the light source 4 substantially horizontally, and the light passing through the gap between the leads 2 is passed through the reflection mirror 5 and the optical system 6 to the CCD. (Charge coupled device) Lead to camera 7. Then, based on the image of the lead array portion of the IC 1 taken by the CCD camera 7, the lead pitch, the lead floating, and the like are measured.

<Projection Method> Referring to FIG. Location mounting the IC1 to be inspected on the inspection stage 8 of the translucent. A screen 9 for projection is laid on the lower surface of the inspection stage 8. Then, using a light source and an optical system (not shown), a parallel light beam is emitted from above the inspection stage 8 to lead 2 of the IC 1.
The projected image of is projected on the screen 9, and the projected image is captured by the CCD camera 7 via the optical system 6, whereby the lead pitch and the lead bend are measured.

[0006]

However, the conventional example having such a structure has the following problems.

Recently, due to the miniaturization of electronic parts, the distance (standoff) between the package body 1a and the inspection stage 3 has become extremely small. Therefore, according to the above-mentioned transmission method, sufficient transmitted light can be obtained. However, there is a problem in that it is difficult to image the lead array portion of the IC1. Further, according to this method, since the two lead array portions arranged to face each other are imaged in an overlapping state, it is difficult to measure the lead shape from this point as well. On the other hand, according to the above-mentioned projection method,
Since the amount of light is attenuated by the screen 9, it is necessary to use a light source with a large amount of light, which causes a problem of increasing the cost of the device.

The present invention has been made in view of the above circumstances, and it is possible to measure the lead shape of an electronic component relatively easily and to reduce the cost.
An object of the present invention is to provide a lead shape inspection device for electronic parts capable of achieving the following .

[0009]

The present invention has the following constitution in order to achieve such an object. That is, according to the invention of claim 1, the lead shape of the electronic component is
Device for inspecting , lead arrangement part of electronic parts
And a single unit for imaging the lead array portion.
One image pickup means and the lead arrangement part of the electronic component are vertically arranged.
The transmitted light is transmitted to one of the bisected imaging areas of the imaging means.
First optical means for vertically incident on one side (first imaging region)
And light that obliquely passes through the lead arrangement part of the electronic component.
On the other side of the bisected imaging area of the imaging means (second
A second optical means for obliquely incident on the imaging area), the shooting
Of the lead array portion obtained by the first imaging area of the image means.
Based on the captured image, the lead pitch and / or lead
A first measuring means for measuring the bending and a first measuring means for the imaging means.
The captured image of the lead arrangement part obtained by one imaging area
Obtained by the second imaging area of the imaging means
The lead float is measured based on the captured image of the lead array.
And a second measuring means for setting.

[0010]

[0011] The invention described in claim 2 is the lead shape inspection apparatus for electronic components according to claim 1, wherein the first optical means, of the light transmitted through vertically lead sequence portion of the electronic components, certain Two first optical selection elements for selectively passing component light are provided, one optical selection element being arranged on the optical axis of the first optical means and the other optical selection element being the imaging device. The second optical means is arranged so as to cover the first imaging region of the means, and the second optical means selects a component different from the first optical selection element from the light obliquely transmitted through the lead arrangement portion of the electronic component. Two second optical selection elements that are optically passed therethrough, one optical selection element being arranged on the optical axis of the second optical means and the other optical selection element being the second imaging means of said imaging means. It is arranged so as to cover the area.

According to a third aspect of the present invention, in the lead shape inspection apparatus for an electronic component according to the first aspect , the second optical means obliquely enters the second image pickup area of the image pickup means. The image forming lens includes an image forming lens whose aberration is corrected so that the image is formed in the entire second image pickup region.

[0013]

The operation of the present invention is as follows. That is,
According to the first aspect of the present invention, the light that has vertically transmitted through the lead arrangement portion of the electronic component is separated by the first optical means into a single light .
The lead arrangement portion is guided to the first image pickup area of the image pickup means.
It is possible to obtain a picked-up image viewed from the vertical direction. The first measuring means measures the lead pitch and / or the lead bend based on the captured image of the lead arrangement portion. On the other hand, the light obliquely transmitted through the lead arrangement portion of the electronic component is the second optical hand.
The step leads to the second imaging region of the same imaging means,
A captured image of the lead array portion viewed from an oblique direction can be obtained.
It If any lead in the lead array portion floats, the interval (lead pitch) between the lead and the adjacent lead in the captured image changes according to the floating amount of the lead. Therefore, the second measuring means is the first measuring means .
With reference to the captured image of the lead sequence portion obtained in the imaging area, based on the captured image of the lead sequence portion obtained in the second imaging region of the imaging means, for measuring the floating of the leads. Here, the captured image of the lead array portion obtained in the first image capturing area of the image capturing means is referred to because the change in the lead pitch in the captured image obtained in the second image capturing area of the image capturing means depends on the lead bending. The reason is that it is necessary to distinguish whether it is due to floating of leads.

[0014]

According to the second aspect of the present invention, the first optical selection element provided in the first optical means and the second optical selection element provided in the second optical means are different from each other. Since the components are selectively passed therethrough, the light guided by the first optical unit does not enter the second imaging region, but enters only the first imaging region. Similarly, the light obliquely transmitted through the lead arrangement portion of the electronic component is incident only on the second image pickup area of the image pickup means.

According to the third aspect of the invention, the light obliquely transmitted through the lead arrangement portion of the electronic component is the second light of the image pickup means.
It is incident on the imaging region from an oblique direction. That is, since the second imaging region (image forming surface) is not perpendicular to the optical axis, a normal image forming lens causes blurring at the end of the lead array portion. Therefore, an image is formed through the aberration-corrected image forming lens included in the second optical unit, so that the entire lead array portion forms an image in the second imaging region.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings .
Comparative reference equipment to facilitate understanding of the principles of the embodiments
The arrangement will be described with reference to FIGS. 1 to 5 .

FIG . 1 is a diagram showing a schematic configuration of a comparative reference device . In the figure, reference numeral 1 is an IC to be inspected, for example, a flat package type IC, and a package body 1a
A large number of leads 2 are led out from the opposite sides of the.
The IC 1 is mounted on the transparent inspection stage 10. A light source 11 and a scattering plate 12 that scatters the light emitted from the light source 11 are arranged above the inspection stage 10. The light source 11 and the scattering plate 12 will be described later.
It is common to the apparatus of the embodiment and corresponds to the illumination means in the present invention.

[0019] Below the inspection stage 10, the light transmitted vertically lead sequence portion of IC1, C CD camera 22a you incidence is provided via the optical system 21a. CC
The captured image of the lead array portion output from the D camera 22a is converted into a binary image by the binarization circuit 23a and then stored in the image memory 24a. The lead pitch / bending measurement unit 25 measures the interval (lead pitch) and the lead bending of each lead 2 based on the binary image stored in the image memory 24a, as described later. The measurement result is CR
It is given to an output device 27 composed of T, a liquid crystal display, a printer or the like.

Below the inspection stage 10, an IC is provided.
The light transmitted obliquely through the same lead arrangement part of 1 is transmitted to the optical system 2
C CD camera 22b is provided you incident through the 1b. The inclination angle θ of the optical axis of the optical system 21b with respect to the optical axis of the optical system 21a is appropriately set in relation to the lead pitch of the IC1 and the measurement accuracy of lead floating, but is usually 30.
It is set within the range of -60 degrees. In the case of IC1 with a small lead pitch, if the inclination angle θ is set too large, C
Since the lead array portions imaged by the CD camera 22b are connected in the lateral direction, the lead floating cannot be measured. On the contrary, if the tilt angle θ is too small, the accuracy of measuring lead floating deteriorates. The picked-up image of the read array portion output from the CCD camera 22b is converted into a binary image by the binarization circuit 23b, and then stored in the image memory 24b. The lead floating measurement unit 26 refers to the binary image stored in the image memory 24a and refers to the binary image stored in the image memory 24b.
The floating amount of each lead is measured based on the value image. The measurement result is given to the output device 27.

Next, the operation of the inspection apparatus having the above-mentioned structure will be described. (A) Measurement of lead pitch and lead bending Refer to FIG. This figure shows a binary image of the lead array portion captured by the CCD camera 22a and stored in the image memory 24a, that is, a binary image of the lead array portion viewed from the vertical direction. The measuring unit 25 displays on this binary image,
Two horizontal measurement lines M ₁ and M ₂ for measuring the lead pitch and the lead bend are automatically set. For example, in the measurement line M ₁ , the distance from the tip of the lead 2 is
It is set to be 10% of the distance L from the tip of the lead 2 to the edge of the package body 1a. In the measurement line M ₂ , the distance from the tip of the lead ₂ is 90% of the distance L from the tip of the lead 2 to the edge of the package body 1a.
Is set to.

The lead pitches P _{1 to} P ₆ are measured on the measurement line M.
Measured along ₁ . Specifically, the number of pixels existing between the center points of the leads 2 which the measurement line M ₁ crosses is counted, and the lead pitches P _{1 to} P _{1 to} P ₁ are obtained by multiplying the count value by a pixel pitch known in advance. ₆ can be measured. The amount of bending of each lead 2 is determined by the center position of each lead 2 which the measurement line M ₁ crosses and the measurement line M ₂
It can be measured by obtaining the difference from the center position of each lead 2 that crosses.

[0023] The measurement technique of bending lead pitch and lead described above is an example, Ru is limited to Re this
Not a thing . For example, in the above-described apparatus of FIG. 1 , the measurement lines M ₁ and M ₂ are automatically set. However, this is because the contents of the image memory 24a are displayed on the CRT and the operator may manually set the measurement lines. Good. Further, in the apparatus of FIG. 1 , the lead pitch and the lead bending are measured, but either one may be measured. Regarding these, the same applies to the devices of the following examples.
Can be applied to

(B) Measurement of Lead Float Reference is made to FIG. This figure shows a binary image of the lead array portion captured by the CCD camera 22b and stored in the image memory 24b, that is, a binary image of the lead array portion viewed from an oblique direction. The measuring unit 26 displays on this binary image,
A horizontal measurement line M ₁ 'for measuring lead floating is automatically set. The measurement line M ₁ ′ is set to be at the same position as the lead pitch measuring line M ₁ shown in FIG. Then, in the same manner as described above, the lead pitches P ₁ ′ to P ₆ ′ are measured for the binary image in which the lead array portion is viewed obliquely.

If the leads 2 of the IC 1 are not floated, the lead pitches P _{1 to} P ₆ obtained based on the binary image of the lead array viewed from the vertical direction and the lead array are determined. The lead pitches P ₁ ′ to P ₆ ′ obtained on the basis of the binary image viewed from the oblique direction maintain a constant ratio according to the tilt angle θ of the optical system 21 b, but one of the leads floats. If so, the interval (pitch) between the lead and the adjacent lead changes according to the floating amount of the lead. Hereinafter, description will be given with reference to FIGS. 4 and 5.

If lead floating does not occur for all the leads 2, it is between the lead pitch P when the lead array portion is viewed in the vertical direction and the lead pitch P ′ when the lead array portion is viewed in the oblique direction. Holds the relation of P ′ = P × cos θ. However, if lead floating occurs in any of the leads (lead _{25 in} FIG. 4), the above relationship is not established, and the lead pitch between the lead and the adjacent lead (see FIG. 4).
Then, P ₄ 'and P ₅ ') change according to the lead floating amount. Therefore, the lead floating measurement unit 26 refers to a binary image obtained by viewing the lead array portion stored in the image memory 24a from a vertical direction, and looks at the lead array portion stored in the image memory 24b from an oblique direction 2 The lead floating amount is measured based on the change amount of the lead pitch P ′ obtained from the value image. Hereinafter, a specific description will be given with reference to FIG.

Assuming that the floating amount of the lead ₂₅ is C,
When the lead arrangement part is viewed from an oblique direction, the floating amount C
Is observed as the pitch deviation amount d. Here, the floating amount C and the pitch shift amount d have the relationship of the following expression (1). C = d / sin θ (1) The pitch deviation amount d is expressed by the following equation (2). d = P ₄ ″ −P ₄ ′ (2) Here, P ₄ ″ is measured when the lead arrangement portion is viewed obliquely when the lead ₂₅ is not floated. Since it is the pitch, it is expressed by the following equation (3). P ₄ ″ = P ₄ × cos θ ··· (3) Therefore, by substituting the equation (3) into the equation (2), the pitch deviation amount d can be obtained, and this is given in the equation (1). By substituting, the floating amount C of the lead 2 ₅ can be obtained.

In the apparatus shown in FIG. 1 , the lead floating measuring section 26 takes in the binary image stored in the image memory 24a, obtains the lead pitch P when the lead array portion is viewed from the vertical direction, and the lead pitch P is determined. The pitch of the leads is measured based on the comparison between the pitch P and the lead pitch P ′ when the lead array portion is viewed from an oblique direction. The lead pitch P of 1 may be directly taken from the lead pitch / bending measurement unit 25. For this,
The same applies to the apparatus of the embodiment.

Next, the apparatus of the embodiment of the present invention will be described.
It In the apparatus shown in FIG. 1 described above, the CCD camera 22a that receives the light vertically transmitted through the lead array portion of the IC1 and the CCD camera 22b that receives the light obliquely transmitted through the same lead array portion are separately installed. In the present embodiment, the CCD camera 50 as a single image pickup means for the two transmitted lights is used.
The light is being received at. This will be described below with reference to FIG. Note that, in FIG. 6, the constituent parts denoted by the same reference numerals as those shown in FIG. 1 have the same configuration as the comparative reference device, and therefore the description thereof is omitted here.

The light which has vertically transmitted through the lead arrangement portion of the IC 1 has a reflection mirror 31, a polarizing plate 32, an image forming lens 33, reflection mirrors 34 and 35, a plane parallel plate 36, and a polarizing plate 3.
The light is incident on the first image pickup area 50 a, which is one of the two divided image pickup areas of the CCD camera 50, via the light source 7. Here, the polarization plates 32 and 37 are arranged such that their polarization planes are parallel to each other. Further, the plane parallel plate 36 is for finely adjusting the position of the captured image on the CCD camera 50 by rotating it. The above-mentioned optical elements 31 to 37 correspond to the first optical means in the present invention,
The polarizing plates 32 and 37 correspond to the first optical selection element in the present invention.

On the other hand, the light obliquely transmitted through the lead arrangement portion of the IC 1 passes through the polarizing plate 41, the aberration correction image forming lens 42, the reflecting mirror 43, and the polarizing plate 44, and is divided into two halves of the image pickup area of the CCD camera 50. Second imaging area 5 of the other
It is incident on 0b. Here, the polarization plates 41 and 44 are arranged so that their polarization planes are parallel to each other and are orthogonal to the polarization planes of the polarization plates 32 and 37. The aberration correction imaging lens 42 is aberration-corrected so that the image of each part of the lead array portion obliquely incident on the second imaging region 50b of the CCD camera 50 is imaged on the surface of the second imaging region 50b. It is an image lens. By using such an aberration correction imaging lens 42, an image of the lead array portion viewed from an oblique direction does not cause defocusing, and the second imaging region 5
Since the image is clearly captured at 0b, the accuracy of lead floating measurement can be improved. The above-mentioned optical elements 41 to 44 correspond to the second optical means in the present invention, and are the polarizing plates 41 and 4
Reference numeral 4 corresponds to the second optical selection element in the present invention.

As described above, the light vertically transmitted through the lead array portion is incident on the first image pickup area 50a of the CCD camera 50 through the polarizing plates 32 and 37 whose polarization planes are parallel to each other, while the light is read. The light obliquely transmitted through the array portion is polarized by the CCD cameras 50 through the polarizing plates 41 and 44 having polarization planes parallel to each other and orthogonal to the polarization planes of the polarization plates 32 and 37. Since the light is incident on the second imaging region 50b, the captured image viewed from the vertical direction of the lead array portion and the captured image viewed from the oblique direction do not overlap in the imaging region of the CCD camera 50, and two captured images are displayed. It can be surely divided. In addition, in the present embodiment, the two captured images are separated by using the polarizing plate, but the first and second optical selection elements in the present invention are not limited to this, and the polarizing plate 3
It is possible to divide the two picked-up images by providing a filter that transmits, for example, red light instead of 2, 37 and a filter that transmits, for example, green light instead of the polarizing plates 41 and 44.

Each image picked up by the CCD camera 50 as described above is binarized by the binarizing circuit 51 and then stored in the image memory 52. FIG. 7 is a binary image stored in the image memory 52, and the upper side is the first imaging region 50a.
2 is a binary image 52a in which the lead array portion imaged in 2 is viewed in the vertical direction, and the lower side is a binary image 52b in which the lead array portion imaged in the second imaging region 50b is viewed in an oblique direction.

Lead pitch / bend measurement section 53 (first measurement
(Corresponding to the fixing means) measures the lead pitch and / or the lead bend based on the binary image 52a in which the lead array portion is viewed from the vertical direction. The measurement method is the same as that in the case of the device of FIG. 1 ( measurement method of the lead pitch / bending measurement unit 25), and therefore description thereof is omitted here. On the other hand, the lead floating measuring unit 54 (corresponding to the second measuring means) refers to the binary image 52a in which the lead array portion is viewed from the vertical direction,
The floating amount of each lead is measured based on the binary image 52b in which the lead array portion is viewed in an oblique direction. This measurement method is
Set the measurement line (M ₁ ') in the binary image 52b and
Find the lead pitch (P ₁ 'to P ₆ ') and
And the lead pitch in the binary image of the binary image 52a
In the case of the device of Fig. 1 (lead floating
The measurement method of the measurement unit 26) is common. But Naga
In this embodiment, since the light obliquely transmitted through the lead array portion is obliquely incident on the CCD camera 50, the method of calculating the lead floating amount is the case of the device of FIG. 1 (lead floating measurement
Calculation method of the unit 26) . Hereinafter, with reference to FIG.
A method for calculating the lead floating amount according to this embodiment will be described.

If no lead floating occurs,
The lead pitch P of the lead array portion, which is vertically transmitted through the lead array portion and vertically incident on the CCD camera 50, is imaged.
Then, the lead pitch P ′ of the lead arrangement portion that is obliquely transmitted through the lead arrangement portion and obliquely incident on the CCD camera 50 and imaged is the same (P = P ′). However, if lead floating occurs in any of the leads (lead _{25 in} FIG. 8), the above relationship is not established, and the lead pitch between the lead and the adjacent lead (P ₄ 'and P in FIG. 8). ₅ '),
It changes according to the lead floating amount. Assuming that the floating amount of the lead ₂₅ is C, the floating amount C is observed as a pitch shift amount D when the lead array portion is viewed in an oblique direction. Here, the floating amount C and the pitch shift amount D have the relationship of the following expression (4). C = D / tan θ (4) The pitch deviation amount D is expressed by the following equation (5). D = P ₄ ″ −P ₄ ′ (5) Here, P ₄ ″ is measured when the lead ₂₅ is not lifted and the lead array portion is viewed from an oblique direction. The pitch, that is, equal to the pitch P ₄ measured when the lead array portion is viewed from above. Therefore, from the equation (5), the pitch deviation amount D is expressed by the following equation (6). D = P ₄ −P ₄ ′ (6) By substituting the pitch deviation amount D thus obtained in the equation (4), the floating amount C of the lead 2 ₅ can be easily obtained. it can.

[0036] In the real施例described above, as illumination means, is using the light source 11 and the scattering plate 12, the present invention is not limited to this, for example, as shown in FIG. 9, is irradiated from the light source 11 The converted light is converted into parallel light rays by the optical lens 60, and the parallel light rays are incident on the reflection mirror 62 via the half mirror 61 to obtain light that vertically passes through the lead arrangement portion of the IC 1 and at the same time. The light reflected by the mirror 61 may be obliquely transmitted through the lead array portion. In addition, a light source that vertically irradiates the lead array portion and a light source that obliquely illuminates the lead array portion,
You may make it provide each separately.

[0037]

As is apparent from the above description, the present invention has the following effects. That is, claim 1
According to the invention described in ( 1 ), the light that has vertically transmitted through the lead arrangement part of the electronic component is
An image of the lead array portion viewed from the vertical direction is obtained by being guided to the first imaging region , the lead pitch and / or the lead bending is measured, and the light obliquely transmitted through the lead array portion is the second optical means. To the first imaging area of the same imaging means
Led to to obtain an image viewed lead pitch from an oblique direction, with reference to the image seen the lead sequence portion from the vertical direction, since the measuring lead floating, light incident on an imaging means Not affected by the standoffs of electronic components, and
Unlike the projection method described in the conventional example, there is no attenuation by the screen, so the captured image of the lead arrangement is clear, and lead shapes such as lead pitch, lead bending, and lead float are relatively easily and accurately measured. can do. Well
In addition, an image of the lead array viewed from the vertical direction
An image of the row section viewed from an oblique direction is displayed by a single image pickup means.
The configuration of this type of device is simple.
The cost of the device can be reduced.

[0038]

According to the second aspect of the present invention, by using the first and second optical selection elements which respectively pass different light components, the light vertically transmitted through the lead arrangement portion and the lead arrangement portion are separated from each other. Since the obliquely transmitted light is separated and made incident on a single image pickup means, the two picked-up images do not overlap each other, and the lead shape inspection by image processing can be easily performed.

According to the third aspect of the invention, the light obliquely transmitted through the lead array portion is obliquely incident on the second image pickup area of the single image pickup means via the aberration-corrected imaging lens. Therefore, it is possible to obtain an image of the lead arrangement portion without defocus, and improve the accuracy of the lead shape inspection.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of a comparative reference device with respect to an embodiment device of the present invention.

FIG. 2 is a diagram showing a binary image obtained by photographing a lead array portion from a vertical direction.

FIG. 3 is a diagram showing a binary image obtained by photographing a lead array portion from an oblique direction.

FIG. 4 is a diagram for explaining a method for measuring lead floating in a comparative reference device .

FIG. 5 is a diagram for explaining a method for measuring lead floating in a comparative reference device .

FIG. 6 is a schematic configuration diagram of an apparatus according to an embodiment of the present invention .

7 is a diagram showing a binary image of the lead sequence portion captured in real施例device.

8 is a diagram for explaining a method of lead floating measurement of the real施例device.

FIG. 9 is a diagram showing a modified example of the illumination means of the lead arrangement section.

FIG. 10 is a diagram showing a schematic configuration of a conventional lead shape inspection device.

FIG. 11 is a diagram showing a schematic configuration of another conventional lead shape inspection apparatus.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... IC (electronic component) 2 ... Lead 11 ... Light source 12 ... Scattering plate 3 2,37 ... Polarizing plate (1st optical selection element) 41,44 ... Polarizing plate (2nd optical selection element) 42 ... Aberration correction Imaging lens 50 ... CCD camera (single image pickup means) 51 ... Binarization circuit 52 ... Image memory 53 ... Lead pitch / bending measurement section (first measurement means) 54 ... Lead floating measurement section (second measurement means)

Claims (3)

[Claims] 1. A method for inspecting a lead shape of an electronic component
An apparatus , comprising: an illuminating unit that illuminates a lead array portion of an electronic component; a single image capturing unit that captures an image of the lead array portion;
One side of the bisected imaging area of the imaging means (first imaging area
The first optical means for vertically incident on the area) and the light obliquely transmitted through the lead arrangement portion of the electronic component,
The other side of the bisected imaging area of the imaging means (second imaging area).
Area) and the lead arrangement obtained by the first imaging area of the imaging means.
Based on the captured image of the row portion, the lead pitch and / or
Is a first measuring means for measuring lead bending, and a lead distribution obtained by the first imaging area of the imaging means.
The second image pickup area of the image pickup means with reference to the image pickup image of the row portion
Based on the captured image of the lead array part obtained by
A lead shape inspecting device for an electronic component , comprising: a second measuring unit for measuring a lead float.
Place 2. The lead shape of the electronic component according to claim 1.
In the inspection device, the first optical means vertically arranges the lead arrangement portion of the electronic component.
Two that selectively pass light of a specific component of the transmitted light
One first optical selection element, one optical selection element
Is arranged on the optical axis of the first optical means, and the other optical means
The selective element covers the first imaging area of the imaging means.
The second optical means is arranged so that the lead arrangement portion of the electronic component is obliquely arranged.
In the transmitted light, a component different from the first optical selection element is transmitted.
Equipped with two second optical selection elements for selectively passing the minute
One optical selection element is located on the optical axis of the second optical means.
The other optical selection element of the imaging means.
The electronic component is arranged so as to cover the second imaging area.
Shape inspection device. 3. The lead shape of the electronic component according to claim 1.
In the inspection device, the second optical means is oblique to the second imaging area of the imaging means.
The image of the lead array portion incident from the
A lens including an imaging lens whose aberration is corrected so that
Lead shape inspection device for child parts.