JPH079951B2 - Method for manufacturing semiconductor device - Google Patents
Method for manufacturing semiconductor deviceInfo
- Publication number
- JPH079951B2 JPH079951B2 JP28919286A JP28919286A JPH079951B2 JP H079951 B2 JPH079951 B2 JP H079951B2 JP 28919286 A JP28919286 A JP 28919286A JP 28919286 A JP28919286 A JP 28919286A JP H079951 B2 JPH079951 B2 JP H079951B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- semiconductor device
- circuit board
- mounting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 38
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 238000000034 method Methods 0.000 title claims description 8
- 238000007789 sealing Methods 0.000 claims description 8
- 239000011347 resin Substances 0.000 description 41
- 229920005989 resin Polymers 0.000 description 41
- 238000002347 injection Methods 0.000 description 13
- 239000007924 injection Substances 0.000 description 13
- 230000003287 optical effect Effects 0.000 description 8
- 238000000465 moulding Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Non-Volatile Memory (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、紫外線消去型プログラマブル・リード・オン
リ・メモリ（以下、EPROMという）素子やイメージセン
サ等の光半導体素子を実装してなる半導体装置の製造方
法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a semiconductor device including an ultraviolet erasable programmable read only memory (hereinafter referred to as EPROM) element and an optical semiconductor element such as an image sensor. The present invention relates to a manufacturing method of.
（従来の技術） 半導体装置に実装される光半導体素子のうち、例えばEP
ROM素子は紫外線照射により記憶情報の消去が可能なメ
モリであり、またイメージセンサに代表される光電変換
素子は光信号を電気信号に変換するものである。この種
の光半導体素子を実装した半導体装置として、例えば紫
外線の照射、あるいは光信号の受光のための窓部材を有
するセラミック製の中空パッケージを用い、さらに窓部
材を透光性アルミナや石英ガラス等で構成したものが知
られている。このような半導体装置はセラミック製のパ
ッケージに実装されているため、気密封止性に優れ信頼
性が高いという利点を有する反面、コスト高になるとい
う欠点がある。そこで樹脂製パッケージを用いた安価な
半導体装置の製造方法が種々提案されている。(Prior Art) Among optical semiconductor elements mounted on a semiconductor device, for example, EP
The ROM element is a memory in which stored information can be erased by irradiation of ultraviolet rays, and a photoelectric conversion element represented by an image sensor converts an optical signal into an electric signal. As a semiconductor device mounted with this type of optical semiconductor element, for example, a ceramic hollow package having a window member for irradiating ultraviolet rays or receiving an optical signal is used, and the window member is made of translucent alumina or quartz glass. It is known that it is composed of. Since such a semiconductor device is mounted in a ceramic package, it has an advantage of excellent airtight sealing and high reliability, but has a disadvantage of high cost. Therefore, various methods for manufacturing an inexpensive semiconductor device using a resin package have been proposed.
従来、この種の半導体装置の製造方法としては、特開昭
57−30351号公報に記載されるものがあった。以下、そ
の構成を図を用いて説明する。Conventionally, as a method of manufacturing a semiconductor device of this type, Japanese Patent Laid-Open No.
There was one described in Japanese Patent Publication No. 57-30351. The configuration will be described below with reference to the drawings.
第２図（ａ），（ｂ），（ｃ）は従来の半導体装置の一
製造方法例を示す工程図である。2 (a), (b), and (c) are process diagrams showing an example of a conventional semiconductor device manufacturing method.
この製造工程では、第２図（ａ）に示すように、素子搭
載部1aの周囲に複数本のリード部1bを有するリードフレ
ーム１を用意し、光で動作する光半導体素子、例えばEP
ROM素子２を素子搭載部1a上に固着し、さらにそのEPROM
素子２をワイヤ３によりリード部1bと接続した後、樹脂
封止用の金型４にセットする。この金型４は上部金型４
−１及び下部金型４−２を備え、その上部金型４−１に
は底面に凹部4aを有する上下動可能なスライド部4bが設
けられると共に、下部金型４−２の上面にも凹部4cが設
けられている。このような上部金型４−１と下部金型４
−２の間にリードフレーム１をセットした後、図示しな
いゲート部により樹脂５を注入して下部金型４−２の凹
部4c内に充填する。In this manufacturing process, as shown in FIG. 2 (a), a lead frame 1 having a plurality of lead portions 1b around an element mounting portion 1a is prepared, and an optical semiconductor element that operates by light, such as an EP, is prepared.
The ROM element 2 is fixed on the element mounting portion 1a, and the EPROM
After the element 2 is connected to the lead portion 1b by the wire 3, the element 2 is set in the resin-sealing die 4. This mold 4 is the upper mold 4
-1 and a lower die 4-2, the upper die 4-1 is provided with a vertically movable slide portion 4b having a depression 4a on the bottom surface, and a depression is also provided on the upper surface of the lower die 4-2. 4c is provided. Such an upper die 4-1 and a lower die 4
After setting the lead frame 1 between -2, the resin 5 is injected by a gate portion (not shown) to fill the concave portion 4c of the lower mold 4-2.
次に、第２図（ｂ）に示すように、樹脂５が充填される
時間を見はからってスライド部4bを上昇させ、図示しな
い他のゲート部より紫外線透過性の樹脂６を注入してス
ライド部4bの底面下に充填する。Next, as shown in FIG. 2 (b), the slide portion 4b is lifted in consideration of the time for the resin 5 to be filled, and the UV transparent resin 6 is injected from another gate portion (not shown). To fill below the bottom of the slide portion 4b.
樹脂5,6の固化後、リードフレーム１を金型４により取
り出し、そのリードフレーム１からリード部1bを切り離
すと共に、そのリード部1bの曲げ加工等を施せば、第２
図（ｃ）に示すような樹脂封止型の安価な半導体装置が
得られる。After the solidification of the resins 5 and 6, the lead frame 1 is taken out by the mold 4, the lead portion 1b is separated from the lead frame 1, and the lead portion 1b is bent and the like.
An inexpensive resin-sealed semiconductor device as shown in FIG. 3C is obtained.
このような半導体装置は、上方から紫外線を照射する
と、その紫外線が樹脂６を通してEPROM素子２上に入射
され、そのEPROM素子２に書込まれた情報が消去され
る。新たな情報はリード部1bを通してEPROM素子２に再
書込みを行うことが可能となる。When such a semiconductor device is irradiated with ultraviolet rays from above, the ultraviolet rays are incident on the EPROM element 2 through the resin 6 and the information written in the EPROM element 2 is erased. New information can be rewritten in the EPROM element 2 through the read section 1b.
（発明が解決しようとする問題点） しかしながら、上記の製造方法では、金型４の構造が複
雑になってしまい、成形加工が困難である他、樹脂注入
の装置も特種なものが必要であり、しかも注入の方法
も、最初に注入する樹脂５の充填時間の管理が難しく、
素子搭載部1aに樹脂５が回り込むおそれがあるので注入
圧力を高く設定できず、それによって気泡や未充填の発
生等といった問題点があった。また、窓部材として紫外
線透過性樹脂６を用いているが、その樹脂粒子の状態が
不均一であるため、透過光線の屈折率が変化し、信頼性
が低くなるという問題点もあった。(Problems to be Solved by the Invention) However, in the above-described manufacturing method, the structure of the mold 4 becomes complicated and the molding process is difficult, and a special resin injection device is required. Moreover, it is difficult to control the filling time of the resin 5 to be injected first, even with the injection method,
Since the resin 5 may wrap around the element mounting portion 1a, the injection pressure cannot be set high, which causes problems such as generation of bubbles and unfilling. Further, although the ultraviolet transmissive resin 6 is used as the window member, since the resin particles are in a non-uniform state, there is a problem that the refractive index of the transmitted light changes and the reliability becomes low.
本発明は前記従来技術が持っていた問題点のうち、金型
の構造の複雑化と、樹脂注入方法の困難性の点について
解決した半導体装置の製造方法を提供するものである。The present invention provides a method of manufacturing a semiconductor device, which solves the problems of the conventional technique, such as the complicated structure of the mold and the difficulty of the resin injection method.
（問題点を解決するための手段） 本発明は前記問題点を解決するために、素子搭載部の周
囲に回路パターンが形成されたプリント基板を用い、そ
の素子搭載部上に光により動作する半導体素子を固着し
その半導体素子を前記回路パターンの内方端部に接続す
ると共に、その回路パターンの外方端部に外部引出し用
のリードを接続する工程と、金型を用いて前記素子搭載
部を包囲するように前記プリント基板のリード接続箇所
を樹脂封止する工程と、前記素子搭載部上の半導体素子
を光透過性の窓部材で封止する工程とを、順次施すよう
にしたものである。(Means for Solving the Problems) In order to solve the above problems, the present invention uses a printed circuit board on which a circuit pattern is formed around an element mounting portion, and a semiconductor operated by light on the element mounting portion. The step of fixing the element and connecting the semiconductor element to the inner end of the circuit pattern, and connecting the lead for external drawing to the outer end of the circuit pattern; and the element mounting part using a mold. A step of resin-sealing the lead connection portion of the printed circuit board so as to surround and a step of sealing the semiconductor element on the element mounting portion with a light-transmissive window member. is there.
（作用） 本発明によれば、以上のように半導体装置の製造方法を
構成したので、半導体素子を搭載するプリント基板はそ
の樹脂成形時における素子搭載部側への注入樹脂の流入
を阻止するように働き、樹脂注入圧の高設定を可能にさ
せると共に、金型及び樹脂注入装置の構造を簡易化させ
る。また窓部材は成形樹脂と共に半導体素子を封止する
ように働く。従って前記問題点を除去できるのである。(Operation) According to the present invention, the method for manufacturing a semiconductor device is configured as described above, so that the printed circuit board on which the semiconductor element is mounted prevents the injection resin from flowing into the element mounting portion side during resin molding. This makes it possible to set the resin injection pressure at a high level and simplifies the structure of the mold and the resin injection device. The window member works together with the molding resin to seal the semiconductor element. Therefore, the above problems can be eliminated.
（実施例） 第１図（ａ），（ｂ），（ｃ）は本発明の一実施例を示
す半導体装置の製造工程図であり、以下それらの図面を
参照しつつ本実施例の製造方法を説明する。(Embodiment) FIGS. 1 (a), (b), and (c) are manufacturing process diagrams of a semiconductor device showing an embodiment of the present invention, and a manufacturing method of this embodiment will be described below with reference to the drawings. Will be explained.
（１）第１図（ａ）の工程 表面に素子搭載部10aとその周囲に形成された回路パタ
ーン10bとを有するプリント基板10を用意し、光により
動作する半導体素子、例えばEPROM素子11を素子搭載部1
0a上に固着し、さらにそのEPROM素子11をワイヤ12によ
り回路パターン10bの内方端部に接続した後、その回路
パターン10bの外方端部に、外部引出し用の複数本のリ
ード13を低温半田やスポットウエルド等の手段を用いて
電気的および機械的に接続する。(1) Step of FIG. 1 (a) A printed circuit board 10 having an element mounting portion 10a and a circuit pattern 10b formed around the element mounting portion 10a on the surface is prepared, and a semiconductor element that operates by light, for example, an EPROM element 11 is used as an element. Mounting part 1
After fixing the EPROM element 11 to the inner end of the circuit pattern 10b with a wire 12, the plurality of leads 13 for external drawing are attached to the outer end of the circuit pattern 10b at low temperature. Electrically and mechanically connect using a means such as solder or spot weld.
なお、回路パターン10bとリード13との接続は、EPROM素
子11の搭載前に行なってもよい。The circuit pattern 10b and the lead 13 may be connected before the EPROM element 11 is mounted.
（２）第１図（ｂ）の工程 上部金型14−１及び下部金型14−２を有する樹脂封止用
の金型14を用意する。上部金型14−１の底面には、EPRO
M素子11を収容するための凹部14aと、その凹部14aの外
周を包囲するように回路パターン10bとリード13の接続
箇所を収容するための枠状の溝14bと、凹部14aと溝14b
を分離する隔壁部14cとが形成されている。また下部金
型14−２の上面には、プリント基板10を収容する凹部14
dと、その外縁を包囲するように前記溝14bに対向配置さ
れた溝14eとが形成されている。そしてそれらの溝14b,1
4eには、図示されていないが樹脂注入口が連設されてい
る。(2) Step of FIG. 1 (b) A resin-sealing mold 14 having an upper mold 14-1 and a lower mold 14-2 is prepared. On the bottom of the upper mold 14-1, EPRO
A concave portion 14a for accommodating the M element 11, a frame-shaped groove 14b for accommodating a connection portion between the circuit pattern 10b and the lead 13 so as to surround the outer periphery of the concave portion 14a, a concave portion 14a and a groove 14b.
A partition portion 14c for separating the above is formed. Further, on the upper surface of the lower mold 14-2, a concave portion 14 for accommodating the printed circuit board 10 is formed.
d and a groove 14e that is arranged to face the groove 14b so as to surround the outer edge thereof are formed. And those grooves 14b, 1
A resin injection port (not shown) is continuously provided at 4e.
このような金型14を用い、その下部金型14−２の凹部14
dにプリント基板10をセットし、上方から上部金型14−
１の底面を接合すると、プリント基板10は上部金型14−
１の隔壁部14cと下部金型14−２の凹部14dとで金型14に
固定されている。その後、図示しない樹脂注入口から樹
脂15を注入すると、その樹脂15が上下の溝14b,14e内に
充填される。この際、溝14b,14bはプリント基板10及び
隔壁部14cによって上部金型14−１の凹部14aと遮断され
ているため、素子搭載部10aへの樹脂15の流入が防止さ
れる。Using such a mold 14, the recess 14 of the lower mold 14-2 is used.
Set the printed circuit board 10 on d, and press the upper mold 14-
When the bottom surface of No. 1 is joined, the printed circuit board 10 becomes the upper mold 14-
The first partition wall 14c and the recess 14d of the lower mold 14-2 are fixed to the mold 14. Thereafter, when the resin 15 is injected from a resin injection port (not shown), the resin 15 is filled in the upper and lower grooves 14b and 14e. At this time, the grooves 14b, 14b are blocked from the recess 14a of the upper mold 14-1 by the printed board 10 and the partition 14c, so that the resin 15 is prevented from flowing into the element mounting portion 10a.
（３）第１図（ｃ）の工程 樹脂15が固化した後、プリント基板10及びリード13を金
型14から取り出し、その樹脂15の上端開口部に、アルミ
ナ、石英ガラス等からなる光透過性の板状窓部材16を接
着剤17により封止固定する。その後、リード13の曲げ加
工等を施せば、中空の樹脂パッケージに実装された半導
体装置が得られる。(3) Step of FIG. 1 (c) After the resin 15 is solidified, the printed circuit board 10 and the leads 13 are taken out from the mold 14, and the resin 15 has a light-transmitting property made of alumina, quartz glass or the like at the upper end opening. The plate-shaped window member (16) is sealed and fixed with an adhesive (17). After that, the leads 13 are bent to obtain a semiconductor device mounted in a hollow resin package.
本実施例では次のような利点を有する。This embodiment has the following advantages.
プリント基板10の素子搭載部10a上にEPROM素子11を搭載
し、その素子搭載部10aを露出させかつ素子搭載部10aへ
樹脂15が流入しないような構造の金型14を用いて、プリ
ント基板10を包み込むように樹脂成形を行った後、窓部
材16により封止を行うため、金型14の構造も従来と比較
して簡単であり、さらに樹脂注入の装置も一般に用いら
れているものと同程度のもので充分である。また樹脂成
形の際に素子搭載部10aには金型14の構造上、樹脂15が
流入しないため、樹脂15の注入圧力を高く設定すること
ができ、それによって気泡の発生や未充填状態の問題も
解決できる。従って低価格で量産性に優れた高品質の半
導体装置の提供が可能となる。The EPROM element 11 is mounted on the element mounting portion 10a of the printed board 10, and the die 14 having a structure that exposes the element mounting portion 10a and prevents the resin 15 from flowing into the element mounting portion 10a is used. Since the resin is molded so as to wrap it, the window member 16 is used for sealing, so that the structure of the mold 14 is simpler than the conventional one, and the resin injection device is the same as that generally used. Something is enough. In addition, since the resin 15 does not flow into the element mounting portion 10a during resin molding due to the structure of the mold 14, the injection pressure of the resin 15 can be set high, which causes problems such as generation of bubbles and unfilled state. Can also be solved. Therefore, it is possible to provide a high-quality semiconductor device that is low in price and excellent in mass productivity.
なお、本発明は図示の実施例に限定されず、種々の変形
が可能である。その変形例としては、例えば次のような
ものがある。The present invention is not limited to the illustrated embodiment, and various modifications can be made. The following are examples of such modifications.
（ｉ）上記実施例では下部金型14−２に凹部14dを設け
たため、プリント基板10の裏面が外部に露出している。
機械的強度をより大きくするために、第３図のような変
形例も採用できる。(I) In the above embodiment, since the lower mold 14-2 is provided with the recess 14d, the back surface of the printed circuit board 10 is exposed to the outside.
In order to increase the mechanical strength, a modified example as shown in FIG. 3 can be adopted.
すなわち、前記第１図（ａ）の工程において、プリント
基板10の裏面に樹脂部材18を固着しておき、その後第１
図（ｂ）の工程において、金型14を用いて樹脂封止を行
えば、プリント基板10の裏面が樹脂部材18でおおわれて
外部に露出しない。これにより機械的強度や水分等の阻
止力をより向上させることができる。また下部金型14−
２にプリント基板収容用の凹部14dを設ける必要もな
い。That is, in the step of FIG. 1 (a), the resin member 18 is fixed to the back surface of the printed circuit board 10, and then the first
In the step of FIG. 2B, if the mold 14 is used for resin sealing, the back surface of the printed circuit board 10 is covered with the resin member 18 and is not exposed to the outside. This makes it possible to further improve the mechanical strength and the stopping power of water and the like. Also lower mold 14-
It is not necessary to provide the concave portion 14d for accommodating the printed circuit board in 2.
（ii）半導体素子としてEPROM素子11を用いた場合、必
ずしも板状の窓部材16を用いる必要はなく、ポッティン
グ等の手段を用いて紫外線透過性樹脂により封止を行っ
てもよい。(Ii) When the EPROM element 11 is used as the semiconductor element, the plate-shaped window member 16 does not necessarily have to be used, and it may be sealed with an ultraviolet-transparent resin using a means such as potting.
（iii）半導体素子としてはEPROM素子11の他、イメージ
センサに代表される光電変換素子等の他の光半導体素子
を用いることもできる。(Iii) As the semiconductor element, in addition to the EPROM element 11, other optical semiconductor elements such as a photoelectric conversion element represented by an image sensor can be used.
（発明の効果） 以上詳細に説明したように、本発明によれば、プリント
基板上に半導体素子を搭載し、そのプリント基板を包み
込むように金型を用いて樹脂成形した後、窓部材で半導
体素子を封止したので、金型や樹脂注入装置は簡単な構
造のものでよく、さらに樹脂注入圧を高くして気泡の発
生や未充填状態を防止でき、それによって低価格、高品
質かつ量産性に優れる半導体装置の提供が可能となる。
また従来まったく不可能であった光素子の樹脂成形パッ
ケージへの搭載も、本発明を用いれば容易に行える。(Effects of the Invention) As described in detail above, according to the present invention, a semiconductor element is mounted on a printed circuit board, resin molding is performed using a mold so as to wrap the printed circuit board, and then a semiconductor is formed using a window member. Since the element is sealed, the mold and resin injection device can have a simple structure. Furthermore, the resin injection pressure can be increased to prevent the generation of bubbles and the unfilled state, which results in low cost, high quality and mass production. It is possible to provide a semiconductor device having excellent properties.
Further, mounting of an optical element on a resin molded package, which has never been possible in the past, can be easily performed by using the present invention.
第１図（ａ），（ｂ），（ｃ）は本発明の実施例を示す
半導体装置の製造工程図、第２図（ａ），（ｂ），
（ｃ）は従来の半導体装置の製造工程図、第３図は第１
図の変形例を示す図である。 10……プリント基板、10a……素子搭載部、10b……回路
パターン、11……EPROM素子（半導体素子）、13……リ
ード、14……金型、14−１……上部金型、14−２……下
部金型、14a……凹部、14b,14e……溝、15……樹脂、16
……窓部材、18……樹脂部材。1 (a), (b), and (c) are manufacturing process drawings of a semiconductor device showing an embodiment of the present invention, and FIGS. 2 (a), (b), and
FIG. 3C is a manufacturing process diagram of a conventional semiconductor device, and FIG.
It is a figure which shows the modification of a figure. 10 ... Printed circuit board, 10a ... Element mounting part, 10b ... Circuit pattern, 11 ... EPROM element (semiconductor element), 13 ... Lead, 14 ... Mold, 14-1 ... Upper mold, 14 -2 ... Lower mold, 14a ... Recess, 14b, 14e ... Groove, 15 ... Resin, 16
…… Window member, 18 …… resin member.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 29/792 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display location H01L 29/792
Claims (1)
れたプリント基板を用い、 その素子搭載部上に光により動作する半導体素子を固着
しその半導体素子を前記回路パターンの内方端部に接続
すると共に、その回路パターンの外方端部に外部引出し
用のリードを接続する工程と、 金型を用いて前記素子搭載部を包囲するように前記プリ
ント基板のリード接続箇所を樹脂封止する工程と、 前記素子搭載部上の半導体素子を光透過性の窓部材で封
止する工程とを、 順次施したことを特徴とする半導体装置の製造方法。1. A printed circuit board on which a circuit pattern is formed around an element mounting portion, a semiconductor element that operates by light is fixed on the element mounting portion, and the semiconductor element is attached to an inner end portion of the circuit pattern. A step of connecting and connecting leads for external drawing to the outer end of the circuit pattern, and a lead-molded portion of the printed circuit board is resin-sealed so as to surround the element mounting part using a mold. A method for manufacturing a semiconductor device, which comprises sequentially performing the steps and the step of sealing the semiconductor element on the element mounting portion with a light-transmissive window member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28919286A JPH079951B2 (en) | 1986-12-04 | 1986-12-04 | Method for manufacturing semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28919286A JPH079951B2 (en) | 1986-12-04 | 1986-12-04 | Method for manufacturing semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63142659A JPS63142659A (en) | 1988-06-15 |
| JPH079951B2 true JPH079951B2 (en) | 1995-02-01 |
Family
ID=17739965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28919286A Expired - Lifetime JPH079951B2 (en) | 1986-12-04 | 1986-12-04 | Method for manufacturing semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH079951B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016217002A (en) * | 2015-05-20 | 2016-12-22 | 前澤化成工業株式会社 | Casing |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0727631Y2 (en) * | 1989-05-23 | 1995-06-21 | 東芝ケミカル株式会社 | Semiconductor package structure |
| EP0734590A1 (en) * | 1994-10-14 | 1996-10-02 | National Semiconductor Corporation | Integrated circuit package assembly including a window and methods of manufacturing |
| JP7218126B2 (en) * | 2018-08-30 | 2023-02-06 | キヤノン株式会社 | Units, modules and devices with circuit boards |
-
1986
- 1986-12-04 JP JP28919286A patent/JPH079951B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016217002A (en) * | 2015-05-20 | 2016-12-22 | 前澤化成工業株式会社 | Casing |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63142659A (en) | 1988-06-15 |
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| EXPY | Cancellation because of completion of term |