JPH0795413B2 - Contact material joining method - Google Patents
Contact material joining methodInfo
- Publication number
- JPH0795413B2 JPH0795413B2 JP7052590A JP7052590A JPH0795413B2 JP H0795413 B2 JPH0795413 B2 JP H0795413B2 JP 7052590 A JP7052590 A JP 7052590A JP 7052590 A JP7052590 A JP 7052590A JP H0795413 B2 JPH0795413 B2 JP H0795413B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- contact material
- ultrasonic
- present
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 title claims description 47
- 238000000034 method Methods 0.000 title claims description 9
- 238000003466 welding Methods 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 239000012190 activator Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H2011/0087—Welding switch parts by use of a laser beam
Landscapes
- Manufacture Of Switches (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は接点材料の接合方法、特に板バネ材等から成
り、リレーやスイッチ等の接点として用いられる金属薄
板に導電性良好な接点材料を接合する方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a method of joining contact materials, particularly a leaf spring material or the like, and a contact material having good conductivity is applied to a thin metal plate used as a contact such as a relay or a switch. Regarding the method of joining.
（従来の技術） リレーやマイクロスイッチやブレーカー等の接点を基板
に接合する手段として、従来、例えば特開昭58−129708
号記載の技術が知られている。(Prior Art) As a means for joining contacts such as a relay, a microswitch, and a breaker to a substrate, there is conventionally known, for example, JP-A-58-129708.
The technology described in the issue is known.
この従来技術によれば、第７図（ａ），（ｂ）に示され
るように、接点材料２′と基材の端子板１′である金属
板とを重ね合わせ、超音波溶接した後、周辺部を高エネ
ルギービーム５′で溶融して接合する方法が採られてい
る。According to this prior art, as shown in FIGS. 7 (a) and 7 (b), after the contact material 2'and the metal plate which is the terminal plate 1'of the base material are superposed and ultrasonically welded, A method is adopted in which the peripheral portion is fused with a high energy beam 5'and joined.
（発明が解決しようとする課題） しかしながら、前述した従来の溶接手段によると、超音
波溶接が主体であり、未溶接部分（周辺部）を高エネル
ギービームで溶接することになる。したがって、超音波
溶接を安定させ、信頼性の高い物にするためには材料に
与える超音波エネルギーを大きくする必要があり、この
場合、材料の変形が大きくなり、接点表面状態に悪影響
を及ぼすという課題がある。(Problems to be Solved by the Invention) However, according to the above-described conventional welding means, ultrasonic welding is mainly used, and the unwelded portion (peripheral portion) is welded with a high energy beam. Therefore, in order to stabilize the ultrasonic welding and make it highly reliable, it is necessary to increase the ultrasonic energy applied to the material. In this case, the deformation of the material becomes large, which adversely affects the contact surface condition. There are challenges.
この発明はかかる課題を解決するためになされたもの
で、その目的とするところは、超音波と高エネルギービ
ームを併用し被接合材の変形が少なく、信頼性の高い接
合界面を得ることのできる接点材料の接合方法を提供す
ることにある。The present invention has been made to solve the above problems, and an object of the present invention is to use ultrasonic waves and a high-energy beam in combination to reduce the deformation of the materials to be bonded and to obtain a highly reliable bonding interface. It is to provide a method for joining contact materials.
（課題を解決するための手段） 本発明では、接点材と端子材とを接触させて超音波溶接
して仮保持させた後、端子材の方向から高エネルギービ
ームを照射し、この超音波溶接部材のほぼ全面にわたっ
て加熱溶接することにより、上記目的を達成している。(Means for Solving the Problem) In the present invention, after the contact material and the terminal material are brought into contact with each other and ultrasonically welded to be temporarily held, a high energy beam is irradiated from the direction of the terminal material, and the ultrasonic welding is performed. The above object is achieved by heating and welding substantially the entire surface of the member.
（作用） 本発明では、上記構成としたため、特に活性剤を用いな
くとも仮保持過程までの間に表面の酸化皮膜の汚れを除
去でき、かつ接点材料と端子材相互を密着させ、部分的
に金属結合が得られるため、両部材を確実に接合でき
る。(Operation) In the present invention, because of the above-mentioned configuration, it is possible to remove the dirt on the oxide film on the surface before the temporary holding process without using an activator, and to bring the contact material and the terminal material into close contact with each other and to partially Since a metal bond is obtained, both members can be reliably joined.
（実施例１） 第１図（ａ），（ｂ）は本発明の第１実施例を示す。こ
の実施例では、先ず、（ａ）図に示すように、金属板か
らなる端子材１の上面所定位置に接点材２を重ね合わせ
て接触せしめ、その接点材２の上部に超音波ホーン３を
当て、この超音波ホーン３を駆動して超音波の振動によ
り接点材２を端子材１上面に仮保持させる。図中４は仮
接合面である。この場合、振動により接合面の酸化皮膜
を、特に活性剤を用いなくとも除去することができる。(Embodiment 1) FIGS. 1A and 1B show a first embodiment of the present invention. In this embodiment, first, as shown in FIG. 1 (a), a contact material 2 is superposed and brought into contact with a predetermined position on the upper surface of a terminal material 1 made of a metal plate, and an ultrasonic horn 3 is placed on the contact material 2. Then, the ultrasonic horn 3 is driven to temporarily hold the contact material 2 on the upper surface of the terminal material 1 by vibrating ultrasonic waves. In the figure, 4 is a temporary bonding surface. In this case, the oxide film on the joint surface can be removed by vibration without using an activator.
すなわち、超音波印加の目的は、接合面を超音波摩擦に
より、酸化皮膜を除去し清浄な面同志を密着させ仮固定
することである。したがって、超音波印加による接点材
料の変形は最小に抑えることができる。That is, the purpose of applying the ultrasonic wave is to remove the oxide film from the joint surface by ultrasonic friction and bring the clean surfaces into close contact with each other to temporarily fix them. Therefore, the deformation of the contact material due to the application of ultrasonic waves can be minimized.
その後、（ｂ）図に示すように、端子材２の下面からレ
ーザービーム、電子ビーム等の高エネルギービーム５を
接合部分に照射して中心から周辺にかけてのほぼ全面に
かけて加熱し、溶融接合するようにしている。図中
（ａ）は溶接部、（ｂ）は合金属である。したがって、
この高エネルギービーム照射時に接合部の熱伝達が安定
し、再現性の高い安定した溶接を得ることができる。ま
た、未溶接部分でもフラックス等の活性剤を用いなくと
も原子の拡散反応が起り易く、例えばAg接点とCu端子に
この方法を用いれば元素の拡散共晶反応により、Ag−Cu
の合金属が形成され、安定した接合が得られるものであ
る。After that, as shown in FIG. 3B, a high-energy beam 5 such as a laser beam or an electron beam is irradiated from the lower surface of the terminal material 2 to the joint portion to heat almost the entire surface from the center to the periphery so that the fusion bonding is performed. I have to. In the figure, (a) is a welded portion, and (b) is a mixed metal. Therefore,
During the irradiation with this high-energy beam, the heat transfer at the joint is stable, and stable welding with high reproducibility can be obtained. Further, even in the non-welded portion, the diffusion reaction of atoms is likely to occur without using an activator such as flux.For example, if this method is used for the Ag contact and Cu terminal, the diffusion eutectic reaction of the elements causes Ag-Cu.
In this way, a composite metal of (3) is formed, and stable bonding can be obtained.
（実施例２） 第２図は本発明の第２実施例で、超音波による仮止めが
第１実施例と異なっている。すなわち、超音波ホーン3A
には接点材２を収納する凹部3aが形成され、超音波ホー
ン3Aによって接点材２を挟持するようにして超音波を介
し接点材２を端子材１に仮保持させるようにしている。
その他の点は第１実施例とほぼ同様であるので、詳細説
明は省略する。(Embodiment 2) FIG. 2 is a second embodiment of the present invention, in which provisional fixing by ultrasonic waves is different from that of the first embodiment. That is, ultrasonic horn 3A
A concave portion 3a for accommodating the contact material 2 is formed therein, and the contact material 2 is sandwiched by the ultrasonic horn 3A so that the contact material 2 is temporarily held by the terminal material 1 via ultrasonic waves.
Since the other points are almost the same as those of the first embodiment, detailed description will be omitted.
（実施例３） 第３図は本発明の第３実施例を示すもので、この例では
接点材2Aの形状に対応した超音波ホーン3Bを用いるよう
にしたことに特徴を有している。すなわち、接点材2Aの
両側部がテーパ状となって接点材2Aが断面略台形状とな
っており、超音波ホーン3Bの形状をその両側部を挟持可
能に構成している。その他、作用等については第１実施
例とほぼ同様である。(Embodiment 3) FIG. 3 shows a third embodiment of the present invention, which is characterized in that an ultrasonic horn 3B corresponding to the shape of the contact material 2A is used. That is, both sides of the contact material 2A are tapered so that the contact material 2A has a substantially trapezoidal cross section, and the shape of the ultrasonic horn 3B can be sandwiched between both sides. In addition, the operation and the like are almost the same as those in the first embodiment.
（実施例４） 第４図は本発明の第４実施例を示すもので、この例では
接点材２の上部を固定部材６によって固定し、端子材１
の下部に超音波ホーン3Cを配置して超音波により仮保持
するようにしたものである。(Embodiment 4) FIG. 4 shows a fourth embodiment of the present invention. In this embodiment, the upper portion of the contact material 2 is fixed by a fixing member 6, and the terminal material 1
An ultrasonic horn 3C is arranged below the above to temporarily hold the ultrasonic horn 3C.
（実施例５） 第５図（ａ）〜（ｅ）は本発明の第５実施例を示す。こ
の実施例では接点材２の上面に設けた超音波ホーン3Dを
垂直方向に駆動し、接合面に対し垂直方向に超音波振動
を印加して仮保持することを特徴としている。このよう
な超音波振動印加によると、接点表面へのダメージを低
減することができる利点がある。(Embodiment 5) FIGS. 5 (a) to 5 (e) show a fifth embodiment of the present invention. This embodiment is characterized in that the ultrasonic horn 3D provided on the upper surface of the contact material 2 is driven in the vertical direction, and ultrasonic vibration is applied in the direction perpendicular to the joint surface to temporarily hold it. Such application of ultrasonic vibration has an advantage that damage to the contact surface can be reduced.
なお、（ａ）図は接点材２と端子材１との接合面がフラ
ットになっている態様、（ｂ）図は端子材１に凹部1aを
形成したもの、（ｃ）図は端子材１に突部1bを形成した
もの、（ｄ）図は接点材２側に凹部2aを形成したもの、
（ｅ）図は接点材２側に突部2aを形成したものを示す。Note that (a) is a mode in which the contact surface between the contact material 2 and the terminal material 1 is flat, (b) is a terminal material 1 in which a concave portion 1a is formed, and (c) is a terminal material 1 The protrusion 1b is formed on the surface of the contact material, (d) in FIG.
(E) The figure shows a contact member 2 having a protrusion 2a formed thereon.
（実施例６） 第６図は本発明の第６実施例を示すもので、この例では
端子材１の下部側に超音波ホーン3Dを設け、接合面に対
し垂直方向に超音波振動を印加するようにしたことに特
徴を有している。なお、接合面の態様はその他上記第５
図（ｂ）〜（ｅ）に示すものを適宜採択し得ることは勿
論である。(Embodiment 6) FIG. 6 shows a sixth embodiment of the present invention. In this embodiment, an ultrasonic horn 3D is provided on the lower side of the terminal material 1 and ultrasonic vibration is applied in a direction perpendicular to the joint surface. It has a feature in doing so. In addition, as for the aspect of the joint surface, other than the above fifth
Of course, those shown in FIGS. (B) to (e) can be appropriately adopted.
（発明の効果） 以上のように本発明によれば、接点材と端子材とを接触
させて超音波溶接により仮保持させるようにしてあるた
め、超音波エネルギーは従前のものに比べ大きくないの
で、接点材の形状変化を軽減でき、また、その後、超音
波溶着部分のほぼ全面にわたって加熱溶着するようにし
たから、ボイド、融合不良等の欠陥が少ない信頼性の高
い接点を得ることができる。(Effect of the invention) As described above, according to the present invention, since the contact material and the terminal material are brought into contact with each other and temporarily held by ultrasonic welding, ultrasonic energy is not so large as compared with the conventional one. In addition, since the change in shape of the contact material can be reduced, and thereafter, the entire surface of the ultrasonically welded portion is heated and welded, a highly reliable contact having few defects such as voids and fusion defects can be obtained.
第１図（ａ）、（ｂ）は本発明の第１実施例の工程説明
図、第２図ないし第６図はそれぞれ本発明の第２ないし
第６実施例、第７図（ａ）、（ｂ）は従来例を示す。 １……端子材、２、2A……接点材 ３、3A、3B、3C、3D……超音波ホーン ５……高エネルギービームFIGS. 1 (a) and 1 (b) are process explanatory diagrams of the first embodiment of the present invention, and FIGS. 2 to 6 are second to sixth embodiments of the present invention and FIG. 7 (a), respectively. (B) shows a conventional example. 1 ... Terminal material, 2, 2A ... Contact material 3, 3A, 3B, 3C, 3D ... Ultrasonic horn 5 ... High energy beam
Claims (1)
て仮保持させた後、端子材の方向から高エネルギービー
ムを照射し、この超音波溶接部材のほぼ全面にわたって
加熱溶着させたことを特徴とする接点材料の接合方法。1. A contact material is brought into contact with a terminal material, ultrasonically welded and temporarily held, then a high energy beam is irradiated from the direction of the terminal material, and the entire surface of this ultrasonically welded member is heat-welded. A method for joining contact materials, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7052590A JPH0795413B2 (en) | 1989-08-11 | 1990-03-20 | Contact material joining method |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20878789 | 1989-08-11 | ||
| JP1-208787 | 1989-08-11 | ||
| JP7052590A JPH0795413B2 (en) | 1989-08-11 | 1990-03-20 | Contact material joining method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03156815A JPH03156815A (en) | 1991-07-04 |
| JPH0795413B2 true JPH0795413B2 (en) | 1995-10-11 |
Family
ID=26411679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7052590A Expired - Lifetime JPH0795413B2 (en) | 1989-08-11 | 1990-03-20 | Contact material joining method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0795413B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113874974B (en) * | 2019-06-04 | 2025-02-25 | 三菱电机株式会社 | Contact manufacturing method, contact and interrupter |
-
1990
- 1990-03-20 JP JP7052590A patent/JPH0795413B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03156815A (en) | 1991-07-04 |
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