JPH0793205B2 - Cryogenic device - Google Patents
Cryogenic deviceInfo
- Publication number
- JPH0793205B2 JPH0793205B2 JP830186A JP830186A JPH0793205B2 JP H0793205 B2 JPH0793205 B2 JP H0793205B2 JP 830186 A JP830186 A JP 830186A JP 830186 A JP830186 A JP 830186A JP H0793205 B2 JPH0793205 B2 JP H0793205B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- cryogenic
- container
- metal
- plating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C3/00—Vessels not under pressure
- F17C3/02—Vessels not under pressure with provision for thermal insulation
- F17C3/08—Vessels not under pressure with provision for thermal insulation by vacuum spaces, e.g. Dewar flask
- F17C3/085—Cryostats
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C2201/00—Vessel construction, in particular geometry, arrangement or size
- F17C2201/01—Shape
- F17C2201/0104—Shape cylindrical
- F17C2201/0119—Shape cylindrical with flat end-piece
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C2203/00—Vessel construction, in particular walls or details thereof
- F17C2203/06—Materials for walls or layers thereof; Properties or structures of walls or their materials
- F17C2203/0602—Wall structures; Special features thereof
- F17C2203/0612—Wall structures
- F17C2203/0626—Multiple walls
- F17C2203/0629—Two walls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C2203/00—Vessel construction, in particular walls or details thereof
- F17C2203/06—Materials for walls or layers thereof; Properties or structures of walls or their materials
- F17C2203/0634—Materials for walls or layers thereof
- F17C2203/0636—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C2203/00—Vessel construction, in particular walls or details thereof
- F17C2203/06—Materials for walls or layers thereof; Properties or structures of walls or their materials
- F17C2203/0634—Materials for walls or layers thereof
- F17C2203/0636—Metals
- F17C2203/0639—Steels
- F17C2203/0643—Stainless steels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C2203/00—Vessel construction, in particular walls or details thereof
- F17C2203/06—Materials for walls or layers thereof; Properties or structures of walls or their materials
- F17C2203/068—Special properties of materials for vessel walls
- F17C2203/0687—Special properties of materials for vessel walls superconducting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C2223/00—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel
- F17C2223/01—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel characterised by the phase
- F17C2223/0146—Two-phase
- F17C2223/0153—Liquefied gas, e.g. LPG, GPL
- F17C2223/0161—Liquefied gas, e.g. LPG, GPL cryogenic, e.g. LNG, GNL, PLNG
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Containers, Films, And Cooling For Superconductive Devices (AREA)
- Filling Or Discharging Of Gas Storage Vessels (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、例えば超電導マグネツトなどを収納する極
低温装置に関し、特に熱侵入量の低減化に関するもので
ある。Description: TECHNICAL FIELD The present invention relates to a cryogenic device that houses, for example, a superconducting magnet, etc., and more particularly to reduction of the amount of heat penetration.
第５図は例えば特開昭59-72785号公報に示された従来の
極低温装置すなわちクライオスタツトの構成を示す断面
図である。図において、（１）は超電導マグネツト，
（２）は超電導マグネツト（１）を冷却する冷媒すなわ
ち液体ヘリウム、（３）は液体ヘリウム（２）を溜める
低温容器すなわちヘリウム槽、（４）は超電導マグネツ
ト（１）を励消磁するための電流リード、（５）はヘリ
ウム気相部、（６）はヘリウム槽（３）への熱ふく射に
よる熱侵入を低減するための熱ふく射シールド板、（6
a）は熱ふく射シールド板を冷却するために液体窒素を
流すパイプ、（７）は前記各部を収納する真空容器、
（８）は液体ヘリウムの注入及びガスヘリウムの回収管
（8c）と破裂板（8b）を設けた放出管（8a）などからな
る配管群、（９）は遮へい体である。FIG. 5 is a sectional view showing the structure of a conventional cryogenic device, that is, a cryostat disclosed in, for example, Japanese Patent Laid-Open No. 59-72785. In the figure, (1) is a superconducting magnet,
(2) is a refrigerant for cooling the superconducting magnet (1), namely liquid helium, (3) is a cryogenic container for storing liquid helium (2), that is, a helium tank, and (4) is a current for demagnetizing the superconducting magnet (1). A lead, (5) a helium vapor phase part, (6) a thermal radiation shield plate for reducing heat intrusion into the helium tank (3) due to thermal radiation, (6
a) is a pipe for flowing liquid nitrogen to cool the heat radiation shield plate, (7) is a vacuum container for accommodating each of the above parts,
(8) is a pipe group including a liquid helium injection and gas helium recovery pipe (8c) and a discharge pipe (8a) provided with a rupturable plate (8b), and (9) is a shield.
次に、上記構成からなる装置における超電導マグネツト
（１）運転時の熱的状況について説明する。超電導マグ
ネツト（１）運転時のヘリウム槽（３）への熱侵入の原
因は熱伝導、熱伝達、熱ふく射の３つであり、前者では
ヘリウム槽（３）と高温部との接続部を通じて熱が侵入
し、中者では真空容器（７）内残留ガスの対流によつて
熱が侵入し、後者では高温部からヘリウム槽（３）へ電
磁波によつて熱が侵入する。これらに対する熱遮断の方
法として以下のような対策を取ることで、熱侵入量の低
減化が図られている。熱伝導については熱伝導率の低い
材料による配管群（８）と断熱支持（図示されていな
い）、熱伝達については真空容器（７）内を高真空状態
に保持、熱ふく射については熱ふく射シールド板（６）
の設置とヘリウム槽（３）外表面の鏡面仕上げとヘリウ
ム槽（３）内の遮へい体（９）の設置である。前記の如
き方法にて熱遮断を実施した場合にも残る熱侵入として
は、配管群（８）、電流リード（４）、断熱支持からの
熱伝導に因るもの、熱ふく射シールド板（６）からの熱
ふく射に因るものが有る。このうち前者に因る熱侵入を
極力抑えるため通常ヘリウム槽（３）としてステンレス
材が用いられている。Next, the thermal condition during operation of the superconducting magnet (1) in the apparatus configured as described above will be described. There are three causes of heat intrusion into the helium tank (3) during operation of the superconducting magnet (1): heat conduction, heat transfer, and heat radiation. In the former case, heat is transferred through the connection between the helium tank (3) and the high temperature part. In the middle case, heat enters by convection of the residual gas in the vacuum container (7), and in the latter case, heat enters from the high temperature part to the helium tank (3) by electromagnetic waves. The following measures are taken as a method of blocking heat from these, so that the amount of heat intrusion is reduced. For heat conduction, a group of pipes (8) and adiabatic support (not shown) made of a material having low heat conductivity, for heat transfer, the vacuum container (7) is kept in a high vacuum state, and for heat radiation, a heat radiation shield. Board (6)
And the mirror finish of the outer surface of the helium tank (3) and the shield (9) in the helium tank (3). The remaining heat intrusion even when the heat is cut off by the above method is due to the heat conduction from the pipe group (8), the current lead (4), the heat insulating support, and the heat radiation shield plate (6). There is something due to the heat radiation from. Of these, a stainless material is usually used for the helium tank (3) in order to suppress heat invasion due to the former as much as possible.
しかしながら、ヘリウム槽（３）をステンレススチール
で形成した場合、その外表面を鏡面仕上げしても、熱ふ
く射率は銅やアルミニウムなどの電気的良導体に比べか
なり大きな値となつている。これを低く押えるためにヘ
リウム槽（３）を銅やアルミニウムなどの電気的良導体
で形成すると、今度は熱伝導率が大きくなることから熱
伝導による熱侵入が大きくなり、しかもマグネツトの励
消磁時あるいはパルス運転時の渦電流により発熱が大き
くなるといつた問題点があつた。However, when the helium tank (3) is made of stainless steel, the thermal emissivity is considerably larger than that of a good electrical conductor such as copper or aluminum even if the outer surface of the helium tank (3) is mirror-finished. If the helium tank (3) is made of a good electrical conductor such as copper or aluminum in order to keep it low, the thermal conductivity will increase and the heat penetration due to heat conduction will increase. There was a problem when heat generation increased due to eddy current during pulse operation.
本発明は上記のような問題点を解消するためになされた
もので、熱伝導による熱侵入及び渦電流による発熱をほ
とんど増大させることなく熱ふく射による熱侵入の低減
化が可能な極低温装置の提供を目的としている。The present invention has been made in order to solve the above-mentioned problems, and a cryogenic device capable of reducing the heat penetration due to the heat radiation and the heat penetration due to the eddy current with almost no increase in the heat penetration due to the heat conduction. It is intended to be provided.
この発明に係る極低温装置は、冷媒が充填された低温容
器とこの低温容器を収納する真空容器を備え、上記低温
容器は熱的かつ電気的不良導体金属で形成され、しかも
上記低温容器の上記真空容器に対向する面には電気的良
導体金属による複数分割メツキ膜が施されているもので
ある。The cryogenic device according to the present invention comprises a cryogenic container filled with a refrigerant and a vacuum container for accommodating the cryogenic container, wherein the cryogenic container is formed of a thermally and electrically poor conductor metal, and the cryogenic container is The surface facing the vacuum container is provided with a plurality of split plating films made of a metal having good electrical conductivity.
この発明における低温容器は、熱的かつ電気的不良導体
金属で形成され真空容器内に収納されているので熱伝導
および熱伝達による熱侵入が防止され、しかも上記低温
容器の真空容器に対向する面には電気的良導体金属によ
る複数分割メッキ膜が施されているので、熱輻射による
熱侵入を防止できる。また、複数分割メッキされている
ので、渦電流も抑制できる。Since the cryogenic container according to the present invention is formed of a metal having a poor thermal and electrical conductivity and is housed in the vacuum container, heat invasion due to heat conduction and heat transfer is prevented, and the surface of the cryogenic container facing the vacuum container is prevented. Since a multi-division plating film made of a metal having good electrical conductivity is applied to this, heat intrusion due to heat radiation can be prevented. Also, since the plating is performed in a plurality of pieces, eddy current can be suppressed.
第１図はこの発明の一実施例による極低温装置について
第５図の従来例に準じて必要箇所のみを描いた断面図で
ある。図において、（10）は後述の第２及び第３図に示
す構成とし、例えばアルミニウム，銅，金などの電気的
良導体金属によるメツキ膜であり、例えばステンレスス
チールなどの熱的かつ電気的不良導体金属により形成さ
れた低温容器すなわちヘリウム槽（３）における真空容
器（７）に対向する面に施されている。他の符号は第５
図に示す従来例と全く同一であり、この発明の要旨と関
係の薄い箇所は第１図では省略されている。FIG. 1 is a cross-sectional view of a cryogenic device according to an embodiment of the present invention, in which only necessary portions are drawn according to the conventional example of FIG. In the figure, (10) has a structure shown in FIGS. 2 and 3 to be described later, and is a plating film made of a metal having good electrical conductivity, such as aluminum, copper, or gold, and a thermally and electrically defective conductor such as stainless steel. It is applied to the surface of the low temperature container made of metal, that is, the surface of the helium tank (3) facing the vacuum container (7). Other symbols are number 5
The same parts as those of the conventional example shown in the drawing are omitted, and parts which are not related to the gist of the present invention are omitted in FIG.
このように構成した極低温装置において、超電導マグネ
ツト（１）を運転すると、配管群（８）および真空の状
態は従来装置と同様であるからこれらによる熱侵入は従
来装置と同程度に防止できる。熱ふく射に関しては、電
気的良導体金属によるメツキ膜（10）が熱ふく射面とな
ることから、従来装置に比べてかなり熱ふく射率が小さ
くなり、全体として熱侵入量の低減化が図れる。また、
厚さが例えば2mm程度の電気的不良導体金属より成る低
温容器（３）に対して厚さが例えばわずか50μｍ程度の
電気良導体金属によるメツキ膜（10）を施しているの
で、渦電流による発熱に対しても重要な問題となる程の
増大とはならず、多少の増大は有つても熱ふく射率の低
減化による効果の方が大きくなり、結果として熱侵入量
のかなりの低減化が実現できる。When the superconducting magnet (1) is operated in the cryogenic apparatus configured as described above, the pipe group (8) and the vacuum state are the same as those in the conventional apparatus, so that the heat intrusion due to these can be prevented to the same extent as in the conventional apparatus. Regarding heat radiation, since the plating film (10) made of a metal having a good electrical conductivity serves as a heat radiation surface, the heat radiation rate is considerably smaller than that of the conventional apparatus, and the amount of heat penetration can be reduced as a whole. Also,
Since a plating film (10) made of a good electrical conductor metal having a thickness of, for example, only about 50 μm is applied to a cryogenic container (3) made of an electrically poor conductor metal having a thickness of, for example, about 2 mm, heat generated by eddy current is prevented. Even if there is some increase, the effect due to the reduction of the thermal emissivity becomes larger, and as a result, the amount of heat penetration can be considerably reduced. .
第２図及び第３図はこの発明の実施例に係る低温容器の
要部を示すそれぞれ正面図および断面図である。この例
は、メツキ膜（10）を複数領域に分割して施す（第２図
ではメツキ部分を明確のためハツチングにより示してい
る。）ことにより、メツキ膜（10）に発生する渦電流を
低減し、かつそのループを縮小することによつて過度時
の熱ふく射面に発生する熱量を低減できるようにしたも
のである。このように構成した装置において超電導マグ
ネツト（１）を過渡運転する時には、最も大きな代表的
な渦電流は第２図の矢印の方向に流れようとする。とこ
ろが図の如く電気的良導体金属によるメツキ膜（10）が
複数領域に分割して施され、各メツキ部領域の間隔が適
切（母材の厚みやメツキの材質，厚さなど多種の要素に
より左右されるが、例えば母材の厚さ以上の間隔があれ
ば良いと思われる。）に取られていると、電流が矢印の
様に流れることができなくなる。そして、仮りに渦電流
が流れたとしても極めてわずかの電流となるかまたはメ
ツキ部各々に小さなループを作つて流れるようになるか
である。従つて、過渡運転時における渦電流による発熱
が、メッキ膜（10）の非分割時に比べ小さくなり、より
熱負荷の低減化が図れる。2 and 3 are a front view and a sectional view, respectively, showing the essential parts of a cryogenic container according to an embodiment of the present invention. In this example, the plating film (10) is divided into a plurality of regions and applied (in FIG. 2, hatching portions are shown for clarity in FIG. 2) to reduce the eddy current generated in the plating film (10). In addition, the amount of heat generated on the heat radiating surface at the time of transient can be reduced by reducing the loop. When the superconducting magnet (1) is transiently operated in the apparatus thus configured, the largest representative eddy current tends to flow in the direction of the arrow in FIG. However, as shown in the figure, the plating film (10) made of a metal with good electrical conductivity is divided into multiple areas, and the spacing of each plating area is appropriate (depending on various factors such as the thickness of the base material, the material of the plating, and the thickness). However, it is considered that it is sufficient if there is a space equal to or larger than the thickness of the base material.), The current cannot flow as shown by the arrow. Even if an eddy current flows, it becomes an extremely small current, or a small loop is formed in each of the plating parts to flow. Therefore, the heat generated by the eddy current during the transient operation is smaller than that when the plating film (10) is not divided, and the heat load can be further reduced.
なお、メツキ膜（10）の分割の仕方は第２図に示すもの
に限らず、例えば第４図のようにしても同様の効果を奏
する。要するに渦電流をしや断できるような離間幅を有
してメツキ部（10）が細分化されていれば良い。従つ
て、メツキ部（10）が豹のような斑点模様でも、レンガ
の塀のような模様であつても良い。The method of dividing the plating film (10) is not limited to that shown in FIG. 2, and the same effect can be obtained by using, for example, FIG. In short, it suffices that the plating portion (10) be subdivided with a separation width that can cut or cut the eddy current. Therefore, the mating part (10) may have a spotted pattern such as a panther or a pattern such as a brick fence.
ただし、メツキ膜（10）は細かく分割して施す程、渦電
流による発熱は防止できるが、逆に熱ふく射による熱侵
入が大きくなる。However, as the plating film (10) is divided into smaller pieces, heat generation due to eddy current can be prevented, but conversely, heat intrusion due to heat radiation increases.
さらに、何れの実施例においてもメツキ膜（３）は非常
に薄く、母材の凹凸がそのまま現れることが多いので、
低温容器（３）のメツキを施す面は鏡面仕上げとしてお
いた方がより熱シールド効果があると思われる。Furthermore, in any of the examples, the plating film (3) is very thin, and irregularities of the base material often appear as they are.
It is considered that the surface of the low temperature container (3) to be plated has a mirror-finished surface for better heat shielding effect.
以上のように、この発明によれば、冷媒が充填された低
温容器とこの低温容器を収納する真空容器を備え、上記
低温容器は熱的かつ電気的不良導体金属で形成され、し
かも上記低温容器の上記真空容器に対向する面には、複
数領域に分割して電気的良導体金属によるメッキ膜が施
されているので、熱輻射による熱侵入を防止できるとと
もに、渦電流の抑制もできる。As described above, according to the present invention, a cryogenic container filled with a refrigerant and a vacuum container accommodating the cryogenic container are provided, and the cryogenic container is formed of a thermally and electrically poor conductor metal, and the cryogenic container Since the surface facing the above-mentioned vacuum container is divided into a plurality of regions and is provided with a plating film of a metal having good electrical conductivity, it is possible to prevent heat invasion due to heat radiation and also suppress eddy currents.
第１図はこの発明の一実施例による極低温装置の要部を
示す断面図、第２図は低温容器の要部を示す正面図、第
３図は第２図の要部を示す断面図、第４図はこの発明の
他の実施例に係る低温容器を模式的に示す正面図、第５
図は従来の極低温容器を示す断面図である。 図において、（１）は超電導マグネツト、（２）は冷
媒、（３）は低温容器、（６）は熱ふく射シールド板、
（７）は真空容器、（10）はメツキ膜である。 なお、各図中同一符号は同一または相当部分を示すもの
とする。FIG. 1 is a sectional view showing an essential part of a cryogenic device according to an embodiment of the present invention, FIG. 2 is a front view showing an essential part of a cryogenic container, and FIG. 3 is a sectional view showing an essential part of FIG. FIG. 4 is a front view schematically showing a cryogenic container according to another embodiment of the present invention, FIG.
The figure is a cross-sectional view showing a conventional cryogenic container. In the figure, (1) is a superconducting magnet, (2) is a refrigerant, (3) is a cryogenic container, (6) is a thermal radiation shield plate,
(7) is a vacuum container, and (10) is a plating film. In the drawings, the same reference numerals indicate the same or corresponding parts.
フロントページの続き (72)発明者 中川 徹太郎 兵庫県尼崎市塚口本町８丁目１番１号 三 菱電機株式会社伊丹製作所内 (72)発明者 藤本 泰司 兵庫県尼崎市塚口本町８丁目１番１号 三 菱電機株式会社伊丹製作所内 (56)参考文献 特開 昭48−43289（ＪＰ，Ａ) 特開 昭50−65187（ＪＰ，Ａ) 特開 昭57−190374（ＪＰ，Ａ) 特開 昭61−145879（ＪＰ，Ａ) 実開 昭61−49465（ＪＰ，Ｕ)Front page continuation (72) Inventor Tetsutaro Nakagawa 8-1-1 Tsukaguchihonmachi, Amagasaki, Hyogo Sanbishi Electric Co., Ltd. Itami Works (72) Inventor Taiji Fujimoto 8-1-1 Tsukaguchihonmachi, Amagasaki, Hyogo Sanryo Electric Co., Ltd. Itami Works (56) Reference JP-A-48-43289 (JP, A) JP-A-50-65187 (JP, A) JP-A-57-190374 (JP, A) JP-A-61 -145879 (JP, A) Actually open Sho 61-49465 (JP, U)
Claims (3)
収納する極低温装置において、上記低温容器は熱的かつ
電気的不良導体金属で形成され、上記真空容器に対向す
る面に電気的良導体金属によるメッキを複数領域に分割
して施したことを特徴とする極低温装置。1. A cryogenic apparatus for accommodating a cryogenic container filled with a refrigerant in a vacuum container, wherein the cryogenic container is formed of a thermally and electrically inferior conductive metal and has an electric surface opposite to the vacuum container. A cryogenic device characterized in that it is plated with a good conductor metal in a plurality of areas.
レス鋼を用いたことを特徴とする特許請求の範囲第１項
記載の極低温装置。2. The cryogenic apparatus according to claim 1, wherein stainless steel is used as the thermally and electrically defective conductor metal.
銅、銀、および金のうちの何れか一種を用いたことを特
徴とする特許請求の範囲第１項ないし第２項の何れかに
記載の極低温装置。3. An electrically conductive metal such as aluminum,
The cryogenic apparatus according to any one of claims 1 and 2, wherein any one of copper, silver, and gold is used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP830186A JPH0793205B2 (en) | 1986-01-17 | 1986-01-17 | Cryogenic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP830186A JPH0793205B2 (en) | 1986-01-17 | 1986-01-17 | Cryogenic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62165901A JPS62165901A (en) | 1987-07-22 |
| JPH0793205B2 true JPH0793205B2 (en) | 1995-10-09 |
Family
ID=11689325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP830186A Expired - Lifetime JPH0793205B2 (en) | 1986-01-17 | 1986-01-17 | Cryogenic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0793205B2 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4926647A (en) * | 1989-04-10 | 1990-05-22 | General Electric Company | Cryogenic precooler and cryocooler cold head interface receptacle |
| JP2816256B2 (en) * | 1991-03-25 | 1998-10-27 | 株式会社日立製作所 | Coil body |
| US5387889A (en) * | 1991-03-29 | 1995-02-07 | Kabushiki Kaisha Toshiba | Superconducting magnet apparatus |
| JP2539121B2 (en) * | 1991-09-19 | 1996-10-02 | 株式会社日立製作所 | Superconducting magnet |
| US5448213A (en) * | 1993-09-16 | 1995-09-05 | Northrup Grumman Corporation | Electromagnetic shielding concept for superconducting levitating magnets |
| US7852079B2 (en) * | 2006-08-01 | 2010-12-14 | General Electric Company | Apparatus for low AC loss thermal shielding and method of making same |
| JP4790000B2 (en) | 2008-12-17 | 2011-10-12 | アイシン精機株式会社 | Vacuum container for superconducting device and superconducting device |
| EP3497705B1 (en) * | 2016-08-15 | 2020-03-25 | Koninklijke Philips N.V. | Magnet system with thermal radiation screen |
| JP2023131881A (en) * | 2022-03-10 | 2023-09-22 | 株式会社東芝 | Superconducting magnet device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57190374A (en) * | 1981-05-20 | 1982-11-22 | Toshiba Corp | Cryovessel |
| JPS60128680A (en) * | 1983-12-16 | 1985-07-09 | Mitsubishi Electric Corp | Cryostat |
-
1986
- 1986-01-17 JP JP830186A patent/JPH0793205B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62165901A (en) | 1987-07-22 |
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