JPH0783956B2 - Mold of radio wave absorber - Google Patents
Mold of radio wave absorberInfo
- Publication number
- JPH0783956B2 JPH0783956B2 JP4627692A JP4627692A JPH0783956B2 JP H0783956 B2 JPH0783956 B2 JP H0783956B2 JP 4627692 A JP4627692 A JP 4627692A JP 4627692 A JP4627692 A JP 4627692A JP H0783956 B2 JPH0783956 B2 JP H0783956B2
- Authority
- JP
- Japan
- Prior art keywords
- die set
- lower piece
- holes
- piece
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000006096 absorbing agent Substances 0.000 title claims description 28
- 238000000465 moulding Methods 0.000 claims description 11
- 229910000859 α-Fe Inorganic materials 0.000 description 14
- 239000002994 raw material Substances 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000779 smoke Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Compounds Of Iron (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、グリッド（格子型）構
造の電波吸収体のプレス成形を可能と成した電波吸収体
の成形金型に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold for a radio wave absorber which enables press molding of a grid (lattice type) radio wave absorber.
【０００２】[0002]
【従来の技術】従来、電波吸収体として平板状のフェラ
イトタイルが使用されていたが、かかるフェライトタイ
ルは広帯域特性が見劣り、そこで性能の良い電波吸収体
が望まれており、グリッド構造（多数の孔が穿設された
格子型）のものが開発されたがグリッド状に成形するこ
とが困難な欠点を有していた。2. Description of the Related Art Conventionally, a flat plate-shaped ferrite tile has been used as an electromagnetic wave absorber, but such a ferrite tile is inferior in broadband characteristics, and there is a demand for an electromagnetic wave absorber with good performance. A lattice type having holes formed therein has been developed, but it has a drawback that it is difficult to form it in a grid shape.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、グリッド構
造であってもプレス成形圧力を高めて強固なグリッド構
造の成形体のプレス成形を可能と成す様にした電波吸収
体の成形金型を提供せんとするものである。DISCLOSURE OF THE INVENTION The present invention provides a mold for a radio wave absorber which is capable of press-molding a molded product having a strong grid structure by increasing the press-molding pressure even with a grid structure. It is intended to be provided.
【０００４】[0004]
【課題を解決するための手段】本発明は、上記従来技術
に基づく、グリッド構造に高圧力でプレス成形すること
が困難な課題に鑑み、下駒に下駒孔を穿設すると共に該
下駒孔に孔形成棒を嵌入し、該孔形成棒を外枠と連動す
る受板に固定することによって、１度のプレス成形で多
数の孔を穿設したグリッド構造に成形する様にして、又
下駒ダイセットの中央に桟となる枠部を形成したり、中
央に近い位置で支柱を設けることによって、プレス圧力
に対して下駒及び下駒ダイセット等を補強する様にし
て、上記課題を解決せんとしたものである。SUMMARY OF THE INVENTION In view of the problem that it is difficult to press-form a grid structure at a high pressure based on the above-mentioned conventional technique, the present invention provides a lower piece hole and a lower piece hole. By inserting a hole forming rod into the hole and fixing the hole forming rod to a receiving plate that interlocks with the outer frame, a grid structure having a large number of holes formed by one press molding is formed. By forming a frame portion to be a crosspiece in the center of the lower piece die set or providing a support at a position close to the center, the lower piece and the lower piece die set are reinforced against the press pressure, and the above-mentioned problem is solved. Is the solution.
【０００５】[0005]
【作用】本発明にあっては、外枠の上昇により外枠と連
動した孔形成棒を上昇させて孔形成棒の側方部に充填キ
ャビティーを形成し、フェライト原料を充填した後上駒
を下降させてグリッド構造の電波吸収体をプレス成形
し、又立板及び下駒ダイセットのブリッジ構造により下
駒ダイセットの強度不足に対して下駒ダイセットの所要
部に枠部を設けたり、下型ダイセットと下駒ダイセット
の間に支柱を設けて下駒ダイセットのブリッジ構造の補
強を行うのである。According to the present invention, when the outer frame is raised, the hole forming rod which is interlocked with the outer frame is raised to form the filling cavity in the side portion of the hole forming rod, and the upper piece is filled with the ferrite raw material. Down to press-mold the electromagnetic wave absorber of the grid structure, and by the bridge structure of the standing plate and the lower piece die set, provide a frame part in the required part of the lower piece die set in case of insufficient strength of the lower piece die set. A pillar is provided between the lower die set and the lower die set to reinforce the bridge structure of the lower die set.
【０００６】[0006]
【実施例】以下本発明の一実施例を図面に基づいて説明
すると、先ず、本発明に係る成形金型１でプレス成形さ
れる電波吸収体Ｍの形状は、正方形フェライト製で全面
に正方形の多数の孔Ｓ、S1…を穿設したグリッド（格子
型）構造であり、この材質形状による特徴を先ず説明す
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. First, the shape of the electromagnetic wave absorber M press-molded by the molding die 1 according to the present invention is made of square ferrite and has a square shape on the entire surface. A grid (lattice type) structure having a large number of holes S, S1 ...
【０００７】かかるフェライトグリッド型の電波吸収体
Ｍは、電波暗室に使用されるものであり、従来のフェラ
イト吸収体の常識を破る画期的なフェライトグリッド型
の広帯域電波吸収体で、素材（フェライト製）そのもの
の高特性（μ２３００以上）と独得のグリッド（格子
型）構造が高度に組み合わされ、電磁波吸収性能及び耐
高電力特性を大幅に向上させ、その有効電磁波吸収特性
は３０ＭＨｚから１０００ＭＨｚの広帯域にわたり、従
来型フェライトタイル吸収体（無垢な平板状）の吸収帯
域（５０〜４００ＭＨｚ）の２倍以上の性能を有する。Such a ferrite grid type electromagnetic wave absorber M is used in an anechoic chamber and is an epoch-making ferrite grid type broadband electromagnetic wave absorber that breaks the common sense of conventional ferrite absorbers. The high characteristics (μ2300 or more) of the product itself and the unique grid (lattice type) structure are highly combined to significantly improve the electromagnetic wave absorption performance and the high power resistance, and the effective electromagnetic wave absorption characteristics are wide band from 30MHz to 1000MHz. In addition, the performance is at least twice as high as that of the absorption band (50 to 400 MHz) of the conventional ferrite tile absorber (solid plate shape).
【０００８】そして、上記電波吸収体Ｍは従来のものに
比して１／５０の厚さでわずか２０ｍｍ（１０ｃｍ角）
であり、例えば３０ＭＨｚから１０００ＭＨｚの広帯域
に対応するためには、従来は厚さ２５００ｍｍのウレタ
ン（またはスチロール）製ピラミッド吸収体、またはフ
ェライトタイルと約１０００ｍｍの厚さのピラミッドと
の複合吸収体が必要とされてきたため、電波暗室寸法も
この吸収壁材寸法に見合った大きさが必要で、暗室の小
型化の限界要因とされてきた。The radio wave absorber M has a thickness of 1/50 of that of the conventional one and is only 20 mm (10 cm square).
For example, in order to support a wide band of 30 MHz to 1000 MHz, conventionally, a pyramid absorber made of urethane (or styrene) having a thickness of 2500 mm or a composite absorber of a ferrite tile and a pyramid having a thickness of about 1000 mm is required. Therefore, the size of the anechoic chamber is required to be commensurate with the size of the absorbing wall material, and has been regarded as a limiting factor for downsizing the anechoic chamber.
【０００９】本願の電波吸収体Ｍでは厚さ約２０ｍｍで
暗室の小型化と内部スペースの拡大と云う二つの理想を
一度に達成出来、又１０００ＭＨｚ以上の帯域の場合で
も、高さわずか３６０ｍｍのピラミッドを電波吸収体Ｍ
と組み合わせて使用することで３０ＭＨｚから５０ＧＨ
ｚ以上のマイクロ波帯迄を連続カバーすることが出来、
更に素材は耐熱性１０００℃と熱に強いフェライト磁性
体のため、火災や発煙の心配も無く、1.２ｋｗ／ｍ2 ・
１２０分照射の試験ではウレタンピラミッドでは３００
℃に達し燃焼したのに対し、電波吸収体Ｍは発火・発煙
も起こらず、又米国における実験でも１０００Ｖ／ｍ
（約2.７ｋｗ／ｍ2 ）で１５分以上の高出力試験にも問
題なく使用できることが実証されています。The electromagnetic wave absorber M of the present application has a thickness of about 20 mm and can simultaneously achieve the two ideals of downsizing the dark room and expanding the internal space. Even in the band of 1000 MHz or more, the pyramid has a height of only 360 mm. The electromagnetic wave absorber M
30MHz to 50GH when used in combination with
It is possible to continuously cover up to the microwave band of z or more,
In addition, the material is a ferrite magnetic material with a heat resistance of 1000 ° C, which is strong against heat, so there is no fear of fire or smoke, and 1.2 kw / m 2 ·
300 minutes for urethane pyramid in 120 minutes irradiation test
Although the temperature reached ℃ and burned, the electromagnetic wave absorber M did not ignite or emit smoke, and was also tested in the US at 1000 V / m.
It has been proved that it can be used for a high output test of 15 minutes or more at (about 2.7 kw / m 2 ) without any problem.
【００１０】２は地上に固定した下型ダイセットであ
り、該下型ダイセット２上に板状の夫々一対の立板３、
3a、４、4aを立設固定し（４枚で四角形の覆い、囲
い）、該立板３、3a、４、4a上に下駒ダイセット５を載
置固定し、下型ダイセット２、立板３、3a、４、4a及び
下駒ダイセット５で空間６を形成し、更に立板３、3a、
４、4aの内方で下型ダイセット２と下駒ダイセット５間
に支柱（補強棒）７、7a…を立設固定している。Reference numeral 2 denotes a lower die set fixed on the ground, and a pair of plate-shaped standing plates 3 on the lower die set 2.
3a, 4 and 4a are erected and fixed (quadrangular covering and enclosure with four pieces), the lower piece die set 5 is placed and fixed on the standing plates 3, 3a, 4 and 4a, and the lower die set 2, A space 6 is formed by the standing plates 3, 3a, 4, 4a and the lower piece die set 5, and the standing plates 3, 3a,
Columns (reinforcing rods) 7, 7a ... Are vertically fixed between the lower die set 2 and the lower piece die set 5 on the inner side of 4, 4a.
【００１１】８は下駒ダイセット５上に固定した下駒、
９は下駒ダイセット５上方で上下動自在に配置した外枠
であり、該外枠９の中央部に入レ子10を介在させてキャ
ビティー11を形成し、該キャビティー11内に下駒８の上
部12を嵌入している。Reference numeral 8 denotes a lower piece fixed on the lower piece die set 5,
Reference numeral 9 denotes an outer frame that is vertically movable above the lower piece die set 5, and a cavity 11 is formed in the center of the outer frame 9 with an interlocking lever 10 interposed between the outer frame 9 and the lower frame. The upper part 12 of the piece 8 is inserted.
【００１２】13は空間６内に上下動自在に配置した受板
であり、該受板13は下駒ダイセット５の穿設孔14、14a
…に挿通した固定ピン15、15a …で入レ子10の下面に固
定され、外枠９（入レ子10）に同調して上下動する様に
成している。A receiving plate 13 is arranged in the space 6 so as to be vertically movable, and the receiving plate 13 is provided with holes 14 and 14a in the lower die set 5.
It is fixed to the lower surface of the insert lever 10 by fixing pins 15 and 15a which are inserted in the ..., and is configured to move up and down in synchronization with the outer frame 9 (insert member 10).
【００１３】16、16a …は下駒ダイセット５に上下方向
に穿設したダイセット孔、17、17a…は下駒８に上下方
向に穿設した下駒孔であり、ダイセット孔16、16a …及
び下駒孔17、17a …の両者に電波吸収体Ｍの孔Ｓ、S1…
に相当する四角柱中空状の孔形成棒18、18a …を夫々上
下動自在に挿通している。, 16a are die set holes formed in the lower piece die set 5 in the vertical direction, 17, 17a are lower piece holes formed in the lower piece 8 in the vertical direction, and the die set holes 16, 16a ... and lower piece holes 17, 17a ... Both holes S, S1 ...
.. corresponding to the square column hollow hole-forming rods 18, 18a ...
【００１４】又、下駒ダイセット５のダイセット孔16、
16a …と下駒８の下駒孔17、17a …は形状が相違してお
り、且つ下駒ダイセット５におけるダイセット孔16、16
a …は下駒ダイセット５の中央部に全面的に例えば電波
吸収体Ｍ全体の大きさで１個の四角状に穿設（この部分
全体の刳貫き）されておらず、中央部の孔形成棒18、18
a …１本（孔Ｓ、S1…１個）に相当する中央孔19、該中
央孔19から枠部（桟）20、20a …を介して十字方向に孔
形成棒18、18a …２本（孔Ｓ、S1…２個）に夫々相当す
る十字孔21、21a …、四角部に枠部20、20a …を介して
孔形成棒18、18a …４本（孔Ｓ、S1…４個）に夫々相当
する四角孔22、22a …を区割穿設している。Further, the die set hole 16 of the lower piece die set 5,
16a and the lower piece holes 17, 17a of the lower piece 8 have different shapes, and the die set holes 16, 16 in the lower piece die set 5 are different.
a ... is not formed in the central portion of the lower piece die set 5 over the entire surface, for example, in the form of one square in the size of the entire electromagnetic wave absorber M (the whole portion is hollowed), and the hole in the central portion is formed. Forming rod 18, 18
a ... a central hole 19 corresponding to one (hole S, S1 ...), and two hole forming rods 18, 18a ... (in the cross direction from the central hole 19 through the frame portions (bars) 20, 20a. .. (corresponding to the holes S, S1 ... 2) respectively, and the cross forming holes 18, 21a .. 4 to the four holes (holes S, S1 .. 4) via the frame portions 20, 20a. Corresponding square holes 22, 22a ... Are formed by division.
【００１５】23、23a …は受板13の４角に穿設した支柱
孔であり、該支柱孔23、23a …に支柱７、7a…を挿通
し、下型ダイセット２上に固定された支柱７、7a…を介
して下駒ダイセット５を載置状態で保持している。Numerals 23, 23a are pillar holes formed at four corners of the receiving plate 13, and the pillars 7, 7a are inserted through the pillar holes 23, 23a, and fixed on the lower die set 2. The lower piece die set 5 is held in a mounted state via the columns 7, 7a ....
【００１６】24は上下動自在な上駒板であり、該上駒板
24の下面に上駒25を固定しており、該上駒25の下面形状
は電波吸収体Ｍと同一のグリッド形状であり、中空棒1
8、18a …が出入自在な上駒孔26、26a …を穿設し、又
上駒板24の側面にストッパー27、27a …を設けている。Reference numeral 24 denotes an upper piece plate that can move up and down.
An upper piece 25 is fixed to the lower surface of 24, and the lower surface of the upper piece 25 has the same grid shape as that of the electromagnetic wave absorber M.
The upper piece holes 26, 26a, ... through which the eight pieces 18a, 18a, ... can be freely inserted and removed, and the stoppers 27, 27a ... are provided on the side surfaces of the upper piece plate 24.
【００１７】次に本発明に係る電波吸収体の成形金型の
作用について説明すると、外枠９及び上駒板24（上駒2
5）を上昇させ、外枠９の上昇により固定ピン15、15a
…及び受板13を介して孔形成棒18、18a …も上昇すると
共に、外枠９の中央部で入レ子10の内方、下駒８の上部
12の上方且つ孔形成棒18、18a …の側方部にフェライト
原料Ｗのグリッド構造の充填キャビティー28が発生し、
該充填キャビティー28に粉体状のフェライト原料Ｗをチ
ャージングし、上駒25を下降させて充填キャビティー28
内のフェライト原料Ｗをプレス成形し、上駒25を上昇さ
せると共に外枠９と孔形成棒18、18a …を下降させて下
駒ダイセット５の上部12（外枠９）上に電波吸収体Ｍを
現出させてグリッド構造の成形体を取出し、順次この工
程を繰り返すのである。Next, the operation of the molding die for the radio wave absorber according to the present invention will be described. The outer frame 9 and the upper piece plate 24 (upper piece 2
5) is lifted and the outer frame 9 is lifted to fix the fixing pins 15 and 15a.
The hole forming rods 18 and 18a also rise through the support plate 13 and the receiving plate 13, and at the center of the outer frame 9, the inner side of the insert 10 and the upper part of the lower piece 8
The filling cavity 28 of the grid structure of the ferrite raw material W is generated in the upper part of 12 and in the lateral part of the hole forming rods 18, 18a.
A powdery ferrite raw material W is charged into the filling cavity 28, and the upper piece 25 is lowered to fill the filling cavity 28.
The ferrite raw material W in the inside is press-molded, the upper piece 25 is raised and the outer frame 9 and the hole forming rods 18 and 18a are lowered to be a radio wave absorber on the upper part 12 (outer frame 9) of the lower piece die set 5. By exposing M, a molded product having a grid structure is taken out, and this process is sequentially repeated.
【００１８】又、下駒８の上部12の上面にはフェライト
原料Ｗを介して上駒25によりプレス圧力が作用し、下駒
ダイセット５にも同様の作用を発生するが、下駒ダイセ
ット５の中央部には枠部20、20a …が存在しているため
に、下駒８の中央部でも強度を保持出来たり、立板３、
3a、４、4a及び下駒ダイセット５によるブリッジ構造に
対しても、下駒ダイセット５自体の強度保持が可能とな
る。The pressing pressure acts on the upper surface of the upper part 12 of the lower piece 8 by the upper piece 25 through the ferrite raw material W, and the same effect is generated in the lower piece die set 5. Since the frame portions 20, 20a ... Are present in the central portion of 5, the strength can be maintained even in the central portion of the lower piece 8, and the standing plate 3,
The strength of the lower piece die set 5 itself can be maintained even with respect to the bridge structure of the lower piece die set 3a, 4 and 4a.
【００１９】更に、下駒ダイセット５中央部に対してプ
レス圧力が作用し、下駒ダイセット５の保持部が周辺部
の立板３、3a、４、4aであるとしても、中央に近い位
置、即ち受板13の周辺部に支柱孔23、23a …を穿設して
支柱７、7a…を配置していることにより、立板３、3a、
４、4a及び下駒ダイセット５のブリッジ構造に対して中
央に近い位置で下駒ダイセット５の撓みに対する強度保
持を図っている。Further, pressing pressure acts on the central portion of the lower piece die set 5, and even if the holding portion of the lower piece die set 5 is the standing plates 3, 3a, 4, 4a in the peripheral portion, it is close to the center. At the position, that is, at the periphery of the receiving plate 13, the supporting holes 7, 23a ... Are bored and the supporting columns 7, 7a are arranged, so that the standing plates 3, 3a ,.
The strength of the lower piece die set 5 against bending is maintained at a position close to the center of the bridge structure of the lower piece die set 5 and the lower piece die set 5.
【００２０】尚、立板３、3a、４、4aは下駒ダイセット
５を固定すると共に下駒ダイセット５の下方部に設けた
空間６内に受板13を配置しているために、立板３、3a、
４、4aの位置は受板13より外側にせざるを得ず、このブ
リッジ構造により下駒ダイセット５の中央部の強度向上
が必要となる。Since the standing plates 3, 3a, 4 and 4a fix the lower piece die set 5 and the receiving plate 13 is arranged in the space 6 provided in the lower part of the lower piece die set 5, Stands 3, 3a,
The positions of 4 and 4a are unavoidable outside the receiving plate 13, and it is necessary to improve the strength of the central portion of the lower piece die set 5 by this bridge structure.
【００２１】[0021]
【発明の効果】要するに本発明は、下型ダイセット２上
に立板３、3a、４、4aを立設すると共に該立板３、3a、
４、4a上に下駒ダイセット５を載置し、該下駒ダイセッ
ト５上に下駒８を固定すると共に下駒ダイセット５の上
方部に外枠９を上下動自在に配置し、下駒８の上部12を
外枠９のキャビティー11に嵌入し、又下駒ダイセット５
の下方の空間６に受板13を上下動自在に配置すると共に
外枠９と受板13を固定ピン15、15a …で連結したので、
孔Ｓ、S1…形成を行う孔形成棒18、18a …及び該孔形成
棒18、18a …の駆動源の受板13は成形金型１の本体（空
間６）内に配置してコンパクト化したり駆動部の露出を
防止出来、又受板13は外枠９に連動しているために通常
のプレス成形力の他に駆動源は必要なく、又下駒ダイセ
ット５と下駒８に多数のダイセット孔16、16a …と下駒
孔17、17a …を夫々穿設し、該ダイセット孔16、16a …
と下駒孔17、17a …に受板13上に固定された孔形成棒1
8、18a …を嵌入し、又外枠９の上部に上駒25を上下動
自在に配置すると共に上駒25に上駒孔26、26a …を穿設
したので、下駒８に対して孔形成棒18、18a …が上下動
すると共に、該孔形成棒18、18a …が上駒孔26、26a …
に嵌入することによりグリッド構造の電波吸収体Ｍをプ
レス成形出来るのである。In summary, according to the present invention, the standing plates 3, 3a, 4, 4a are erected on the lower die set 2 and the standing plates 3, 3a,
4, the lower piece die set 5 is placed on the lower piece die set 5, the lower piece 8 is fixed on the lower piece die set 5, and the outer frame 9 is arranged above the lower piece die set 5 so as to be vertically movable. The upper part 12 of the lower piece 8 is fitted into the cavity 11 of the outer frame 9, and the lower piece die set 5
Since the receiving plate 13 is vertically movable in the space 6 below the outer frame 9 and the receiving plate 13 is connected by the fixing pins 15, 15a ...
The hole forming rods 18 and 18a for forming the holes S, S1 ... And the receiving plate 13 of the driving source for the hole forming rods 18, 18a ... Are arranged in the main body (space 6) of the molding die 1 to make it compact. The drive unit can be prevented from being exposed, and since the receiving plate 13 is interlocked with the outer frame 9, a drive source is not necessary in addition to the normal press forming force, and the lower piece die set 5 and the lower piece 8 have a large number of driving sources. The die set holes 16, 16a ... And the lower piece holes 17, 17a ... Are drilled respectively, and the die set holes 16, 16a.
And a hole forming rod 1 fixed on the receiving plate 13 in the lower piece holes 17, 17a.
8 and 18a are inserted, and the upper piece 25 is vertically movable on the upper portion of the outer frame 9 and the upper piece 25 is provided with upper piece holes 26, 26a. The forming rods 18, 18a move up and down, and the hole forming rods 18, 18a.
The radio wave absorber M having a grid structure can be press-molded by being fitted into the.
【００２２】又、下駒ダイセット５に穿設したダイセッ
ト孔16、16a …は枠部20、20a …を設けて１本の孔形成
棒18、18a …が嵌入する中央孔19、２本の孔形成棒18、
18a…が夫々嵌入する十字孔21、21a …、及び４本の孔
形成棒18、18a …が夫々嵌入する四角孔22、22a …を区
割穿設したので、電波吸収体Ｍの孔Ｓ、S1…をプレス成
形するに際して、下駒ダイセット５にプレス圧力が作用
しても枠部20、20a …の存在により下駒ダイセット５自
体の強度を維持出来たり、故障を未然に防止出来る。Further, the die set holes 16, 16a ... Bored in the lower piece die set 5 are provided with frame portions 20, 20a ... And central holes 19, 2 into which one hole forming rod 18, 18a. Hole forming rod 18,
Since the cross holes 21, 21a ... into which 18a ... are respectively inserted and the square holes 22, 22a ... into which the four hole forming rods 18, 18a ... are respectively inserted are formed by division, the holes S of the electromagnetic wave absorber M, At the time of press-molding S1 ..., the strength of the lower piece die set 5 itself can be maintained due to the existence of the frame portions 20, 20a.
【００２３】又、下型ダイセット２と下駒ダイセット５
の間で、受板13に穿設した支柱孔23、23a …を挿通して
支柱７、7a…を介在させたので、下駒ダイセット５を保
持する立板３、3a、４、4aの間隔が広くて下駒ダイセッ
ト５のブリッジ構造の全体強度が低下しても、支柱７、
7a…で下駒ダイセット５の中央部の強度を保持出来、撓
みを防止出来、又故障を未然に防止出来る等その実用的
効果甚だ大なるものである。Also, the lower die set 2 and the lower piece die set 5
Between the upright plates 3, 3a, 4 and 4a holding the lower piece die set 5, since the upright holes 23, 23a formed in the receiving plate 13 are inserted to interpose the uprights 7, 7a. Even if the gap is wide and the overall strength of the bridge structure of the lower piece die set 5 is reduced,
With 7a, the strength of the central portion of the lower piece die set 5 can be maintained, the bending can be prevented, and the failure can be prevented beforehand, which is a great practical effect.
【図１】本発明に係る成形金型の正面図である。FIG. 1 is a front view of a molding die according to the present invention.
【図２】図１の正面断面図である。FIG. 2 is a front sectional view of FIG.
【図３】プレス成形時の工程図である。FIG. 3 is a process drawing at the time of press molding.
【図４】下駒ダイセットの裏面図である。FIG. 4 is a rear view of the lower piece die set.
【図５】図４の断面図である。5 is a cross-sectional view of FIG.
【図６】下駒の平面図である。FIG. 6 is a plan view of a lower piece.
【図７】図６の断面図である。7 is a cross-sectional view of FIG.
【図８】上駒の裏面図である。FIG. 8 is a rear view of the upper piece.
【図９】図８の断面図である。9 is a cross-sectional view of FIG.
【図１０】受板の裏面図である。FIG. 10 is a rear view of the receiving plate.
【図１１】図１０の断面図である。11 is a cross-sectional view of FIG.
【図１２】電波吸収体の斜視図である。FIG. 12 is a perspective view of a radio wave absorber.
２ 下型ダイセット ３、3a 立板 ４、4a 立板 ５ 下駒ダイセット ６ 空間 ７、7a… 支柱 ８ 下駒 ９ 外枠 11 キャビティー 13 受板 15、15a … 固定ピン 16、16a … ダイセット孔 17、17a … 下駒孔 18、18a … 孔形成棒 19 中央孔 20、20a … 枠部 21、21a … 十字孔 22、22a … 四角孔 23、23a … 支柱孔 25 上駒 26、26a … 上駒孔 2 Lower die set 3, 3a Standing plate 4, 4a Standing plate 5 Lower piece die set 6 Space 7, 7a ... Strut 8 Lower piece 9 Outer frame 11 Cavity 13 Support plate 15, 15a… Fixing pin 16, 16a… Die Set holes 17, 17a ... Lower piece holes 18, 18a ... Hole forming rod 19 Center holes 20, 20a ... Frame portions 21, 21a ... Cross holes 22, 22a ... Square holes 23, 23a ... Support holes 25 Upper pieces 26, 26a ... Upper piece hole
フロントページの続き (72)発明者 野村 孝 愛知県刈谷市宝町６丁目31番地 日本超硬 株式会社内 (56)参考文献 特開 平２−61001（ＪＰ，Ａ) 特公 昭55−41281（ＪＰ，Ｂ２)Front page continuation (72) Inventor Takashi Nomura 6-31 Takaramachi, Kariya city, Aichi Japan Cemented Carbide Co., Ltd. , B2)
Claims (3)
に該立板上に下駒ダイセットを載置し、該下駒ダイセッ
ト上に下駒を固定すると共に下駒ダイセットの上方部に
外枠を上下動自在に配置し、下駒の上部を外枠のキャビ
ティーに嵌入し、又下駒ダイセットの下方の空間に受板
を上下動自在に配置すると共に外枠と受板を固定ピンで
連結し、下駒ダイセットと下駒に多数のダイセット孔と
下駒孔を夫々穿設し、該ダイセット孔と下駒孔に受板上
に固定された孔形成棒を嵌入し、又外枠の上部に上駒を
上下動自在に配置すると共に上駒に上駒孔を穿設したこ
とを特徴とする電波吸収体の成形金型。1. A standing plate is erected on the lower die set, the lower piece die set is placed on the standing plate, and the lower piece is fixed on the lower piece die set. The outer frame is vertically movably arranged in the upper part, the upper part of the lower piece is fitted in the cavity of the outer frame, and the receiving plate is vertically movably arranged in the space below the lower piece die set and the outer frame is received. The plate is connected by fixing pins, and a large number of die set holes and lower piece holes are respectively formed in the lower piece die set and the lower piece, and hole forming rods fixed on the receiving plate in the die set holes and the lower piece holes. A mold for a radio wave absorber, characterized in that the upper piece is fitted in the upper piece so that the upper piece is vertically movable, and the upper piece has a hole.
は枠部を設けて１本の孔形成棒が嵌入する中央孔、２本
の孔形成棒が夫々嵌入する十字孔、及び４本の孔形成棒
が夫々嵌入する四角孔を区割穿設したことを特徴とする
請求項１の電波吸収体の成形金型。2. A die set hole formed in the lower piece die set is provided with a frame portion, a central hole into which one hole forming rod is fitted, a cross hole into which two hole forming rods are fitted, and four holes. 2. The mold for a radio wave absorber according to claim 1, wherein square holes into which the hole-forming rods of FIGS.
で、受板に穿設した支柱孔を挿通して支柱を介在させた
ことを特徴とする請求項１又は２の電波吸収体の成形金
型。3. The electromagnetic wave absorber according to claim 1, wherein a column is inserted between the lower die set and the lower piece die set by inserting a column hole formed in the receiving plate. Molding die.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4627692A JPH0783956B2 (en) | 1992-01-31 | 1992-01-31 | Mold of radio wave absorber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4627692A JPH0783956B2 (en) | 1992-01-31 | 1992-01-31 | Mold of radio wave absorber |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05212596A JPH05212596A (en) | 1993-08-24 |
| JPH0783956B2 true JPH0783956B2 (en) | 1995-09-13 |
Family
ID=12742709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4627692A Expired - Fee Related JPH0783956B2 (en) | 1992-01-31 | 1992-01-31 | Mold of radio wave absorber |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0783956B2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5541281B2 (en) | 2009-06-03 | 2014-07-09 | 株式会社ニコン | Vibration actuator, lens barrel and camera |
-
1992
- 1992-01-31 JP JP4627692A patent/JPH0783956B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5541281B2 (en) | 2009-06-03 | 2014-07-09 | 株式会社ニコン | Vibration actuator, lens barrel and camera |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05212596A (en) | 1993-08-24 |
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