JPH0799700B2 - Thermocompression bonding member and manufacturing method thereof - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermocompression-bonding connecting member, and more particularly to a display body such as a liquid crystal display (LCD), electroluminescence (EL), light emitting diode (LED), electrochromic display (ECD) and plasma display. The present invention relates to a thermocompression-bonding connecting member used for connecting between a connection terminal and a circuit board on which a driving part thereof is mounted, or a board of various electric circuits, and a manufacturing method thereof.

[0002]

2. Description of the Related Art Conventionally, LCD, EL, LED, EC
Display devices such as D and plasma displays, rigid printed wiring boards (PCB), flexible printed circuit boards (FP)
A thermocompression-bonding connecting member is used for connection with C) or between PCB and FPC.

As for this conventional thermocompression-bonding connecting member, as shown in FIG. 3, a desired conductive line pattern 12 is formed on the insulating flexible base material 11 with a conductive paste, and the desired conductive line pattern 12 is formed thereon. It is known that a conductive particle 13 and an anisotropic conductive adhesive layer 15 obtained by dispersing the conductive particle 13 in an insulating adhesive 14 are provided (Japanese Patent Publication No. 55-38073 and Japanese Patent Publication No. 58-56996). (Refer to the official gazette), the conductive line pattern 17 is formed on the insulating flexible base material 16 as shown in FIG.
It is also proposed that a conductive paste containing 18 dispersed therein is provided, and an insulating adhesive 19 is provided on the conductive paste.
62-500828, JP-A-62-154746). In addition,
In FIG. 3 and FIG. 4, a is an electrode to be connected which faces.

[0004]

However, in recent years, electricity,
With the downsizing and precision of electronic equipment, the pitch of connection terminals required for this thermo-compression bonding connecting member is in the 0.3 mm range, 0.2 mm
Since the table is becoming finer, the type in which the conductive particles are dispersed in the insulating adhesive as shown in FIG. 3 has a drawback that the conductive line patterns are easily short-circuited by the conductive particles. There is.

Further, this conductive line pattern is usually formed by screen printing, but this becomes more difficult to print as the pitch becomes finer, and the passability of the conductive paste to the screen openings and screen mesh deteriorates. In particular, an insulating flexible base material as shown in FIG.
In the type in which the desired conductive line pattern 17 is formed with a conductive paste in which the conductive particles 18 are dispersed and mixed, the conductive particles mixed in the conductive paste further deteriorates the printability, so that it is necessary to reduce the pitch in recent years. However, it is not possible to cope with this. Further, since the conductive line pattern contains conductive particles, when the line is bent, the line is easily cracked and the line is easily broken.

[0006]

SUMMARY OF THE INVENTION The present invention relates to a thermocompression-bonding connecting member and a method for manufacturing the same, which solves the above disadvantages and disadvantages. The thermocompression-bonding connecting member includes a flexible base material and a flexible base material. At least in the region where the conductive line pattern is to be formed on the conductive substrate, particles fixed by using an insulating organic polymer substance as a binder, and a conductive line pattern formed by printing a conductive paste on the particles, and the conductivity thereof. It is characterized by comprising an insulating adhesive layer formed on at least a joint portion of the line pattern with the circuit board to be connected, and this manufacturing method forms at least the conductive line pattern of the flexible base material. Particles are fixed to the area to be used by using an insulating organic polymer substance as a binder, and a conductive paste is printed on the particles by screen printing to form a conductive pattern. And then, it is characterized in that it comprises the step of forming an insulating adhesive layer at least at the junction of the the connected circuit board on the conductor line pattern.

Namely, the present inventors have results of various investigations on means for solving the problems described above, in the electric connection structure between the various connecting pin and the conductive line pattern, a connection terminal which has been indispensable to date without use of conductive particles responsible for electrical connection to the conductive line pattern separately, irregularities provided in advance fixed to the flexible substrate to form the conductive line pattern this particle, a conductive paste over the It has been found that if printing is carried out so that the coating of the conductive paste for coating the particles is projected and the connection terminals are directly contacted and connected, it is possible to secure conductivity with high reliability after the connection. Research was also conducted to complete the present invention. This will be described in more detail below.

[0008]

The present invention relates to a thermocompression-bondable connecting member and a method for manufacturing the same, wherein the thermocompression-bonding connecting member is formed with at least a conductive line pattern on a flexible base material. Conductive or insulating particles having an insulating organic polymer substance fixed as a binder at a desired portion, a conductive line pattern formed by printing a conductive paste on the particles, and at least a connection target on the conductive line pattern It is characterized by comprising an insulating adhesive layer formed in a joint portion with a circuit board, according to this, having a highly reliable electrical conductivity after connection by heating, pressure, This provides an advantage that a thermocompression-bonding connecting member that can handle a fine pitch can be obtained easily and at low cost.

In the thermocompression-bonding connecting member of the present invention, particles mixed and dispersed in an insulating organic polymer substance as a binder are applied to the surface of a flexible substrate and fixed, and then a conductive paste is applied thereto. It is made by applying it by screen printing to form a conductive line pattern on it, and then applying an insulating adhesive to it.
It has the configuration shown in FIG. FIG. 1 is a vertical sectional view of a thermocompression bonding connecting member of the present invention, and FIG.
A plan view of what is connected to the O connection terminal, FIG.
(C) is a vertical cross-sectional view of an ITO connection terminal thermocompression bonded thereto, which shows that the surface of the flexible substrate 1 is covered with the insulating organic polymer substance 3 and the solvent. After the particles 2 are mixed and dispersed in the above solution and the particles 2 are fixed, a conductive paste is applied to the solution to form a conductive line pattern 4, and an insulating adhesive is applied on the conductive line pattern 4. The agent layer 5 is applied.

When this thermocompression-bonding connecting member is used, it is thermocompression-bonded to an ITO connecting terminal or the like and PCB, FP
C and the like are electrically connected to each other, which is, for example, I as shown in FIGS. 2 (a), (b) and (c).
It is sufficient to place the TO connection terminal and heat and pressurize it.
In this way, the ITO connection terminal can be electrically connected easily and surely.

The flexible base material used in the present invention is not particularly limited, but as for this, polyimide, polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, polycarbonate, polyphenylene sulfide, poly-1,4. Examples include heat-resistant polymer films having a thickness of 10 to 50 μm selected from cyclohexanedimethylene terephthalate, polyarylate, liquid crystal polymers and the like, and metal foils having an equivalent thickness. (However, it is desirable that an electrically conductive material such as a metal foil be made electrically insulating by interposing an insulating organic polymer substance that fixes particles described later.)

Particles mixed and dispersed in an insulating organic polymer as a binder are applied to the surface of the flexible base material and fixed to the surface of the flexible base material. The compressive strength of the particles needs to have at least a strength range that does not break through the coating of the conductive paste when the connection is pressed, and more preferably has rubber elasticity. This is because it is required that the amount of deformation of the particles during heating and pressurization follows that of the conductive paste, so that by providing elasticity, it is possible to electrically connect the protruding portions of the conductive paste. The contact pressure is continuously applied to the existing connection terminals, and a stable connection is obtained .

The shape of the particles fixed on the flexible base material is appropriately selected from spherical, granular, scale-like, dendritic, plate-like, dice-like, sponge-like, etc. In order to obtain a more stable electrical connection in the state, it is more preferable that the conductive line pattern has a shape such as a sponge-like shape or a dendritic shape-like shape that makes contact with a connection terminal facing it at multiple points. Further, in order to prevent the conductive paste film from breaking through the conductive line pattern formation and thermocompression bonding, the particles are coated with an insulating organic polymer substance that fixes the conductive paste, or a porous It is preferable to have a surface, and this porous surface physicochemically adsorbs the insulating organic polymer substance to which it is fixed, which makes it possible to obtain very high adhesion. . Furthermore, more desirably, the SP of the surface
The difference between the value and that of the insulating organic polymer substance or the conductive paste is within 2 and preferably within 1.
As a result, chemical and molecular binding forces and similarities are obtained, and the surface of the particles is well wetted with the insulating organic polymer substance, whereby high adhesion can be obtained.

However, it is impossible to use the particles in which the particles are easily dissolved in the organic solvent in the conductive paste, and it is not preferable that the particles easily absorb the organic solvent to cause expansion. Furthermore, it is desirable that these particles have heat resistance such that they do not melt easily when thermocompression-bonded at 80 to 200 ° C. If this is a resin, the melting point is 80 ° C or higher, preferably 120 ° C or higher. Is good.

Examples of the particles include resins, carbon particles, metal particles, porous metal particles, and metal particles whose surface is modified with a resin. The shape and elasticity can be controlled by a polymerization method or the like. In addition, the surface of the resin should be porous, and the SP value of the surface should be controlled by a known surface modification technique such as selection of material for particles or introduction of organic polar group. Is preferred.

Resins satisfying such required characteristics include polystyrene-based, polyimide-based, polyacrylic-based, polyester-based, polyurethane-based, polyamide-based, phenol-based, epoxy-based, polyolefin-based, polyvinyl-based resins, and the like. Examples thereof include copolymers and their elastomer resins, isoprene-based and butadiene-based synthetic rubbers, and the like.

The insulating organic polymer material for fixing the particles on the flexible substrate is not particularly limited as long as it is an insulating material, and various general-purpose resins, natural and synthetic rubbers, One kind or a mixture of two or more kinds may be appropriately selected from engineering plastics and the like.
For this, tackifiers and reactivity aids for increasing the adhesion to the flexible substrate, crosslinking agents, heat-resistant additives, deterioration inhibitors, softeners, colorants and the like may be added as appropriate, Furthermore, the SP value may be close to that of the conductive paste to improve the adhesion with the conductive paste.

The method of fixing the particles to the flexible base material by using the insulating organic polymer substance as a binder is not particularly limited, but it is not limited to the method in which the insulating organic polymer substance is dissolved in an organic solvent. After the particles are dispersed and mixed, they can be applied to a flexible substrate by a coating method such as roll coating, bar coating, spin coating, or dip coating, or can be printed by a printing method such as screen printing or gravure printing. Alternatively, an insulating organic polymer material may be heat-melted and the particles dispersed therein may be applied.

When the particles are fixed on the flexible substrate in this way, in order to obtain a stable connection state when the conductive line pattern described later is connected thereto, the number of particles is If the area of the connecting terminal portion of the conductive line pattern is less than 20 per 1 mm ² of particles, there will be few particles when thermocompression-bonded, or particles will not exist in the thermocompression-bonded part, especially when the pitch is low. Can no longer have a stable connection, so this number of particles is
It is advisable to fix them so that the number is 20 or more, preferably 50 or more.

However, in the case of particles having electrical conductivity such as metal, carbon, etc., it should be noted that if the amount of fixing is too large, the insulating property between the conductive line patterns may be affected. It is desirable that the insulating material is desirable. Usually, the thickness of the conductive line pattern is about 3 to 50 μm, and the particle diameter of the particles that project the conductive line pattern is optimally selected from the range of 0.01 to 100 μm, preferably 10 to 50 μm. If it is smaller than this, it becomes impossible to form a sufficient protrusion for connection, and if it is larger than this, the particles cannot be covered by the conductive line pattern.

By applying an insulating organic polymer substance for fixing the particles to the flexible base material, the adhesion of the conductive line pattern formed thereon to the flexible base material is not only improved. Even when the conductive line pattern is formed, the solvent penetration ability of the insulating organic polymer material prevents the conductive line pattern from sagging, and has an advantage that a clear conductive line pattern can be easily formed.

When the conductive paste is a thermosetting paste, a conductive line pattern may be formed on the conductive paste, and then a batch process may be performed to complete the curing by heating in an oven. The flexible substrates on which the line patterns are formed are stacked, but if the insulating organic polymer material is simply applied to the flexible substrates to improve the adhesion of the conductive line patterns, the insulating organic polymers are When the substance is inferior in heat resistance, the flexible substrates may cause blocking, but in the present invention, it is difficult to cause blocking due to the presence of particles in the insulating organic polymer substance.

After the conductive line pattern is formed in this manner, an insulating adhesive layer is provided thereon. The material forming this insulating adhesive layer is not particularly limited, and may be either thermoplastic or thermosetting as long as it exhibits adhesiveness by heating, The ones that are bonded by heating at a relatively low temperature for a short time have a long pot life, and the thermosetting ones have large adhesive strength and excellent heat resistance, so these should be selected appropriately according to the purpose of use. Good.

The main component of this insulating adhesive is ethylene-vinyl acetate copolymer, carboxyl-modified ethylene-vinyl acetate copolymer, ethylene-acrylate copolymer, ethylene-ethyl acrylate copolymer, ethylene-isobutyl. Acrylate copolymer, polyamide, polyester, polymethylmethacrylate, polyvinyl ether, polyvinyl butyral, polyurethane, styrene-butylene-styrene (SBS) copolymer, carboxyl modified SBS copolymer, styrene-isoprene-styrene (SIS) copolymer Coal, styrene-ethylene-butylene-styrene (SEBS) copolymer, maleic acid modified SE
BS copolymer, polybutadiene rubber, chloroprene rubber (CR), carboxyl modified CR, styrene-butadiene rubber, isobutylene-isoprene copolymer, acrylonitrile-butadiene rubber (NBR), carboxyl modified NBR, epoxy resin, silicone rubber (SR) It is obtained by one kind or a combination of two or more kinds selected from the following.

As a tackifier for this insulating adhesive,
Rosin, rosin derivative, terpene resin, terpene-phenol copolymer, petroleum resin, coumarone-indene resin,
One kind or two or more kinds of styrene resin, isoprene resin, alkylphenol resin, phenol resin and the like are appropriately added. Also, this includes a reactive auxiliary agent, a phenol resin as a cross-linking agent, polyols, isocyanates,
Melamine resin, urea resin, urotropins, amines,
Acid anhydrides, peroxides, metal oxides, organic acid metal salts such as trifluoroacetic acid chromium salt, titanium, zirconia, alkoxides such as aluminum, organometallic compounds such as dibutyltin oxide, 2,2-diethoxyacetophenone, Photoinitiators such as benzyl, amines, phosphorus compounds,
Sensitizers such as chlorine compounds are appropriately selected and used as needed, and further, these include curing agents, vulcanizing agents, control agents, deterioration inhibitors, heat resistance additives, thermal conductivity improvers, softeners, colorants. , Various coupling agents, metal deactivators and the like may be appropriately added.

As the solvent for dissolving these, ester type, ketone type, ether ester type, chlorine type,
Ether-based, alcohol-based, hydrocarbon-based, etc., such as methyl acetate, ethyl acetate, isopropyl acetate, isobutyl acetate, butyl acetate, amyl acetate, methyl ethyl ketone, methyl isobutyl ketone, methyl isoamyl ketone, methyl amyl ketone, ethyl amyl ketone, isobutyl Ketone, methoxymethylpentanone, cyclohexanone, diacetone alcohol, methyl cellosolve acetate,
Ethyl cellosolve, butyl cellosolve acetate, methoxybutyl acetate, methyl carbitol acetate, ethyl carbitol acetate, dibutyl carbitol acetate, trichloroethane, trichloroethylene, n-butyl ether, diisoamyl ether, n-butylphenyl ether, propylene oxide, furfural, isopropyl Examples thereof include alcohol, isobutyl alcohol, amyl alcohol, cyclohexanol, benzene, toluene, xylene, isopropylbenzene, petroleum spirit, petroleum naphtha, etc. These are preferably ester type, ketone type and ether ester type.

The insulating adhesive is applied to the connecting portion of the circuit board to be connected on the conductive line pattern by a conventionally known method, such as roll coating, bar coating, knife coating, or the like. It may be performed using a method such as spray coating, screen printing, gravure printing, etc., but if necessary, an insulating resist layer may be provided on the other portions by the same method.

The thermocompression-bonding connecting member of the present invention is constructed as described above, but this one is a portion which is projected and formed on the conductive line pattern by the particles embedded and fixed under the conductive paste forming the conductive line pattern. Is formed, and the electrically conductive paste in the protruding portion due to the heating and pressurizing operation at the time of connection is brought into direct contact with the opposing connection terminal, thereby performing electrical conduction. As described above, in the present invention, since the connection terminals are directly contacted and electrically connected to each other, there is no possibility of a short circuit between the connection terminals, and the presence of the insulating adhesive layer prevents the connection structure between the connection terminals. Since it firmly holds the particles, the advantage that the reliability of electrical conduction can be improved under various environments is given, and in addition, since the particles are first fixed to the flexible substrate, the conventional method is used. The conductive particles do not impair the printability when printing the conductive line pattern, and a conductive line pattern with a fine pitch can be easily obtained, and the particles and the insulating organic polymer substance that fixes the particles adhere to the conductive line pattern. Having good properties also gives the advantage that when it is folded, it is difficult to fold it, and thus no wire breakage occurs.

[0029]

EXAMPLES Examples and comparative examples of the present invention will be given below.
The conductive line pattern printing yield, bending test result, thermal shock test, 60 ° C., 95% RH storage test in the examples show the following results.

(Yield of printing conductive line pattern) 1.00 when screen printing conductive line pattern
Passing rate in 0 pieces (things without electrical disconnection are passed). (Folding test results) 140 ° C, 3 ° C for the connection terminals of the printed hard board (PCB)
What was thermocompression-bonded under the conditions of 0 kg / cm ² and 12 sec was folded 180 °, an excess weight of 10 kg / cm ² was applied, and conversely, folded 180 ° and the same operation was repeated 5 times before and after. Rate of change in resistance between both connection terminals. (Thermal Shock Test) A transparent conductive oxide film substrate (ITO) having a sheet resistivity of 30Ω was thermocompression-bonded under the conditions of 140 ° C., 30 kg / cm ² , and 12 sec, and the temperature was 85 ° C. for 30 minutes at −30.
Change in resistance value between both connection terminals after repeating alternating cycle of ℃ and 30min (60 ℃ 95% RH test) Transparent conductive oxide film substrate (ITO) with area resistance of 30Ω 140 ° C. to the connecting terminal, a material obtained by thermocompression bonding under the conditions of 30kg ^/ cm 2, 12 sec, the time and was left standing to 60 ° C. 95% RH, the change in the resistance value between both the connection terminals.

Example I. Adhesion of particles to flexible base material A PET film having a thickness of 25 μm as a flexible base material and an insulating organic polymer substance having a molecular weight of 20,000 to 25,0
00, hydroxyl value 6.0KOHmg / g, acid value 1.0KOHmg / g, SP value 9.2
15 parts by weight of the saturated copolyester resin of 1) and 1 part by weight of a blocked isocyanate obtained by blocking a biuret trimer of hexamethylene diisocyanate with methyl ethyl ketoxime are mixed with MEK-toluene = 1: 1 solvent 1
What was dissolved in 00 parts by weight, the following particles as particles were added to 10 parts by volume with respect to 100 parts by volume of the insulating organic polymer substance solution, mixed and dispersed, and applied using a roll coater, It was dried to fix the particles. Sponge-like porous nylon resin with a particle size of 40 μm (SP value 1
0.9), spongy porous nylon resin with a particle size of 5 μm (〃
), Sponge-like porous nylon resin with a particle size of 80 μm (〃
), Spherical non-porous acrylic resin with a particle size of 40 μm (SP value
9.8), Agglomerate non-porous nickel particles with a particle size of 40 μm, Agglomerate porous aluminum particles with a particle size of 40 μm, Sponge-like particles with a particle size of 40 μm on the surface of phenol resin (SP value
9.7) Copper particles with layers.

II. Preparation of conductive paste 20 parts by weight of saturated copolymerized polyester resin having a molecular weight of 25,000 to 30,000 as an organic binder, a hydroxyl value of 4.8 KOHmg / g, an acid value of 1.0 KOHmg / g and an SP value of 9.6, and a biuret hexamer of hexamethylene diisocyanate. 1 part by weight of blocked isocyanate blocked with methyl ethyl ketoxime,
75 parts by weight of scaly silver powder, 0.0001 parts by weight of amine curing accelerator, leveling agent, dispersion stabilizer, defoaming agent, thixotropic agent
0.01 parts by weight of the mixture was dissolved in 40 parts by weight of carbitol acetate to prepare a conductive paste. III. Preparation of insulating adhesive solution To 100 parts by weight of carboxyl-modified NBR, 40 parts by weight of a phenol-based tackifier, a deterioration inhibitor, a heat-resistant additive, and an amine-based silane coupling agent are added by 1 part each.
It was dissolved in a mixed solvent of petroleum naphtha: butyl carbitol = 1: 1 to prepare a 35 wt% insulating adhesive.

IV. Manufacture of Thermocompression Bonding Connection Member Next, the above I. Using a stainless screen plate having a screen wire diameter of 28 μm, a mesh thickness of 63 μm, an opening side length (1) of 50 μm, and an aperture ratio of 41% on the flexible base material on which the particles prepared in (1) are fixed. 0.2mm of conductive paste created in
A pitch conductive line pattern was formed. Next, the insulating adhesive prepared in III. Above is applied to the entire surface with a bar coater so as to have a thickness of 20 μm after removing the solvent and dried to form an insulating adhesive layer. The size was cut to obtain a thermocompression bonding connecting member of the present invention. V. Test The thermocompression-bonding connecting member thus obtained was subjected to the above-mentioned conductive pattern printing yield, bending test, thermal shock test, and 60 ° C., 95% RH storage test. The results shown in Tables 3 and 4 were obtained.

Comparative Example Nickel particles having a particle size of 40 μm were formed on a PET film having a thickness of 25 μm as described in II. 5 parts by weight of 100 parts by weight of the conductive paste prepared in step 1 were mixed and dispersed, and the screen wire diameter was 28 μm, the thickness was 63 μm, and the length of one side of the opening was 50 μm.
0.2 with a stainless screen plate with an aperture ratio of 41%
A conductive line pattern of mm pitch was formed. Then, on the entire surface, II. The insulating adhesive prepared in 1. is coated with a bar coater and dried so that the thickness after removing the solvent is 20 μm, and dried to form an insulating adhesive layer, which is cut into desired dimensions, A sample for comparison with was prepared, and the thermocompression-bonding connecting member thus obtained was tested in the same manner as in the example. The results are shown in Table 1, Table 2, Table 3 and Table 4 below. The exact result was obtained.

[0035]

[Table 1]

[Table 2]

[Table 3]

[Table 4]

[0036]

The present invention relates to a thermocompression bonding member and a method for manufacturing the same, and as described above, this thermocompression bonding member comprises a flexible base material and at least a conductive line pattern on the flexible base material. Particles fixed to the site to be formed by using an insulating organic polymer substance as a binder, a conductive line pattern formed by printing a conductive paste on the particles, and at least a circuit board to be connected on the conductive line pattern. This method is characterized by comprising an insulating adhesive layer formed on the joint part of the insulating base material. Particles are fixed by using a molecular substance as a binder, and a conductive paste is printed on the particles by screen printing to form a conductive line pattern. The junction between at least the connected circuit board on the turn is characterized in that it comprises the step of forming an insulating adhesive layer.

However, according to this, since the electrical connection is made by direct contact between the connecting terminals, there is no possibility of a short circuit between the contact terminals, and the presence of the insulating adhesive layer prevents the adhesive structure between the connecting terminals. Is firmly held, which provides an advantage that the reliability of electrical conduction under various environments can be improved.

[Brief description of drawings]

FIG. 1 is a vertical sectional view showing an example of a thermocompression bonding member of the present invention.

2A is a plan view for explaining the connection between the thermocompression bonding connection member and the patterned ITO glass connection terminal, and FIG. 2B is its X view.
A vertical cross-sectional view taken along the line -X, and (c) is a vertical cross-sectional view taken along the line YY.

FIG. 3 is a vertical cross-sectional view of a conventionally known thermocompression-bonding connecting member.

FIG. 4 is a vertical cross-sectional view of another conventionally known thermocompression-bonding connecting member.

[Explanation of symbols]

1,11, 16 ... flexible substrate, 2 ... particles,
13 , 18 ... Conductive particles, 3 ... Insulating organic polymer substance, 4, 12, 17 ... Conductive line pattern, 5, 14 , 19 ... Insulating adhesive layer, 6 ... ITO
Connection terminal, 15 ... An anisotropic conductive adhesive layer.

Claims (3)

[Claims] 1. A flexible base material, and particles having an insulative organic polymer substance fixed as a binder on at least a portion of the flexible base material where a conductive line pattern is to be formed,
Thermocompression bonding, characterized by comprising a conductive line pattern formed by printing a conductive paste on the particles, and an insulating adhesive layer formed on at least a joint portion of the conductive line pattern with a circuit board to be connected. Sex connection member. 2. Particles fixed with an insulating organic polymer substance as a binder have a porous surface.
The thermocompression-bondable connecting member described in. 3. A conductive material is formed by fixing particles to a flexible base material, at least at a site where a conductive line pattern is to be formed, by using an insulating organic polymer substance as a binder, and printing a conductive paste by screen printing. A method of manufacturing a thermocompression-bonding connecting member, comprising the step of forming a line pattern and then forming an insulating adhesive layer on at least a joint with the circuit board to be connected on the conductive line pattern.