JPH0796645B2 - Polyamide resin composition - Google Patents
Polyamide resin compositionInfo
- Publication number
- JPH0796645B2 JPH0796645B2 JP1191926A JP19192689A JPH0796645B2 JP H0796645 B2 JPH0796645 B2 JP H0796645B2 JP 1191926 A JP1191926 A JP 1191926A JP 19192689 A JP19192689 A JP 19192689A JP H0796645 B2 JPH0796645 B2 JP H0796645B2
- Authority
- JP
- Japan
- Prior art keywords
- polyamide resin
- hypophosphite
- parts
- resin composition
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Compositions Of Macromolecular Compounds (AREA)
Description
【発明の詳細な説明】 <産業上の利用分野> 本発明はポリアミド樹脂組成物に関するものである。詳
しくは、難燃性で、しかも加熱乾燥においても着色する
ことのない耐熱安定性の優れたポリアミド樹脂に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION <Field of Industrial Application> The present invention relates to a polyamide resin composition. More specifically, the present invention relates to a polyamide resin which is flame-retardant and has excellent heat resistance stability that does not become colored even when heated and dried.
<従来の技術> ポリアミド樹脂は機械的特性、成形加工性、耐薬品性が
良好であることを利用して自動車部品、電気・電子部
品、機械部品など様々な分野で使用されており、このう
ち電気・電子部品用途においては難燃性に対する要求が
強く、本来自己消火性であるポリアミド樹脂にも、更に
高度な難燃性を付与することが必要である。ポリアミド
樹脂にトリアジン系化合物難燃剤を配合してなるポリア
ミド樹脂はよく知られている(特開昭53−31759、同53
−125459)。このポリアミド樹脂は十分な難燃性を有し
ブリードアウトやブルーミングのない極めて優れた樹脂
組成物である。<Prior Art> Polyamide resins are used in various fields such as automobile parts, electric / electronic parts, and mechanical parts due to their good mechanical properties, molding processability, and chemical resistance. There is a strong demand for flame retardancy in electric / electronic component applications, and it is necessary to impart even higher flame retardancy to polyamide resins that are inherently self-extinguishing. Polyamide resins obtained by blending a polyamide resin with a triazine-based compound flame retardant are well known (JP-A-53-31759 and JP-A-53759).
−125459). This polyamide resin is a very excellent resin composition having sufficient flame retardancy and no bleed-out or blooming.
<発明が解決しようとする課題> これらの難燃性ポリアミド樹脂組成物も成形・加工時の
製品化率を向上させる目的で、成形時に発生するスプル
ー、ランナー等の成形屑を再利用することが通常なされ
る。再利用にあたってスプルー、ランナー等は粉砕機で
粉砕される。ポリアミド樹脂は吸湿性があり、粉砕作業
の間に空気中の水分を吸う。吸湿したポリアミド樹脂を
そのまま成形・加工に使用すると、水分による発泡によ
り著しく成形・加工性がわるくなる。そこで、通常は80
℃〜150℃の温度で乾燥することが行われる。乾燥が空
気気流中で行われるときポリアミド樹脂は著しく着色す
るという欠点を有している。したがって、成形・加工屑
を再利用した製品と再利用していない製品との間に色調
差が生じ商品価値を著しく低下させることになる。そこ
で本発明者らは耐熱性に優れ、かつ高温空気中での乾燥
条件下でも着色されることのない難燃性ポリアミド樹脂
組成物を得るべく鋭意検討した結果、特定の無機リン化
合物を添加することにより上記の目的が容易に達成され
ることを見出だし本発明に到達した。リン化合物を添加
した難燃性ポリアミド樹脂組成物は公知である。すなわ
ち特開昭54−94540には有機、無機のリン化合物の添加
が、特開昭58−183747には有機亜リン酸化合物の添加
が、さらに特開昭51−59946には次亜リン酸アルカリ金
属塩の添加が示されている。しかし同公報に開示されて
いる発明にはトリアジン系難燃剤と次亜リン酸化合の併
用が全くなく、その目的とするところも、難燃剤の耐熱
性の改善とか、引張り伸率、耐衝撃性の改善とか、ある
いは難燃性の向上のために難燃助剤として添加すること
であり、着色の改善については何も示されていない。本
発明は難燃性で、しかも空気雰囲気中で加熱乾燥されて
も着色することのない耐熱安定性の優れたポリアミド樹
脂組成物を提供することにある。<Problems to be Solved by the Invention> These flame-retardant polyamide resin compositions may also be reused with molding scraps such as sprue and runner generated during molding for the purpose of improving the productization rate during molding and processing. Usually done. For reuse, sprue and runners are crushed by a crusher. Polyamide resin is hygroscopic and absorbs moisture in the air during the grinding operation. If a hygroscopic polyamide resin is used as it is for molding and processing, it will remarkably deteriorate in molding and processing due to foaming due to moisture. So usually 80
Drying is performed at a temperature of ℃ to 150 ℃. Polyamide resins have the disadvantage that they are markedly colored when the drying is carried out in a stream of air. Therefore, a difference in color tone occurs between a product in which the molding / processing waste is reused and a product in which the waste is not reused, and the commercial value is significantly reduced. Therefore, as a result of intensive investigations by the present inventors to obtain a flame-retardant polyamide resin composition which is excellent in heat resistance and is not colored even under dry conditions in high temperature air, a specific inorganic phosphorus compound is added. As a result, they have found that the above-mentioned object can be easily achieved, and have reached the present invention. Flame-retardant polyamide resin compositions containing a phosphorus compound are known. That is, in JP-A-54-94540, organic and inorganic phosphorus compounds are added, in JP-A-58-183747, organic phosphorous acid compounds are added, and in JP-A-51-59946, alkali hypophosphite is added. The addition of metal salts is shown. However, the invention disclosed in the publication does not use a triazine-based flame retardant and a hypophosphorous oxide at all, and the object is to improve the heat resistance of the flame retardant, tensile elongation and impact resistance. Is added as a flame retardant aid for improving the flame retardancy or improving the flame retardancy, and no improvement in coloring is shown. An object of the present invention is to provide a polyamide resin composition which is flame-retardant and which is not colored even when heated and dried in an air atmosphere and has excellent heat stability.
<課題を解決するための手段> すなわち本発明は、 ポリアミド樹脂100重量部に対し、 (a)メラミン・シアヌル酸難燃剤1〜20重量部およ
び、 (b)次亜リン酸アルカリ土類金属塩、次亜リン酸ナト
リウム、次亜リン酸アルミニウム、次亜リン酸カリウム
および次亜リン酸マンガンから選ばれる少なくとも1種
類の化合物を0.001〜5重量部 を含有してなるポリアミド樹脂組成物を提供するもので
ある。<Means for Solving the Problems> That is, the present invention relates to 100 parts by weight of a polyamide resin, (a) 1 to 20 parts by weight of a melamine / cyanuric acid flame retardant, and (b) an alkaline earth metal hypophosphite. Provided is a polyamide resin composition containing 0.001 to 5 parts by weight of at least one compound selected from the group consisting of sodium hypophosphite, aluminum hypophosphite, potassium hypophosphite and manganese hypophosphite. It is a thing.
以下に本発明を詳細に説明する。The present invention will be described in detail below.
本発明で用いられるポリアミド樹脂はアミノ酸、ラクタ
ムあるいはジアミンとジカルボン酸を主たる構成成分と
するポリアミドである。構成成分の具体例を挙げるとε
−カプロラクタム、エナントラクタム、ω−ラウロラク
タムなどのラクタム、ε−アミノカプロン酸、11−アミ
ノウンデカン酸、12−アミノドデカン酸などのアミノ
酸、テトラメチレンジアミン、ヘキサメチレンジアミ
ン、ウンデカメチレンジアミン、ドデカメチレンジアミ
ン、2,2,4−/2,4,4−トリメチルヘキサメチレンジアミ
ン、5−メチルノナメチレンジアミン、m−キシリレン
ジアミン、p−キシリレンジアミン、1,3−ビスアミノ
メチルシクロヘキサン、1,4−ビスアミノメチルシクロ
ヘキサン、ビス−p−アミノシクロヘキシルメタン、ビ
ス−p−アミノシクロヘキシルプロパン、イソホロンジ
アミンなどのジアミン、アジピン酸、スベリン酸、アゼ
ライン酸、セバシン酸、ドデカン2酸、1,4−シクロヘ
キサンジカルボン酸、1,3−シクロヘキサンジカルボン
酸、テレフタル酸、イソフタル酸、ナフタレンジカルボ
ン酸、ダイマー酸などのジカルボン酸がある。これらの
構成成分は単独あるいは二種以上の混合物の形で重合に
供され、そうして得られるポリアミドホモポリマ、コポ
リマいずれも本発明で用いることができる。特に本発明
で有用に用いられるポリアミドはポリカプラミド(ナイ
ロン6)、ポリヘキサメチレンアジパミド(ナイロン6
6)、ポリテトラメチレンアジパミド(ナイロン46)、
ポリヘキサメチレンセバカミド(ナイロン610)、ポリ
ウンデカンアミド(ナイロン11)、ポリドデカンアミド
(ナイロン12)、ポリヘキサメチレンアジパミド/ヘキ
サメチレンテレフタルアミド共重合体(ナイロン66/6
T)、ポリカプラミド/ポリヘキサメチレンアジパミド
共重合体(ナイロン6/66)そしてこれらポリアミドの混
合物である。The polyamide resin used in the present invention is a polyamide containing amino acid, lactam or diamine and dicarboxylic acid as main constituents. Specific examples of the constituents are ε
-Lactams such as caprolactam, enanthlactam, ω-laurolactam, amino acids such as ε-aminocaproic acid, 11-aminoundecanoic acid, 12-aminododecanoic acid, tetramethylenediamine, hexamethylenediamine, undecamethylenediamine, dodecamethylenediamine , 2,2,4- / 2,4,4-trimethylhexamethylenediamine, 5-methylnonamethylenediamine, m-xylylenediamine, p-xylylenediamine, 1,3-bisaminomethylcyclohexane, 1,4 -Diamines such as bisaminomethylcyclohexane, bis-p-aminocyclohexylmethane, bis-p-aminocyclohexylpropane and isophoronediamine, adipic acid, suberic acid, azelaic acid, sebacic acid, dodecane diacid, 1,4-cyclohexanedicarboxylic acid Acid, 1,3-cyclohex There are dicarboxylic acids such as sandicarboxylic acid, terephthalic acid, isophthalic acid, naphthalenedicarboxylic acid and dimer acid. These constituents are subjected to polymerization in the form of a single kind or a mixture of two or more kinds, and any of the polyamide homopolymers and copolymers thus obtained can be used in the present invention. Polyamides particularly useful in the present invention include polycapramide (nylon 6) and polyhexamethylene adipamide (nylon 6).
6), polytetramethylene adipamide (nylon 46),
Polyhexamethylene sebacamide (nylon 610), polyundecane amide (nylon 11), polydodecane amide (nylon 12), polyhexamethylene adipamide / hexamethylene terephthalamide copolymer (nylon 66/6)
T), polycapramide / polyhexamethylene adipamide copolymer (nylon 6/66) and mixtures of these polyamides.
ここで用いられるポリアミドの重合度については特に制
限はなく、1%濃硫酸溶液の25℃における相対粘度が1.
5〜5.0の範囲内にあるものを任意に用いることができ
る。The degree of polymerization of the polyamide used here is not particularly limited, and the relative viscosity of a 1% concentrated sulfuric acid solution at 25 ° C is 1.
Any material within the range of 5 to 5.0 can be used.
メラミン・シアヌル酸(以下MC塩)難燃剤はメラミンと
シアヌル酸との等モル反応物であって、例えばメラミン
の水溶液とシアヌル酸の水溶液とを混合し、90℃〜100
℃で撹拌下に反応させ、生成した沈澱を過することに
よって得られる。これは白色の固体であり、微粉末状に
粉砕して使用するのが好ましい。また、MC塩中のアミノ
塩、水酸基のいくつかが他の置換基で置換されていても
よい。The melamine-cyanuric acid (MC salt) flame retardant is an equimolar reaction product of melamine and cyanuric acid, for example, an aqueous solution of melamine and an aqueous solution of cyanuric acid are mixed, and the mixture is heated at 90 ° C to 100 ° C.
It is obtained by reacting at 0 ° C. under stirring and passing through the formed precipitate. This is a white solid, and it is preferable to use it after pulverizing it into a fine powder. Further, some of the amino salt and hydroxyl group in the MC salt may be substituted with other substituents.
さらにMC塩難燃剤の使用量としてはポリアミド樹脂100
重量部に対して通常1〜20重量部であり、特に好ましく
は3〜15重量部である。使用量が1重量部より少ない場
合には難燃剤としての効果がなく、使用量が20重量部よ
り多くしても得られる難燃性がより改善されることはな
い。Furthermore, as the amount of MC salt flame retardant used, polyamide resin 100
It is usually 1 to 20 parts by weight, and particularly preferably 3 to 15 parts by weight, based on parts by weight. When the amount used is less than 1 part by weight, the effect as a flame retardant is not exerted, and even when the amount used exceeds 20 parts by weight, the flame retardancy obtained is not further improved.
MC塩難燃剤のポリアミド樹脂への配合方法は公知のいか
なる技術も適用できるが、本発明に用いられる難燃剤の
長所をいかした難燃性の樹脂を得るためにはポリアミド
樹脂と微粒化した難燃剤とをヘンシェルミキサー等で混
合した後エクストルーダ等で内部混合することが好まし
い。Any known technique can be applied to the method of compounding the MC salt flame retardant into the polyamide resin, but in order to obtain a flame retardant resin that makes the best use of the advantages of the flame retardant used in the present invention, it is difficult to atomize with a polyamide resin. It is preferable to mix the flame retardant with a Henschel mixer or the like and then internally mix with an extruder or the like.
本発明で用いられる(b)の次亜リン酸金属塩のうち次
亜リン酸アルカリ土類金属塩の例としては次亜リン酸カ
ルシウム、次亜リン酸ストロンチウム、次亜リン酸バリ
ウム、次亜リン酸ベリリウム、次亜リン酸マグネシウム
等が挙げられる。とくに好ましくは次亜リン酸カルシウ
ム、次亜リン酸バリウム、次亜リン酸マグネシウムが用
いられる。(b)の次亜リン酸金属塩としては、その他
に、次亜リン酸ナトリウム、次亜リン酸カリウム、次亜
リン酸マンガン、次亜リン酸アルミニウムが使用でき
る。これら金属塩の添加量はポリアミド樹脂100重量部
に対して、通常0.001〜5重量部であり、特に好ましく
は0.01〜3重量部である。添加量が0.001重量部に満た
ない場合にはポリアミド樹脂の耐熱安定性が著しく低下
し、空気雰囲気での乾燥条件下で着色することになる。
添加量を5重量部より多くしても得られるポリアミド樹
脂の耐熱安定性がより改善されることはない。次亜リン
酸アルカリ土類金属塩の添加時間については特に限定さ
れるものではなく重合前、重合中、重合後の任意の段階
で添加することができる。また次亜リン酸金属塩は単独
で使用してもよく、二種以上を併用してもよい。Among the (b) metal hypophosphite salts used in the present invention, examples of the alkaline earth metal hypophosphite include calcium hypophosphite, strontium hypophosphite, barium hypophosphite, and hypophosphite. Examples thereof include beryllium and magnesium hypophosphite. Particularly preferably, calcium hypophosphite, barium hypophosphite and magnesium hypophosphite are used. In addition, sodium hypophosphite, potassium hypophosphite, manganese hypophosphite, and aluminum hypophosphite can be used as the metal hypophosphite salt (b). The addition amount of these metal salts is usually 0.001 to 5 parts by weight, and particularly preferably 0.01 to 3 parts by weight, based on 100 parts by weight of the polyamide resin. If the amount added is less than 0.001 part by weight, the heat resistance stability of the polyamide resin will be significantly reduced, and coloring will occur under dry conditions in an air atmosphere.
Even if the addition amount is more than 5 parts by weight, the heat resistance stability of the obtained polyamide resin is not further improved. The addition time of the alkaline earth metal hypophosphite is not particularly limited, and it can be added at any stage before, during, or after the polymerization. The metal hypophosphite may be used alone or in combination of two or more.
本発明のポリアミド樹脂組成物はポリアミド樹脂と次亜
リン酸金属塩とのポリアミド樹脂組成物マスターとして
使用してもよく、ポリアミド樹脂、トリアジン系化合物
難燃剤および次亜リン酸金属塩とのポリアミド樹脂組成
物マスターとしての使用も可能であり、本発明の好まし
い実施態様に含まれる。本発明のポリアミド樹脂組成物
には、本発明の効果を著しく損なわない程度に他の添加
剤、例えば滑剤、帯電防止剤、耐候剤、耐熱剤、補強剤
などを適量、任意の段階で添加することができる。The polyamide resin composition of the present invention may be used as a polyamide resin composition master of a polyamide resin and a metal hypophosphite, a polyamide resin, a triazine-based compound flame retardant and a polyamide resin with a metal hypophosphite. Use as a composition master is also possible and is included in the preferred embodiment of the invention. To the polyamide resin composition of the present invention, other additives such as a lubricant, an antistatic agent, a weathering agent, a heat-resistant agent, a reinforcing agent, etc. are added in an appropriate amount at any stage so long as the effects of the present invention are not significantly impaired. be able to.
<実施例> 次に実施例および比較例を挙げて本発明をさらに詳しく
説明するが、本発明はこれらの実施例により限定される
ものではない。<Examples> Next, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to these Examples.
実施例および比較例中「部」は全て「重量部」を示す。
色調「YI値」とはスガ試験機(株)製SM−カラーコンピ
ューター:SM−3によって測定した黄色の着色度を示す
値であり、数値が大きくなるほど黄色に着色しているこ
とを示す。All "parts" in the examples and comparative examples are "parts by weight".
The color tone “YI value” is a value indicating the degree of yellow coloring measured by SM-Color Computer: SM-3 manufactured by Suga Test Instruments Co., Ltd. The larger the value, the more yellow the color is.
比較例1 ヘキサメチレンジアミン・アジピン酸塩1900g、水630g
を重合釜に入れ窒素置換後、通常の重合方法に従って重
合を行い、重合釜よりストランド状に紡出してカッター
で切断しペレット状のポリアミド樹脂を得た。このペレ
ットを80〜100℃で16時間、真空乾燥した。乾燥したペ
レット100重量部にMC塩5重量部を添加してヘンシェル
ミキサーで混合し、この混合物を池貝(株)製PCM30の
2軸押出機で溶融混練し、ストランドを冷却後ペレタイ
ザーでペレタイズした。Comparative Example 1 Hexamethylenediamine adipate 1900 g, water 630 g
Was placed in a polymerization kettle and purged with nitrogen, and then polymerization was carried out in accordance with a usual polymerization method. Spinning was performed in a strand from the polymerization kettle and cut with a cutter to obtain pelletized polyamide resin. The pellet was vacuum dried at 80-100 ° C. for 16 hours. To 100 parts by weight of the dried pellets, 5 parts by weight of MC salt was added and mixed by a Henschel mixer, and the mixture was melt-kneaded by a twin-screw extruder of PCM30 manufactured by Ikegai Co., Ltd., and the strand was cooled and pelletized by a pelletizer.
ここで得られたペレットを80℃〜100℃真空下で16時間
乾燥した。この乾燥ペレットをシャーレに取りリサイク
ル使用時の乾燥条件を想定した140℃にコントロールさ
れているギアーオーブン(タバイMFG(株)製)に入れ3
0分、60分に取出しYI値を測定した。結果を表1に示し
た。The pellets obtained here were dried under vacuum at 80 ° C to 100 ° C for 16 hours. Put these dried pellets in a petri dish and put them in a gear oven (Tabay MFG Co., Ltd.) that is controlled at 140 ° C assuming the drying conditions for recycling 3
The YI value was taken out at 0 minutes and 60 minutes and measured. The results are shown in Table 1.
実施例1〜3 ヘキサメチレンジアミン・アジピン酸塩1900g、水630
g、次亜リン酸マンガンを表1に記載の添加量に従って
重合釜に入れて重合した以外は比較例1と同様に操作し
て耐熱安定性を評価し、表1に示す結果を得た。比較例
1に比べYI値が著しく低下し、耐熱安定性が向上した。Examples 1 to 3 Hexamethylenediamine adipate 1900 g, water 630
The heat resistance stability was evaluated in the same manner as in Comparative Example 1 except that g and manganese hypophosphite were added to the polymerization vessel according to the addition amount shown in Table 1 and polymerized, and the results shown in Table 1 were obtained. Compared to Comparative Example 1, the YI value was remarkably reduced and the heat stability was improved.
実施例4〜9 実施例1〜3の次亜リン酸マンガンに替えて次亜リン酸
ナトリウムを表1に記載の添加量に従って添加し重合釜
に入れて重合した以外は比較例1と同様に操作して耐熱
安定性を評価し、表1に示す結果を得た。いずれもYI値
が著しく低下し、耐熱安定性が向上した。Examples 4 to 9 Similar to Comparative Example 1 except that sodium hypophosphite was added according to the addition amount shown in Table 1 in place of manganese hypophosphite of Examples 1 to 3 and placed in a polymerization kettle for polymerization. The heat resistance stability was evaluated by operation, and the results shown in Table 1 were obtained. In each case, the YI value was remarkably reduced and the heat resistance stability was improved.
実施例10〜13 実施例1〜3の次亜リン酸マンガンに替えて表2の次亜
リン酸金属塩を表2に記載の添加量に従って添加し重合
釜に入れて重合した以外は比較例1と同様に操作して耐
熱安定性を評価し、表2に示す結果を得た。いずれもYI
値が著しく低下し、耐熱安定性が向上した。 Examples 10 to 13 Comparative Examples except that the manganese hypophosphite of Examples 1 to 3 was replaced by the metal hypophosphite of Table 2 according to the addition amount described in Table 2 and placed in a polymerization kettle and polymerized. The heat resistance stability was evaluated in the same manner as in 1, and the results shown in Table 2 were obtained. Both are YI
The value was significantly reduced, and the heat resistance stability was improved.
比較例2〜10 表3に記載の無機リン化合物および有機リン化合物を実
施例1〜3の次亜リン酸マンガンに替えて添加し重合し
た以外は比較例1と同様に操作して耐熱安定性を評価
し、表3に示す結果を得た。いずれも次亜リン酸金属塩
を上回る耐熱安定性を有するものはなかった。 Comparative Examples 2 to 10 Heat stability was performed in the same manner as in Comparative Example 1 except that the inorganic phosphorus compounds and organic phosphorus compounds shown in Table 3 were added instead of the manganese hypophosphite of Examples 1 to 3 and polymerized. Was evaluated and the results shown in Table 3 were obtained. None of them had a heat resistance stability higher than that of the metal hypophosphite.
比較例11〜12 ポリアミド樹脂の種類を6/66および610に替えて比較例
1と同様に操作して耐熱安定性を評価し、表4の結果を
得た。 Comparative Examples 11 to 12 The heat resistance stability was evaluated in the same manner as in Comparative Example 1 except that the type of polyamide resin was changed to 6/66 and 610, and the results in Table 4 were obtained.
実施例14〜17 ポリアミド樹脂と種類を6/66および610に替え、表4に
記載の次亜リン酸金属塩を添加して重合した以外は比較
例1と同様に操作して耐熱安定性を評価し、表4に示す
結果を得た。いずれも比較例に比しYI値が小さく耐熱安
定性に優れていることがわかる。Examples 14 to 17 The same heat treatment was performed as in Comparative Example 1 except that the polyamide resin and the types were changed to 6/66 and 610, and the metal hypophosphite shown in Table 4 was added and polymerized. It evaluated and obtained the result shown in Table 4. It can be seen that each of them has a smaller YI value than the comparative example and is excellent in heat resistance stability.
実施例18〜20 表5のマスターポリマーの欄に示した実施例のポリアミ
ド樹脂と次亜リン酸金属塩のポリアミド樹脂組成物をマ
スターポリマーとして用い、ポリアミド樹脂の種類の欄
に示したポリアミド樹脂(希釈用ポリマー)およびMC塩
を表5の割合でヘンシェルミキサーで混合し、この混合
物を池貝(株)製PCM30の2軸押出機で溶融混練し、ス
トランドを冷却後ペレタイザーでペレタイズした。ここ
で得られたペレットを以降比較例1と同様に操作して評
価し、表5の結果を得た。いずれもYI値の小さい耐熱安
定性のよいポリアミド樹脂組成物が得られた。 Examples 18 to 20 Using the polyamide resin composition of the examples shown in the column of master polymer in Table 5 and the polyamide resin composition of the metal hypophosphite as the master polymer, the polyamide resin shown in the column of type of polyamide resin ( (Diluting polymer) and MC salt were mixed in a ratio of Table 5 by a Henschel mixer, and this mixture was melt-kneaded by a PCM30 twin-screw extruder manufactured by Ikegai Co., Ltd., and the strand was cooled and pelletized by a pelletizer. The pellets obtained here were subsequently evaluated in the same manner as in Comparative Example 1, and the results shown in Table 5 were obtained. In all cases, a polyamide resin composition having a small YI value and good heat stability was obtained.
<発明の効果> 本発明のようにポリアミド樹脂、トリアジン系化合物難
燃剤、次亜リン酸金属塩よりなるポリアミド樹脂組成物
は耐熱安定性に優れ、特に空気雰囲気中での高温乾燥に
おいて、特にリサイクルされたポリアミド樹脂組成物の
着色を抑制する効果が顕著であるポリアミド樹脂組成物
を得ることが可能となった。 <Effects of the Invention> A polyamide resin composition comprising a polyamide resin, a triazine-based compound flame retardant, and a metal hypophosphite as in the present invention has excellent heat resistance stability and is particularly recycled in high-temperature drying in an air atmosphere. It is now possible to obtain a polyamide resin composition having a remarkable effect of suppressing the coloring of the polyamide resin composition.
Claims (1)
び、 (b)次亜リン酸アルカリ土類金属塩、次亜リン酸ナト
リウム、次亜リン酸アルミニウム、次亜リン酸カリウム
および次亜リン酸マンガンから選ばれる少なくとも1種
類の化合物を0.001〜5重量部を含有してなるポリアミ
ド樹脂組成物。1. A polyamide resin containing 100 parts by weight of (a) 1 to 20 parts by weight of a melamine / cyanuric acid flame retardant, and (b) an alkaline earth metal hypophosphite, sodium hypophosphite or hypophosphite. A polyamide resin composition comprising 0.001 to 5 parts by weight of at least one compound selected from aluminum phosphate, potassium hypophosphite and manganese hypophosphite.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1191926A JPH0796645B2 (en) | 1989-07-24 | 1989-07-24 | Polyamide resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1191926A JPH0796645B2 (en) | 1989-07-24 | 1989-07-24 | Polyamide resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0354252A JPH0354252A (en) | 1991-03-08 |
| JPH0796645B2 true JPH0796645B2 (en) | 1995-10-18 |
Family
ID=16282743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1191926A Expired - Lifetime JPH0796645B2 (en) | 1989-07-24 | 1989-07-24 | Polyamide resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0796645B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1333302A4 (en) * | 1999-12-24 | 2005-06-22 | Mitsubishi Rayon Co | FIBER OPTIC CABLE AND FIBER OPTIC CABLE WITH CONNECTOR |
| US6453104B1 (en) * | 1999-12-28 | 2002-09-17 | Mitsubishi Rayon Co., Ltd. | Optical fiber cable and optical fiber cable with plug |
| WO2005075566A1 (en) * | 2004-01-07 | 2005-08-18 | Italmatch Chemicals S.P.A. | Polyamide compositions flame retarded with aluminium hypophosphite |
| KR20120056254A (en) * | 2009-08-10 | 2012-06-01 | 인비스타 테크놀러지스 에스.에이.알.엘. | Improved nylon resins and process |
| CN103403076A (en) * | 2011-02-24 | 2013-11-20 | 罗地亚(中国)投资有限公司 | Use of calcium hypophosphite as a filler to improve the mechanical properties of polyamide compositions |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6042826B2 (en) * | 1977-12-31 | 1985-09-25 | 旭化成株式会社 | Phosphorus-containing flame-retardant resin composition |
| JPS61137773A (en) * | 1984-12-10 | 1986-06-25 | Fuji Photo Film Co Ltd | Thermal recording paper |
| JPS61280987A (en) * | 1985-06-07 | 1986-12-11 | Oji Paper Co Ltd | Thermal recording material |
| JPH0674348B2 (en) * | 1987-07-09 | 1994-09-21 | 住友化学工業株式会社 | Weather resistant resin composition |
| JPH0281670A (en) * | 1988-09-07 | 1990-03-22 | Kanzaki Paper Mfg Co Ltd | Thermal recording element |
-
1989
- 1989-07-24 JP JP1191926A patent/JPH0796645B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0354252A (en) | 1991-03-08 |
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