JPH079967B2 - High power hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To enable a device small in thickness and excellent in operability to be offered by a method wherein two boards are arranged confronting each other through the intermediary of a casing so as to keep the surface of one of the boards exposed, and a power lead terminal fixed to one of the boards in led out along the surface of the casing. CONSTITUTION:Metal boards 1a and 1b are structured into one piece with a casing 4 interposing a casing 4 between them so as to keep the surface of the control board 1a out of the boards 1a and 1b exposed, and a power lead terminal 3b fixed to the other board 1b is led out along the surface of the connecting member 12 of the casing 4, whereby a high output power hybrid integrated circuit device where a lead terminal 3b is not protrudent can be offered. In result, a high output power hybrid integrated circuit device which is small in thickness and excellent in operability can be realized.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a high output hybrid integrated circuit device in which a high output circuit board and a control circuit board for controlling the same are integrated via a case member. More specifically, the present invention relates to a package structure of a high power hybrid integrated circuit device.

(B) Conventional technology Generally, a power semiconductor device is used for power drive control of an outdoor unit of an inverter air conditioner. In this type of conventional power semiconductor device, a power circuit to which a power semiconductor element is connected is used. The board and the control circuit board to which various electric parts are connected are separately and independently arranged on the control panel or the like. For this reason, it has been difficult to miniaturize the device and to make the module form easily replaceable.

Therefore, in recent years, in order to solve the above-mentioned problems, there is a power semiconductor device in which a power circuit board and a control circuit board are integrated in one package.

FIG. 7 is a sectional view showing, for example, one conventional power semiconductor device.

As shown in FIG. 7, the electric power circuit board (51) and the control circuit board (52) are provided, and the electric power circuit board (51) has an inner injection resin (such as silicon gel) inside the molding resin outer frame (54). 56)
And the control circuit board (52) is fitted into the molding resin outer frame (54) and fixed by injecting and curing the sealing resin (58) such as epoxy resin. ) (52) are laminated and held in parallel with each other on the molding resin outer frame (54). And power circuit board (51)
A power semiconductor element (110) such as a transistor or a diode is provided on the wiring pattern formed on the control circuit board (5).
2) Various electrical components (11
2) are connected respectively. Furthermore, power circuit boards (51)
An external input / output terminal (114) is soldered to this, and the external input / output terminal (114) is led out to the upper part through the sealing resin (58) and the control circuit board (52). In addition, the control circuit board (52) has an external connector (11
6) is connected, and this external connection connector (116) is fixed by a sealing resin (58) and protrudes upward. The power circuit board (51) and the control circuit board (52) are electrically connected to each other by a board connection connector (118).

(C) Problems to be Solved by the Invention The conventional power semiconductor device described above has the following various problems.

First of all, although such a power semiconductor device could realize a miniaturization and a replaceable module form, a power circuit board (5
Internal injection resin (56) between 1) and control circuit board (52)
And the sealing resin (58), the semiconductor element for power (11) arranged on the power circuit board (51).
The heat generated from (0) is transmitted to various electric components (112) arranged on the control circuit board (52) through the internal injection resin (56) and the sealing resin (58), and therefore various electric components are generated. The (112) is affected by heat and its characteristics are changed to cause malfunction, which is a major cause of restriction of the power circuit formed on the power circuit board (51). Therefore, there is a big problem that a device compatible with high power circuits in the 50A to 200A class cannot be realized.

Next, since the control circuit board (52) is formed of a resin-based board and the electric component (112) mounted on the board (52) is arranged on the upper surface side, noise resistance is improved. Since it is extremely bad, malfunctions due to noise occur.

Furthermore, the power circuit board (51) and the control circuit board (52) are connected to each other by first fixing the power circuit board (51) to the outer frame (54) and previously fixing the connector on the board (51). (11
8) has to be projected onto the surface of the substrate (52) and the protruding portion has to be soldered, resulting in a problem that workability and reliability are significantly reduced and automation cannot be performed.

Further, since all the terminals of the input / output terminal (114) and the connector (116) are projected in the upper surface direction from the main body, there is a problem that the stacking at the time of completion cannot be performed and the packing work efficiency is reduced.

(D) Means for Solving the Problems The present invention has been made in view of the above-described problems, and includes two metal substrates that are arranged to face each other so that the surface of at least one substrate is exposed, and the both substrates. A plurality of control system circuit elements connected to a conductive path of a desired shape formed above and the conductive paths on the one substrate, and a plurality of power system circuit elements connected to the conductive paths on the other substrate. And a case member for fixing and integrating the two substrates together, the power lead terminal fixed to at least one side edge of the other substrate is extended along the surface of the case member and led out. It is characterized by that.

(E) Action As described above, according to the present invention, the two metal substrates are arranged so as to face each other with the case member interposed therebetween so as to expose the surfaces of the two substrates.
The lead terminal for power fixed on the other substrate is led out to the outside along the surface of the case material, so that the lead terminal is provided even though it is a high output hybrid integrated circuit device including a power circuit and a control circuit. It is possible to provide a high-output hybrid integrated circuit device having no protruding portion. As a result, it is easy to handle, and the external connection part of the power lead terminal can be arbitrarily arranged on the side surface or the top surface side of the device. Depending on the mounting location, the connection position of the power lead terminal can be set in one device. Can be different.

Further, in the high-output hybrid integrated circuit device of the present invention, the one in which the circuit elements such as control system transistors, ICs, chip capacitors, and chip resistors are chip-shaped is used on one of the substrates whose surface is exposed. Therefore, it is possible to provide a highly integrated control board.

Furthermore, since the two substrates are connected at their respective peripheral edge portions, there is an advantage that the two substrates can be connected very easily.

Furthermore, since the back surfaces of both substrates are exposed and the respective circuit elements are arranged so as to face each other, the effect of shielding external noise is significantly improved.

(F) Embodiment Hereinafter, the high output hybrid integrated circuit device of the present invention will be described in detail based on the embodiment shown in FIGS.

FIG. 1 is a sectional view showing a high-power hybrid integrated circuit device of the present invention, FIG. 2 is a plan view, and FIG. 3 is a front view.

As shown in FIGS. 1 to 3, the high output hybrid integrated circuit device of the present invention includes two metal substrates (1a) and (1b) and a plurality of metal substrates (1a) and (1b) mounted on both substrates. Control system and power system circuit elements (2a) (2b), small signal and power lead terminals (3a) (3b) fixed to the peripheral edges of both boards (1a) (1b), and It is composed of a case member (4) that separates and adheres the substrates (1a) and (1b) to each other.

As the metal substrate, for example, an aluminum substrate having a thickness of 0.5 to 5.0 mm is used. Aluminum oxide film (alumite layer) is formed on the surface of both substrates (1a) and (1b) by well-known anodic oxidation.
Is formed, and an insulating resin layer such as epoxy or polyimide having a thickness of 10 to 70 μm is attached to the one main surface side. Further, a copper foil having a thickness of 10 to 105 μm is adhered to the insulating resin layer at the same time as the insulating resin layer by means such as a roller or a hot press.

Noble metal (gold, silver, platinum) plating layer is formed by exposing a conductive path of a desired shape by screen printing on the copper foil surface provided on one main surface of both substrates (1a) and (1b) and masking it with a resist. Is plated on the copper foil surface. After that, the resist is removed and the copper foil is etched using the noble metal plating layer as a mask to form a desired conductive path. Here, since the fineness of the conductive path by screen printing is 0.5 mm at the limit, when a fine wiring pattern is required, it is possible to form the fine conductive path up to about 2 μ rule by the well-known photo-etching technique.

FIG. 4 is a plan view of one of the two substrates (1a) and (1b) (1a) formed by using the above-described technique, that is, the control circuit board. As is clear from FIG. On one substrate (1a), a conductive path (5a) for control, that is, for a signal line is formed on substantially the entire surface of the substrate (1a). Its conduction path (5
A plurality of lead fixing pads (6a) are provided on the peripheral end of the substrate (1a) on which a) is extended. A small signal lead terminal (3a) for connecting to an external circuit is fixed to a pad (6a) provided on the opposing peripheral ends of the substrate (1a). Although this lead terminal (3a) is not clarified from each figure, the tip portion of the lead terminal (3a) is arranged so as to be upward from the horizontal direction, and the tip portion of the lead terminal (3a) is arranged on one substrate (1a). It is designed so that it does not protrude from the exposed surface (opposite surface) of the substrate. A fixing pad (6a ') provided on the other side of one substrate (1a) is a fixing pad for connecting to the other substrate (1b) described later.

Chip-shaped circuit elements (2a) such as transistors, ICs, chip capacitors, and chip resistors that do not generate heat are mounted on a substrate (1a) of the control system described above in a die shape at predetermined positions.

On the other hand, Fig. 5 is a plan view of the other substrate (1b), that is, a power output substrate. As shown in Fig. 5, a thick conductive path (5b) for power is mainly provided on the substrate (1b). Has been formed. A plurality of pads (6b) for fixing power lead terminals are provided on one peripheral edge of the substrate (1b) extending from the conductive path (5b), and the power lead terminals (3b) are provided on the pads (6b). )
Is stuck. Further, not only the power conductive path (5b) but also a part of the signal conductive path is formed on the other substrate (1b), and the tip of the conductive path has a power lead terminal (3b). Are formed to extend on the opposite side to which they are fixed and serve as pads (6b ') connected to the connection pads (6a') of the one substrate (1a) described above.

On the other substrate (1b), there are mounted power elements such as power transistors, power MOSs, and IGBTs, and a plurality of circuit elements (2b) that should constitute a power-system protection circuit including a large current detection resistor. There is. Needless to say, what is required for the power element is mounted on the substrate (1b) via a so-called heat sink material (7) such as Cu or Invar.

The thickness of the copper foil of the other substrate (1b) in this example was 105
Because of μ, it is possible to pass a large current of 100A to 200A class with minimum heat generation.

The power lead terminal (3b) fixed on the other substrate (1b) is fixed to the fixing pad (6b) as shown in FIGS. 1 and 2, and is temporarily led out in the horizontal direction and then at a predetermined position. It is bent and formed. The bent portion is bent along the surface of the case member (4) described later, but in this embodiment, the bent portion is formed so as to form a substantially right angle.

By the way, the size of the other board (1b) of the power system of the two boards (1a) and (1b) is taken into consideration at the time of designing so as to be larger than one board (1a) of the control system. These two substrates (1a) and (1b) are fixed and integrated by a case material (4) with a predetermined gap so that the circuit elements (2a) and (2b) face each other.

The case member (4) used in this embodiment will be described with reference to FIGS. 6A to 6C.

6A is a front view of the case member (4), FIG. 6B is a plan view,
FIG. 13C is a bottom view.

As shown in FIGS. 6A to 6C, the case member (4) includes a frame portion (10) formed in a frame shape for separating the two substrates (1a) and (1b), and a frame portion (10). A wing-shaped engaging portion (11) led out from both ends and an external connecting member (12) which is in substantial contact with the power lead terminal (3b) and is connected to an external circuit are mainly constituted.

Further, in the case material (4) of the present embodiment, in addition to the above-mentioned main constituent parts, a projection (13) forming a region for connecting both substrates (1a) (1b) and a case material (4) after injection molding are formed. A reinforcing portion (19) for preventing distortion (warpage) is formed integrally with the case material (4).

The characteristic of the case material (4) is the external connection member (12). That is, the external connecting member (12) is provided on each of the vertical surface and the horizontal surface of the case member (4) so that the connecting portion of the power lead terminal (3b) is set on the side surface and the upper surface of the device, respectively. The (12) is provided with a hole (19 ') into which a nut for screwing is inserted.

Further, the plurality of external connection members (12) are partitioned into blocks by slits (14 ') having a predetermined depth. An insulator (not shown) is inserted into the slit (14 ') and is designed so that it can be used to maintain a constant insulation distance between adjacent power lead terminals.

Both substrates (1a) and (1b) are integrated with the case member (4) by using the case member (4).

One board (1a), which is a control system circuit board, is arranged on the upper surface side of the case material (4), and the other board (1b), which is a power system circuit board, is arranged on the lower surface side of the case material (4). It is considered that the circuit elements (2a) and (2b) mounted on the substrates (1a) and (1b) face each other. By the way, the case material (4) and the respective substrates (1a) and (1b) are adhered to each other by an adhesive sheet (J sheet: product name), which is fixed and integrated by a heat press bonding method.

Both boards (1a) (1b) integrated with the case material (4) are
They are electrically connected to each other in the space formed by the projecting portion (13) of the case material (4) and the peripheral end portions of both substrates (1a) and (1b). There are several methods for connecting the film, such as a film and a metal lead. In this embodiment, the metal lead (15) is used for connection. Both boards (1a) (1
After connecting b), the above-mentioned space is filled with an epoxy type sealing resin (17) to protect the respective connection areas. In addition, since it is necessary to fill the resin (17) in the space formed by both the substrates (1a) (1b) and the protrusion (13), the substrate peripheral edges of both the substrates (1a) (1b) are substantially Designed to match.

As shown in FIG. 2, the small signal lead terminal (3a) derived from one of the substrates (1a) arranged on the upper surface of the case member (4) is arranged on the upper surface side and its lead terminal ( 3a)
As shown in FIG. 3, the tip of the substrate does not protrude from the surface of the substrate (1a).

On the other hand, the power lead terminal (3b) fixed to the other substrate (1b) arranged on the lower surface of the case member (4) is connected to the outside of the case member (4) as shown in FIGS. It is bent and arranged along the member (12). In this embodiment, it is designed such that the connecting portion of the lead terminal (3b) is arranged on the vertical surface side of the case material (4), that is, on the intermediate portion of both substrates (1a) and (1b). External connection member (12) for case material (4)
Since the nut (16) is already placed in the hole (13 ′) of the nut, the nut (16) is bent and the lead terminal (3
It will be sealed by b). Needless to say, the lead terminal (3b) is provided with a hole, and the screw (18) is inserted into the hole and fastened with the screw (18) and the nut (16). 3b) and the external circuit are connected.

In the present embodiment, the external connection portion of the power lead terminal (3b) is provided between both substrates (1a) and (1b) as described above, but in the case material (4) of this embodiment, one of Board (1a)
It can be set by bending and arranging the connecting portion of the lead terminal (3b) also on the front surface side, that is, the upper surface side.

In this embodiment, the mother substrate (20) serving as the third substrate is fixedly integrated with the surface of the other substrate (1b).

A metal substrate is used for the mother substrate (20) for the purpose of improving heat dissipation and insulating properties, and an insulating resin layer (not shown) such as a polyimide resin is provided on the main surface thereof. There is. As is apparent from FIG. 1, this mother substrate (20) is formed larger than the other substrate (1b), and is housed in the case member (4) like the two substrates (1a) and (1b).

That is, the mother substrate (20) is arranged in the area indicated by the alternate long and short dash line as shown in FIG. 6C (a diagram showing the bottom surface of the case member). At this time, since the mother board (20) is position-controlled by the wing-shaped locking portions (11) provided at both ends of the case material (4), the other board (1b) and the mother board (20) are
There is no possibility of causing a problem such as a positional deviation when fixing and.

When the mother board (20) and the other board (1b) are fixed and integrated with the case material (4), the mother board (20) and the case material (4) are connected as shown in FIGS. 1 and 3. Material (12)
Epoxy-based encapsulation resin in the space formed by (17)
Is filled, and the fixed connection portion of the power lead terminal (3b) is sealed and protected.

According to the present invention, the two metal substrates (1a) and (1b) are integrated with the case member (4) so as to expose the surface of one substrate (1a) of the control system, and the other substrate By leading the power lead terminal (3b) fixed to (1b) to the outside along the surface of the connecting member (12) of the case member (4),
It is possible to provide a high-output hybrid integrated circuit device in which the lead terminals (3b) do not protrude.

As a result, it is possible to realize a high-power hybrid integrated circuit device which is thin and which is extremely easy to handle.

(G) Effects of the Invention As described above in detail, according to the present invention, both substrates (1a)
Since the lead terminals (3a) and (3b) fixed to (1b) do not project, it is possible to provide a thin device having excellent handleability.

Next, according to the present invention, there is an advantage that the connection portion of the power lead terminal (3b) with the external circuit can be selected by using the same case material (4) for the side surface and the upper surface depending on the mounting location.

Furthermore, according to the present invention, since the substrate surface of one substrate (1a) is arranged to be exposed, the other substrate (1a) for power (1
The influence of heat from b) is significantly reduced compared to the conventional structure. As a result, the other substrate (1b)
Even if a circuit for large output is formed on the circuit, the reliability of the circuit element (2a) provided on one substrate (1a) of the control system can be improved by heat.

Further, according to the present invention, since the chip-shaped circuit elements (2a) and (2b) are mounted on both substrates (1a) and (1b), a highly integrated hybrid integrated circuit device for high output is provided. be able to.

[Brief description of drawings]

1 is a sectional view showing the present invention, FIG. 2 is a plan view of FIG. 1, FIG. 3 is a front view of FIG. 1, and FIGS. 4 and 5 are plan views of a substrate. A to C are views showing a case material used in this embodiment, and FIG. 7 is a sectional view showing a conventional example. (1a) and (1b) are substrates, (2a) and (2b) are circuit elements, and (3a)
(3b) is a lead terminal, (4) is a case material, (5a) (5b)
Is a conductive path, (6a) and (6b) are lead terminal fixing pads,
(7) is a heat sink, (10) is a frame part, (11) is a locking part, (12) is an external connection member, (13) is a protruding part, (14) is a reinforcing part, and (15) is a metal lead. , (16) is a nut, (1
7) is a sealing resin, (18) is a screw, and (20) is a mother board.

Claims (5)

[Claims] 1. Two metal substrates, which are arranged so as to face each other so that the surface of at least one of the substrates is exposed, a conductive path of a desired shape formed on the both substrates, and a conductive path on the one substrate. A plurality of control system circuit elements, a plurality of power system circuit elements connected to a conductive path on the other substrate, and a case member that fixes and integrates the two substrates, and at least the other substrate A hybrid integrated circuit device for high output, characterized in that lead terminals for power fixed to one side edge are extended and led out along the surface of the case material. 2. The high power hybrid integrated circuit device according to claim 1, wherein the conductive path is made of copper foil. 3. The high output hybrid integrated circuit device according to claim 1, wherein the other substrate is larger than the one substrate, and the respective substrates are electrically connected to each other. 4. A high output hybrid integrated circuit device according to claim 3, wherein the peripheral edges of the respective substrates electrically connected to each other are substantially coincident with each other. 5. The high output hybrid integrated circuit device according to claim 1, wherein the power lead terminal is bent upward.