JPH0784041B2 - Laminated board manufacturing method - Google Patents
Laminated board manufacturing methodInfo
- Publication number
- JPH0784041B2 JPH0784041B2 JP20758186A JP20758186A JPH0784041B2 JP H0784041 B2 JPH0784041 B2 JP H0784041B2 JP 20758186 A JP20758186 A JP 20758186A JP 20758186 A JP20758186 A JP 20758186A JP H0784041 B2 JPH0784041 B2 JP H0784041B2
- Authority
- JP
- Japan
- Prior art keywords
- base material
- fiber length
- paper
- paper base
- length distribution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Description
【発明の詳細な説明】 (産業上の利用分野) 本発明は、印刷回路用銅張積層板の製造方法に関する。TECHNICAL FIELD The present invention relates to a method for producing a copper clad laminate for printed circuits.
(従来の技術) 近年、銅張積層板には、プリント配線板加工技術の高度
化及び部品挿入の自動化に伴い、優れた寸法精度ととも
にそり、ねじれの少ないことが強く要求される。このた
め、そり、ねじれ、寸法変化の少ない木材パルプを原料
とした紙基材の採用、また紙基材の引張り強さのたて方
向とよこ方向の比が1.0:1乃至1.4:1の範囲にあるものを
使用することによって前記要求に対処している。(Prior Art) In recent years, copper clad laminates have been strongly required to have excellent dimensional accuracy and less warpage as the printed wiring board processing technology is advanced and component insertion is automated. For this reason, the adoption of a paper base material made from wood pulp with less warp, twist, and dimensional change, and the ratio of the tensile strength of the paper base material in the vertical direction and the horizontal direction is in the range of 1.0: 1 to 1.4: 1. Some have addressed the need by using one.
(発明が解決しようとする問題点) しかしながら、前記程度の対策ではプリント配線板のそ
り、ねじれを十分に解消できない現状にある。プリント
配線板の形状や残銅率に変化が生じた場合、そり、ねじ
れが大きくなり実用に供し得ない結果となっている。(Problems to be Solved by the Invention) However, the current situation is that the warp and twist of the printed wiring board cannot be sufficiently eliminated by the measures described above. When the shape or residual copper rate of the printed wiring board changes, warping and twisting become large, and the results cannot be put to practical use.
(問題点を解決するための手段) 本発明者は、以上の問題点にかんがみ、研究の結果本発
明を得た。(Means for Solving Problems) The present inventors have obtained the present invention as a result of research in view of the above problems.
銅張積層板は、紙基材に熱硬化性樹脂を含浸乾燥したプ
リプレグの所要枚数を加熱加圧して製造するが、このプ
リプレグの組織が均一な伸縮をしないときは、そり及び
ねじれは大きくなる。このそり、ねじれを小さくするた
めには、プリプレクの表裏において均一な繊維分布と樹
脂の付着が必要である。A copper clad laminate is manufactured by heating and pressing a required number of prepregs obtained by impregnating a paper base material with a thermosetting resin and drying. When the structure of this prepreg does not uniformly expand and contract, warpage and twisting increase. . In order to reduce this warpage and twist, it is necessary to have a uniform fiber distribution and resin adhesion on the front and back of the prepreg.
本発明は、紙の厚さ方向を3層に分けてなる表裏層にお
いて、42M/Sオン、60M/Sオン、100M/Sオン、150M/Sオ
ン、150M/Sパスの5種類の繊維長分布の比率の各々の差
の絶対値が1.5%以下という均一な繊維長分布をなす紙
基材を便用するものである。The present invention has five types of fiber lengths of 42M / S on, 60M / S on, 100M / S on, 150M / S on, 150M / S pass in front and back layers formed by dividing the paper in the thickness direction into three layers. A paper base material having a uniform fiber length distribution in which the absolute value of each difference in distribution ratio is 1.5% or less is used.
(実施例) (製造例及び測定法) 繊維長0.8〜1.8mmのLBKP(広葉樹晒クラフトパルプ)を
用い、5%の水分散液として250メッシュのスクリーン
を使用して坪量132g/m2の紙を作製した。150メッシュの
スクリーンを用いると短い繊維がスクリーンを抜けてし
まいスクリーン側(ワイヤー面)の繊維長分布が長い方
に分布する。一方、その反対側のフェルト面はスクリー
ンに積層された繊維により短い繊維が捕捉されワイヤー
面に比べ繊維長分布が短い方に分布する。そのため紙の
厚み方向で繊維長分布が異なる。この繊維長分布の厚み
方向の片寄りが反り、ねじれに悪影響する。目の細かい
スクリーンを用い短い繊維長の抜けを防止したが、150
メッシュでもあらかじめ長い繊維長のものを分別してお
き、その分散液で極薄くメッシュ表面を詰まらせその後
通常の操作を行う方法もある。(Example) (Production Example and Measuring Method) LBKP (hardwood bleached kraft pulp) having a fiber length of 0.8 to 1.8 mm was used as a 5% aqueous dispersion using a 250 mesh screen to obtain a basis weight of 132 g / m 2 . Paper was made. If a 150 mesh screen is used, short fibers will pass through the screen and the fiber length distribution on the screen side (wire side) will be distributed in the longer direction. On the other hand, on the felt surface on the opposite side, short fibers are captured by the fibers laminated on the screen, and the fiber length distribution is shorter than that of the wire surface. Therefore, the fiber length distribution differs in the thickness direction of the paper. The deviation of the fiber length distribution in the thickness direction warps and adversely affects the twist. A fine screen was used to prevent short fiber lengths from slipping out.
There is also a method in which long mesh fibers having a long fiber length are separated in advance, and the dispersion is used to clog the mesh surface very thinly and then the normal operation is performed.
紙基材を3層に分けての表裏層の繊維長分布は、次のよ
うにして行った。紙基材の片面(表層)に、幅100mmの
粘着剤付きポリエステルテープ(粘着テープ)を当てが
い、押しつけてから粘着テープを剥がす。この時粘着テ
ープには、粘着面に紙基材から紙が層状に剥がれて付着
してくる。粘着テープの押しつけ圧力や剥離角度を調節
することにより、剥離するときに紙基材の厚さの約1/3
を剥がすことができる。主として剥離角度で調節でき18
0゜剥離が実験結果では良好であった。剥離した粘着テ
ープは、水中に浸しておき、粘着剤から紙基材を剥離さ
せる。繊維長分布を調べるには、JIS P8207と同様、約
10gの試料が必要である。同様に紙基材の他面(裏層)
も処理する。そして、水中に分散させた紙基材に界面活
性剤を少量添加し攪拌させ、紙基材分散液を作製した。
次ぎに、受け容器、150M/S(メッシュ)槽、100M/S槽、
60M/S槽、42M/S槽の篩いにより、紙基材分散液と水を加
え各篩いに残った紙繊維の乾燥重量を測定した。受け容
器中のものは、濾紙で濾過し、濾紙上に残った紙繊維の
乾燥重量を測定した。このようにして紙基材の表層と裏
層の繊維長分布をそれぞれ調べた。その一例を表2に示
す。The fiber length distribution of the front and back layers when the paper base material was divided into three layers was performed as follows. Apply a 100 mm wide polyester tape with adhesive (adhesive tape) to one side (surface layer) of the paper substrate, press it, and then remove the adhesive tape. At this time, in the adhesive tape, the paper is peeled off from the paper base material and adheres to the adhesive surface. By adjusting the pressing pressure of the adhesive tape and the peeling angle, about 1/3 of the thickness of the paper substrate when peeling
Can be peeled off. Adjustable mainly by peeling angle 18
The 0 ° peeling was good in the experimental results. The peeled pressure-sensitive adhesive tape is dipped in water to peel the paper base material from the pressure-sensitive adhesive. To check the fiber length distribution, approximately the same as JIS P8207,
10 g of sample is required. Similarly, the other side of the paper substrate (back layer)
Also process. Then, a small amount of a surfactant was added to the paper base material dispersed in water and stirred to prepare a paper base material dispersion liquid.
Next, receiving container, 150M / S (mesh) tank, 100M / S tank,
The dry weight of the paper fiber remaining on each sieve was measured by adding the paper substrate dispersion liquid and water through the sieves of the 60 M / S tank and the 42 M / S tank. The contents in the receiving container were filtered with a filter paper, and the dry weight of the paper fiber remaining on the filter paper was measured. In this way, the fiber length distributions of the surface layer and the back layer of the paper substrate were examined. An example is shown in Table 2.
実施例1 フェノール700g、クレゾール300g、ホルマリン(37%ホ
ルムアルデヒド水溶液)100g、25%アンモニア水35gの
混合物を加熱反応した後減圧脱水し、これに有機溶剤を
加えてフェノール樹脂ワニスを得た。広葉樹ハルプより
なり、表裏層の繊維長分布において42M/Sオンの比率差
が0.8%、60M/Sオンが0.3%、100M/Sオンが0.5%、150M
/Sオンが0.3%、150M/Sパスが0.3%である紙基材に前記
ワニスを含浸乾燥して全樹脂付着量50%のプリプレグを
得た。このプリプレグの所要枚数と接着剤付き銅箔を重
ね合わせて、165℃、85Kg/cm2で40分間加熱加圧し厚さ
1.6mmの銅振積層板を得た。その性能を表1に示す。 Example 1 A mixture of 700 g of phenol, 300 g of cresol, 100 g of formalin (37% formaldehyde aqueous solution) and 35 g of 25% ammonia water was heated and reacted, and dehydrated under reduced pressure. An organic solvent was added to the mixture to obtain a phenol resin varnish. Consisting of hardwood halves, the ratio of 42M / S on is 0.8%, 60M / S on is 0.3%, 100M / S on is 0.5%, 150M in the fiber length distribution of the front and back layers.
The varnish was impregnated into a paper base material having a / S ON of 0.3% and a 150M / S pass of 0.3% to obtain a prepreg having a total resin adhesion amount of 50%. The required number of this prepreg and the copper foil with adhesive are overlaid, and heated and pressed at 165 ° C and 85Kg / cm 2 for 40 minutes to obtain a thickness
A 1.6 mm copper vibration laminated plate was obtained. The performance is shown in Table 1.
実施例2 広葉樹パルプよりなり、表裏層の繊維長分布において42
M/Sオンの比率差が1.5%、60M/Sオンが0.5%、100M/Sオ
ンが0.5%、150M/Sオンが0.3%、150M/Sパスが1.4%で
ある紙基材に実施例1と同様にして銅張積層板を得た。
その性能を表1に示す。Example 2 Consisting of hardwood pulp, the fiber length distribution of the front and back layers was 42.
Example for paper base material with M / S on ratio difference of 1.5%, 60M / S on 0.5%, 100M / S on 0.5%, 150M / S on 0.3%, 150M / S pass 1.4% A copper clad laminate was obtained in the same manner as in 1.
The performance is shown in Table 1.
比較例 広葉樹パルプよりなり、表裏層の繊維長分布において、
42M/Sオンの比率差が2.9%、60M/Sオンが0.6%、100M/S
オンが0.3%、150M/Sオンが0.2%、150M/Sパスが2.3%
である紙基材に実施例1と同様にして銅張積層板を得
た。その性能を表1に示す。Comparative Example Made of hardwood pulp, in the fiber length distribution of the front and back layers,
42M / S ON ratio difference 2.9%, 60M / S ON 0.6%, 100M / S
On: 0.3%, 150M / S On: 0.2%, 150M / S Pass: 2.3%
A copper clad laminate was obtained in the same manner as in Example 1 on the paper base material. The performance is shown in Table 1.
表1に数値を示す試験法は、(1)そり、(2)ねじれ
の何れも次による。 The test methods whose numerical values are shown in Table 1 are as follows for both (1) warpage and (2) twist.
試験片サイズ 500×250(たて方向)mm(残銅率50
%) 処理 常態→エッチング→160℃、10分乾燥 測定法 静置法により4隅を測定し最大値をそりとす
る。又、最大値と最小値の絶対値差をねじれとする。Specimen size 500 x 250 (vertical direction) mm (remaining copper rate 50
%) Treatment Normal condition → Etching → Dry at 160 ° C for 10 minutes Measuring method Measure the four corners by the static method and use the maximum value as the warpage. The absolute value difference between the maximum value and the minimum value is the twist.
(発明の効果) 表1に示す測定結果が示すように、本発明の方法によっ
てそり及びねじれに優れた熱硬化性樹脂銅張積層板を製
造することが可能となった。(Effects of the invention) As the measurement results shown in Table 1 show, it became possible to manufacture a thermosetting resin copper-clad laminate excellent in warpage and twist by the method of the present invention.
Claims (1)
プレグの所要枚数を加熱加圧する積層板の製造におい
て、使用する紙基材の厚さ方向を3層に分けてなる表裏
層の繊維長分布を、42M/S(メッシュ)オン、60M/Sオ
ン、100M/Sオン、150M/Sオン、150M/Sパスの5種類の繊
維長分布の比率(重量百分率)の各々の差の絶対値を1.
5%以下であるように、均一化することを特徴とする積
層板の製造方法。1. A method for producing a laminated plate, comprising heating and pressing a required number of prepregs obtained by impregnating a paper base material with a thermosetting resin and drying the paper base material, wherein the front and back layers are divided into three layers in the thickness direction. The fiber length distribution of the difference (weight percentage) of 5 types of fiber length distribution of 42M / S (mesh) on, 60M / S on, 100M / S on, 150M / S on, 150M / S pass Absolute value is 1.
A method for producing a laminated plate, which comprises homogenizing so as to be 5% or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20758186A JPH0784041B2 (en) | 1986-09-03 | 1986-09-03 | Laminated board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20758186A JPH0784041B2 (en) | 1986-09-03 | 1986-09-03 | Laminated board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6362727A JPS6362727A (en) | 1988-03-19 |
| JPH0784041B2 true JPH0784041B2 (en) | 1995-09-13 |
Family
ID=16542124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20758186A Expired - Lifetime JPH0784041B2 (en) | 1986-09-03 | 1986-09-03 | Laminated board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0784041B2 (en) |
-
1986
- 1986-09-03 JP JP20758186A patent/JPH0784041B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6362727A (en) | 1988-03-19 |
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