JPH0787269B2 - Reflow soldering method - Google Patents
Reflow soldering methodInfo
- Publication number
- JPH0787269B2 JPH0787269B2 JP63191507A JP19150788A JPH0787269B2 JP H0787269 B2 JPH0787269 B2 JP H0787269B2 JP 63191507 A JP63191507 A JP 63191507A JP 19150788 A JP19150788 A JP 19150788A JP H0787269 B2 JPH0787269 B2 JP H0787269B2
- Authority
- JP
- Japan
- Prior art keywords
- reflow soldering
- vapor
- soldering method
- lead
- surface mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はベーパーフェーズ方式による表面実装用部品の
プリント基板へのリフローはんだ付方法に関する。The present invention relates to a method for reflow soldering a surface mounting component to a printed circuit board by a vapor phase method.
従来、この種のリフローはんだ付方法は、ベーパーフェ
ーズの気化潜熱を利用することにより、表面実装用部品
の温度上昇を行ない、あらかじめプリント基板に塗布し
てあるクリームはんだを溶融させはんだ接続を得てい
た。Conventionally, this type of reflow soldering method uses vaporization latent heat of vapor phase to raise the temperature of surface mounting components, and melts the cream solder previously applied to the printed circuit board to obtain solder connection. It was
上述した従来のリフローはんだ付方法は、ベーパーフェ
ーズの気化潜熱を利用するので、表面実装用部品の個々
の形状により各部分の熱容量が異なるため、温度上昇が
各部分によって異なり、表面実装用部品の中でリード等
を持つものはそのボデーに比較してリード等の熱容量が
小さいので温度上昇が早くなり、プリント基板パッドに
塗布されたクリームはんだが溶融すると、より温度の高
い側へ引寄せられ、リード等とパッドとの間に未はんだ
が発生するにいたるという欠点がある。Since the conventional reflow soldering method described above uses the vaporization latent heat of vapor phase, since the heat capacity of each part is different depending on the individual shape of the surface mounting component, the temperature rise is different for each part, and the surface mounting component Among them, those with leads etc. have a smaller heat capacity of the leads etc. compared to the body, so the temperature rises quickly, and when the cream solder applied to the printed circuit board pad melts, it is drawn to the higher temperature side, There is a drawback that unsoldered solder is generated between the leads and the pads.
以上の問題を解決するため、本発明のリフローはんだ付
方法では、ベーパーフェイズ方式によってプリント基板
上にリードもしくは電極を有する部品を表面実装するリ
フローはんだ付方法において、ベーパー層と空気との境
界面が、はんだ付部と前記部品本体の間の高さになるよ
うに、前記ベーパー層の高さを制御する。In order to solve the above problems, in the reflow soldering method of the present invention, in the reflow soldering method of surface-mounting a component having leads or electrodes on a printed circuit board by a vapor phase method, the interface between the vapor layer and air is The height of the vapor layer is controlled so that the height is between the soldering part and the component body.
ベーパー層の高さが制御されて表面実装用部品のリード
や電極等のベーパーの気化潜熱による温度上昇が緩慢な
ので、プリント基板にパッドと温度上昇差がなく、した
がって、リードや電極等へのはんだの吸い上げがないの
で未はんだが発生しない。Since the height of the vapor layer is controlled and the temperature rise due to the latent heat of vaporization of the vapor of the leads and electrodes of surface mounting parts is slow, there is no difference in temperature rise from the pad on the printed circuit board. There is no wicking so no unsoldered.
次に、本発明の実施例について図面を参照して説明す
る。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明のリフローはんだ付方法の第１の実施例
としてＪ形リードを持つ表面実装用部品に適用したとき
の縦断面図である。FIG. 1 is a longitudinal sectional view when applied to a surface mounting component having a J-shaped lead as a first embodiment of the reflow soldering method of the present invention.
ベーパー１はプリント基板３の上面を覆っており、その
空気との境界面７は表面実装用部品の部品ボデー６に取
付けられているＪ形リード２の中間位置となるように制
御されている。ベーパー１の高さの制御は、例えば、特
開昭63−90362号に記載の技術を用いて実現できる。プ
リント基板３のパッド４とＪ形リード２の間にはクリー
ムはんだ５が塗布されており、Ｊ形リード２のベーパー
１内にある部分やパッド４は気化潜熱を吸収して温度上
昇を生ずる。クリームはんだ５の溶融点より高い沸点を
持つベーパー１が使用されているのでＪ形リード２とパ
ッド４の間にはんだが浸透し、はんだ接続が行なわれ
る。この場合、Ｊ形リード２全体をベーパー１が覆って
いればＪ形リード２全体が温度上昇しパッド４の熱容量
に比べてＪ形リード２の熱容量が小さいので溶融したク
リームはんだ５はＪ形リード２全体へ浸透して行きパッ
ド４との間にはんだがなくなるが、本実施例はＪ形リー
ド２の中間位置にベーパーの境界面７、すなわちベーパ
ー１の高さが保持されているのでＪ形リード２の温度上
昇速度は緩慢となり、パッド４との温度上昇差はなく、
したがってクリームはんだ５の吸い上げがなくパッド４
とＪ形リード２の間の未はんだ現象は発生せず良好なは
んだ接続が得られる。The vapor 1 covers the upper surface of the printed circuit board 3, and its boundary surface 7 with the air is controlled to be an intermediate position of the J-shaped lead 2 attached to the component body 6 of the surface mounting component. The control of the height of the vapor 1 can be realized by using the technique described in JP-A-63-90362, for example. The cream solder 5 is applied between the pad 4 of the printed board 3 and the J-shaped lead 2, and the portion of the J-shaped lead 2 inside the vapor 1 and the pad 4 absorb the latent heat of vaporization to raise the temperature. Since the vapor 1 having a boiling point higher than the melting point of the cream solder 5 is used, the solder penetrates between the J-shaped lead 2 and the pad 4, and solder connection is performed. In this case, if the entire J-shaped lead 2 is covered by the vapor 1, the temperature of the entire J-shaped lead 2 rises and the heat capacity of the J-shaped lead 2 is smaller than the heat capacity of the pad 4. 2 penetrates to the whole 2 and there is no solder between the pad 4 and this, but in the present embodiment, since the interface 7 of the vapor, that is, the height of the vapor 1 is held at the intermediate position of the J-shaped lead 2, the J-shaped is formed. The temperature rise rate of the lead 2 becomes slow, and there is no difference in temperature rise from the pad 4,
Therefore, there is no suction of the cream solder 5 and the pad 4
An unsoldered phenomenon does not occur between the J-shaped lead 2 and the J-shaped lead 2, and good solder connection can be obtained.
第２図は本発明のリフローはんだ付方法の第２の実施例
としてガルウィング形リードを持つ表面実装用部品に適
用したときの縦断面図である。FIG. 2 is a vertical cross-sectional view of the reflow soldering method according to the second embodiment of the present invention, which is applied to a surface mounting component having gull-wing leads.
この実施例は第１図のＪ形リード２に代ってガルウィン
グ形リード８を持つ表面実装用部品に適用されている
が、第１図の実施例と同様にパッド４とガルウィング形
リード８の間の未はんだ現象は発生しない。Although this embodiment is applied to a surface mounting component having a gull wing type lead 8 in place of the J type lead 2 of FIG. 1, the pad 4 and gull wing type lead 8 of the pad 4 and gull wing type lead 8 are applied similarly to the example of FIG. The unsoldered phenomenon does not occur.
第３図は本発明のリフローはんだ付方法の第３の実施例
としてバット形リードを持つ表面実装用部品に適用した
ときの縦断面図である。FIG. 3 is a vertical cross-sectional view of the third embodiment of the reflow soldering method of the present invention when applied to a surface mounting component having a butt-shaped lead.
この実施例は第１図のＪ形リード２に代ってバット形リ
ード９を持つ表面実装用部品に適用されているが、第１
図、第２図の実施例と同様にパッド４とバット形リード
９の間の未はんだ現象は発生しない。This embodiment is applied to a surface mounting component having a butt type lead 9 instead of the J type lead 2 of FIG.
Similar to the embodiment shown in FIGS. 2 and 3, the unsoldered phenomenon between the pad 4 and the butt-shaped lead 9 does not occur.
以上説明したように本発明は、ベーパーフェーズ方式の
リフローはんだ方式において、プリント基板に接続され
る表面実装用部品のリードや電極等の温度上昇が緩慢と
なるようにベーパー層の高さを制御することにより、表
面実装用部品のリード等と、プリント基板にパッドとの
温度上昇差がなくなり、プリント基板のパッドに塗布さ
れたクリームはんだがリード等に吸い上げられないので
未はんだの発生がなく良質なはんだ接続が得られる効果
がある。As described above, in the present invention, in the vapor phase reflow soldering method, the height of the vapor layer is controlled so that the temperature rise of the leads and electrodes of the surface mounting component connected to the printed board becomes slow. As a result, there is no difference in temperature rise between the leads of surface mounting components and the pads on the printed circuit board, and the cream solder applied to the pads on the printed circuit board cannot be sucked up by the leads, etc. There is an effect that solder connection can be obtained.
第１図は本発明のリフローはんだ付方法の第１の実施例
としてＪ形リードを持つ表面実装用部品に適用したとき
の縦断面図、第２図は本発明のリフローはんだ付方法の
第２の実施例としてガルウィング形リードを持つ表面実
装用部品に適用したときの縦断面図、第３図は本発明の
リフローはんだ付方法の第３の実施例としてバット形リ
ードを持つ表面実装用部品に適用したときの縦断面図で
ある。 １…ベーパー、２…Ｊ形リード、３…プリント基板、４
…パッド、５…クリームはんだ、６…部品ボデー、７…
境界面、８…ガルウィング形リード、９…バッド形リー
ド。FIG. 1 is a longitudinal sectional view when applied to a surface mounting component having a J-shaped lead as a first embodiment of the reflow soldering method of the present invention, and FIG. 2 is a second section of the reflow soldering method of the present invention. FIG. 3 is a longitudinal sectional view when applied to a surface mounting component having a gull wing type lead, and FIG. 3 is a surface mounting component having a butt type lead as a third embodiment of the reflow soldering method of the present invention. It is a longitudinal cross-sectional view when applied. 1 ... vapor, 2 ... J lead, 3 ... printed circuit board, 4
… Pads, 5… Cream solder, 6… Parts body, 7…
Boundary surface, 8 ... Gull wing type lead, 9 ... Bad type lead.
Claims (1)
板上にリードもしくは電極を有する部品を表面実装する
リフローはんだ付方法において、 ベーパー層と空気との境界面が、はんだ付部と前記部品
本体の間の高さになるように、前記ベーパー層の高さを
制御することを特徴とするリフローはんだ付方法。1. A reflow soldering method for surface-mounting a component having a lead or an electrode on a printed circuit board by a vapor phase method, wherein a boundary surface between a vapor layer and air has a height between the soldering portion and the component body. The reflow soldering method is characterized by controlling the height of the vapor layer so that
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63191507A JPH0787269B2 (en) | 1988-07-29 | 1988-07-29 | Reflow soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63191507A JPH0787269B2 (en) | 1988-07-29 | 1988-07-29 | Reflow soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0240995A JPH0240995A (en) | 1990-02-09 |
| JPH0787269B2 true JPH0787269B2 (en) | 1995-09-20 |
Family
ID=16275802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63191507A Expired - Lifetime JPH0787269B2 (en) | 1988-07-29 | 1988-07-29 | Reflow soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0787269B2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6390362A (en) * | 1986-10-03 | 1988-04-21 | Hitachi Techno Eng Co Ltd | Vapor reflow type soldering device |
-
1988
- 1988-07-29 JP JP63191507A patent/JPH0787269B2/en not_active Expired - Lifetime
Non-Patent Citations (1)
| Title |
|---|
| 大澤直著「はんだ付技術の新時代」（昭６０−７−１５） |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0240995A (en) | 1990-02-09 |
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