JPH0787988B2 - Soldering device - Google Patents
Soldering deviceInfo
- Publication number
- JPH0787988B2 JPH0787988B2 JP62258916A JP25891687A JPH0787988B2 JP H0787988 B2 JPH0787988 B2 JP H0787988B2 JP 62258916 A JP62258916 A JP 62258916A JP 25891687 A JP25891687 A JP 25891687A JP H0787988 B2 JPH0787988 B2 JP H0787988B2
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- Prior art keywords
- substrate
- solder
- solder melting
- section
- preheating
- Prior art date
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- Expired - Lifetime
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Description
【発明の詳細な説明】 産業上の利用分野 本発明は、不活性溶剤を使用した半田付装置に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering device using an inert solvent.
従来の技術 第３図は従来の半田付装置の側面図であり、基板の搬送
径路に沿って搬入部１、予熱部２、半田溶融部３、及び
冷却・搬出部４とに分かれている。５は基板６を搬送す
るコンベア、７は基板６を搬入部１へ搬入する搬入口で
ある。予熱部２ではコンベア５の上側と下側に上部予熱
ヒーター８と下部予熱ヒーター９がそれぞれ設けられて
いる。半田溶融部３では中央下部にリフロータンク10と
加熱ヒーター11が設置され、リフロータンク10の中に例
えばフッ素系不活性液などの不活性溶剤が収容されてい
る。12はリフロータンク10の中の不活性溶剤を加熱ヒー
ター11で加熱することによって発生する不活性飽和蒸気
であり、空気よりも比重が大きい。この不活性飽和蒸気
12は、半田溶融部３の一部である吹出口13から吹き出さ
れ、吹出口13の両側に流れ込む。そして、半田溶融部３
の両側に設けられた回収口14,14aの中の冷却器15,15aに
よって冷却・凝縮しリフロータンク10に戻る仕組みとな
っている。そして、リフロータンク10に戻った不活性液
体はフィルタリング装置16で不純物を取り除かれて再び
リフロータンク10に戻る。更に不活性飽和蒸気12は、予
熱部２側に設けられた排気口17と冷却・搬出部４側に設
けられた排気口17aより、配管部18を通って排気回収部1
9へ回収される。20は基板６を冷却する冷却ファン、21
はコンベア５を駆動する駆動モーター、22はプーリーで
ある。2. Description of the Related Art FIG. 3 is a side view of a conventional soldering apparatus, which is divided into a carry-in section 1, a preheating section 2, a solder melting section 3, and a cooling / unloading section 4 along a carrying path of a substrate. Reference numeral 5 is a conveyer for carrying the substrate 6, and 7 is a carry-in port for carrying the substrate 6 into the carry-in section 1. In the preheating unit 2, an upper preheating heater 8 and a lower preheating heater 9 are provided above and below the conveyor 5, respectively. In the solder melting section 3, a reflow tank 10 and a heater 11 are installed in the lower center part, and the reflow tank 10 contains an inert solvent such as a fluorine-based inert liquid. Reference numeral 12 is an inert saturated vapor generated by heating the inert solvent in the reflow tank 10 with the heater 11, and has a specific gravity larger than that of air. This inert saturated steam
12 is blown out from the blowout port 13 which is a part of the solder melting section 3, and flows into both sides of the blowout port 13. And the solder melting part 3
The cooling devices 15 and 15a in the recovery ports 14 and 14a provided on both sides of the cooling device cool and condense and return to the reflow tank 10. Then, the inert liquid returned to the reflow tank 10 has impurities removed by the filtering device 16 and returns to the reflow tank 10 again. Further, the inert saturated steam 12 passes through the piping section 18 from the exhaust port 17 provided on the preheating section 2 side and the exhaust port 17a provided on the cooling / unloading section 4 side, and the exhaust gas recovery section 1
Recovered to 9. 20 is a cooling fan for cooling the substrate 6, 21
Is a drive motor for driving the conveyor 5, and 22 is a pulley.
以上のように構成された半田付装置について、以下その
動作を説明する。The operation of the soldering device configured as described above will be described below.
先ず、基板６上のパターン上にペースト状の半田を印刷
技術によって塗布し、その上に電子部品23を載せたもの
を用意する。そして、基板６を搬入部１のコンベア５上
に置く。そうすると、基板６は矢印Ａの方向へ搬送が開
始される。基板６は搬入部１から予熱部２へ搬送され、
上部予熱ヒーター８と下部予熱ヒーター９の間を通過す
る。その際、上部予熱ヒーター８及び下部予熱ヒーター
９により基板６及び半田が加熱される。First, a paste-like solder is applied on the pattern on the substrate 6 by a printing technique, and an electronic component 23 is placed thereon. Then, the substrate 6 is placed on the conveyor 5 of the carry-in section 1. Then, the substrate 6 starts to be transported in the direction of arrow A. The substrate 6 is conveyed from the carry-in section 1 to the preheating section 2,
It passes between the upper preheater 8 and the lower preheater 9. At that time, the board 6 and the solder are heated by the upper preheater 8 and the lower preheater 9.
次に、基板６は半田溶融部３へ搬送される。そして、リ
フロータンク10の中の不活性溶剤を加熱ヒーター11によ
って加熱することにより発生する不活性飽和蒸気12によ
り電子部品23と基板６上の導電箔との間の半田が溶融す
る。そして、基板６が半田溶融部３より冷却・搬出部４
の方へ搬送され、冷却・搬出部４に設置された冷却ファ
ン20により冷却される。その際、電子部品23と基板６上
の導電箔上との間で半田が固まり、基板６上の導電箔上
に電子部品23が装着される。そして、基板６は矢印Ｂの
方向へ搬出される。Next, the substrate 6 is conveyed to the solder melting section 3. Then, the inert saturated vapor 12 generated by heating the inert solvent in the reflow tank 10 with the heater 11 melts the solder between the electronic component 23 and the conductive foil on the substrate 6. The board 6 is cooled and carried out from the solder melting section 3
And is cooled by the cooling fan 20 installed in the cooling / unloading unit 4. At that time, the solder is solidified between the electronic component 23 and the conductive foil on the substrate 6, and the electronic component 23 is mounted on the conductive foil on the substrate 6. Then, the substrate 6 is carried out in the direction of arrow B.
発明が解決しようとする問題点 しかしながら、前記の従来の構成では、予熱部２と半田
溶融部３との間には加熱手段がない。このことにより、
基板６が基板搬送方向に対して搬入部１から冷却・搬出
部４までを搬送される際の基板６の温度変化を示すと第
９図のグラフＣのような温度変化となる。Problems to be Solved by the Invention However, in the above-described conventional configuration, there is no heating means between the preheating section 2 and the solder melting section 3. By this,
A temperature change of the substrate 6 when the substrate 6 is transferred from the carry-in unit 1 to the cooling / unloading unit 4 in the substrate transfer direction is as shown by a graph C in FIG.
つまり、基板６は予熱部２で加熱されて温度が上昇する
が予熱部２と半田溶融部３との間に加熱手段がないた
め、基板６の温度が一旦下がってしまう。その後、半田
溶融部３で熱媒の温度近くまで基板６の温度が急激に上
昇する。基板６は各部分で熱容量の分布が均一でないた
め急激に加熱されると温度分布も均一にならない。よっ
て、基板６が急激に加熱されると、基板面上の各部分で
半田が溶融する時間に多少の差が出て第５図〜第８図に
示すような過程によって不良が発生する場合があった。That is, the substrate 6 is heated by the preheating unit 2 and its temperature rises, but since there is no heating means between the preheating unit 2 and the solder melting unit 3, the temperature of the substrate 6 temporarily drops. After that, the temperature of the substrate 6 rises rapidly in the solder melting part 3 to near the temperature of the heat medium. Since the heat capacity distribution of the substrate 6 is not uniform in each part, the temperature distribution will not be uniform when heated rapidly. Therefore, when the substrate 6 is rapidly heated, there is a slight difference in the time taken for the solder to melt at each portion on the substrate surface, and a defect may occur in the process shown in FIGS. 5 to 8. there were.
以下、不良の発生の過程を詳細に示すと、第５図は半田
溶融部で基板６の温度が急激に上昇することにより、基
板６上の温度分布が不均一になり、基板６上の半田24が
先に溶けて、半田25が溶けていない状態で、電子部品23
が溶融した半田24の表面張力により矢印Ｄの方向に引っ
張られた状態を示す。The process of occurrence of defects will be described in detail below. FIG. 5 shows that the temperature of the substrate 6 rises rapidly at the solder melting portion, resulting in non-uniform temperature distribution on the substrate 6 With 24 melted first and solder 25 not melted,
Shows a state in which the solder is pulled in the direction of arrow D by the surface tension of the melted solder 24.
その後、第６図に示すように半田24の表面張力によって
電子部品23が引っ張られ、矢印D1に示された方向に電子
部品23が回転して一方の端部が浮く。続いて、第７図に
示すように電子部品23の端部が浮いている状態から更に
半田24の表面張力によって電子部品23が垂直に立った状
態となる。更に、第８図では第７図のように電子部品23
が垂直に立った状態から更に半田24の表面張力が矢印D3
の方向に働くため、電子部品23が矢印D3の方向に倒れる
状態となる。After that, as shown in FIG. 6, the electronic component 23 is pulled by the surface tension of the solder 24, and the electronic component 23 rotates in the direction shown by the arrow D 1 to float one end. Then, as shown in FIG. 7, the electronic component 23 is vertically stood by the surface tension of the solder 24 from the state where the end of the electronic component 23 is floating. Further, in FIG.
The surface tension of the solder 24 is further indicated by the arrow D 3
, The electronic component 23 falls in the direction of the arrow D 3 .
以上のように従来の半田付装置では、予熱部２と半田溶
融部３の間には基板６を加熱するための手段が存在しな
かったために、第９図のグラフＣに示されるようにこの
間で基板６の温度が低下してしまい、続いて半田溶融部
３において基板６は200℃以上の高温度にまで急激に加
熱されるので、基板６の温度分布が不均一になって基板
６の温度が場所的にばらつき、このため一方の半田24が
他方の半田25よりも先に溶融してしまい、その結果、電
子部品23は先きに溶けた半田24の表面張力に引っ張られ
て、第５図〜第８図に示すように立ちや倒れを生じやす
いという問題点があった。As described above, in the conventional soldering apparatus, since there is no means for heating the substrate 6 between the preheating section 2 and the solder melting section 3, as shown in the graph C of FIG. Then, the temperature of the substrate 6 is lowered, and then the substrate 6 is rapidly heated to a high temperature of 200 ° C. or higher in the solder melting portion 3, so that the temperature distribution of the substrate 6 becomes non-uniform and The temperature locally varies, so that one solder 24 melts before the other solder 25, and as a result, the electronic component 23 is pulled by the surface tension of the previously melted solder 24, As shown in FIGS. 5 to 8, there is a problem that it is easy to stand or fall.
したがって本発明は、予熱部と半田溶融部の間で基板の
温度が低下するのを防止し、基板の温度分布のばらつき
によって半田が不均一に溶け、電子部品が先きに溶けた
半田に引っ張られて立ちや倒れを生じることのない半田
付装置を提供することを目的とする。Therefore, the present invention prevents the temperature of the board from decreasing between the preheating section and the solder melting section, the solder is unevenly melted due to the variation in the temperature distribution of the board, and the electronic component is pulled to the previously melted solder. It is an object of the present invention to provide a soldering device that does not stand up or fall down.
課題を解決するための手段 このために本発明は、予熱部と半田溶融部の間にノズル
を設け、半田溶融部から発生した不活性飽和蒸気をこの
ノズルから半田溶融部側へ向って吹き出すようにしたも
である。Means for Solving the Problems For this purpose, the present invention provides a nozzle between the preheating part and the solder melting part, and blows out the inert saturated vapor generated from the solder melting part toward the solder melting part from this nozzle. It was also
作用 上記構成によれば、半田溶融部で発生した不活性飽和蒸
気の一部は予熱部と半田溶融部の間のノズルから吹き出
されるので、この間を搬送される基板はこの吹き出され
た不活性飽和蒸気によって加熱されることとなり、これ
によりこの間で基板の温度が低下するのは防止される。
そして続いて半田溶融部においては基板は半田の溶融温
度以上までスムーズに加熱されて、基板上のすべての半
田は一様に溶融し、すべての電子部品は基板に正しく半
田付けされる。Action According to the above configuration, since a part of the inert saturated vapor generated in the solder melting portion is blown out from the nozzle between the preheating portion and the solder melting portion, the substrate conveyed during this period is the blown out inert gas. It is heated by the saturated steam, which prevents the temperature of the substrate from decreasing during this period.
Then, subsequently, in the solder melting portion, the board is smoothly heated to a temperature equal to or higher than the melting temperature of the solder, all the solder on the board is uniformly melted, and all the electronic components are correctly soldered to the board.
実施例 第１図，第２図及び第４図はそれぞれ本発明の一実施例
における半田付装置を示す側面図，要部斜視図，及び要
部側面図である。１は搬入部、２は予熱部、３は半田溶
融部、４は冷却・搬出部、５はコンベア、６は基板、７
は基板の搬入口、８は上部予熱ヒーター、９は下部予熱
ヒーター、10はリフロータンク、11は加熱ヒーター、12
は不活性飽和蒸気、13は吹出口、14,14aは回収口、15,1
5aは冷却器、16はフィルタリング装置、17,17aは排気
口、18は配管部、19は排気回収部、20は冷却ファン、21
は駆動モーター、22はプーリー、23は電子部品である。
ここまでは第３図に示した従来の半田付装置の構成と同
じであるので、詳細な説明は省略する。Embodiment FIG. 1, FIG. 2, and FIG. 4 are a side view, a perspective view of a main part, and a side view of a main part, respectively, showing a soldering device according to an embodiment of the present invention. 1 is a carry-in section, 2 is a preheating section, 3 is a solder melting section, 4 is a cooling / unloading section, 5 is a conveyor, 6 is a substrate, 7
Is a substrate inlet, 8 is an upper preheater, 9 is a lower preheater, 10 is a reflow tank, 11 is a heater, 12
Is an inert saturated steam, 13 is an outlet, 14 and 14a are recovery ports, 15 and 1
5a is a cooler, 16 is a filtering device, 17 and 17a are exhaust ports, 18 is a piping part, 19 is an exhaust recovery part, 20 is a cooling fan, 21
Is a drive motor, 22 is a pulley, and 23 is an electronic component.
Up to this point, the structure is the same as that of the conventional soldering device shown in FIG. 3, and therefore detailed description thereof is omitted.
第１図に示すように、予熱部２と半田溶融部３の間には
ノズル26が設けられている。ノズル26はコンベヤ５の上
側と下側にそれぞれ１個づつ設けられており、半田溶融
部３で発生した不活性飽和蒸気12をこのノズル26から半
田溶融部３側へ向って吹き出す。As shown in FIG. 1, a nozzle 26 is provided between the preheating section 2 and the solder melting section 3. One nozzle 26 is provided on each of the upper side and the lower side of the conveyor 5, and the inert saturated vapor 12 generated in the solder melting section 3 is blown out from the nozzle 26 toward the solder melting section 3 side.
第４図は半田溶融部３における不活性飽和蒸気12の分布
状態を示す。加熱ヒーター11でリフロータンク10内に貯
留された不活性溶剤を加熱すると、不活性飽和蒸気12が
発生するが、この不活性飽和蒸気12は図中Ｅで示すよう
に、リフロータンク10の上部を覆う層となる。そしてこ
の層Ｅの中を基板６が搬送されることにより基板６は半
田の溶融温度以上まで加熱されて半田は溶融し、電子部
品23は基板６に半田付けされる。FIG. 4 shows a distribution state of the inert saturated vapor 12 in the solder melting part 3. When the inert solvent stored in the reflow tank 10 is heated by the heater 11, the inert saturated vapor 12 is generated. The inert saturated vapor 12 is generated in the upper part of the reflow tank 10 as indicated by E in the figure. It becomes a layer to cover. When the substrate 6 is conveyed through the layer E, the substrate 6 is heated to the melting temperature of the solder or higher, the solder is melted, and the electronic component 23 is soldered to the substrate 6.
一方、リフロータンク10で発生した不活性飽和蒸気12の
一部は、ノズル26から半田溶融部３へ向って吹き出され
る。図中、Ｆはノズル26から吹き出された不活性飽和蒸
気12の層を示している。このように予熱部２と半田溶融
部３の間に、不活性飽和蒸気12の層Ｆを生成することに
より、予熱部２と半田溶融部３の間においても基板６を
加熱する。On the other hand, a part of the inert saturated vapor 12 generated in the reflow tank 10 is blown out from the nozzle 26 toward the solder melting part 3. In the figure, F indicates the layer of the inert saturated vapor 12 blown out from the nozzle 26. By thus forming the layer F of the inert saturated vapor 12 between the preheating part 2 and the solder melting part 3, the substrate 6 is also heated between the preheating part 2 and the solder melting part 3.
第９図において、Ｇは本実施例の温度のグラフを示して
いる。上記従来例では、予熱部２と半田溶融部３の間の
150℃付近で基板６の温度が低下するため、上述したよ
うな問題点を生じていたが、本発明ではこの間でノズル
26から不活性飽和蒸気12を吹き出して、その層Ｆで基板
６を加熱するので、予熱部２と半田溶融部（リフロー
部）３の内においても基板６の温度はスムーズに上昇
し、続いて半田溶融部（リフロー部）３において200℃
以上の半田溶融温度以上にまで加熱されて半田は完全に
溶融することとなる。このように基板６の温度を低下さ
せることなく、半田の溶融温度以上までスムーズに上昇
させれば、基板６の温度分布が不均一にばらつくことは
なく、基板６上のすべての半田は一様に溶けてすべての
電子部品23は正しく半田付けされる。In FIG. 9, G shows the temperature graph of this embodiment. In the above-mentioned conventional example, between the preheating part 2 and the solder melting part 3
Since the temperature of the substrate 6 lowers near 150 ° C., the above-mentioned problem occurs, but in the present invention, the nozzle is in between during this time.
Since the inert saturated vapor 12 is blown from 26 and the substrate 6 is heated by the layer F, the temperature of the substrate 6 rises smoothly even in the preheating part 2 and the solder melting part (reflow part) 3, and then 200 ℃ at solder melting part (reflow part) 3
The solder is completely melted by being heated to the solder melting temperature or higher. In this way, if the temperature of the substrate 6 is smoothly raised to the melting temperature of the solder or higher without lowering, the temperature distribution of the substrate 6 does not vary unevenly, and all the solder on the substrate 6 is uniform. And all electronic components 23 are properly soldered.
発明の効果 本発明は、予熱部と半田溶融部の間にノズルを設け、こ
のノズルから不活性飽和蒸気を半田溶融部へ向って吹き
出すようにしているので、この間において基板はこの不
活性飽和蒸気によって加熱されることとなり、したがっ
てこの間において基板の温度が低下することはなく、基
板は半田が溶融する溶融温度以上までスムーズに加熱さ
れることとなり、したがって基板の温度分布がばらつく
ことはなく、すべての半田は一様に溶けて電子部品は正
しく半田付けされ、電子部品に立ちや倒れが生じるのは
解消される。しかも不活性飽和蒸気はノズルからその発
生源である半田溶融部側へ向って吹き出されるので、半
田溶融部にスムーズに回収することができる。EFFECTS OF THE INVENTION According to the present invention, a nozzle is provided between the preheating portion and the solder melting portion, and the inert saturated vapor is blown out from the nozzle toward the solder melting portion. Therefore, the temperature of the board does not drop during this period, and the board is heated smoothly to the melting temperature or higher at which the solder melts. Therefore, the temperature distribution of the board does not vary, and The solder is melted uniformly and the electronic components are correctly soldered, and the electronic components are prevented from standing or falling. Moreover, since the inert saturated vapor is blown out from the nozzle toward the solder melting portion side, which is the generation source thereof, it can be smoothly collected in the solder melting portion.
また不活性液体には一般にフロン系の有毒物質が含まれ
ている。このような有毒物質を含む不活性飽和蒸気が予
熱部側へ流出すると、予熱部のヒーターで加熱されてガ
ス化し、このガスが外部へ漏れて環境汚染を発生させ
る。しかしながら本発明は、不活性飽和蒸気はノズルか
ら予熱部とは反対側の半田溶融部側へ向って吹き出すよ
うにしているので、このような問題も生じない。Further, the inert liquid generally contains a chlorofluorocarbon-based toxic substance. When the inert saturated vapor containing such a toxic substance flows out to the preheating section side, it is heated by the heater of the preheating section and gasified, and this gas leaks to the outside to cause environmental pollution. However, according to the present invention, since the inert saturated vapor is blown out from the nozzle toward the solder melting portion side opposite to the preheating portion, such a problem does not occur.
第１図は本発明の一実施例における半田付装置全体を示
す側面図、第２図は本発明の一実施例における半田付装
置の要部斜視図、第３図は従来の半田付装置全体を示す
側面図、第４図は本発明の一実施例における半田付装置
の要部側面図、第５図〜第８図は電子部品の半田不良の
例を示す要部拡大図、第９図は半田付が行われる際の温
度プロファイルを示す特性図である。 ２……予熱部、３……半田溶融部 ４……冷却・搬出部、５……コンベア 8,9……予熱ヒーター 12……不活性飽和蒸気 23……電子部品、26……ノズル Ｃ……従来の温度プロファイル Ｇ……本発明の温度プロファイルFIG. 1 is a side view showing the whole soldering device according to an embodiment of the present invention, FIG. 2 is a perspective view of a main part of the soldering device according to one embodiment of the present invention, and FIG. 3 is a whole conventional soldering device. FIG. 4 is a side view of a main part of a soldering device according to an embodiment of the present invention, and FIGS. 5 to 8 are enlarged views of a main part showing an example of defective soldering of an electronic component. FIG. 4 is a characteristic diagram showing a temperature profile when soldering is performed. 2 ... Preheating part, 3 ... Solder melting part 4 ... Cooling / unloading part, 5 ... Conveyor 8, 9 ... Preheating heater 12 ... Inert saturated steam 23 ... Electronic parts, 26 ... Nozzle C ... ... Conventional temperature profile G ... Temperature profile of the present invention
Claims (1)
送手段を備え、基板の搬送方向に対して基板搬入側から
基板搬出側へ順に、基板を予熱する予熱部と、不活性液
体を加熱することにより発生する不活性飽和蒸気によっ
て基板上の半田を溶融する半田溶融部と、基板を冷却し
搬出する冷却・搬出部を備えた半田付装置であって、前
記予熱部と前記半田溶融部の間にノズルを設け、前記半
田溶融部から発生した不活性飽和蒸気をこのノズルから
前記半田溶融部側へ向って吹き出すようにしたことを特
徴とする半田付装置。1. A pre-heating section for pre-heating a substrate and a preheating section for heating an inert liquid, comprising a substrate carrying means for carrying a substrate on which an electronic component is mounted, in order from the substrate loading side to the substrate unloading side in the substrate carrying direction. A soldering device comprising: a solder melting part for melting solder on a substrate by inert saturated vapor generated by; and a cooling / unloading part for cooling and carrying out the substrate, wherein the preheating part and the solder melting part are provided. A soldering apparatus, characterized in that a nozzle is provided between the nozzles and the inert saturated vapor generated from the solder melting portion is blown out toward the solder melting portion from the nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62258916A JPH0787988B2 (en) | 1987-10-14 | 1987-10-14 | Soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62258916A JPH0787988B2 (en) | 1987-10-14 | 1987-10-14 | Soldering device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01104468A JPH01104468A (en) | 1989-04-21 |
| JPH0787988B2 true JPH0787988B2 (en) | 1995-09-27 |
Family
ID=17326813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62258916A Expired - Lifetime JPH0787988B2 (en) | 1987-10-14 | 1987-10-14 | Soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0787988B2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6221463A (en) * | 1985-07-17 | 1987-01-29 | Tamura Seisakusho Co Ltd | Vapor phase type soldering equipment |
-
1987
- 1987-10-14 JP JP62258916A patent/JPH0787988B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01104468A (en) | 1989-04-21 |
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