JPH0793248B2 - Method and apparatus for applying conductive paste to electronic parts - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for applying a conductive paste of an electronic component for uniformly applying the conductive paste into the through holes of the base of the electronic component.

[0002]

2. Description of the Related Art Conventionally, when a dielectric filter is manufactured by a dielectric ceramic, for example, a conductive film is formed on the inner wall of a through hole formed in a dielectric filter substrate to form a necessary electrode. There is. Then, as a method for forming the electrode film in the through hole, for example, a method of applying a conductive paste to the inner wall surface of the through hole using a brush or the like, or, for example, JP-A-3-117902
As disclosed in Japanese Patent Laid-Open Publication No. 2004-242242, a method of injecting a conductive paste into one opening end of the through hole of the dielectric ceramic, and then sucking the conductive paste from the other opening end of the through hole with a vacuum pump. And so on.

[0003]

However, in the former method of applying the conductive paste to the inner peripheral surface of the through hole using a brush or the like, it is difficult to uniformly apply the conductive paste to the entire inner peripheral surface. Some of them are cut off or faded. In order to prevent these troubles, for example, a conductive paste is applied multiple times, but this increases the number of steps and productivity is poor, and the film thickness of the formed electrode becomes uneven, There is a problem that the yield of products is low.

In the latter method, in which the conductive paste is injected into one opening end of the through hole and then the conductive paste is sucked from the other opening end of the through hole by a vacuum pump, the former conductive film Problems such as breaks and fading can be solved. However, during suction, pulsation occurs in the air flow near the opening end of the through hole on the side where the conductive paste is injected, so the surface of the conductive paste applied by suction becomes wavy, and the film thickness of the formed electrode There was a problem that was not uniform.

In view of the above-mentioned problems in the prior art, the present invention can apply the conductive paste with a uniform film thickness to the inner peripheral surface of the through hole formed in the circuit component substrate such as the dielectric ceramic. It is an object of the present invention to provide a conductive paste applying method for electronic parts and a device therefor.

[0006]

That is, according to the present invention, in order to achieve the above-mentioned object, a conductive paste is injected in the vicinity of one opening end of a through hole of an electronic component base, and this conductive paste is used as described above. Suction from the other open end of the through hole,
In the method of applying a conductive paste to the inner peripheral surface of the through hole, at the time of the suction, a through hole having the same diameter of the guide guide is connected to the one opening end side of the through hole of the base material,
There is proposed a method for applying a conductive paste for an electronic component, characterized in that a core rod having a diameter smaller than the diameter of the through hole is inserted into the through hole of the base material.

Further, as means for carrying out the above method, a holding means for holding the electronic component base material, a conductive paste injecting means for injecting a conductive paste near one opening end of the through hole of the base material, and the holding means. Means for sucking air from the other opening end side of the through hole, and when sucking by the suction means, the same diameter is applied to the one opening end side of the through hole of the base material. An electrically conductive paste coating device for electronic parts, comprising: a guide guide attached to the base material so that the through holes are continuous, and a core rod inserted into the through hole of the base material and having a diameter smaller than the through hole. Is proposed.

[0008]

According to the above-described method and apparatus for applying a conductive paste to an electronic component according to the present invention, the conductive paste is injected into one opening end of the through hole formed in the base of the electronic component, and the conductive paste is penetrated into the through hole. When sucking from the other opening end side of the hole and applying it to the inner wall of the through hole, the through hole of the guide guide is continuous with the through hole of the base material, so that the through hole of the guide guide is substantially the air inlet. As a result, eddy currents and wave currents generated in the vicinity of the open ends of the through holes of the base material are eliminated. Furthermore, by inserting the core rod into the through hole, the cross-sectional area of the air passage is adjusted, the generation of turbulence is controlled, and wavy turbulence does not occur on the surface of the applied conductive paste.
Therefore, it becomes possible to apply the conductive paste to the inner wall surface of the through hole with a uniform film thickness.

[0009]

Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 3 shows an outline of a conductive paste applying apparatus for electronic parts according to an embodiment of the present invention. For example, a dielectric filter substrate 1 in which a dielectric ceramic or the like is formed in a predetermined shape is inserted into a recess 3 formed in a central portion of the upper surface of a holding portion 2 having a substantially socket-like appearance. As shown in FIGS. 4 (a) and 4 (b), this dielectric filter substrate 1 is formed into a prismatic shape or a columnar shape having an elliptical cross section, and two through holes 4 and 4 are formed in the center of the cross section. Electrodes are formed on the inner peripheral surfaces of these two through holes 4 and 4. The diameter of these through holes 4 and 4 is, for example, 5
It is about mmφ.

On the other hand, as shown in the sectional view of FIG. 1, in the holding portion 2, the concave portion 3 and the vacuum chamber 5 therebelow are partitioned by a partition wall 6. The partition wall 6 is provided with suction holes 7 and 7 at positions corresponding to the two through holes 4 and 4 formed in the dielectric filter substrate 1. A vacuum introducing hole 8 is formed in a part of the wall surface of the vacuum chamber 5, and the vacuum introducing hole 8 is connected to a vacuum pump (VP) 10 via, for example, a piping tube 9. A valve 11 for opening and closing is provided between the vacuum introduction hole 8 and the vacuum pump (VP) 10.

Further, a conductive paste dispenser needle 12 formed in a bifurcated shape is disposed above the holding portion 2. This dispenser needle 12
A certain amount of conductive paste is poured out from the tip. In addition, reference numeral 13 in the drawing denotes a conductive paste accumulated on the bottom of the vacuum chamber 5.

Further, the device is provided with a core rod 14 and a guide guide 17. The core rod 14 is shown in FIG.
As shown in FIG. 2 (a), for example, a rod-shaped metal member is formed into a bifurcated shape, and the diameter of the tip of the bifurcation is larger than the inner diameters of the through holes 4 and 4 of the dielectric filter substrate 1. Is also set to be thin. On the other hand, the guide 17
It is a plate having the same shape as the upper surface of the dielectric filter substrate 1. Further, through holes 18, 18 having the same diameter are formed in the guide guide 17 at positions corresponding to the through holes 4, 4 of the dielectric filter substrate 1.

Next, a conductive paste coating method using the above-described electronic component conductive paste coating apparatus will be described with reference to FIGS. 1 and 2. First, the dielectric filter substrate 1 to which the conductive paste is to be applied is inserted into the through holes 4 and 4 in the recess 3 of the holding portion 2. As shown in FIG. 1A, the dispenser needle 12 is moved onto the surface of the dielectric filter substrate 1, and the through holes 4 and 4 are formed.
The tip of the needle 12 is arranged directly above the nozzle, and a certain amount of the conductive paste 15, 15 is injected from the tip near the upper open end of the through holes 4, 4. After that, as shown in FIG. 1B, a guide guide 17 is arranged on the dielectric filter substrate 1, and the through holes 18, 18 are connected to the upper end openings of the through holes 4, 4 of the substrate 1. And then the core rod 1
The tip of 4 is inserted into the through holes 4 and 4. Then, the opening / closing valve 11 is opened for a certain time to open the through hole 4,
Air is sucked by the vacuum pump 10 from the other (lower) opening end of No. 4. Due to this suction action, as shown in FIG. 1B, air flows in the through holes 4 and 4 in the direction indicated by the arrow, and along with this, the opening end portions above the through holes 4 and 4 are formed. The conductive pastes 15, 15 injected into the vicinity are sucked into the through holes 4, 4 and applied to the inner peripheral wall surface thereof.

At this time, as shown in FIG.
By inserting the core rod 14, the flow of air in the through holes 4 and 4 is controlled so as not to be disturbed. Also, guide guide 17
By aligning the through holes 18, 18 of the guide holes 17 with the upper open ends of the through holes 4, 4, the upper end openings of the through holes 18, 18 of the guide guide 17 substantially become the air inlet, and The turbulence of the air flow, that is, a vortex or a wave flow is generated in the vicinity, but the upper end openings of the through holes 4 and 4 of the dielectric filter substrate 1 are substantially behind the air inlet, and the vortex and the wave are generated. Not affected by the flow. Therefore, it becomes possible to apply the conductive pastes 15, 15 to the inner peripheral surfaces of the through holes 4, 4 with a uniform film thickness.

On the other hand, according to the above-mentioned conventional technique, as shown in FIG. 2B, due to the influence of the vortex or the wave flow generated near the upper ends of the through holes 4 and 4 of the dielectric filter substrate 1, Conductive paste 1 applied to inner wall surfaces of through holes 4 and 4
The surfaces of 5'and 15 'become wavy and the film thickness becomes non-uniform.

Further, according to the present invention, in place of the rod-shaped core rod 14 described above, various cross-sections as shown in FIG. 5, or
Even if a core rod having a side surface shape (for example, one in which a groove or the like is formed) is used, it is possible to exhibit the same effect as or more than the above. Further, the diameter of the core rod 14 can be changed corresponding to the diameters of the through holes 4 and 4, so that the cross-sectional area through which air flows can be made constant. As a result, the flow velocity of the air flowing through the through holes 4 and 4 can be made constant regardless of the diameters of the through holes 4 and 4, and the conductive paste can always be applied with a uniform film thickness.

[0017]

As is apparent from the above description, according to the method and apparatus for applying a conductive paste for an electronic component of the present invention, the penetration formed in the base material of the electronic component can be achieved by adding a relatively simple device. The conductive paste can be stably applied to the inner peripheral surface of the hole with a uniform film thickness. As a result, the quality of the manufactured electronic component is improved, and the work is simple and suitable for automation, which can contribute to the improvement of the productivity of the electronic component.

[Brief description of drawings]

FIG. 1 is an operation explanatory view for explaining a method for applying a conductive paste of an electronic component of the present invention.

FIG. 2 is an enlarged explanatory diagram for explaining the details of the above operation.

FIG. 3 is a conceptual diagram illustrating a schematic structure of a conductive paste coating device for electronic components of the present invention.

FIG. 4 is a perspective view showing an external appearance of an electronic component substrate in which a conductive paste is applied to the through holes by the applying method.

FIG. 5 is a diagram including a partial cross section for showing another modification of the core rod used in the present invention.

[Explanation of symbols]

 1 Dielectric Filter Base 2 Holding Part 3 Recess 4 Through Hole 10 Vacuum Pump 12 Dispenser Needle 14 Core Bar 17 Guide Guide 18 Through Hole

Claims (2)

[Reference number] 0030289-01 [Claims] 1. A conductive paste is injected into the vicinity of one opening end of a through hole of an electronic component substrate, the conductive paste is sucked from the other opening end of the through hole, and is applied to an inner peripheral surface of the through hole. In the method of applying a conductive paste, at the time of suction, a through hole having the same diameter of a guide guide is connected to the one opening end side of the through hole of the base material, and the through hole is formed in the through hole of the base material. A method of applying a conductive paste for an electronic component, characterized in that a core rod having a diameter smaller than the diameter of is inserted. 2. A holding means for holding the electronic component base, a conductive paste injecting means for injecting a conductive paste near one opening end of the through hole of the base, and a holding means connected to the holding means. Vacuum suction means for sucking air from the other opening end side, and at the time of suctioning by the suction means, a through hole of the same diameter is attached to the base material so that a through hole having the same diameter is connected to the one opening end side. An electroconductive paste applying apparatus for electronic parts, comprising: a guide and a core rod inserted into the through hole of the base material and having a diameter smaller than the through hole.