JPH0792477B2 - Probe card - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe card used for measuring the electrical characteristics of a semiconductor chip which has been particularly densified and miniaturized.

[0002]

2. Description of the Related Art A conventional technique will be described below with reference to FIG. The probe card used for measuring the electrical characteristics of the IC chip 90 is a substrate 1 having a wiring pattern 1a formed on its surface, and an insulating member fitted in an opening 1b formed in substantially the center of the substrate 1. Gender frame (also called a ring) 2
And a plurality of probes 3 attached to the inclined surface 2a of the frame 2 with an epoxy resin 4 or the like.

The tip 3a of the probe 3 is formed in a substantially V-shape so as to project from the through hole 2b formed in the substantially central portion of the frame 2 toward the rear surface of the substrate 1 by a predetermined dimension. The rear end 3b of the probe 3 is connected to the wiring pattern 1a.

The probe card thus constructed is connected to a measuring device (not shown) called a prober, and the tip 3a of the probe 3 is applied to the bump 91, which is an electrical input / output portion of the IC chip 90, at a predetermined contact pressure. The electrical characteristics of the IC chip 90 are measured by bringing them into contact with each other.

[0005]

However, the above-mentioned conventional probe card has the following problems. That is, as the density and the size of the IC chip 90 increase, it becomes difficult to bring the probe 3 into proper contact with the bump 91 of the IC chip 90.

For example, when the dimension between the bumps 91 becomes about 75 μm, an extremely fine probe 3 having a diameter of about 30 μm must be used. It is difficult to obtain a predetermined contact pressure with the bump 91. For example, 1 mil for a probe card
Even if the overdrive is added, only a contact pressure of about 5 g / mm ² can be obtained, and the contact resistance between the probe 3 and the bump 91 becomes high, which makes it difficult to perform accurate measurement.

Further, if each probe 3 is arranged at a position that exactly opposes a predetermined bump 91, and the mutual position between the probes 3 is not maintained accurately when the overdrive is applied. I won't.

Furthermore, since the heights of the bumps 91 and the protrusion dimensions of the probes 3 do not always make contact, that is, not all the probes 3 and the bumps 91 are always in contact with each other at the same time. Probe 3 that first came into contact with
May slip off the bump 91. In this case, the tip 3a of the probe 3 may be deformed.

The present invention was devised in view of the above circumstances. Even in a probe card provided with a large number of extremely fine probes at minute intervals, a predetermined contact pressure is applied to the electrical input / output section of the semiconductor. Contact with each other, the position of each probe with respect to the electrical input / output section and the mutual position between the probes are accurately maintained, and the tip of the probe is moved from the electrical input / output section even when overdrive is applied. The purpose is to provide a probe card that does not slip off.

[0010]

In order to solve the above-mentioned problems, the probe card according to claim 1 is provided with an electric power source for a semiconductor chip.
Of the semiconductor chip by contacting the probe with the static input / output
Probe card for measuring static characteristics, with specified wiring
Patterned substrate and stepped apertures in this substrate
The large opening and the small opening and the step between these openings.
By providing a through hole having, in the peripheral portion of the small opening,
In the direction of the thickness of the peripheral part, the entire length of this thickness is duplicated.
An insulative first frame having a number of grooves, and the first frame
Insulating second frame fixed on top and between the first and second frames
Is fixed in the groove, the vicinity of the tip is inserted into the groove, and the tip is the first
Multiple probes protruding from the underside of the frame and part of the probe
Fill the opening of the second frame and the large opening so as to be embedded.
And an insulating synthetic resin with the elasticity
A pressure plate closely laminated on the oil, the step and the synthetic resin
Was arranged so as to close the small opening of the first frame and the groove.
And an insulating film, wherein the groove is a semiconductor
It is formed to correspond to the electrical input / output section of the chip.
Both the first and second frames are rectangular, square or
It is a ring.

[0011]

An embodiment of the present invention will be described below with reference to the drawings.
Reveal 1 to 7 are for explaining one embodiment of the present invention.
FIG. 1 is a cross-sectional explanatory view and FIG. 2 is a first frame
Plan view, FIG. 3 is a plan view of a frame member constituting the first frame, FIG.
4 is a sectional view taken along the line AA of FIG. 3, and FIG. 5 is a line BB of FIG.
FIG. 6 is a partial plan view of the first frame, and FIG. 7 is a modified view.
3 is a partial perspective view of a first frame of FIG.

The probe card according to this embodiment is a semiconductor
IC chip 90, which is a chip,
Of the IC chip 90 by bringing the probe 30 into contact with the pump 91.
A probe card for measuring electrical characteristics,
The substrate 10 on which the wiring pattern 81 is formed,
The large opening 24a is fitted into the stepped opening 11 of the substrate 10.
And small opening 24b and the step between these openings 24a and 24b
26 and a through hole 24 having
In the peripheral portion 25, in the thickness direction of the peripheral portion 25,
Insulation with multiple grooves 23 formed over the entire length of the
Sexual first frame 20 and fixed on this first frame 20
Insulating second frame 40, the first frame 20 and the second frame
It is fixed between 40 and the vicinity 32 of the tip is in the groove 23.
The tip 31 was inserted and protruded from the lower surface of the first frame 20.
A plurality of tips 30 and a part of the tips 30 should be embedded.
The opening 41 of the second frame 40 and the large opening 24a.
The filled insulative synthetic resin 70 having elasticity, and
A pressing plate 60 adhered and laminated on a synthetic resin 70, and the step
The small opening 2 of the first frame 20 is provided between the difference 26 and the synthetic resin 70.
4b and the groove 23, which is an insulating film disposed so as to close the groove 23
That has an arm 50.

The probe 30 is made of metal and is near the tip.
32 is bent in a substantially V shape, and the tip 31 is a bun.
It is designed to come into contact with the cap 91. Also, this probe 3
0 arm part (a part excluding the tip 31 and the tip vicinity 32)
33) is fixed to the first frame 20 and the second frame 40.
It has become a part.

The substrate 10 is provided with an opening 11 at a substantially central portion.
The holes 11 are centered in a substantially radial pattern.
The wiring pattern 81 is formed on the upper surface. The opening 1
1 is a portion into which a first frame 20 described later is fitted.
And the lower side (IC chip 90 side) is smaller
It is in a state.

On the other hand, the first frame 20 and the second frame 40 are
Made of synthetic resin, quartz or glass, etc., usually thermoset
A transparent transparent insulating synthetic resin is used. But money
The surface of the metal may be coated with insulating synthetic resin, etc.
Yes.

In this embodiment, the first frame 20 is a flat surface.
The second frame 40 has a rectangular shape as viewed, and the second frame 40 is the first frame 2.
The IC chip 90 has a rectangular shape corresponding to the shape of 0.
The first frame 20 according to the arrangement pattern of the bumps 91 of the
Both the second frame 40 may be square, or circular or suitable.
It is also possible to form a ring having an appropriate shape.

The first frame 20 has an insulating property.
1, the large opening 24a and the small opening 24b and these
Through hole 2 having step 26 between both openings 24a, 24b
4 has a frame shape that is generally square-shaped as a whole
Has been done. Further, the peripheral portion 25 of the small opening 24b
In the direction of the thickness of this peripheral portion 25,
A plurality of grooves 23 are formed over the length.

A base is provided on the outer peripheral edge of the first frame 20.
A step portion corresponding to the opening 11 of the plate 10 is provided.

Next, the procedure for manufacturing the first frame 20 as described above.
Will be described. The first frame 20 is as shown in FIG.
And a pair of frame members 21 and 21 arranged to face each other.
A pair of frame members 22 and 22 arranged to face each other.
The frame member 21 and the frame member 22 are alternately connected to the first
The frame 20 of FIG. The frame member 21 is shown in FIGS.
As shown in FIG. 5 and FIG. 5, the cross section has the above-mentioned step 26.
It is a substantially L-shaped frame member whose plane shape is rectangular.
Yes, in the thickness direction (Z-Z direction in FIG. 5)
A plurality of grooves 23 are formed across.

These grooves 23 are formed by the cutter 95 shown in FIG.
Can be cut by. The cutter 95 has a circle
A plate-shaped diamond blade 96 is provided as shown in FIG.
XX direction, Y-Y direction and figures perpendicular to these directions
In the Z-Z direction of 5, the rotating cutter 95
By moving and scraping the frame member 21, a plurality of (this embodiment
In the example, a case where nine grooves 23 are formed for convenience of understanding will be described.
Although shown, in practice, for example, dozens to hundreds
It is possible to easily form a large number of grooves 23.
Also, cut both ends of the frame member 21 at the positions indicated by the dotted lines 27.
Refuse.

The frame member 22 is similar to the frame member 21 described above.
Manufactured in the same manner as the groove 23 provided in the frame member 21.
The groove 23 is formed. In this embodiment, the frame member 22
The frame member 21 is longer than the frame member 21.
2 has a larger number of grooves 23 than the grooves 23 provided in the frame member 21.
Has been formed. Then, between the frame member 21 and the frame member 22
The ends are alternately bonded to form the first frame 20 shown in FIG.
That is, with the step 26 facing inward, each frame member 2
The first frame 20 and the first frame 20 are formed by alternately bonding 1 and 22.
To do. Each groove 23 of the first frame 20 is
At the position of the bump 91 of the IC chip 90 with which the needle 30 contacts
It has been cut to the correct position.

On the other hand, the second frame 40 has an insulating property.
As shown in FIG. 1, the large opening 24a of the first frame 20
It has openings 41 of approximately the same size,
It is formed like a square frame. Furthermore, the second
The lower surface 42 of the frame 40 of the first frame 20 faces the upper surface 211 of the first frame 20.
It has become a slope. Also, of this second frame 40
The upper surface 43 is a flat surface so that the pressing plate 60 can be placed.
ing.

Next, the probe card according to the present embodiment is
The assembling method will be described. First in the opening 11 of the substrate 10.
After fitting the frame 20 of the first frame 2 to the film 50
It is installed on the step 26 of 0. And the tip of the probe 30
Stick 31 into the film 50. At that time, the tip of the probe 30
The end 31 is located in the groove 23 of the first frame 20.
It Then, the tip 31 of the probe 30 is below the first frame 20.
Make sure that it projects a certain length from the surface. At this time,
A part of the arm portion 33 of the needle 30 is attached to the upper surface 21 of the first frame 20.
Place on top of 1 and fix to the first frame 20 with epoxy resin
To do. Then, the rear end 34 of the probe 30 is soldered 82
Connect to the wiring pattern 81.

Of the first frame 20 to which the probe 30 is attached
The second frame 40 is made of epoxy resin or the like on the upper surface 211.
Stick and fix. And on the film 50, the first
Inside the large opening 24a of the frame 20 and inside the opening 41 of the second frame 40
The synthetic resin 70 in a fluidized state is injected into the. Then press
The pressure plate 60 is closely laminated on the synthetic resin 70, and the pressure plate 6
The periphery of 0 is fixed to the upper surface 43 of the second frame 40.

Instead of providing the film 50,
After the needle 30 is installed as described above, the small opening 2 of the first frame 20
4b and the groove 23, as shown in FIG.
And then the large opening 24a of the first frame 20 and the second opening 24a
Injection of synthetic resin 70 into opening 41 of frame 40 and pressing plate 6
After installing 0, heat to soften and drop paraffin 29.
An assembling method of lowering and removing may be used.

When the film 50 is not provided in this way
Of the peripheral portion 25 of the first frame 20 as shown in FIG.
A groove 28 that intersects with the groove 23 is provided on the upper surface of the probe 30.
Bent in the vicinity 32 of the tip that was bent in the shape of a letter
From the part, the front end 31 side is in the groove 23, and the rear end 34 side is in the groove 28.
It can also be housed inside.

Next, the operation of the probe card according to the present embodiment will be described.
Describe the work. The probe card according to the present embodiment
When installed so as to face the IC chip 90, each probe 3
Since 0 is held in the groove 23 of the first frame 20,
Accurately faces the bump 91 corresponding to each probe 30. So
Then, lower the probe card to the tip of each probe 30.
31 is brought into contact with the bump 91 of the IC chip 90. Change
Lower the probe card, ie overdrive
multiply.

In this case, the bumps 91 of the probe 30 are provided.
The stylus pressure is applied to the stylus pressure of the probe 30 itself by the pressing plate 60.
The elastic force due to the deformation of the pressed synthetic resin 70 is applied.
Then, the predetermined needle pressure is reached, and this needle pressure is applied to all the probe 3
It becomes almost equal through 0. Moreover, the pressing plate 60 is combined
Since it is closely attached to the resin 70, the deformation of the synthetic resin 70
It is within the prescribed range.

The arm portion 33 of each probe 30 is composed of
Being held in the resin 70 and the tip of the probe 30
The vicinity 32 of the end is held in the groove 23 of the first frame 20.
Therefore, each probe 30 is attached to a bump 91 corresponding to the probe 30.
And the probe 30
The mutual position of can be made accurate. And plow
Even when you overdrive Bucard,
Since the mutual positions of the tips 30 are still kept accurate, the tips 3
The tip 31 of 0 slips off the bump 91 and comes off.
There is no

[0030]

As described above, the professional according to the present invention
The probe card has a probe on the electrical input / output section of the semiconductor chip.
A contact point to measure the electrical characteristics of the semiconductor chip.
A robe card that has a predetermined wiring pattern
Board and a stepped hole in this board
And a through hole having a small opening and a step between these openings.
The thickness of this peripheral part should be the same as the peripheral part of the small opening.
In the opposite direction, multiple grooves were formed over the entire length of this thickness.
Insulating first frame and insulation fixed on the first frame
Fixed between the first frame and the second frame, and close to the tip.
Sides the tip is inserted in the groove projects from the lower surface of the first frame
A plurality of probes that have been removed and a second probe so that part of the probe is embedded.
It has elasticity filled in the opening of the frame and in the large opening.
Insulating synthetic resin that is adhered and laminated on this synthetic resin
Of the first frame between the pressure plate and the step and the synthetic resin.
An insulating film disposed so as to close the opening and the groove,
And the groove is an electrical input / output of the semiconductor chip.
And the first and second frames are formed corresponding to the parts.
Are both rectangular, square or annular.

Therefore, this probe card is a semiconductor
When measuring the electrical characteristics of the chip, it is extremely fine with a minute interval.
Although it is a probe card with many probes
Is the elasticity of synthetic resin that is pressed by the pressing plate.
Depending on the force, the electrical input / output of the semiconductor chip is
And all the tips come into contact with almost equal contact pressure.
It Therefore, accurate measurement of electrical characteristics of semiconductor chips is not possible.
It will be possible.

Further , in the synthetic resin and in the groove of the first frame,
Since the tips are inserted and held, half of each tip is
Position of the conductor tip with respect to the electrical input / output section and between the tips
The mutual position of is accurately maintained. In addition, the probe card
Even if overdrive is added to the
Position is kept accurate. Therefore, each probe is
Make accurate contact with the air input / output section and
The tip of the probe slips from the electrical input / output even if you hold the eve.
It has the advantage of never falling. Therefore,
It does not deform due to the tip sliding off.

In this probe card, the first frame
And the second frame are formed in a rectangular shape, a square shape, or an annular shape.
The electrical characteristics of the semiconductor chip to be measured.
It is possible to arrange the probe in correspondence with the layout of the input / output section.
It also has the advantage that it can.

[Brief description of drawings]

FIG. 1 is a sectional explanatory view of an embodiment of the present invention.

FIG. 2 is a plan view of a first frame according to an embodiment of the present invention.

FIG. 3 is a plan view of a frame member that constitutes a first frame of the exemplary embodiment of the present invention.

4 is a sectional view taken along the line AA of FIG.

5 is a sectional view taken along the line BB of FIG.

FIG. 6 is a partial plan view of the first frame of the embodiment of the present invention.

FIG. 7 is a partial perspective view of a modified first frame of the embodiment of the present invention.

FIG. 8 is a cross-sectional explanatory view of a conventional probe card.

[Explanation of symbols]

10 substrate 11 open hole 20 first frame 23 groove 24 through hole 24a large opening 24b small opening 25 peripheral portion 26 step 30 probe 31 tip 32 tip vicinity 33 arm part 40 second frame 41 opening 50 film 60 pressing plate 90 IC chip (semiconductor chip) 91 bump (electrical input / output section)

Front page continuation (72) Inventor Kiyoshi Sugaya 3-1, Nishi-Nagasumotodori, Amagasaki-shi, Hyogo Nihon Electronic Materials Co., Ltd. (56) References JP-A-3-42574 (JP, A) JP-A-1 -265530 (JP, A) JP-A 64-4042 (JP, A) Actual Kaihei 3-90081 (JP, U)

Claims (1)

[Claims] 1. A probe is provided at an electrical input / output portion of a semiconductor chip.
A contact point to measure the electrical characteristics of the semiconductor chip.
A predetermined wiring pattern is formed on the lobe card.
Board and a stepped hole in this board
And a through hole having a small opening and a step between these openings.
The thickness of this peripheral part should be the same as the peripheral part of the small opening.
In the opposite direction, multiple grooves were formed over the entire length of this thickness.
Insulating first frame and insulation fixed on the first frame
Fixed between the first frame and the second frame, and close to the tip.
The side is inserted into the groove and the tip projects from the lower surface of the first frame.
A plurality of probes that have been removed and a second probe so that part of the probe is embedded.
It has elasticity filled in the opening of the frame and in the large opening.
Insulating synthetic resin that is adhered and laminated on this synthetic resin
Of the first frame between the pressure plate and the step and the synthetic resin.
An insulating film disposed so as to close the opening and the groove,
The groove is used for electrical input / output of the semiconductor chip.
Is formed corresponding to the force portion, and the first and second
Features that both frames are rectangular, square or annular
A probe card to collect.