JPH0782772B2 - Fluorescent lamp device - Google Patents
Fluorescent lamp deviceInfo
- Publication number
- JPH0782772B2 JPH0782772B2 JP16981786A JP16981786A JPH0782772B2 JP H0782772 B2 JPH0782772 B2 JP H0782772B2 JP 16981786 A JP16981786 A JP 16981786A JP 16981786 A JP16981786 A JP 16981786A JP H0782772 B2 JPH0782772 B2 JP H0782772B2
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- heat insulating
- lamp device
- fluorescent lamp
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Discharge Lamps And Accessories Thereof (AREA)
Description
【発明の詳細な説明】 〔発明の目的〕 （産業上の利用分野） 本発明は電源部を具備したけい光ランプ装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a fluorescent lamp device having a power supply section.
（従来の技術） 最近省エネルギを目的とし白熱電球よりも効率に優れた
けい光ランプを小形に屈曲成形して、上記白熱電球とほ
ゞ同じ大きさに形成し、このけい光ランプを上記白熱電
球の代替光源として使用できるようにしたけい光ランプ
装置が普及している。(Prior Art) Recently, a fluorescent lamp, which is more efficient than an incandescent light bulb for the purpose of energy saving, is flexibly molded into a small size, and is formed to be approximately the same size as the incandescent light bulb. Fluorescent lamp devices that can be used as an alternative light source for a light bulb are in widespread use.
しかし、けい光ランプ装置の大きさを今後、普及白熱電
球程度の大きさまでコンパクト化し、さらに高輝度化を
進めるとなると、ランプを発光させるための電源部は、
それに応じて小型化され、消費電力も増加し、電源部の
発熱密度は、増加する一方になる。そして、さらに発光
部からの光エネルギを熱エネルギとして吸収するのでそ
の熱対策は深刻である。現状のけい光ランプ装置におい
てこの問題を克服しているものは見当らない。However, in the future, when the size of the fluorescent lamp device will be made compact to the size of a popular incandescent lamp and higher brightness will be promoted, the power supply unit for making the lamp emit light will be
Accordingly, the size is reduced, the power consumption is increased, and the heat generation density of the power supply unit is increasing. Further, since the light energy from the light emitting section is further absorbed as heat energy, the heat countermeasure is serious. No current fluorescent lamp device has overcome this problem.
（発明が解決しようとする問題点） 本発明の目的は、断熱基板を介して連結された発光部と
電源部からなるけい光ランプ装置において、普及白熱電
球なみの小型化にしてもあるいは、より高輝度のけい光
ランプ装置であっても電源部が十分設定温度内に納まる
ようにすることができるけい光ランプ装置を提供しよう
とするものである。(Problems to be Solved by the Invention) An object of the present invention is to reduce the size of a fluorescent lamp device composed of a light emitting part and a power supply part that are connected via a heat insulating substrate, and to reduce the size of the incandescent lamp. It is an object of the present invention to provide a fluorescent lamp device capable of keeping the power supply unit within a preset temperature even if the fluorescent lamp device has high brightness.
（問題点を解決するための手段） 本発明は、放電路を形成するガラスバルブを透光性外囲
器に収納してなる発光管部と、電源要素を電源ケースに
収納してなる電源部と、前記発光管部と前記電源部とを
多層構造を有する断熱基板を介して連結し、該断熱基板
の層間の少なくとも一つに、断熱層となる空間をほぼ全
域にわたって形成することを特徴とするけい光ランプ装
置を提供するものである。(Means for Solving the Problems) The present invention relates to a light emitting tube part in which a glass bulb forming a discharge path is housed in a translucent envelope, and a power supply part in which a power supply element is housed in a power supply case. And the arc tube portion and the power source portion are connected via a heat insulating substrate having a multi-layer structure, and a space to serve as a heat insulating layer is formed in at least one of the layers of the heat insulating substrate over substantially the entire area. The present invention provides a fluorescent lamp device.
（作 用） 今まで発光管部から発生した熱は、断熱基板で断熱され
ていたが、小型化、高輝度化により発熱密度が高くな
り、断熱が不十分となってきた。そのため電源部を設定
温度内におさめることができなかった。(Operation) Up until now, the heat generated from the arc tube was insulated by the heat insulating substrate, but due to miniaturization and higher brightness, the heat generation density has increased and heat insulation has become insufficient. Therefore, the power supply could not be kept within the set temperature.
しかし、本発明のような断熱層（例えば空気層）をもつ
構成にすることにより１枚の断熱基板より１桁以上断熱
効果が高くなる。よって小型化、高輝度化になっても電
源部を設定温度内におさめることが可能となる。さらに
上記空気層を密閉にし、真空にする。そして、この空間
を作る、壁面を熱放射率のわるい材料でコーティングす
ることにより、さらに断熱効果を高めることができる。However, by adopting a structure having a heat insulating layer (for example, an air layer) as in the present invention, the heat insulating effect is higher than that of one heat insulating substrate by one digit or more. Therefore, it becomes possible to keep the power supply within the set temperature even if the size and the brightness are increased. Further, the air layer is closed and a vacuum is applied. Then, by coating the wall surface forming this space with a material having a poor thermal emissivity, the heat insulating effect can be further enhanced.
（実施例） 以下本発明について、第１図に示す一実施例にもとづき
説明する。(Example) The present invention will be described below based on an example shown in FIG.
図において、１は透光性外囲器であり、ガラス、また
は、アクリル樹脂などの透明もしくは、半透明材料によ
り形成されている。外囲器１は一般に白熱級で知られる
PS形もしくはＧ形バルブの形状に合致、もしくは、近似
するように、一端が開放されて、ほぼ球形をなしてい
る。外囲器１の中には、屈曲した放電路を形成するガラ
スバルブ２が外囲器１の開放端と接合される断熱基板３
に取付けられている。断熱基板３に取付けられる、ガラ
スバルブ２、外囲器１の反対面に電源部４が設けられて
いる。電源部４は電気配線基板５とその上に搭載された
電気素子６と、さらにそれらを収納するケース７から成
りたっている。In the figure, reference numeral 1 denotes a translucent envelope, which is formed of a transparent or semitransparent material such as glass or acrylic resin. The envelope 1 is generally known as incandescent grade
One end is open to form a nearly spherical shape so as to match or approximate the shape of the PS type or G type valve. Inside the envelope 1, a glass bulb 2 forming a bent discharge path is joined to the open end of the envelope 1 to form a heat insulating substrate 3
Installed on. A power supply unit 4 is provided on the surface opposite to the glass bulb 2 and the envelope 1 attached to the heat insulating substrate 3. The power supply section 4 is composed of an electric wiring board 5, an electric element 6 mounted thereon, and a case 7 for accommodating them.
この様に形成されたけい光ランプ装置の、前記断熱基板
３をプラスチックなどの断熱性のよい材料で２〜３層に
て構成する。そして、この層と層の間に空気層９をさら
に設け構成する。一般に断熱性の良い材料と、空気層９
とを同じ厚さにて熱伝導率を比較すると、約１桁ほど空
気層９のほうの熱伝導率が低い。すなわち、断熱性能が
よくなる。次に熱の流れを考えてみると発熱は、ガラス
バルブ２と電気素子６から発成する、電気素子６の熱は
電気配線基板５を介してケース７へつたわり自然対流、
ふく射による放熱がされる。この電気素子６のみの発熱
であれば、十分安定作動温度内に入いる。しかし、ラン
プ等の光源は、一般に天井に取付られるため発光管部８
が下向で電源部４が上側になる。すなわち、発光管部８
の熱は断熱基板３を通って電源部４へ熱が伝わる形にな
る。ここで空気層９は一般に用いられる断熱材よりも１
桁ほど断熱性能がよくなるから、この発光管８から発生
する熱を断熱し、電源部４への熱の通過を少なくし電気
素子６を安定に作動させることが可能となるものであ
る。In the fluorescent lamp device thus formed, the heat insulating substrate 3 is composed of two or three layers made of a material having a good heat insulating property such as plastic. Then, an air layer 9 is further provided between the layers. In general, a material with good heat insulation and an air layer 9
Comparing the thermal conductivities of and with the same thickness, the thermal conductivity of the air layer 9 is lower by about one digit. That is, the heat insulation performance is improved. Next, considering the flow of heat, the heat is generated from the glass bulb 2 and the electric element 6, and the heat of the electric element 6 is transferred to the case 7 via the electric wiring board 5 and natural convection.
Radiation dissipates heat. If only the electric element 6 generates heat, it is within a sufficiently stable operating temperature. However, since a light source such as a lamp is generally mounted on the ceiling, the arc tube portion 8
Is downward and the power supply unit 4 is upward. That is, the arc tube portion 8
The heat is transmitted to the power source unit 4 through the heat insulating substrate 3. Here, the air layer 9 is 1 more than a commonly used heat insulating material.
Since the heat insulation performance is improved by the order of magnitude, it is possible to insulate the heat generated from the arc tube 8 and reduce the passage of the heat to the power source section 4 to stably operate the electric element 6.
次に本発明の他の実施例について説明する。第２図は本
発明によるけい光ランプ装置の要部を示す断面図であ
る。このけい光ランプ装置は断熱基板３の層と層の間を
密閉空間10にし、さらにこの空間を真空にする。そして
この密閉空間10を構成する壁面に熱放射率の悪い材料11
例ばメッキなどコーティングする。Next, another embodiment of the present invention will be described. FIG. 2 is a sectional view showing a main part of the fluorescent lamp device according to the present invention. In this fluorescent lamp device, a closed space 10 is provided between layers of the heat insulating substrate 3, and the space is evacuated. Then, a material 11 having a poor thermal emissivity is formed on the wall surface forming the closed space 10.
For example, coating such as plating.
この様にすることにより、真空は空気層よりも、さらに
断熱性能がよく、しかも、壁面を熱放射率の悪い材料11
でコーティングすることによりふく射熱を小さくするこ
とができ、より断熱効果が高くなる。By doing so, the vacuum has a better thermal insulation performance than the air layer, and the wall surface is made of a material with a poor thermal emissivity.
By coating with, the radiant heat can be reduced, and the heat insulation effect becomes higher.
さらに、本発明の他の実施例として第３図に示すよう
に、ケース７に熱放射率の良い材料12例ば、黒色ペイン
トを塗布することによりケース７からの放射を増加さ
せ、電気素子６の温度を低くおさえることができる。Further, as another embodiment of the present invention, as shown in FIG. 3, 12 cases of materials having a good thermal emissivity are applied to the case 7 to increase the radiation from the case 7 by applying a black paint to the electric element 6. The temperature of can be kept low.
本発明によれば、電源部の熱的弊害を少なくすることが
できるので、電源部内の素子などを安定して動作させる
ことができ、結果として装置全体の小型化、高輝度化の
設計が可能となる。According to the present invention, the thermal damage of the power supply unit can be reduced, so that the elements in the power supply unit can be stably operated, and as a result, the overall size of the device can be reduced and the brightness can be increased. Becomes
第１図は、本発明の一実施例を示す断面図、第２図は本
発明の他の実施例を示す断熱基板部の断面図、第３図
は、本発明の他の実施例を示すケース部分の断面図であ
る。 １……外囲器、８……発光管部 ２……ガラスバルブ、９……空気層 ３……断熱基板、10……密閉空間 ４……電源部、11……メッキ ５……電気配線基板、12……黒色ペイント ６……電気素子、13……口金 ７……ケースFIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a sectional view of a heat insulating substrate portion showing another embodiment of the present invention, and FIG. 3 is another embodiment of the present invention. It is sectional drawing of a case part. 1 ... Envelope, 8 ... Aluminum tube section 2 ... Glass bulb, 9 ... Air layer 3 ... Insulation board, 10 ... Closed space 4 ... Power supply section, 11 ... Plating 5 ... Electrical wiring Substrate, 12 ... Black paint 6 ... Electric element, 13 ... Base 7 ... Case
Claims (5)
囲器に収納してなる発光管部と、電源要素を電源ケース
に収納してなる電源部と、前記発光管部と前記電源部と
を多層構造を有する断熱基板を介して連結し、該断熱基
板の層間の少なくとも一つに、断熱層となる空間をほぼ
全域にわたって形成することを特徴とするけい光ランプ
装置。1. A light-emitting tube portion containing a glass bulb forming a discharge path in a translucent envelope, a power supply portion containing a power supply element in a power supply case, the light-emitting tube portion and the power supply. The fluorescent lamp device is characterized in that the space is connected to a portion via a heat insulating substrate having a multi-layered structure, and a space serving as a heat insulating layer is formed in at least one of the layers of the heat insulating substrate over substantially the entire area.
する特許請求の範囲第１項記載のけい光ランプ装置。2. The fluorescent lamp device according to claim 1, wherein the heat insulating layer is an air layer.
真空層であることを特徴とする特許請求の範囲第１項記
載のけい光ランプ装置。3. The fluorescent lamp device according to claim 1, wherein the space is a closed space and the heat insulating layer is a vacuum layer.
い材料がコーティングされていることを特徴とする特許
請求の範囲第３項記載のけい光ランプ装置。4. The fluorescent lamp device according to claim 3, wherein the inner wall surface of the closed space is coated with a material having a low thermal emissivity.
の高い材料でコーティングされていることを特徴とする
特許請求の範囲第１項乃至第４項のいずれかに記載のけ
い光ランプ装置。5. The fluorescence according to any one of claims 1 to 4, wherein the inner wall surface of the power supply case is coated with a material having a high thermal emissivity. Lamp device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16981786A JPH0782772B2 (en) | 1986-07-21 | 1986-07-21 | Fluorescent lamp device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16981786A JPH0782772B2 (en) | 1986-07-21 | 1986-07-21 | Fluorescent lamp device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6326904A JPS6326904A (en) | 1988-02-04 |
| JPH0782772B2 true JPH0782772B2 (en) | 1995-09-06 |
Family
ID=15893452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16981786A Expired - Fee Related JPH0782772B2 (en) | 1986-07-21 | 1986-07-21 | Fluorescent lamp device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0782772B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005085602A (en) * | 2003-09-09 | 2005-03-31 | Matsushita Electric Ind Co Ltd | Method of using vacuum heat insulating material and electric bulb-type fluorescent lamp and compressor-integrated electrical component to which vacuum heat insulating material is applied |
| JP5421037B2 (en) * | 2009-09-15 | 2014-02-19 | パナソニック株式会社 | Light emitting module |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59148206A (en) * | 1983-02-14 | 1984-08-24 | 三菱電機株式会社 | Discharge lamp device |
| JPS59148205A (en) * | 1983-02-14 | 1984-08-24 | 三菱電機株式会社 | Discharge lamp device |
| JPS59192209U (en) * | 1983-06-08 | 1984-12-20 | 株式会社東芝 | fluorescent lamp device |
-
1986
- 1986-07-21 JP JP16981786A patent/JPH0782772B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6326904A (en) | 1988-02-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |