JPH0794127B2 - Automatic division method of ceramic substrate - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for automatically dividing a ceramic substrate.

[0002]

2. Description of the Related Art On a ceramic substrate, a large number of individual pieces having a final shape are continuously provided longitudinally and laterally on one rectangular substrate through dividing lines, and a circuit pattern is printed on each individual piece. Then, a chip component such as an IC, a diode, and a capacitor is mounted on each individual piece to divide the rectangular ceramic substrate into strips, and then the strips are divided into final individual pieces.

Conventionally, in the case of dividing a ceramic substrate, a series of these dividing operations are almost inefficient because they rely on manual work, and in addition, the hand fingers of an operator mount the chip parts for the manual work. Since it touches the ceramic substrate, there is a problem in maintaining the quality and reliability of the ceramic substrate.

As a solution to this problem, the present applicant has previously
We have applied for "Ceramic substrate division method" in Japanese Patent Application No. 2-47204. This invention aligns the dividing line position of the ceramic substrate with the fulcrum pin provided on the dividing rotor, applies a force in the swing direction to the edge of the ceramic substrate with the dividing pin, and separates it from the dividing line of the ceramic substrate to divide it into a plurality of ceramic substrates. However, since the shock to the ceramic substrate cannot be completely absorbed, burr may occur on the edge of the ceramic substrate depending on the conditions such as the thickness and division size of the ceramic substrate. is there.

[0005]

SUMMARY OF THE INVENTION The present invention relates to a method for solving such a problem, and more specifically, it automatically divides a ceramic substrate vertically and horizontally along a dividing line and ejects a dummy module. A method for automatically dividing a ceramic substrate for feeding a substrate, which is capable of improving the division accuracy, quality stability, and productivity regardless of the thickness condition of the ceramic substrate.

[0006]

According to the present invention, there is provided a master side conveyance guide on which a ceramic substrate is placed, and a pusher for pushing and conveying the ceramic substrate placed on the master side conveyance guide until it abuts against a stopper. When the pushing of the pusher is completed, the pusher closes and holds the ceramic substrate, and while holding the ceramic substrate, it swings at the same angle around the dividing line to promote the division of the ceramic substrate and divide it. The chuck on the master side that opens and returns by the amount of the shaken moment, and the split momentarily separated from the dividing line, moves forward while returning the angle of the shaken movement, and the conveyance guide on the module side in the subsequent process. And a module side chuck that opens and operates by placing the divided ceramic substrate on it, and adjusts the dividing position of the ceramic substrate by the stopper, and And gripping Mick substrate edge, by applying a force of the swing direction in said ceramic substrate, and a means to enable automatic division of the ceramic substrate. Further, the present invention is
For each chuck on the master side and module side, the holding recess of the ceramic substrate is formed with an elastic resin body, and the impact during division is absorbed by the elastic resin body of the chuck, reducing the occurrence of burrs regardless of the conditions of the ceramic substrate. Was taken as a means to

[0007]

According to the embodiment of the present invention, the ceramic substrate 2 placed on the master side conveyance guide 1 is pushed by the pusher 4 until it abuts on the stopper 3. In FIG. 1, the arrow direction indicates the pushing direction of the pusher.

At this time, the master-side chuck 4 and the module-side chuck 5 are on standby in the open state. When the pushing operation of the pusher is completed, the master-side chuck 4 and the module-side chuck 5 are closed, the ceramic substrate 2 is gripped, and the stopper 3 escapes upward.
(See Figure 1.)

Next, the master-side chuck 4 and the module-side chuck 5 holding the ceramic substrate 2 have the same angle about the dividing line A of the ceramic substrate 2 so that the force is concentrated on the dividing line A of the ceramic substrate 2. (5 ° in the case of the embodiment of the present invention) swinging movement (in the direction of arrow a and the arrow b of FIG. 3)
Direction), the ceramic substrate 2 is gripped and divided. At this time, the master side conveyance guide 1 also swings at the same time (direction of arrow c in FIG. 3), and further, one master side chuck 4
Returns by the amount of the shake (arrow stop a'direction in FIG. 4), opens the chuck 4, and the other module-side chuck 5 returns the shake amount and returns the arrow stop b'in FIG.
In the subsequent step, the module substrate 8 is placed on the module-side conveyance guide 7 in the subsequent step, the chuck 5 is opened, and the ceramic substrate 2 is returned to the set position, that is, the state of FIG. During the above dividing operation, the ceramic substrate 2 is held by the elastic resin bodies of the master-side chuck 4 and the module-side chuck 5, so that the impact at the time of division is absorbed by the elastic resin body. Therefore, according to the present invention, burrs are reduced regardless of the condition of the ceramic substrate.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. 1, FIG. 2, FIG. 3 and FIG. 4 are perspective views showing the outline of the operation of the main part mechanism of the ceramic substrate automatic dividing apparatus for carrying out the ceramic substrate automatic dividing method of the present invention.

In the figure, 1 is a master side conveyance guide and 2
Is a ceramic substrate placed on the master side conveyance guide, 3 is a stopper, 4 is a master side chuck, 5 is a module side chuck, and the substrate holding recesses 6 of both chucks 4 and 5 are shown.
Is formed of an elastic resin body. In the figure, reference numeral 7 denotes a module-side transport guide, and A denotes a dividing line of the ceramic substrate. Further, in FIG. 1, the arrow stopping direction indicates the pushing direction of the pusher.

[0012]

Industrial Applicability The present invention is an automatic dividing method for a ceramic substrate in which the position of the scribe is aligned with a stopper, the edge of the ceramic substrate is gripped by a chuck, and a force in the swing direction is applied to the ceramic substrate to divide it. Since the dividing work is performed by each of the gripping, dividing, and separating operations described above, as a result, the dividing precision (burr precision) of the ceramic substrate is remarkably improved, and the manufacturing process of individual pieces of high-quality ceramic substrate is performed. Will be more efficient and productivity will be improved.

During the dividing operation, the ceramic substrate is held by the elastic action of the holding recesses of both chucks.
The shock at the time of division is absorbed by the elastic resin body of the chuck, and the occurrence of burrs is reduced regardless of the conditions such as the thickness and division size of the ceramic substrate.
The above) has become possible.

Further, by adopting the cam mechanism for the dividing operation and changing the dividing position by adjusting the stopper, the dividing operation can be performed quickly and accurately and the versatility is improved.

[Brief description of drawings]

FIG. 1 is a perspective view showing an outline of the operation of a main part mechanism of an automatic ceramic substrate dividing apparatus for carrying out an automatic ceramic substrate dividing method according to the present invention.

FIG. 2 is a perspective view showing an outline of the operation of a main part mechanism of an automatic ceramic substrate dividing apparatus for carrying out the ceramic substrate automatic dividing method according to the present invention.

FIG. 3 is a perspective view showing an outline of the operation of a main part mechanism of an automatic ceramic substrate dividing apparatus for carrying out the ceramic substrate automatic dividing method according to the present invention.

FIG. 4 is a perspective view showing an outline of the operation of a main part mechanism of a ceramic substrate automatic dividing apparatus for carrying out the ceramic substrate automatic dividing method according to the present invention.

[Explanation of symbols]

 1 Master Side Transport Guide 2 Ceramic Substrate 3 Stopper 4 Master Side Chuck 5 Module Side Chuck 6 Chuck's Substrate Gripping Recess 7 Module Side Transport Guide A Ceramic Board Dividing Line

Claims (2)

[Claims] 1. A master-side transport guide on which a ceramic substrate is placed, a pusher for pushing the ceramic substrate placed on the master-side transport guide until it abuts against a stopper, and a pusher closed when pushing of the pusher is completed. Operate to hold the ceramic substrate, hold the ceramic substrate, swing at the same angle around the dividing line, promote the splitting of the ceramic substrate, and only the angle of the split instant swing The master side chuck that returns and opens, and the part that splits away from the dividing line instantly, moves forward while returning the angle of the shake, and puts the divided ceramic substrate on the transfer guide on the module side in the subsequent process and opens. And a module side chuck for adjusting the dividing position of the ceramic substrate by the stopper, grasping the ceramic substrate edge, A method for automatically dividing a ceramic substrate, wherein a force in the swing direction is applied to the substrate to enable automatic division of the ceramic substrate. 2. The automatic dividing method for a ceramic substrate according to claim 1, wherein each of the chucks on the master side and the module side has a holding recess of the ceramic substrate formed of an elastic resin body. .