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JPH0791149B2 - Single crystal silicon swing width detection method in CZ furnace - Google Patents
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JPH0791149B2 - Single crystal silicon swing width detection method in CZ furnace - Google Patents

Single crystal silicon swing width detection method in CZ furnace

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Publication number
JPH0791149B2
JPH0791149B2 JP62002749A JP274987A JPH0791149B2 JP H0791149 B2 JPH0791149 B2 JP H0791149B2 JP 62002749 A JP62002749 A JP 62002749A JP 274987 A JP274987 A JP 274987A JP H0791149 B2 JPH0791149 B2 JP H0791149B2
Authority
JP
Japan
Prior art keywords
single crystal
furnace
crystal silicon
swing width
detection method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62002749A
Other languages
Japanese (ja)
Other versions
JPS63170296A (en
Inventor
洋 市川
Original Assignee
九州電子金属株式会社
大阪チタニウム製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 九州電子金属株式会社, 大阪チタニウム製造株式会社 filed Critical 九州電子金属株式会社
Priority to JP62002749A priority Critical patent/JPH0791149B2/en
Publication of JPS63170296A publication Critical patent/JPS63170296A/en
Publication of JPH0791149B2 publication Critical patent/JPH0791149B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、CZ炉内での単結晶シリコン揺動防止管理に供
されるCZ炉内の単結晶シリコン振れ幅検出方法に関す
る。
Description: TECHNICAL FIELD The present invention relates to a single crystal silicon swing width detection method in a CZ furnace, which is used for a single crystal silicon oscillation prevention control in the CZ furnace.

(従来技術とその問題点) 近年、CZ炉の大容量化が進み、そのために微振動の影響
を受けにくく、且つ炉高が低く設定できるワイヤ方式、
すなわち治具を介して種結晶をワイヤの先端に吊し、そ
のワイヤを巻き取りながら生成単結晶シリコンを上昇さ
せる方式、が主に採用されている。
(Prior art and its problems) In recent years, as the capacity of CZ furnaces has increased, wire systems that are less susceptible to microvibrations and that can set the furnace height low,
That is, a method is mainly adopted in which a seed crystal is hung on the tip of a wire through a jig and the generated single crystal silicon is raised while winding the wire.

しかし上記ワイヤ方式は、ワイヤの回転中心(換言すれ
ば単結晶シリコンの回転中心)とるつぼの回転中心(換
言すればシリコン溶液の回転中心)との芯ずれによる単
結晶シリコンの揺動が起り易く、それに起因して単結晶
の劣化が生じ、最悪の場合には多結晶化、形状の劣化
(変形)が発生している。
However, in the above wire system, the single crystal silicon is likely to swing due to misalignment between the rotation center of the wire (in other words, the rotation center of the single crystal silicon) and the rotation center of the crucible (in other words, the rotation center of the silicon solution). Due to this, deterioration of the single crystal occurs, and in the worst case, polycrystallization and deterioration (deformation) of the shape occur.

そこでCZ炉内での単結晶シンコンの揺動防止管理を行う
必要があり、そのためには、CZ炉内における単結晶シリ
コンの振れ幅検出手段が必要となるが、従来は簡易且つ
好適な手段が提案されていなかった。
Therefore, it is necessary to perform rocking prevention management of the single crystal sinchon in the CZ furnace, and for that purpose, a swing width detection means of the single crystal silicon in the CZ furnace is required, but conventionally, a simple and suitable means is available. It was not suggested.

なお、物体の揺動幅(振れ幅)を計測する方法として、
二次元カメラで画像処理を行い、物体の基準点(回転体
の場合は回転中心等)の変位を求める方法が一般に行わ
れているが、単結晶シリコン製造装置に適用しようとす
ると、検出装置が大規模となるため、従来は二次元カメ
ラによる単結晶シリコン振れ幅検出装置は実用化されて
いなかった。本発明は上記実情の下になされたものであ
る。
In addition, as a method of measuring the swing width (shake width) of an object,
A method of performing image processing with a two-dimensional camera and obtaining the displacement of a reference point of an object (such as the center of rotation in the case of a rotating body) is generally used. Due to the large scale, a single-crystal silicon swing width detecting device using a two-dimensional camera has not been put into practical use. The present invention has been made under the above circumstances.

(問題点を解決するための手段) 本発明は上記問題点を解決するために次の如き技術手段
を採用する。
(Means for Solving Problems) The present invention employs the following technical means for solving the above problems.

すなわち、単結晶成長中のCZ炉内に向って配された一次
元CCDカメラで二つの高輝度点を把え、該二つの高輝度
点の中間点を繰り返し検出し、一定時間内における前記
中間点の変位幅を長さに変換し、該長さを炉内単結晶シ
リコンの振れ幅として把握する検出方法にある。
That is, the two high-intensity points are grasped by a one-dimensional CCD camera arranged toward the inside of the CZ furnace during single crystal growth, the intermediate point between the two high-intensity points is repeatedly detected, and the intermediate point within a certain period of time is detected. This is a detection method in which the displacement width of a point is converted into a length and the length is grasped as the swing width of single-crystal silicon in a furnace.

(発明の成立基盤とデータ処理) 以下、図面に基づいて本発明を詳述する。(Foundation of Invention and Data Processing) Hereinafter, the present invention will be described in detail with reference to the drawings.

第1図は、単結晶シリコン成長中のCZ炉の概略図で、1
はCZ炉チャンバ、2は前記CZ炉チャンバ1内に回転駆動
可能として配置されたるつぼ、3はるつぼ2内のシリコ
ン溶融液、4はるつぼ2の中心に向い垂下されたワイ
ヤ、5はワイヤ4の下端に取り付けられた種結晶、6は
種結晶5に付着して成長する単結晶シリコンを示す。
Figure 1 is a schematic diagram of the CZ furnace during the growth of single crystal silicon.
Is a CZ furnace chamber, 2 is a crucible which is rotatably arranged in the CZ furnace chamber 1, 3 is a silicon melt in the crucible 2, 4 is a wire hanging toward the center of the crucible 2, and 5 is a wire 4. The seed crystal attached to the lower end of the seed crystal and the single crystal silicon 6 attached to the seed crystal 5 and grown.

上記の如き構成のCZ炉内にCCDカメラ7を当てた場合、
単結晶シリコン6表面とシリコン溶融液3との境界部分
が、高輝度な部分として把えられる。例えば、一次元CC
Dカメラによると、帯状の輪8(以下「フュージョンリ
ング」と称する。)として把握される。
When the CCD camera 7 is placed in the CZ furnace having the above structure,
A boundary portion between the surface of the single crystal silicon 6 and the silicon melt 3 can be grasped as a high brightness portion. For example, one-dimensional CC
According to the D camera, it is recognized as a belt-shaped ring 8 (hereinafter referred to as "fusion ring").

従って、このフュージョンリング8の直径方向に走査線
Rを走らせる一次元CCDカメラを用いた場合には、第2
図(2)に示すように、フュージョンリング8を通過す
る二点が高輝度A,Bとして把えられる。
Therefore, when the one-dimensional CCD camera that runs the scanning line R in the diameter direction of the fusion ring 8 is used,
As shown in FIG. 2B, two points passing through the fusion ring 8 can be grasped as high brightness A and B.

本発明は上記高輝度A,Bを把握し、第3図に示すデータ
処理を行って成立するものである。
The present invention is realized by grasping the high brightness A and B and performing the data processing shown in FIG.

すなわち、単結晶シリコンは常時振れているものとみな
すことができ、その時点、その時点での振れ幅が存在す
る。そこで本発明では一定時間内において一つの振れ幅
を有するものとして振れ幅を把握し、実際の操業時にこ
れを修正せんとするものである。
That is, the single crystal silicon can be regarded as always swinging, and there is a swing width at that time and at that time. Therefore, in the present invention, the swing width is grasped as having one swing width within a certain time, and this is corrected during the actual operation.

例えば、第4図に示す二つの状態(一方を実線で他方を
仮想線で示す。)が存する場合、まず、それぞれの中間
点C=(a+b)/2、C′=(a′+b′)/2を求め、
これらの数値から振れ幅を算出すのである。具体的に
は、一定時間内において、C,C′,C″…を求め、これら
の数値のMax−Minを出し、これに長さ変換定数Kを掛け
てL=(Max−Min)×Kを求め、更に真円補正量Cを加
味して(L−C)を振れ幅とする。
For example, when there are two states shown in FIG. 4 (one is shown by a solid line and the other is shown by a virtual line), first, the respective intermediate points C = (a + b) / 2 and C ′ = (a ′ + b ′). Ask for / 2,
The swing width is calculated from these numerical values. Specifically, C, C ′, C ″, etc. are obtained within a fixed time, Max-Min of these numerical values is obtained, and this is multiplied by a length conversion constant K to obtain L = (Max-Min) × K. Is calculated, and the roundness correction amount C is further added to make (LC) the swing width.

(実施例) るつぼを備えた単結晶シリコン製造装置に一次元CCDカ
メラを設置し、このカメラ内の各素子の電圧をA/D変換
するインターフェースを介して輝度分布をマイクロコン
ピュータのメモリに取り込み、メモリに取り込まれた輝
度分布データから、0.5秒毎に中間点Cを求め、中間点2
0個をもって1ロットとし、上記データ処理を行って振
れ幅を求め、振れ幅矯正を行いつつ操業したところ、振
れ幅の監視・矯正が常時楽に行うことができ、また品質
の劣化(多結晶化)、形状劣化(変形)にもとづくロス
が減少し、単結晶シリコン生成の歩留りが従来に比べ5
%向上したことを確認した。
(Example) A one-dimensional CCD camera is installed in a single crystal silicon manufacturing apparatus equipped with a crucible, and the luminance distribution is taken into a memory of a microcomputer through an interface for A / D converting the voltage of each element in the camera, The intermediate point C is calculated every 0.5 seconds from the brightness distribution data stored in the memory, and the intermediate point 2
When 0 pieces are regarded as one lot, the above-mentioned data processing is performed to obtain the runout width, and the operation is performed while correcting the runout width, the runout can be monitored and corrected easily at all times, and the quality is deteriorated (polycrystallization). ), Loss due to shape deterioration (deformation) is reduced, and the yield of single crystal silicon production is 5
It was confirmed that it improved by%.

(発明の効果) 以上説明したように、本発明は、一次元CCDカメラを用
いた単結晶シリコンの振れ幅を検出する方法であるた
め、装置が小型で実用に適したものであり、本発明を用
いて単結晶シリコンの振れの迅速な矯正が可能となり、
これにより品質の向上がもたらされる。また、炉体精度
(ワイヤー芯とるつぼ芯とのずれ)の指標を作成する場
合にも利用できる等の利点もある。
(Effects of the Invention) As described above, the present invention is a method for detecting the swing width of single crystal silicon using a one-dimensional CCD camera, and therefore the device is small and suitable for practical use. It is possible to quickly correct the shake of single crystal silicon using
This leads to improved quality. In addition, there is an advantage that it can be used when creating an index of furnace accuracy (deviation between the wire core and the crucible core).

【図面の簡単な説明】[Brief description of drawings]

第1図はCZ炉の概略図を示し、第2図(1)はフュージ
ョンリングの説明図、第2図(2)は一次元CCDカメラ
で把えたフュージョンリングの輝度分布、第3図は本発
明のフローチャート、第4図は中間点の取り方の説明図
である。 6……単結晶シリコン 7……CCDカメラ A,B……高輝度点
Fig. 1 shows a schematic view of the CZ furnace, Fig. 2 (1) is an explanatory view of the fusion ring, Fig. 2 (2) is the brightness distribution of the fusion ring as seen by a one-dimensional CCD camera, and Fig. 3 is the book. FIG. 4 is a flow chart of the invention, and is an explanatory diagram of how to set an intermediate point. 6 …… Single crystal silicon 7 …… CCD camera A, B …… High brightness point

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】単結晶成長中のCZ炉内に向って配された一
次元CCDカメラで二つの高輝度点を把え、該二つの高輝
度点の中間点を繰り返し検出し、一定時間内における前
記中間点の変位幅を長さに変換し、該長さを炉内単結晶
シリコンの振れ幅として把握することを特徴とするCZ炉
内の単結晶シリコン振れ幅検出方法。
1. A two-dimensional high-intensity point is grasped by a one-dimensional CCD camera arranged toward the inside of a CZ furnace during single crystal growth, and an intermediate point between the two high-intensity points is repeatedly detected, and within a fixed time. A method for detecting a single crystal silicon swing width in a CZ furnace, which comprises converting a displacement width of the intermediate point into a length and grasping the length as a swing width of the single crystal silicon in the furnace.
JP62002749A 1987-01-09 1987-01-09 Single crystal silicon swing width detection method in CZ furnace Expired - Fee Related JPH0791149B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62002749A JPH0791149B2 (en) 1987-01-09 1987-01-09 Single crystal silicon swing width detection method in CZ furnace

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62002749A JPH0791149B2 (en) 1987-01-09 1987-01-09 Single crystal silicon swing width detection method in CZ furnace

Publications (2)

Publication Number Publication Date
JPS63170296A JPS63170296A (en) 1988-07-14
JPH0791149B2 true JPH0791149B2 (en) 1995-10-04

Family

ID=11537996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62002749A Expired - Fee Related JPH0791149B2 (en) 1987-01-09 1987-01-09 Single crystal silicon swing width detection method in CZ furnace

Country Status (1)

Country Link
JP (1) JPH0791149B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2538748B2 (en) * 1992-11-27 1996-10-02 信越半導体株式会社 Crystal size measuring device
JP3099724B2 (en) * 1996-03-15 2000-10-16 住友金属工業株式会社 Apparatus and method for detecting torsional vibration of silicon single crystal and method for producing single crystal using same
JP3758743B2 (en) * 1996-04-22 2006-03-22 コマツ電子金属株式会社 Semiconductor single crystal manufacturing equipment

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6065789A (en) * 1983-09-21 1985-04-15 Toshiba Mach Co Ltd Apparatus for preventing lateral oscillation of pulling shaft of semiconductor pulling device
JPS61122188A (en) * 1984-11-20 1986-06-10 Toshiba Mach Co Ltd Apparatus for pulling up semiconductor single crystal

Also Published As

Publication number Publication date
JPS63170296A (en) 1988-07-14

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