JPH0785879B2 - Method and jig for cutting thin plate material constituting electronic parts, etc. - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention mainly cuts substrate materials such as wafers, ferrites and ceramics, which form electronic parts, into chips, and, as an application example, materials that form optical parts such as single crystals and glass. The present invention relates to a method for cutting a thin plate material and a jig therefor which can be applied to cut a relatively small predetermined shape.

[0002]

2. Description of the Related Art Generally, diode transistors and I
Taking a wafer, which is a substrate constituting C, LSI, that is, a silicon substrate as an example, a wafer material having an area larger than a predetermined unit body is used for mass production of the circuit board, and each unit is provided on the plate surface. After a plurality of circuits for each body are arranged by ion implantation or etching, the wafer material is positioned and fixed on the plane of the jig and cut into chips for each circuit by a cutting blade.

FIG. 3 shows an example of a jig used in the conventional wafer material cutting method. This jig is provided with a base plate P made of glass or a similar material, and the base plate P is provided. A means for adhering and fixing a thin wafer material W on the plate surface with a hot-melt adhesive E such as electron wax or glycol phthalate wax, and cutting it into chips as described above by a not-shown vertically moving cutting blade. Is taken.

By applying this wafer material supporting means, the wafer material can be securely fixed, and even if the adhesive area after cutting into chips is reduced, the wafer materials are securely fixed and held without peeling. It is preferable because it is possible. However, the adhesive E is heated and softened when the wafer material W is bonded and fixed and peeled after cutting, and the cleaning process of the adhesive is complicated, and the cleaning after cutting is insufficient. If there is, there is a possibility that the characteristics of the functional material may be deteriorated due to the contamination with the remaining adhesive.

FIG. 4 shows another example of a jig used in the conventional method for cutting a wafer material, which is a sheet material S having a small amount of adhesive attached to one surface of the wafer material W.
Is adhered and fixed, and a vacuum pressure is applied from the side of the sheet surface of the sheet member S to fix the sheet member S and the wafer material W on the plate surface of the vacuum chuck C, and the cutting blade is moved up and down in the same manner as described above. A tape cutting method is used in which the wafer material W is cut by cutting to a depth of about ½ of the sheet thickness. In the figure, R is a seat reinforcing ring.

In this tape cutting method, the heat effect at the time of sticking or peeling can be avoided, but since the sheet member is an elastic body and the adhesive is an adhesive type, the wafer material W is securely fixed. If you do, you will be inferior. In addition, since the wafer material W and the sheet member S are easily bent at the time of cutting and the end faces are inclined, the overall shape becomes a trapezoid, resulting in a decrease in dimensional accuracy. There is also a problem in that the material is easily peeled off from the member S and easily scattered, resulting in troublesome handling after the operation and damage to the cutting blade.

[0007]

DISCLOSURE OF THE INVENTION The present invention causes adverse effects caused by an adhesive such as thermal damage to a thin plate material and deterioration of characteristics due to insufficient cleaning, and deterioration of shape, dimensional accuracy and the like due to a tape cutting method. In addition, it is an object of the present invention to provide a method for cutting a thin plate material that constitutes an electronic component or the like and a jig for the same that can securely fix the thin plate material and accurately cut the sheet material without using an adhesive or an adhesive.

[0008]

In the method for cutting a thin plate material according to claim 1 of the present invention, a thin plate material such as a wafer, ferrite, or ceramic, which constitutes an electronic component, is placed directly on the flat surface of a base plate. Then, the sheet member is covered from the upper surface side of the thin plate material, and the sheet member is tensioned and fixed to position and support the thin plate material on the plane of the base plate, and the thin plate material is cut from the sheet surface of the sheet member. It is designed to be cut into a predetermined shape with a blade. In the thin plate material cutting method according to claim 2, the thin plate material positioned and supported by the sheet member is cut into a plurality of strips at the first time, and each strip-shaped thin plate material is positioned and supported by the sheet member. The chip shape is formed by the second cutting that is applied in the direction perpendicular to the first cutting as it is.
In the method of cutting a thin plate material according to (1), prior to the second cutting, another new sheet member is stacked and tension-fixed from the sheet member having a slit on the sheet surface in the first cutting.

In a thin plate material cutting jig according to a fourth aspect of the present invention, there are provided a base plate on which the thin plate material is placed directly on a flat surface, and a thin plate material placed on the flat surface of the base plate. A sheet member which is covered on the upper surface side, and the base plate is provided on the board surface, and an end portion of the sheet member which is covered on the upper surface side of the thin plate material is extended to a board surface lower than the flat surface of the base plate. A pair of holding means for sandwiching and fixing at least two ends of the sheet member facing each other between the jig base to be placed and the lowered board surface of the jig base, and at least one side of the holding means. And a tension adjusting means for the sheet member, which is provided on the jig base to tensionally support the end surface of the sheet member on the board surface of the jig base.

[0010]

In the method of cutting a thin plate material according to the first aspect of the present invention, the thin plate material placed directly on the plate surface of the base plate is positioned and supported by pressing it from the upper surface side with the sheet member which is tensioned and fixed. The thin plate material is cut into a predetermined shape with a cutting blade that cuts from the sheet surface of the sheet member. Therefore, the thin plate material can be positioned and fixed on the plate surface of the base plate without using an adhesive agent, so that a precise shape can be obtained. You will be able to cut high.

In the method for cutting a thin plate material according to claim 2 of the present invention, when the thin plate material is cut into a plurality of strips at the first time and is cut into a plurality of chips at the second time, the strip is cut at the first time. Hold the thin sheet material of multiple strips cut in the same way with the sheet member and add it in the direction orthogonal to the first time 2
Since each strip of thin plate material is cut into chips at the first time,
Each strip-shaped thin plate material that is cut at least at the first time does not scatter at the same time as cutting, and the next handling can be facilitated, and the cutting treatment can be performed not only at the first time but also at the second time as in claim 1. it can. In the method for cutting a thin plate material according to claim 3, prior to the second cutting, another new sheet member is superposed and tension-fixed on the sheet member having a cut on the sheet surface in the first cutting, The newly stacked sheet members can be positioned and supported even if they are cut into chips and can prevent them from scattering, so that subsequent handling can be facilitated and damage to the cutting blades can be reliably prevented. Become.

In the thin plate material cutting jig according to the fourth aspect of the present invention, the thin plate material is surely positioned and supported on the plate surface of the base plate by a very simple mechanism without adhering or sticking the thin plate material. Not only can it be done, but at least by arranging the edge of the sheet member on the board surface lower than the plane of the bed board by a jig base provided with the bed board on which the thin plate material is placed, Since the thin plate material is sandwiched and fixed by the end portions of the two opposite sides by the pair of pressing means, it is possible to avoid that the cutting blade for cutting the thin plate material acts on the end side of the sheet member.
Even after cutting the thin plate material, the sheet member can be positioned and supported on the plate surface of the base plate. In addition, at least one side of the holding means is provided with a sheet member tension adjusting means for tensionally supporting the end surface of the sheet member on the board surface of the base, so that the sheet member can be held under the required tension and the thin plate material can be held. It is possible to reliably position and support on the plate surface of the base plate.

[0013]

1 and 2 show a jig used to carry out the method for cutting a thin plate material according to the present invention, in which 1 is a base, 2 is a base plate, 3, 3 ... Positioning pins of the base plate, 4 is a sheet member, 5 and 6 (7, 8) are a pair of holding means, 9 is a tension adjusting means of the sheet member, W is a thin plate material such as a wafer, ferrite, or ceramic that constitutes an electronic component. Indicates.

The base 1 is a base plate 2 on which the thin plate material W is directly placed.
Is assembled and arranged at a substantially central position 1a on the board,
A plurality of positioning pins 3, 3 ... Abutting on the peripheral side surface of the base plate 2 are planted and fixed on the board surface at predetermined intervals according to the outer shape of the base plate 2.

The base plate 2 is for mounting the thin plate material W on the plate surface in advance and to assemble it on the plate surface of the base 1, and is formed of glass or a material similar to glass to have a flat plate surface. A sheet member 4 which is covered from the upper surface side of the thin plate material W can be sequentially supplied to the base plate 2. As the sheet member, it is preferable to use an inexpensive member such as a resin material of which the sheet surface can be cut by a cutting blade which will be described later, or a paper sheet having a sufficient expansion force and having no fluff. In addition, even if the sheet width between the two opposite sides of the sheet member 4 is formed to be approximately the same as the sheet width of the thin plate material W,
The sheet length between the other two opposite sides may be formed to be longer than the sheet width of the thin plate material W. The sheet member can cover the entire surface of the thin plate material W, and the surplus sheet portion can be tensioned and fixed as described later.

The sheet member 4 is placed on the flat surface of the base plate 2 with its end extending and arranged on the plate surface 1b which is lower than the flat surface of the base plate 2 mounted on the base surface of the base 1. The thin plate material W thus formed is assembled by tensioning and fixing it so as to position and support it. This sheet member 4 can be tensioned and fixed at the ends of at least two opposing sides formed in a relatively long dimension, and a pair of pressing means is provided on the side end plate of the base 1 on which the respective ends extend. 5 and 6 are provided.

The pressing means 5 and 6 have stopper plates 5a and 6a having a length corresponding to the sheet width of the sheet member 4.
The stopper plates 5a and 6a are detachably provided by fixing the stopper plates 5a and 6a to the board surface of the base 1 with tightening screws 5b, 5b ..., 6b, 6b. By fitting the V-shaped grooves 1c and 1d formed on the plate surface of the base plate 1 on the back surfaces of the stopper plates 5a and 6a in the longitudinal direction,
Projecting teeth 5c, 6 for fixing each end of the sheet member 4 with a key
c is formed. Also, at least one side of the holding means 5, 6 is provided between the stepped board surface 1b of the base 1 and the end surface of the sheet member 4 into the V groove 1e formed on the board surface of the base 1. A tension adjusting means 9 for the sheet member for supporting the indentation is provided. Tension adjusting means 9 for this sheet member
Is provided with a concave groove 6c on the back side of the pressing means 6, and the concave groove 6c is formed.
It is equipped with a tension bar 9a having a wedge-shaped lower surface inside by being attached by a fine adjustment screw 9b so as to be vertically movable.

This jig for cutting a thin plate material W is used for cutting a thin plate material by using an ordinary cutting blade (not shown) in which linear cutting blades are formed in parallel with each other at a plurality of intervals. Has been applied. Using the cutting blade, after the thin plate material W is cut into a plurality of strips at the first time, each strip-shaped thin plate material is cut into chips by the second cutting applied in the direction orthogonal to the first time. So that each cut is made. At the time of cutting, a pair of holding means 7, 8 having the same structure as the pair of holding means 5, 6 described above is used as a base so that another new sheet member can be sequentially supplied and tension-fixed even in the second cutting. It is provided on the disc surface close to the other end of one.

After the thin plate material W is placed directly on the flat surface of the base plate 2 and the base plate 2 is assembled on the board surface of the base 1 by using the cutting jig for the thin plate material configured as described above, By covering the sheet member 4 on the upper surface side of the thin plate material W and tensioning and fixing it, the thin plate material W is positioned and supported on the plane of the base plate 2 by the sheet member 4. In assembling this sheet member, the end portion of the sheet member 4 which covers the entire surface of the thin plate material W is positioned so as to extend on the stepped board surface 1b of the base 1.
First, one end of the sheet member 4 is sandwiched and fixed by the fixing means 5. Next, after fixing the other end portion of the sheet member 4 by the fixing means 6 located on the other side, the tension bar 9a is finely moved downward by the fine adjustment screw 9b, and the end portion of the sheet member 4 is moved. The seat member 4 is tensioned and fixed by fitting the wedge-shaped lower surface portion into the V groove 1e so as to support the surface in the V groove 1e. In this sheet member 4, the thin plate material W can be reliably positioned and supported on the plate surface of the base plate 2 only by directly mounting it on the plate surface of the base plate 2 without using an adhesive or an adhesive.

To cut the thin plate material W positioned and supported on the flat surface of the base plate 2, the above-mentioned cutting blade may be moved up and down so as to cut from the sheet surface of the sheet member 4. When the cutting blade performs the first cutting, the thin plate material W is cut into a plurality of strips. The cutting is preferably performed in the relatively long longitudinal direction of the sheet member 4, and each end is sandwiched and fixed on the board surface of the base 1 stepped down from the plane of the base plate 2 to form a cutting blade of a cutting blade. Since the sheet does not work, the sheet member 4 can be prevented from being finely separated by merely inserting a few slits into the sheet surface. Therefore, at the time when one cutting is completed, the thin plate material cut into a plurality of strips is not scattered and each strip-shaped thin plate material can be positioned and supported by the sheet member 4.

Next, in order to cut the strip-shaped thin plate material into chips, a second cutting is applied in a direction orthogonal to the first cutting. Prior to the second cutting, another new sheet member (not shown) is tensioned and fixed by another pair of pressing means 7 and 8 in a direction orthogonal to the sheet member 4 having a slit on the previous sheet surface. ) Should be covered. When the strip-shaped thin plate material is pressed by this other sheet member and cut into chips, the inner surface of the sheet member 4 in which the cut is formed in the sheet surface in the first cutting is cut into a base-like small piece. However, since the sheet surface of the new sheet member has only a few parallel cuts, the substrates cut into chips are not scattered as with the first cutting even when the second cutting is performed. , Is positioned and supported on the plate surface of the base plate 2 in the cut state.

After this cutting, the second sheet member is removed, and the first sheet member 4 is cut into small pieces.
Is removed to obtain a substrate for constituting an electronic component, which is cut into a predetermined chip shape.

In the above embodiment, the holding means 5, 6
Tightening screws 5b, 5b on the board surface of the base 1 as (7, 8)
... 6b, 6b ... Stopper plates 5a, 6a that can be attached and detached
However, instead of this, the stopper plates 5a, 6
It is possible to apply a mechanism in which a is vertically moved by a drive cylinder to sandwich and fix the end portion of the sheet member 4 on the plate surface of the base. In this case, a belt-shaped member that is relatively wider than the thin plate material is used as the sheet member, and a winding or rewinding reel for the sheet member 4 is provided on the side portions of the pair of guide plates 5a and 6a. The continuous sheet member can be constructed so as to be intermittently continuous with a required width by feeding and mounting the continuous sheet member on the lower surface side of the guide plates 5a and 6a.

Further, as a thin plate material to be cut, not only functional materials such as wafers, ferrites, ceramics, etc. which compose electronic parts, but also materials which compose optical parts such as single crystal and glass are similarly applied. can do.

[0025]

As described above, according to the method for cutting a thin plate material constituting an electronic component or the like and the jig therefor according to the present invention, a sheet member can be used as a base even if the thin plate material is not bonded or adhesive. Since it can be reliably positioned and supported on the plate surface of the plate, it does not cause thermal damage due to heating of the adhesive or the adhesive or deterioration of characteristics due to insufficient cleaning, and of course, a thin plate material can be formed by a jig with a simple mechanism. Since it can be directly and stably positioned and supported on the flat surface of the base plate, the shape of the product by cutting can be formed with high precision.

[Brief description of drawings]

FIG. 1 is a partial cutaway side view of a jig applied to carry out a method for cutting a thin plate material according to the present invention.

FIG. 2 is a plan view of the jig.

FIG. 3 is an explanatory diagram of a jig used in a method of cutting a thin plate material according to an example of a conventional example.

FIG. 4 is an explanatory diagram of a jig used in a method for cutting a thin plate material according to another example of the conventional example.

[Explanation of symbols]

 1 Jig base 1b Plate lower surface of base 2 Base plate 4 Sheet members 5, 6 (7, 8) A pair of holding means 9 Seat tension adjusting means W Thin plate material

Claims (4)

[Claims] 1. A thin plate material such as a wafer, a ferrite, or a ceramic constituting an electronic component is directly placed on the flat surface of a base plate, and a sheet member is covered from the upper surface side of the thin plate material, and the sheet member is covered with the sheet member. An electronic component or the like characterized in that the thin plate material is positioned and supported on the flat surface of the base plate by tensioning and fixed, and the thin plate material is cut into a predetermined shape by a cutting blade that cuts from the sheet surface of the sheet member. How to cut thin plate material. 2. The thin plate material positioned and supported by the sheet member is cut into a plurality of strips at the first time, and the strip-shaped thin plate materials are positioned and supported by the sheet member and are orthogonal to the first time. The method for cutting a thin plate material according to claim 1, wherein the second plate is formed into a chip shape by the second cutting applied in the direction. 3. Prior to the second cutting, another new sheet member is superposed and tension-fixed from the upper surface side of the sheet member having a cut on the sheet surface in the first cutting. The method for cutting a thin plate material according to claim 2. 4. A jig used to cut a thin plate material such as a wafer, ferrite, or ceramics, which constitutes an electronic component, into a predetermined shape with a cutting blade which moves up and down, wherein the thin plate material is placed directly on a flat surface. A base plate, a sheet member covered on the upper surface side of the thin plate material placed on the flat surface of the base plate, and a base member provided on the board surface and covered on the upper surface side of the thin plate material. At least two opposite sides of the sheet member between the jig base on which the end of the sheet member is extended and arranged on the board surface lower than the plane of the base plate and the lowered board surface of the jig base. A pair of pressing means for sandwiching and fixing the end portions of the sheet, and a tension adjusting means for the sheet member, which is provided on at least one side of the pressing means and tensionally supports the end surface of the sheet member on the board surface of the jig base. A thin plate material that constitutes electronic parts, etc. Cutting jig.