JPH0795557B2 - Semiconductor bonding method and device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention is to bond inner leads of a lead frame formed in a tape carrier by a bonding stage and a bonding head to terminals of a chip, and then down set. The present invention relates to a semiconductor bonding method and device for performing the above.

(Prior Art) In recent years, in semiconductors, a copper foil is pasted on a tape such as a synthetic resin film, and the copper foil is etched to form a lead frame on the tape. The one to which the bump is attached is prepared, and the bonding process is performed by using, for example, an apparatus as described in JP-A-58-165335. That is, the chip is placed on the bonding stage, the tape is transported to a predetermined position, and the bonding head is vertically lowered to connect the inner lead of the tape and the bump of the chip terminal.

In the semiconductor obtained by the above-mentioned operation, the inner lead of the tape and the chip are substantially parallel to each other, so that the inner lead may come into contact with the chip to cause a short circuit. Therefore, after performing the bonding process, move the tape horizontally at the same position upward to down-set the inner lead so that the inner lead is inclined with respect to the chip, or use a down-set processing device to perform the bonding process. The processed tape is fixed at a predetermined position, the chip is gripped from above and below, and the chip is lowered to perform the downset process.

(Problem) In the former method, in which the tape is horizontally moved upward and down set is processed, excess tension acts on the inner leads or outer leads when moving the tape, which may damage the inner leads. In addition, in order to raise and lower the vertical direction in a horizontal state so that very thin tape may not be distorted or wrinkled, very advanced processing and assembly technology is required. It was very difficult to put this device into practical use.

Further, in the case of performing the downset processing using the latter downset processing device, the bonded tape must be set at a predetermined position, and distortion, wrinkles, etc. may occur in the gripping operation of the tape. There was a problem.

(Object) A first object of the present invention is to enable a downset process to be performed subsequent to the bonding process.

The second purpose is to prevent the tape from being distorted or wrinkled.

(Means for Solving the Problems) In order to achieve the above object, a semiconductor bonding method of the present invention is to mount a chip on a bonding stage, convey a tape to a predetermined position, and move a bonding head in a vertical direction. The inner lead formed on the tape and the chip terminals are heated and pressure-bonded to perform the bonding process.Next, with the tape fixed, hold the bonding stage and bonding head with the inner lead part and the chip. Down set processing is performed by lowering.

Further, in order to carry out the above-mentioned method, the semiconductor bonding apparatus of the present invention includes a bonding head above the tape gripping mechanism, a bonding stage below, and the bonding stage and the bonding head simultaneously. Alternatively, it is configured to vertically move up and down independently.

The above-described apparatus can be reliably implemented by configuring the bonding head and the bonding stage to move up and down in the vertical direction by the cam mechanism.

(Embodiment) The configuration of one embodiment of a semiconductor bonding apparatus of the present invention will be described with reference to the drawings.

The semiconductor bonding apparatus includes a tape gripping mechanism 3 for fixing the tape 90 transported to a predetermined bonding position, a bonding stage 2 for mounting a chip 91 at the bonding position, and an inner layer formed on the tape 90. It is composed of a lead 90a and a bonding head 1 for pressure contact that connects the terminal 91a of the chip 91.

The bonding head 1 is installed on an XY table (not shown) which is installed on the machine base and moves in the horizontal direction in the front-rear direction and in the left-right direction. The details are shown in FIGS.
As shown in the figure. In the figure, 4 is a frame mounted on an XY table (not shown), and a guide 4a is formed horizontally on the wall surface. Reference numeral 5 denotes a support body attached so as to move horizontally along a guide 4a formed on the frame body. A shaft 6 is rotatably attached to the frame body 4 and is rotated by an electric motor (not shown) such as a pulse motor or a synchronous electric motor. A first cam body 7 and a second cam body 8 are attached to the shaft 6, and a cam surface is formed so as not to act on the support body 5 and the oscillating body 10 at the same time even when integrally rotated. is there. Reference numeral 9 denotes a cam follower attached to the support body 5, which is brought into contact with the cam surface of the first cam body 7 by a spring spanned between the frame body 4 and the support body 5 or a cylinder (not shown). Then, when the first cam body 7 rotates, the support body 5 moves in the horizontal direction. Rocker
A shaft 10 is rotatably attached to the frame body 4 by a shaft 11, and a guide groove 10a is formed at an end thereof. A cam follower 12 is rotatably attached to the rocking body 10, and is in contact with the cam surface of the second cam body 8. Reference numeral 13 is a bracket for attaching the bonding tool 16, and a bearing 14 is integrally attached. The bearing 14 is mounted so that it can be vertically moved up and down along a guide 5a formed on the support 5. 15 is a roller rotatably attached to the bracket 13,
It engages with a guide groove 10a formed in the rocking body 10.

Since the bonding tool 16 presses the inner leads 90a formed on the tape 90 against the terminals 91a of the chip 91 at a predetermined temperature, a heating source (not shown) such as a sheath heater is attached. Further, a heat insulating material, a cooling body and the like are attached to the upper part of the heating source so that the bracket 13 and the like are not heated.

Reference numeral 17 denotes a single-acting linder, and the end of the piston rod is in contact with the lower surface of the rocking body 10. Then, when the piston rod projects, the rocking body 10 rotates counterclockwise around the shaft 11 as a fulcrum, and lowers the bonding tool 16 together with the bracket 13. Reference numerals 18a and 18b denote detectors that detect the ascending / descending position of the bonding tool 16 via the oscillating body 10, and are operated by the protrusion 10b formed at the end of the oscillating body 10. Reference numeral 19 is a screw body such as a micrometer attached to the bracket 13 for determining the downset amount, and the upper surface 5b of the support body 5
And the lowering position of the bonding tool 16 is regulated.

Next, details of the bonding stage 2 are as shown in FIGS. 3 and 4, in which 20 is an XY table (not shown) which is installed on the machine base and moves back and forth in the horizontal direction and left and right. It is a turntable mounted on the base 21
Is mounted so that it can move horizontally. Reference numeral 22 is a pair of brackets mounted on the base 21, and bearings 23 are mounted so as to face each other. Reference numeral 23 is an elevating body rotatably attached to a support body 28 by a shaft 29, and a roller 25 is rotatably attached thereto. The roller 25 is in contact with the cam surface 27a of the cam body 27 attached to the end of the piston rod of the cylinder 26 installed on the base 21. A guide 28 is formed on the support body 28 and engages with a bearing 23 mounted on the bracket 22 to move up and down in the vertical direction. In addition, a screw screwed to the support 28
The elevating body 24 is rotated by the shaft 29 with the shaft 29 as a fulcrum by the 30 to adjust the vertical position of the support body 28. Reference numeral 31 denotes a spring that is stretched over a pin 32 projecting from the elevating body 24 and a pin 33 projecting from the supporting body 28, so that the supporting body 28 is always brought close to the elevating body 24 side. 34 is a pin 35 protruding from the base 21 and a support 28
It is a spring that is stretched over a pin 36 that is provided so as to project, and the roller 25 is brought into contact with the cam surface 27a of the cam body 27 with a predetermined surface pressure. Then, when the piston rod of the cylinder 26 projects, the supporting body 28 rises together with the lifting body 24, and when the piston rod retracts, the supporting body 28 descends together with the lifting body 24.

37 is a cooling body attached to the upper surface of the support body 28, water,
A hole for passing a cooling fluid such as air is bored, and a cooling fluid supply pipe (not shown) is connected. 39 is insulation
The heating element is attached to the cooling element 37 via 38, and a heating source (not shown) such as a sheath heater is attached. 40 is a stage mounted on the upper surface of the heating body 39,
Place 91. Reference numeral 41 is a bracket attached to the base 21, and a guide 41a is formed in the vertical direction. 42 is bearing 4
It is a positioning piece to which 3 is integrally attached, and the bearing 43 engages with a guide 41a formed on the bracket 41 and moves up and down in the vertical direction. A cylinder 44 is attached to the base 21, and the positioning piece 42 is attached to the end of the piston rod. 45 is a screw screwed to the bracket 41,
The restricting surface 42a of the positioning piece 42 contacts and restricts the upward movement of the positioning piece 42. Reference numeral 46 denotes a bracket attached to the lifting body 24, to which a screw body 47 such as a micrometer is attached. Then, the screw body 47 is positioned on the regulation surface 42b of the positioning piece 42.
And the downward movement of the elevating body 24 is restricted.

In the bonding stage 2 configured as described above, when the cylinder 26 operates and the piston rod projects, the elevating body 24 to which the roller 25 is attached by the cam body 27 and the support body 28 ascend to raise the stage 40. When it moves to the bonding operation position and the piston rod retracts, the lifting body 24 and the support body 28 descend until the screw body 47 contacts the regulation surface 42b of the positioning piece 42, and the stage 40 moves to the downset operation position. To do. The amount of down-setting is determined by adjusting the height of the positioning piece 42 with the screw 45.

Details of the tape gripping mechanism 3 are as shown in FIG. 5 to FIG. 7. In the drawings, reference numeral 48 is a frame body attached to a machine base (not shown), and guides 48a, 48b in the vertical direction. Is formed. Reference numeral 49 denotes a lower frame to which a bearing 50 is integrally attached, and the bearing 50 engages with a guide 48a formed on the frame body 48 to move up and down in the vertical direction. A pressing piece 51 is fitted in a groove formed in the lower frame 49, and is fixed to the lower frame 49 by a screw 52. Reference numeral 53 denotes an upper frame to which a bearing 54 is integrally attached, and the bearing 54 is engaged with a guide 48b formed on the frame 48 to move up and down in the vertical direction. A pressing piece 55 is fitted in a groove formed in the upper frame 53, and is fixed to the upper frame 53 by a screw 56. Reference numeral 57 is a cylinder, and a lower frame 49 is attached to the body and an upper frame 53 is attached to the end of the piston rod. Reference numeral 58 denotes a spring that is stretched around a pin 59 projecting from the frame 48 and a pin 60 projecting from the lower frame 49, and pulls the body of the cylinder 57 downward. The downward movement of the lower frame attached to the cylinder 57 is restricted by the screw 61 screwed to the frame body 48.
Further, the upward movement of the upper frame 53 attached to the piston rod of the cylinder 57 is regulated by the screw 62 screwed to the frame body 48, and the downward movement is regulated by the screw 63.

Reference numeral 64 denotes a guide frame attached to the frame body 48, and has a guide groove 64a for regulating the position of the tape 90 in the width direction and a hole 64b for bonding operation.

Reference numeral 65 is a control device including a memory circuit, a comparison operation circuit, an operation command circuit, or the like, or a micro computer.

A compressed air supply main pipe 66 is connected to a compressed air supply source such as a compressor. 67 is the cam follower 12 and the second cam body 8
It is a pressure reducing valve for adjusting the pressure of the compressed air supplied to the cylinder 17 for abutting against, and the inlet side is connected to the compressed air supply main pipe 66, and the outlet side is connected to the solenoid valve 68 by the compressed air supply pipe 75. Also,
The outlet side of the solenoid valve 68 is connected to the cylinder 17 by a compressed air supply pipe 76. 69 is a pressure reducing valve for adjusting the pressure of the compressed air that moves down the bonding tool 16 during the bonding operation,
The inlet side is connected to the compressed air supply main pipe 66, and the outlet side is connected to the solenoid valve 70. The outlet side of the solenoid valve 70 is connected to the solenoid valve 70 by a compressed air supply pipe 77.
It is connected to 68. 71 is a pressure reducing valve that adjusts the pressure of the compressed air supplied to the cylinder that descends the bonding tool 16 during the downset operation, and the inlet side is the compressed air supply main pipe 66,
The outlet side is connected to the solenoid valve 72. The outlet side of the solenoid valve 72 is connected by a compressed air supply pipe 77. Reference numeral 73 is a solenoid valve for supplying and stopping compressed air to the cylinder descending the stage 40 during downset operation, and the inlet side is a compressed air supply main pipe.
At 66, the outlet side is connected to the cylinder 26 by compressed air supply pipes 78, 79. 74 is stage 40 for down set operation
Is a solenoid valve that supplies and stops compressed air to the cylinder that regulates the descending amount of the compressed air. The inlet side is connected to the compressed air supply main pipe 66, and the output side is connected to the cylinder 44 by compressed air supply pipes 80 and 81.

When performing bonding and down-setting with the above equipment, operate the pressure reducing valve to
The pressure of the compressed air supplied to is adjusted to a preset value. Further, the screw body 19 is operated to adjust the bonding tool 16 so as to descend to a predetermined position at the time of down-setting operation, and the screw 45 is operated to adjust the protruding position of the positioning piece 42 to operate the screw body 47. Adjust the lowered position of the stage 40 during the down set operation. The control unit 65 sets and inputs the operation sequence of the bonding head 1, the bonding stage 2, the tape gripping mechanism 3, etc., the operation time, the tape transport amount, the bonding tool 16, and the heating temperature of the stage 40.

Next, a tape supply reel (not shown) is attached to a predetermined tape supply section, and the tape 90 is removed from the reel (not shown).
The guide groove 64a of the guide frame 64 and the pressing piece 5
It is wound around a reel (not shown) attached to the winding section through the space between 1 and 55, and is prepared on a tray, a conveyor, etc. of a supply mechanism (not shown) for the chip 91.

When these are ready and the control device 65 is started, the tape 90 is sent out, and when the first inner lead 90a formed on the tape 90 is conveyed to the bonding operation position, the cylinder 57 operates and the piston The rod retracts and descends until the upper frame 53 contacts the screw 63. But,
As the piston rod continues to retract, the lower frame 49 rises together with the main body of the cylinder 57, and the tape 90 lowers the lower frame 49.
51 and the presser piece attached to the upper frame 53
It is grasped from above and below by 55. During the above operation, the supply mechanism (not shown) operates to mount the chip 91 on the stage 40, and then the XY table (not shown) operates to move the chip 91 to the bonding operation position. When transported, solenoid valve
73 operates to supply compressed air to the cylinder 26, retract the piston rod, move the cam body 27 in the (f) direction, and move the stage 40 together with the lifting body 24 and the support body 28 upward.
Then, when the chip 91 on the stage 40 moves to the bonding position, an electric motor (not shown) operates to rotate the first cam body 7 together with the shaft 6 and move the bonding head 16 together with the support body 5 in the (a) direction. Project to. When the bonding head 16 is moved to the bonding position, the solenoid valve 68 is operated to switch the pipe line to supply compressed air from the pressure reducing valve 67 to the cylinder 17 to cause the piston rod to project, and the rocking body 10 to be supported by the shaft 11 as a fulcrum. And rotate in the (d) direction to move the cam follower.
12 is brought into contact with the second cam body 8 with a predetermined pressing force. Then,
An electric motor (not shown) operates to drive the shaft 6 and the first cam body 7 together.
Rotates and changes the cam surface so that it comes closer to the shaft center side.
At this time, since the compressed air is still supplied to the cylinder 17, the rocking body 10 moves along with the change of the cam surface.
It is rotated in the (d) direction with 11 as a fulcrum. Then, the bonding head 16 descends vertically with the bracket 14 and is heated to a predetermined temperature.
The inner lead 90a formed on the tape 90 and the terminal 91a of the chip 91 are pressed by a force of 2 to 5 kg, and the detector 18a is activated by the actuating portion 10a formed at the end of the oscillator 10. , The solenoid valve 68 and the solenoid valve 70 are operated at the same time to switch the pipeline to supply the compressed air from the pressure reducing valve 70 to the cylinder 17 to the bonding head 16 20 to 30 kg.
Inner lead formed on the tape 90 by applying the force of
Bonding is performed by heating and crimping 90a and the terminal 91a of the chip 91. During the bonding operation, the solenoid valve 74
Is operated to supply compressed air to the cylinder 44 so that the piston rod is projected and the positioning piece 42 is moved to a predetermined position. Then, when the preset bonding processing time has elapsed, the solenoid valves 68, 70, 72, 73 are simultaneously operated to switch the pipeline, and the cylinder 17 is supplied with compressed air from the pressure reducing valve 71 and the cylinder 26 The piston rod is protruded by changing the supply position of the compressed air, and the stage body 40 together with the lifting body 24, the support body 28, and the screw body 47 integrally attached to the support body 28 are lowered by the spring 34 until they come into contact with the positioning piece 42. . At this time, the bowing head 16 is also 90 tape
Apply a force of 2 to 5 kg to the upper surface of the inner lead 90a of
While holding the inner lead 90a and the chip 91 between the stage 40 and the stage 40, the screw body 19 integrally attached to the bonding tool 16 descends until it comes into contact with the upper surface 5a of the support body 5.

In the above operation, the tape 90 is fixed by the pressing pieces 51 and 55, and only the tip 91 is lowered, so that the inner lead is downset as shown in FIG. Then, when a preset down-set operation time elapses, the solenoid valves 68 and 74 operate to switch the pipelines to stop the supply of compressed air to the cylinder 17, and switch the supply position of compressed air to the cylinder 44 to change the piston rod. And the positioning piece 42 is returned to the standby position. Then, the spring 34 lifts the lifting body 24 and the support body 28.
At the same time, the stage 40 descends to a position where the roller 25 contacts the cam body 27. On the other hand, the solenoid valve 68 is activated and the cylinder 17
When the supply of compressed air to the air is stopped, an electric motor (not shown) operates to rotate the second cam body 8 together with the shaft 6 and rotate the rocking body 10 in the (c) direction with the shaft 11 as a fulcrum. To do. Then, the bonding tool 16 is raised together with the bracket 13, and the detector 18b is actuated by the protrusion 10b of the rocking body 10, and an electric motor (not shown) is actuated to rotate and support the first cam body 7 together with the shaft 6. The body is retracted in the (b) direction and the bonding tool 16 is returned to the standby position. When the bonding tool 16 and the stage 40 return to the standby position, a solenoid valve (not shown) operates to switch the supply position of compressed air to the cylinder 57, project the piston rod, and the upper frame 35 contacts the screw 62. . At this time, the piston rod tries to protrude further, and this time the lower frame 49 is screwed together with the body of the cylinder 57.
Move until it abuts 61. By the movement of the upper frame 53 and the lower frame 49, the holding of the tape 90 by the pressing pieces 51, 55 is released. Then, the tape supply section and the winding section (not shown) are activated to move the tape 90 and convey the second inner lead 90a to the bonding operation position. By the above operation, the tip 9 for the first inner lead 90a
The bonding process of the terminal 91a of 1 and the down set process are completed.

By repeating the above-described operation, the bonding process of the terminal 91a of the chip 91 to the inner lead 91a formed on the tape 90 and the down-setting process can be continuously performed.

(Effects of the Invention) A semiconductor bonding method of the present invention is to mount a chip on a bonding stage, convey the tape to a predetermined position, and lower the bonding head in a vertical direction to form an inner lead formed on the tape. Bonding is performed by heating and crimping the terminals of the chip, and then lowering the bonding stage and bonding head while holding the tape while fixing the inner lead part and the chip with the tape fixed to perform the downsetting process. After the processing, down set processing can be performed,
Manufacturing time can be shortened.

In addition, the semiconductor bonding apparatus of the present invention has a bonding head disposed above and a bonding stage disposed below the tape gripping mechanism, and the bonding stage and the bonding head are simultaneously or individually moved vertically. Therefore, it is possible to reliably perform the bonding process and the downset process without causing the film tape to be distorted or wrinkled.

The above-described apparatus is configured so that the bonding head and the bonding stage can be vertically moved up and down by the cam mechanism, so that the structure is simple and can be surely implemented.

[Brief description of drawings]

FIG. 1 is a schematic front view showing one embodiment of a semiconductor bonding apparatus of the present invention, and FIG. 2 is a Z- line in FIG.
It is a Z arrow line view. FIG. 3 is a schematic view of the bonding stage, and FIG. 4 is a view on arrow XX in FIG. FIG. 5 is a schematic view of the tape gripping mechanism, and FIG.
FIG. 7 is a view taken along the line YY in the drawing, and FIG. 7 is a plan view of FIG. FIG. 8 is a schematic view showing a cross section of a down-set processed semiconductor device. 1: bonding head, 2: bonding stage, 3: tape gripping mechanism, 4,48: frame, 5,28: support, 6,11,29: axis,
7: First cam body, 8: Second cam body, 9, 12: Cam followers, 10:
Oscillator, 13,22,41,44: Bracket, 14,23,43,50,54: Bearing, 15,25: Roller, 16: Bonding tool, 17,26,44,
57: Cylinder, 18: Detector, 19, 47: Screw body, 20: Turntable, 21: Base, 24: Lifting body, 27: Cam body, 30, 45, 52,
56,61,62,63: Screw, 31,34,58: Spring, 37: Cooling body,
38: heat insulator, 39: heating body, 40: stage, 42: positioning piece,
49: Lower frame, 51, 55: Presser piece, 53: Upper frame, 64: Guide frame, 65: Control device,

Claims (3)

[Claims] 1. A chip is placed on a bonding stage, a tape is conveyed to a predetermined position, a bonding head is vertically lowered, and an inner lead formed on the tape and a terminal of the chip are heated and pressure-bonded. A semiconductor bonding method characterized by performing a bonding process and then descending a bonding stage and a bonding head with a tape fixed while holding an inner lead portion and a chip. 2. A tape holding mechanism is sandwiched between a bonding head above and a bonding stage below, and the bonding stage and the bonding head are simultaneously or independently moved up and down in a vertical direction. A semiconductor bonding device characterized by the above. 3. The semiconductor bonding apparatus according to claim 2, wherein the bonding head and the bonding stage are vertically moved up and down by a cam mechanism.