JPH0793286B2 - Spray processing device - Google Patents

Description

TECHNICAL FIELD The present invention relates to chemical treatment of a semiconductor substrate (semiconductor wafer: hereinafter referred to as a wafer) used in a semiconductor device manufacturing process, and is particularly used for peeling and cleaning. The present invention relates to a semiconductor substrate processing apparatus.

[Conventional technology]

Conventionally, this type of spraying type processing apparatus has been a method of spraying a processing liquid in a sprayed state while rotating a processed material for processing.

Hereinafter, a conventional technique will be described with reference to the drawings.

FIG. 8 is a side view of a conventional processing apparatus. A cassette 18 containing a plurality of wafers is set in a rotor 17 provided in a hermetically sealed bowl 16, and a chemical solution filtered from a spray post 19 provided in the bowl 16 is sprayed while rotating the rotor 17. It was something to spray.
For example, Japanese Patent Publication No. 61-42352 is a prior art bowl patent, and Japanese Patent Publication No. 61-21756 is a spray post patent.

[Problems to be Solved by the Invention]

Since the above-mentioned conventional spraying type processing apparatus processes while rotating the carrier containing the wafer, a mechanism for rotating the carrier is required.

Therefore, there are drawbacks such that dust generation from the rotating part cannot be avoided, the operating rate is lowered due to a failure of the rotating mechanism part having a high wafer damage rate, and maintenance is required.

The present invention solves the above-mentioned problems and improves yield in IC manufacturing and productivity. That is, the object of the present invention is to process the wafer without rotating it, thereby improving the IC manufacturing yield by eliminating the damage and dust generation of the wafer, and reducing the decrease in operating rate due to the failure of the device due to the elimination of rotation, and maintenance. An object of the present invention is to provide a spray-type processing apparatus that can realize cost reduction due to cost reduction and man-hour reduction.

[Means for Solving the Problems]

The spray-type processing apparatus of the present invention holds a sealed chamber and a plurality of parallel wafers in the chamber, and treats all the wafers to an angle such that the upper end of a certain wafer and the lower end of the adjacent wafer do not overlap in the vertical direction. The guide line that tilts in one direction and the center line of the atomizing port of the atomizer that sprays the chemical liquid are aligned, and are orthogonal to the line that connects the points that are equidistant in the circumferential direction from the upper edge of the plurality of wafers and that are aligned. It has an atomizer arranged at a position orthogonal to the line connecting the center points of the wafer surfaces, an exhaust hole for exhausting and draining the inside of the chamber so as not to disturb the spray state, and a means for supplying a chemical solution to the atomizer. .

Further, the spray-type processing apparatus of the present invention is an atomizer arranged so that the processing liquid is atomized and can be uniformly irradiated to the processed material, and a storage liquid having a function of storing the processing liquid and controlling the liquid temperature. A tank, a function of filtering and supplying the processing liquid in the liquid storage tank to the atomizer, a processing tank which is a closed type and does not find a spray state created by the atomizer, and has an outlet, It has a mist separator that is connected to the discharge port and separates the chemical liquid and air and discharges each, and a guide that is placed in the processing tank to fix the processed products, and processes multiple processed products at the same time and processes during processing. It is composed of things that do not move.

〔Example〕

 Next, the present invention will be described with reference to the drawings.

FIG. 1 is a block diagram of the first embodiment of the present invention. The chemical liquid supply valve 1 supplies the chemical liquid to the mixing tank 2, the filter 3 removes dust of the chemical liquid supplied to the mixing tank 2, and the temperature controller 4 controls the temperature of the chemical liquid in the mixing tank 2. Is to keep the value set to an arbitrary value.

The supply pump 5 is capable of supplying the chemical liquid in the blending tank 2 to the atomizer 6 and outputting the discharge pressure and the discharge flow rate necessary for spraying, and the final filter 7 completes the chemical liquid supplied to the atomizer 6. The atomizer 6 is for uniformly spraying and irradiating the wafer 9 housed in the cassette 8 with the chemical solution.

The chamber 10 is sealed with a lid 11 and a lead seal 12 so that the atomized chemical liquid does not leak to the outside, and has a discharge port 13 for discharging the atmosphere in the chamber 10.

The cassette guide 14 is used for positioning and fixing the cassette 8 when the cassette 8 is placed in the chamber 10, and the cassette 8 is inclined so as to be inclined in a direction perpendicular to the surface of the wafer 9.

Next, FIGS. 2 and 3 are views showing only the positional relationship between the wafer 9 and the atomizer 6, respectively.
2 is a view of the surface of FIG. 2 from the front and a partial view of the surface from the side.

In these figures, the cassette 8 is omitted in order to clarify the positional relationship between the atomizer 6 and the wafer 9. The atomizer 6 can cover a range of the diameter of the wafer 9 or more and the width of the cassette 8 or more in the diameter direction of the wafer 9. Use a spray pattern,
In the thickness direction of the wafer 9, a range of one or more wafers can be covered. In FIG. 3, three wafers 9a, 9b,
The case of covering 9c was fried as an example. Wafer here
Make sure that the upper edge of 9a and the lower edge of wafer 9b, and the upper edge of wafer 9b and the lower edge of wafer 9c do not overlap in the vertical direction.
In order to tilt all of a, 9b, 9c in the same direction and at the same angle,
The cassette guide 14 is tilted. This tilt angle is the third
Denote by θ in the figure, for example, when the wafer is 4 inches and the wafer pitch is 3/16 inches, And θ becomes about 2.69 °.

FIG. 4 is a view showing a state in which the liquid is sprayed in FIG. 1, in which the cassette 8 and the cassette guide 14 are omitted to clarify the relationship between the sprayed state and the wafer.

Next, the operation will be described. By opening the chemical liquid valve 1, a plurality of filtered chemical liquids are supplied to the mixing tank 2. The chemical solution whose temperature has been adjusted in the mixing tank 2 passes through the final filter 7 by the supply pump 5 and the atomizer 6
Be atomized. The atomized chemical solution efficiently contacts the surface of the wafer 9 to be processed, thereby performing the processing.

FIG. 5 is a sectional view of the processing portion of the second embodiment of the present invention.

The wafer holder 15 has a groove having an angle such that the upper end of an arbitrary wafer 9 and the lower end of the adjacent wafer do not overlap each other in the vertical direction, and the wafer 9 is prevented from inclining any more and the downward direction. It is intended to be held so that it does not fall into the. In this embodiment, since the cassette is not used, there is no blind spot of the wafer due to the cassette, which is considered in the first embodiment, and there is an advantage that the area of the blind spot can be minimized.

FIG. 6 is a block diagram showing the third embodiment.

6, the chemical liquid supply valve 31 supplies the chemical liquid to the constant temperature liquid storage tank 32, and the filter 3 reduces the amount of dust of the chemical liquid supplied to the constant temperature liquid storage tank 32. The container 34 is for keeping the temperature of the chemical liquid in the constant temperature liquid storage tank 32 at a set value. The supply pump 35 is for supplying the chemical solution in the constant temperature storage tank 32 to the ultrasonic atomizer 36, and the final filter 37 is the ultrasonic atomizer 36.
The chemical solution supplied to the device is made 100% filtered, and the final filter 37 is an ultrasonic atomizer.
The numeral 36 is for uniformly irradiating the wafer 38 with the chemical liquid in a spray state without waste. The processing tank 39 has a closed structure for spraying the wafer 38, and has a discharge port 40 for discharging the atmosphere in the tank. Mist separator
Reference numeral 41 is for separating the atmosphere discharged from the discharge port 40 into a chemical liquid and air, and has an exhaust port 42 and an exhaust port 43. The guide 44 fixes the wafer 38.

Next, the basic operation will be described. The chemical liquid filtered by the filter 33 and the final filter and controlled by the temperature controller 34 is uniformly atomized by the ultrasonic atomizer 36 without waste and used for the treatment of the wafer 38. Then, the sprayed chemical liquid after the treatment is separated into a chemical liquid and air by the mist separator 41 and discharged.

FIG. 7 is a structural diagram for explaining a fourth embodiment of the present invention. The air supply valve 45 supplies air to the aspirator 46, and the aspirator 46 sucks up the chemical solution in the constant temperature liquid storage tank 32 to the nozzle 47 according to the flow velocity of air. Nozzle 47 is
It is atomized according to the flow rate of the chemical liquid mixture.

This embodiment has an advantage that there is no dust generating element at the point of use because the atomizer has no sliding portion.

〔The invention's effect〕

As described above, the present invention, with respect to the atomizer spraying the chemical liquid, there is no blind spot on the surface of the wafer to be processed, a plurality of wafers can be processed uniformly, and the effect of the surface that is not desired to be processed is eliminated. There is an effect that can be. Furthermore, since the wafer and cassette are not moved during processing, there is no possibility of dust generation and failure.

Further, according to the present invention, the processing liquid is finely sprayed by a spraying device such as an ultrasonic atomizer and uniformly irradiated onto the wafer surface, so that the wafer can be processed in a stationary state. Therefore, the damage due to the rotation of the wafer can be eliminated, and since the dust-generating portion is eliminated, the yield in the IC manufacturing is improved.

As described above, since the present invention does not have a rotating mechanism, it also has an effect of reducing the occurrence of a reduction in the operating rate due to a failure, and achieving a reduction in maintenance costs and man-hours.

[Brief description of drawings]

FIG. 1 is a block diagram of a first embodiment of the present invention, FIGS. 2 and 3 are partial views of a side view and a front view showing a positional relationship between an atomizer and a wafer, and FIG. It is a figure which shows the state which sprayed the liquid in the figure. FIG. 5 is a sectional view showing only the processing section of the second embodiment of the present invention. FIG. 6 is a block diagram showing a third embodiment of the present invention. FIG. 7 is a block diagram showing the fourth embodiment of the present invention. FIG. 8 is a side view showing an example of a conventional processing apparatus. In the figure, 1 ... Chemical supply valve, 2 ... Mixing tank, 3 ... Filter, 4 ... Temperature controller, 5 ... Supply pump, 6 ... Atomizer, 7 ... Final filter, 8,18 ...... Cassette, 9,9a, 9b, 9c …… Wafer, 10 …… Chamber, 11…
… Lid, 12 …… Lid seal, 13 …… Ejection port, 14 …… Cassette guide, 15 …… Wafer holder, 16 …… Bowl,
17 …… rotor, 19 …… spray post, 31 …… chemical supply valve, 32 …… constant temperature storage tank, 33 …… filter, 34…
… Temperature controller, 35… Pump, 36… Ultrasonic atomizer,
37 …… Final filter, 38 …… Wafer, 39 ……
Treatment tank, 40 ... Ejection port, 41 ... Mist separator, 42 ...
… Exhaust port, 43 …… Drainage port, 44 …… Guide, 45 …… Air supply valve, 46 …… Asprayer, 47 …… Nozzle.

Claims (4)

[Claims] 1. A spray-type processing apparatus in which a semiconductor wafer is stationary during processing and a plurality of semiconductor wafers arranged in parallel are simultaneously processed, and an upper end portion of a semiconductor wafer and a lower end portion of a semiconductor wafer adjacent to the semiconductor wafer. Tilt the semiconductor wafer in one direction so that they do not overlap in the vertical direction, intersect with the line connecting the upper ends of the plurality of semiconductor wafers with the center line of the atomizing port of the atomizer that sprays the processing liquid aligned, and in the vertical direction. The spray-type processing device is arranged at a position that 2. A spray-type processing apparatus in which a semiconductor wafer is stationary during processing and a plurality of semiconductor wafers are arranged in parallel at the same time, and the upper end of a semiconductor wafer and the lower end of a semiconductor wafer adjacent to the semiconductor wafer are processed. The semiconductor wafers are tilted in one direction so that they do not overlap in the vertical direction, and the center line of the atomizing port of the atomizer is located at the same distance in the same direction on the circumference from the upper ends of the aligned semiconductor wafers. A spray-type processing apparatus, characterized in that the atomizer is arranged so as to intersect a line connecting the centers of a plurality of aligned semiconductor wafers at right angles to the connecting line. 3. The spray-type processing apparatus according to claim 1, wherein the atomizer is plural. 4. An atomizer in which the treatment liquid is atomized and arranged so that the treatment product can be uniformly irradiated, a storage tank having the function of storing the treatment liquid and controlling the liquid temperature, and the storage tank. A function of filtering and supplying a processing liquid in a liquid tank to the atomizer, a processing tank which is a sealed type and does not find a spray state made by the atomizer, and has a discharge port,
A mist separator that is connected to the discharge port to separate the chemical liquid and air and discharges each, and a mist separator that is disposed in the processing tank and has a guide that fixes the processed product, and simultaneously processes a plurality of processed products,
In addition, the spray-type processing apparatus is characterized in that the processed material does not move during processing.