JPH078550B2 - Composite metal plate for vibration damping that has excellent vibration damping properties, delamination strength, and weldability - Google Patents
Composite metal plate for vibration damping that has excellent vibration damping properties, delamination strength, and weldabilityInfo
- Publication number
- JPH078550B2 JPH078550B2 JP60131585A JP13158585A JPH078550B2 JP H078550 B2 JPH078550 B2 JP H078550B2 JP 60131585 A JP60131585 A JP 60131585A JP 13158585 A JP13158585 A JP 13158585A JP H078550 B2 JPH078550 B2 JP H078550B2
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- vibration damping
- composite metal
- weldability
- volume
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 title claims description 63
- 229910052751 metal Inorganic materials 0.000 title claims description 63
- 239000002131 composite material Substances 0.000 title claims description 23
- 238000013016 damping Methods 0.000 title claims description 15
- 230000032798 delamination Effects 0.000 title claims description 3
- 229920005989 resin Polymers 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 25
- 239000000843 powder Substances 0.000 claims description 17
- 239000000835 fiber Substances 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 description 10
- 239000006185 dispersion Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229940006076 viscoelastic substance Drugs 0.000 description 1
- 239000003190 viscoelastic substance Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Vibration Prevention Devices (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は抵抗溶接性のすぐれた制振用複合金属板に関す
る。The present invention relates to a vibration-damping composite metal plate having excellent resistance weldability.
［発明の背景］ 複合金属板は、２枚以上の金属板の間に樹脂層を圧着す
ることによって構成される。BACKGROUND OF THE INVENTION A composite metal plate is formed by pressing a resin layer between two or more metal plates.
複合金属板の適用部品の多くがスポット溶接など、抵抗
溶接によって組立てられる。しかし、従来の複合金属板
は抵抗溶接がむずかしく、短絡回路を設けなければ溶接
できない欠点をもっている。Many of the applied parts of the composite metal plate are assembled by resistance welding such as spot welding. However, the conventional composite metal plate has a drawback that resistance welding is difficult and cannot be welded unless a short circuit is provided.
そこで、従来から樹脂層に導電性の金属粉を分散させる
ことが行われている。Therefore, conventionally, conductive metal powder is dispersed in the resin layer.
導電性の金属粉を樹脂層に分散させるものとしては、次
のものが知られている。The following are known as those for dispersing the conductive metal powder in the resin layer.
（Ｉ）該中間層に導電性のある100メッシュより細かい
金属粉を１〜80容量％含有する粘弾性物質を使用する複
合金属板（特開昭50-79920号公報）。(I) A composite metal plate using a viscoelastic substance containing 1 to 80% by volume of conductive metal powder finer than 100 mesh in the intermediate layer (Japanese Patent Laid-Open No. 50-79920).
しかしこの種の複合金属板には、次の欠点がある。However, this type of composite metal plate has the following drawbacks.
・金属粉の添加量が１〜80％と多いのでコストが高い。・ The cost is high because the amount of metal powder added is as high as 1-80%.
・粘弾性樹脂に混練するのでコストが高い。・ High cost as it is kneaded with viscoelastic resin.
・添加量が多いので制振特性（ηmax）が低い。・ Since the added amount is large, the damping characteristics (ηmax) are low.
・接着強度（Ｔ剥離）が低い。・ Low adhesive strength (T peeling).
・導電効率が必ずしも良くなく、従って抵抗溶接性も必
ずしも良くない。・ Conductive efficiency is not always good, and therefore resistance weldability is not always good.
（II）金属粉が樹脂層中の10〜50％重量パーセントを占
めるとともに、導電性粒子の50体積パーセント以上が所
要制振層厚の以上の粒径を有するもの（特開昭57-14664
9号公報）。(II) The metal powder occupies 10 to 50% by weight of the resin layer, and 50% by volume or more of the conductive particles have a particle diameter equal to or larger than the required damping layer thickness (JP-A-57-14664).
No. 9 bulletin).
しかし、この種の複合金属板も金属粉添加量が多いため
コストが高い。また、抵抗溶接性が必ずしもよくない。However, this type of composite metal plate is also expensive because of the large amount of metal powder added. Also, resistance weldability is not always good.
［発明の目的］ 本発明は、上記従来技術の上記欠点を解決するためにな
されたものであり、損失係数が高く、層間の接着強度が
高く、しかも抵抗溶接性のすぐれた安価な制振用複合金
属板を提供することを目的とする。[Object of the Invention] The present invention has been made in order to solve the above-mentioned drawbacks of the above-mentioned prior art, and has a high loss coefficient, a high adhesive strength between layers, and an inexpensive vibration damping method having excellent resistance weldability. An object is to provide a composite metal plate.
［発明の概要］ 上記目的は、２枚以上の金属板の間に樹脂層を圧着する
ことによって構成される複合金属板において、樹脂層
に、膜厚の100％〜200％の径の金属粉若しくは金属ファ
イバー又はこれらの混合物を、樹脂の0.2容量％以上3.0
容量％未満分散させたことを特徴とする優れた制振特
性、層間剥離強度、溶接性を兼備した制振用複合金属板
によって達成される。[Summary of the Invention] The above object is to provide a composite metal plate constituted by press-bonding a resin layer between two or more metal plates, wherein the resin layer has metal powder or metal having a diameter of 100% to 200% of the film thickness. 0.2% by volume of resin or more than 3.0% of fiber or mixture thereof
This is achieved by a composite metal plate for vibration damping, which has excellent vibration damping characteristics, delamination strength, and weldability, which are characterized by being dispersed at less than volume%.
樹脂の種類には限定されない。The type of resin is not limited.
本発明では、この樹脂層に金属粉あるいは金属ファイバ
ーを分散させる。金属粉と金属ファイバーとの混合物を
分散させてもよい。金属粉又は金属ファイバーは、樹脂
層の膜厚の100％〜200％以下の径とする。分散量は樹脂
の0.2容量％以上3.0容量％未満である。In the present invention, metal powder or metal fibers are dispersed in this resin layer. A mixture of metal powder and metal fibers may be dispersed. The metal powder or metal fiber has a diameter of 100% to 200% or less of the film thickness of the resin layer. The amount of dispersion is 0.2% by volume or more and less than 3.0% by volume of the resin.
粒径が膜厚の100〜200％としたのは、金属板間の短絡を
100％にするためである。すなわち、100％未満の場合に
はスポット溶接に不良が発生する場合がある。しかるに
200％を超えると、粒の変形及び金属板への食い込みが
大きくなり（第１図（ａ）参照）、金属板表面に凹凸を
起す（第１図（ｂ）参照）。The particle size was set to 100-200% of the film thickness to prevent short circuit between metal plates.
This is to make it 100%. That is, if it is less than 100%, spot welding may be defective. However,
If it exceeds 200%, the deformation of the grains and the biting into the metal plate become large (see FIG. 1 (a)), resulting in unevenness on the surface of the metal plate (see FIG. 1 (b)).
分散量を0.2容量％以上3.0容量％未満としたのは、0.2
容量％未満では抵抗溶接が不可能な場合があり、3.0容
量％以上では制振性能及び接着強度が低下し始めるから
である。The dispersion amount was 0.2% or more and less than 3.0% by volume was 0.2
This is because resistance welding may not be possible at less than 3% by volume, and vibration damping performance and adhesive strength may start to deteriorate at more than 3.0% by volume.
金属粉、金属ファイバー又はこの混合物の分散は、金属
板の間に樹脂層を圧着する際の圧着力によって行えばよ
い。たとえば、第２図に示すように、金属板２の上に樹
脂層４を載置し（第２図（ａ））、樹脂層４の上に金属
粉等６を供給し（第２図（ｂ））、さらに、この金属粉
等６の上に他の金属板２を載置した状態で、たとえば、
圧延ローラー８等により加圧圧着せしめればよい（第２
図（ｃ））。Dispersion of the metal powder, the metal fiber, or the mixture thereof may be performed by a pressure bonding force when the resin layer is pressure bonded between the metal plates. For example, as shown in FIG. 2, the resin layer 4 is placed on the metal plate 2 (FIG. 2A), and the metal powder 6 is supplied onto the resin layer 4 (see FIG. b)), and further with another metal plate 2 placed on the metal powder 6 or the like, for example,
It may be pressure-bonded by the rolling roller 8 or the like (second
Figure (c)).
［実施例］ 以下に本発明の実施例を説明する。[Examples] Examples of the present invention will be described below.
（第１実施例） 第１表に示すように、金属板の板厚0.8mm、樹脂層の厚
み、樹脂層厚（Ｔ）50μｍにおいて、金属粉径（Ｄ）を
変量させて複合金属板を作成した。(First Example) As shown in Table 1, a composite metal plate was prepared by varying the metal powder diameter (D) at a metal plate thickness of 0.8 mm, a resin layer thickness, and a resin layer thickness (T) of 50 μm. Created.
樹脂はポリオレフィン系樹脂を用いた。金属粉は、銅粉
を用いた。この分散量は、樹脂の0.8容量％とした。分
散は第２図に示す方法、すなわち、加圧圧着により行っ
た。The resin used was a polyolefin resin. Copper powder was used as the metal powder. This dispersion amount was 0.8% by volume of the resin. Dispersion was performed by the method shown in FIG. 2, that is, by pressure bonding.
このようにして作成した複合金属板を、第３図に示すよ
うに複合板同士をスポット溶接した。溶接条件は以下の
通りである。The composite metal plates thus prepared were spot-welded to each other as shown in FIG. The welding conditions are as follows.
スポット溶接条件 本実施例に係る複合金属板はいずれも溶接性が良好であ
った（第１表）。Spot welding conditions The composite metal sheets according to this example all had good weldability (Table 1).
（第２実施例） 金属板0.8mm、樹脂層の厚さ（Ｔ）50μｍの金属複合板
を作成した。本例においては、銅よりなる径（Ｄ）63μ
ｍφ、長さ（Ｌ）3mmL（D/T:126％）の金属ファイバー
を使用した。 Second Example A metal composite plate having a metal plate 0.8 mm and a resin layer thickness (T) of 50 μm was prepared. In this example, the diameter (D) of copper is 63μ.
A metal fiber having mφ and a length (L) of 3 mmL (D / T: 126%) was used.
分散量については、第２表に示すように変量した。The amount of dispersion was varied as shown in Table 2.
圧着方法、スポット溶接条件は第１実施例と同じであ
る。ただ、複合金属板の溶接の相手として、複合金属板
の他に単一板についても行った。The pressure bonding method and spot welding conditions are the same as in the first embodiment. However, as a partner of welding of the composite metal plate, a single plate was performed in addition to the composite metal plate.
溶接性については、第４図に示すように、分散量0.2容
量％以上3.0容量％未満の範囲においては、複合金属
板、単一板とも良好であった。 Regarding the weldability, as shown in FIG. 4, both the composite metal plate and the single plate were good in the range of the dispersion amount of 0.2% by volume or more and less than 3.0% by volume.
また、制振性を調べるため、損失係数を測定した所、第
５図に示すように0.2容量％以上3.0容量％未満の範囲に
おいては、優れた制振性が得られた。Moreover, when the loss coefficient was measured to examine the vibration damping property, as shown in FIG. 5, excellent vibration damping property was obtained in the range of 0.2% by volume to less than 3.0% by volume.
さらに、金属板と樹脂層とのＴ剥離強度を試験した所、
第６図に示すように0.2容量％以上3.0容量％未満の範囲
においては、Ｔ剥離強度は優れていた。Furthermore, when the T peel strength between the metal plate and the resin layer was tested,
As shown in FIG. 6, the T peel strength was excellent in the range of 0.2% by volume to less than 3.0% by volume.
なお、本願発明に係る複合金属板は、自動車部品、機械
・電機部品、各種カバー類、建材、建造材、構造物など
広範囲にわたって使用する事ができる。The composite metal plate according to the present invention can be widely used for automobile parts, mechanical / electrical parts, various covers, building materials, building materials, structures and the like.
［発明の効果］ 以上のように本発明によれば、制振特性に優れ、層間の
接着強度が高く、しかも安価な抵抗溶接性のすぐれた制
振複合金属板が得られる。[Effects of the Invention] As described above, according to the present invention, it is possible to obtain a vibration-damping composite metal plate having excellent vibration-damping characteristics, high adhesive strength between layers, and low cost, excellent in resistance weldability.
第１図は、不良例を示すための断面図である。第２図
は、本発明に係る複合金属板製造例を示すための断面図
である。第３図は、溶接条件を示すための断面図であ
る。第４図は、金属ファイバーの分散量と溶接性との関
係を示すグラフである。第５図は、金属ファイバーの分
散量と損失係数との関係を示すグラフである。第６図
は、金属ファイバーの分散量とＴ剥離強度を示すグラフ
である。 ２……金属板、４……樹脂層、６……金属粉、８……圧
延ローラ、10……複合金属板、Ａ……凹凸、Ｂ……変
形、Ｃ……食込み。FIG. 1 is a sectional view showing a defective example. FIG. 2 is a cross-sectional view showing an example of manufacturing a composite metal plate according to the present invention. FIG. 3 is a sectional view showing welding conditions. FIG. 4 is a graph showing the relationship between the dispersion amount of metal fibers and weldability. FIG. 5 is a graph showing the relationship between the dispersion amount of metal fibers and the loss coefficient. FIG. 6 is a graph showing the amount of metal fibers dispersed and the T peel strength. 2 ... metal plate, 4 ... resin layer, 6 ... metal powder, 8 ... rolling roller, 10 ... composite metal plate, A ... unevenness, B ... deformation, C ... bite.
フロントページの続き (56)参考文献 特開 昭57−51453（ＪＰ，Ａ) 特開 昭58−142845（ＪＰ，Ａ) 特開 昭57−146649（ＪＰ，Ａ) 特開 昭53−128687（ＪＰ，Ａ) 特開 昭50−79920（ＪＰ，Ａ)Continuation of front page (56) Reference JP-A-57-51453 (JP, A) JP-A-58-142845 (JP, A) JP-A-57-146649 (JP, A) JP-A-53-128687 (JP , A) JP-A-50-79920 (JP, A)
Claims (1)
ことによって構成される複合金属板において、樹脂層
に、膜厚の100％〜200％の径の金属粉若しくは金属ファ
イバー又はこれらの混合物を、樹脂の0.2容量％以上3.0
容量％未満分散させたことを特徴とする優れた制振特
性、層間剥離強度、溶接性を兼備した制振用複合金属
板。1. A composite metal plate constituted by press-bonding a resin layer between two or more metal plates, wherein the resin layer has a metal powder or a metal fiber having a diameter of 100% to 200% of the film thickness, or these. Mix the mixture with 0.2% by volume or more of resin 3.0
A composite metal plate for vibration damping, which has excellent vibration damping characteristics, delamination strength, and weldability, characterized by being dispersed in less than volume%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60131585A JPH078550B2 (en) | 1985-06-17 | 1985-06-17 | Composite metal plate for vibration damping that has excellent vibration damping properties, delamination strength, and weldability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60131585A JPH078550B2 (en) | 1985-06-17 | 1985-06-17 | Composite metal plate for vibration damping that has excellent vibration damping properties, delamination strength, and weldability |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61290044A JPS61290044A (en) | 1986-12-20 |
| JPH078550B2 true JPH078550B2 (en) | 1995-02-01 |
Family
ID=15061493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60131585A Expired - Lifetime JPH078550B2 (en) | 1985-06-17 | 1985-06-17 | Composite metal plate for vibration damping that has excellent vibration damping properties, delamination strength, and weldability |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH078550B2 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6374634A (en) * | 1986-09-19 | 1988-04-05 | 新日鐵化学株式会社 | Spot weldable composite type vibration-damping material |
| JPH0659711B2 (en) * | 1987-01-08 | 1994-08-10 | 日本鋼管株式会社 | Resin Laminated Steel Plate |
| JPH0347749A (en) * | 1989-07-15 | 1991-02-28 | Kobe Steel Ltd | Resistance-weldable damping steel plate |
| JPH072396B2 (en) * | 1989-02-28 | 1995-01-18 | 株式会社神戸製鋼所 | Resistance Weldable Vibration Suppression Plate |
| JPH0236937A (en) * | 1988-07-27 | 1990-02-06 | Nippon Steel Corp | Sandwich type resin composition metal plate and its resistance welding |
| CA2734738C (en) | 2008-08-18 | 2019-05-07 | Productive Research LLC. | Formable light weight composites |
| KR101774911B1 (en) | 2009-12-28 | 2017-09-05 | 프로덕티브 리서치 엘엘씨 | Processes for welding composite materials and articles therefrom |
| US9415568B2 (en) | 2010-02-15 | 2016-08-16 | Productive Research Llc | Formable light weight composite material systems and methods |
| US9233526B2 (en) | 2012-08-03 | 2016-01-12 | Productive Research Llc | Composites having improved interlayer adhesion and methods thereof |
| US11338552B2 (en) | 2019-02-15 | 2022-05-24 | Productive Research Llc | Composite materials, vehicle applications and methods thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60912B2 (en) * | 1980-06-04 | 1985-01-10 | 住友金属工業株式会社 | Spot weldable adhesive clad metal plate |
| JPS58142845A (en) * | 1982-02-18 | 1983-08-25 | 住友金属工業株式会社 | Weldable laminated board |
-
1985
- 1985-06-17 JP JP60131585A patent/JPH078550B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61290044A (en) | 1986-12-20 |
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