JPH0787267B2 - Electronic element mounting method - Google Patents
Electronic element mounting methodInfo
- Publication number
- JPH0787267B2 JPH0787267B2 JP2413956A JP41395690A JPH0787267B2 JP H0787267 B2 JPH0787267 B2 JP H0787267B2 JP 2413956 A JP2413956 A JP 2413956A JP 41395690 A JP41395690 A JP 41395690A JP H0787267 B2 JPH0787267 B2 JP H0787267B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- mounting
- tip
- electronic element
- mounting board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
- H05K3/308—Adaptations of leads
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は実装基板等への電子素子
の実装方法に関し、特に実装基板への実装時におけるリ
ード先端の引っかかりを防止して実装信頼性を高める技
術に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting an electronic element on a mounting board or the like, and more particularly to a technique for preventing lead tips from being caught at the time of mounting on a mounting board to improve mounting reliability.
【０００２】[0002]
【従来の技術】従来、コンデンサ等の電子素子を実装基
板に実装する際には、図６に示すように、パッケージ本
体３１から伸出したリード３２をカッター等で単純にフ
ォーミング・カットしたままの状態で、実装基板に開孔
されたスルーホールに挿入することが一般的であった。2. Description of the Related Art Conventionally, when an electronic element such as a capacitor is mounted on a mounting board, a lead 32 extending from a package body 31 is simply formed and cut by a cutter as shown in FIG. In this state, it was common to insert it into the through hole opened in the mounting board.
【０００３】[0003]
【発明が解決しようとする課題】従来の電子素子のリー
ドでは、図７に示すようにリード３２が曲がったり、ま
たパッケージ組立のばらつきや実装基板にスルーホール
を開孔する際の位置ずれ、さらに実装工程中のパッケー
ジや実装基板の位置ずれ、等が発生した場合、リードを
実装基板に自動挿入する際に、図８に示すように、リー
ド３２の先端が実装基板３６のスルーホール３７に縁に
引っかかり、実装不良となる率が高かった。In the lead of the conventional electronic device, the lead 32 is bent as shown in FIG. 7, variation in package assembly, positional deviation when a through hole is formed in a mounting board, and When the package or the mounting board is displaced during the mounting process, when the leads are automatically inserted into the mounting board, as shown in FIG. 8, the tips of the leads 32 are aligned with the through holes 37 of the mounting board 36. There was a high rate of mounting defects.
【０００４】本発明は事項に鑑みなされたものであり、
実装基板に電子素子を挿入する際、リードと実装基板の
スルーホールとに位置ずれが生じていても、リードを確
実に実装基板に挿入できる実装技術を提供することを目
的とする。The present invention has been made in consideration of the matters,
It is an object of the present invention to provide a mounting technique capable of surely inserting a lead into a mounting board when inserting an electronic element into the mounting board even if the lead and a through hole of the mounting board are misaligned.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するた
め、本発明は、パッケージ本体より突出されたリードの
先端部を側方両端から押圧裁断して、リードの先端部の
裁断面上に突部を形成し、次に上記リードの先端部を半
田溶液中に浸漬した後これを引き上げ、当該リードの先
端部に先細状の円錐突起を形成した後、実装基板に開孔
されたスルーホールに対して円錐突起の先端からリード
を挿入する電子素子の実装方法とした。To achieve the above object, according to the present invention, the tips of the leads protruding from the package body are pressed and cut from both lateral ends to project on the cut surface of the tips of the leads. Part, and then the tip of the lead is dipped in a solder solution and then pulled up to form a tapered conical projection on the tip of the lead, and then the through hole is opened in the mounting board. On the other hand, a mounting method of an electronic element in which a lead is inserted from the tip of the conical protrusion is used.
【０００６】[0006]
【作用】本発明は電子素子のリードの先端を先細状の円
錐形状に加工形成した。そのため、電子素子のリードを
実装基板に自動挿入する際、リードと実装基板のスルー
ホールとに位置ずれが生じていても、スルーホールの縁
に、リードの先端が引っかかることがきわめて少なくな
る。According to the present invention, the tip of the lead of the electronic element is formed into a tapered conical shape. Therefore, when the leads of the electronic element are automatically inserted into the mounting board, even if the leads and the through holes of the mounting board are misaligned, the ends of the leads are hardly caught on the edges of the through holes.
【０００７】[0007]
【実施例】以下本発明の一実施例を図１ないし図３に基
づいて説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.
【０００８】実施例１は、本発明の半田浸漬によるリー
ドの加工方法である。Example 1 is a method of processing a lead by dipping solder according to the present invention.
【０００９】加工前のリードの長さを一定にするため
に、まず図２（ａ）・（ｂ）・（ｃ）に示すように、リ
ード２の先端部を側方両端から押圧裁断して、リード２
の先端部の裁断面上に突部４を形成する。この図２に示
す裁断は、加工前のリードの先端部が斜めになっていた
場合、これをほぼ水平形状にするためのものでもある。In order to make the length of the lead constant before processing, first, as shown in FIGS. 2 (a), (b) and (c), the tip of the lead 2 is pressed and cut from both lateral ends. , Lead 2
The protrusion 4 is formed on the cut surface of the tip of the. The cutting shown in FIG. 2 is also for making the lead end portion substantially horizontal when the lead end portion before processing is slanted.
【００１０】次に裁断したリード２の先端を半田溶液中
に浸漬した後引き上げる。そうすると、図１に示すよう
に、半田が円錐突起３をリード２の先端部に形成する。Next, the ends of the cut leads 2 are dipped in a solder solution and then pulled up. Then, as shown in FIG. 1, the solder forms the conical protrusion 3 on the tip portion of the lead 2.
【００１１】そして、図３に示すように、実装基板６に
開孔されたスルーホール７に対して、円錐突起３の先端
からリード２を挿入する。この際、パッケージ本体１か
ら伸出するリード２と実装基板６のスルーホール７に多
少の位置ずれが生じていた場合でも、リード２の先端の
円錐突起３の円錐面がスルーホール７の縁に当接し、リ
ード２はスルーホール７に滑り込み確実に実装される。Then, as shown in FIG. 3, the lead 2 is inserted from the tip of the conical protrusion 3 into the through hole 7 formed in the mounting substrate 6. At this time, even if the lead 2 extending from the package body 1 and the through hole 7 of the mounting substrate 6 are slightly displaced from each other, the conical surface of the conical projection 3 at the tip of the lead 2 is located at the edge of the through hole 7. Upon contact, the lead 2 slips into the through hole 7 and is securely mounted.
【００１２】電子素子の実装が完了した実装基板は、実
装基板全体を半田溶液に浸漬し、引き上げた後洗浄す
る。そして、実装基板の裏面に出ている余分なリードを
切断し、製品とする。The mounting board on which the electronic elements have been mounted is immersed in a solder solution for the entire mounting board, lifted and then washed. Then, the extra leads on the back surface of the mounting board are cut to obtain a product.
【００１３】[0013]
【発明の効果】本発明は電子素子のリードの先端部を、
半田浸漬の方法により先細状の円錐形状に加工形成し
た。According to the present invention, the tips of the leads of the electronic element are
It was formed into a tapered conical shape by a solder dipping method.
【００１４】このため、電子素子のリードを実装基板に
挿入する際、リードと実装基板のスルーホールとに多少
のずれが生じていても、加工したリード先端部の円錐形
状部がスルーホールの縁に当接して滑り込み、確実に電
子素子を実装基板に実装することができる。For this reason, when the leads of the electronic element are inserted into the mounting board, even if there is some deviation between the leads and the through holes of the mounting board, the conical portion of the processed lead tips is the edge of the through hole. The electronic element can be surely mounted on the mounting board by coming into contact with and sliding in.
【図１】本発明の一実施例に係る電子素子の実装方法に
おける電子素子の正面図である。FIG. 1 is a front view of an electronic device in an electronic device mounting method according to an embodiment of the present invention.
【図２】（ａ）は本発明の一実施例に係る電子素子の実
装方法におけるリードの加工後の上面図、（ｂ）はその
正面図、（Ｃ）はその側面図である。FIG. 2A is a top view after processing of leads in a method for mounting an electronic element according to an embodiment of the present invention, FIG. 2B is a front view thereof, and FIG. 2C is a side view thereof.
【図３】本発明の一実施例に係る電子素子の実装方法に
おいて、リードを実装基板に実装する際の状態を示した
説明図である。FIG. 3 is an explanatory view showing a state in which the leads are mounted on the mounting board in the electronic element mounting method according to the embodiment of the present invention.
【図４】従来技術における素子の正面図である。FIG. 4 is a front view of a device according to the related art.
【図５】従来技術における素子の側面図である。FIG. 5 is a side view of an element in the related art.
【図６】従来技術における実装不良の状態を示した説明
図である。FIG. 6 is an explanatory diagram showing a mounting failure state in a conventional technique.
１ パッケージ本体、 ２ リード、 ３ 円錐突起、 ４ 突部、 ６ 実装基板、 ７ スルーホール、 ３１ パッケージ本体、 ３２ リード、 ３６ 実装基板、 ３７ スルーホール。 1 package body, 2 leads, 3 conical protrusions, 4 protrusions, 6 mounting boards, 7 through holes, 31 package body, 32 leads, 36 mounting boards, 37 through holes.
Claims (1)
先端部を側方両端から押圧裁断して、リードの先端部の
裁断面上に突部を形成し、次に上記リードの先端部を半
田溶液中に浸漬した後これを引き上げ、当該リードの先
端部に先細状の円錐突起を形成した後、実装基板に開孔
されたスルーホールに対して円錐突起の先端からリード
を挿入する電子素子の実装方法。1. A lead tip projecting from the package body is pressed and cut from both lateral ends to remove the lead tip end portion.
A protrusion is formed on the cut surface, and then the tip of the lead is dipped in a solder solution and then pulled up to form a tapered conical projection on the tip of the lead, and then a hole is formed in the mounting board. Method for mounting electronic element in which lead is inserted from the tip of conical projection to the formed through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2413956A JPH0787267B2 (en) | 1990-12-26 | 1990-12-26 | Electronic element mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2413956A JPH0787267B2 (en) | 1990-12-26 | 1990-12-26 | Electronic element mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04225295A JPH04225295A (en) | 1992-08-14 |
| JPH0787267B2 true JPH0787267B2 (en) | 1995-09-20 |
Family
ID=18522504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2413956A Expired - Fee Related JPH0787267B2 (en) | 1990-12-26 | 1990-12-26 | Electronic element mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0787267B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07162138A (en) * | 1993-12-03 | 1995-06-23 | Nec Corp | Integrated circuit mounting method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49103157A (en) * | 1973-02-07 | 1974-09-30 | ||
| JPS5839398B2 (en) * | 1977-03-30 | 1983-08-30 | 松下電器産業株式会社 | Part leg processing method |
-
1990
- 1990-12-26 JP JP2413956A patent/JPH0787267B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04225295A (en) | 1992-08-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |